CN103021898A - Method for measuring plane angle, and method and system for measuring relative inclination angle of chip and base plate - Google Patents
Method for measuring plane angle, and method and system for measuring relative inclination angle of chip and base plate Download PDFInfo
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Abstract
The invention discloses a method for measuring a plane angle, and a method and a system for measuring a relative inclination angle of a chip and a base plate. The method for measuring the relative inclination angle of the chip and the base plate includes: S21, obtaining an angle error between a first reference plane and a second reference plane using a marked method; S22, obtaining a first inclination angle of the chip and the first reference plane by combining the method for measuring the plane angle with an altitude distance measured by a first altitude sensor, and obtaining a second inclination angle of the base plate and the second reference plane by combining the method for measuring the plane angle with an altitude distance measured by a second altitude sensor; and S23, obtaining the relative inclination angle of the chip and the base plate by performing vector quantity subtraction on the second inclination angle, the first inclination angle and the angle error. The method for measuring the plane angle, and the method and the system for measuring the relative inclination angle of the chip and the base plate use the altitude sensors for measuring altitudes of multiple points so as to measure the inclination angles, and further use the method of marking the inclination angles to measure the relative inclination angle of the chip and the base plate conveniently, rapidly and accurately, and are simple to implement, high in measuring accuracy, and small and exquisite in measuring system and leveling system.
Description
Technical field
The invention belongs to the precision measurement field of measuring techniques, more specifically, relate to a kind of measurement plane Angle Method, chip and substrate relative inclination method of measurement and system.
Background technology
Because the development of High Density Packaging Technology, chip size is more and more less, and is more and more higher to the paster required precision.In the chip paster technique, normally adopt the mounting head with vacuum valve to pick up chip, and according to given pace it is moved to be placed into and carry out the paster operation on the substrate; But mounting head is in picking up chip processes because the absorption chip action can make chip at every turn all different with the inclination angle with respect to the position of substrate, so must before finishing chip attachment, rectify a deviation, leveling.Can have a strong impact on when the chip inclination angle is larger and mount effect.The leveling of chip is important module in the high-density packages, and the precision of leveling has determined the quality of paster quality.
The general mask aligner that only is used for of focusing and leveling technology does not carry out the leveling of chip usually in the paster packaging technology at present.Existing leveling technology mainly is the photoelectric measurement method that is applied on the mask aligner, as: ASML adopts based on the Morie fringe of grating and the photoelectric measurement method of 4 quadrant detector; Nikon then adopts the photo-detection method based on slit and 4 quadrant detector; Canon adopts the Photodetection system based on pin hole and area array CCD.
Above-mentioned various photoelectric measurement method, precision are all very high.But measuring process is complicated, and measuring system is huger.For paster technique, efficient is not high, and the leveling system requisite space is larger, operation inconvenience.
Summary of the invention
For the defective of prior art, the object of the present invention is to provide the measurement plane Angle Method that a kind of implementation method is simple and certainty of measurement is high.
The method of measurement plane angle provided by the invention comprises the steps:
S11: in datum plane, get three some A1, B1, C1, so that 3 line form right angle triangle;
S12: set up the frame of reference according to three points getting, the described frame of reference is respectively X-axis and Y-axis take the summit, right angle as initial point with two right-angle sides, take by initial point and perpendicular to the straight line on plane, 3 places as Z axis;
S13: the distance h of respective point A on A1 point and the plane to be measured on the employing height sensor measuring basis plane
A, the line that A point and A1 are ordered is perpendicular to described datum plane;
S14: repeating step S13 also records respectively on the datum plane distance h of respective point B on the B1 point and plane to be measured
BDistance h with respective point C on C1 point and the plane to be measured on the datum plane
cThe line that B point and B1 are ordered is perpendicular to described datum plane; The line that C point and C1 are ordered is perpendicular to described datum plane;
S15: according to formula
Calculate the projection of normal vector n on the XY plane and the angle α of X-axis on plane to be measured
1, and according to formula
Calculate the projection of normal vector n on the XZ plane and the angle α of Z axis on plane to be measured
2x
BFor the B point with respect to the displacement of A point on directions X, y
CFor the C point with respect to the displacement of A point in Y-direction.
The present invention also provides the method for measurement of a kind of chip and substrate relative inclination, comprises the steps:
S21: the mode that employing is demarcated obtains the angular error α between the first datum plane and the second datum plane;
S22: obtain the first tilt angle gamma of chip and the first datum plane according to the method for measurement plane angle and in conjunction with the height distance that the first height sensor records, and the height distance acquisition substrate that records according to the method for measurement plane angle and in conjunction with the second height sensor and the second angle of inclination beta of the second datum plane;
S23: described the second inclination angle, the first inclination angle and angular error are done the vector subtraction computing obtain relative inclination β-γ-α between described chip and the described substrate.
Further, in step S21, the mode of described demarcation is specially:
Adopt the first height sensor to measure the first normal inclination angle b1 on plane, scaling board place,
Adopt the second height sensor to measure the second normal inclination angle b2 on plane, scaling board place,
The first normal inclination angle b1 and the second normal inclination angle b2 are done the vector subtraction computing obtain angular error α between the first datum plane and the second datum plane.
Further, described the first datum plane is the plane that the motion of the first height sensor forms, and described the second datum plane is the plane that the motion of the second height sensor forms.
Further, in step S22, the method for described measurement plane angle is specially:
In datum plane, get three some A1, B1, C1, so that 3 line form right angle triangle;
Set up the frame of reference according to three points getting, the described frame of reference is respectively X-axis and Y-axis take the summit, right angle as initial point with two right-angle sides, take by initial point and perpendicular to the straight line on plane, 3 places as Z axis;
The distance h of respective point A on A1 point and the plane to be measured on the employing height sensor measuring basis plane
A, the line of A and A1 is perpendicular to described datum plane;
Repeat above-mentioned steps and record respectively on the datum plane distance h of respective point B on the B1 point and plane to be measured
BDistance h with respective point C on C1 point and the plane to be measured on the datum plane
cThe line of B and B1 is perpendicular to described datum plane; The line of C and C1 is perpendicular to described datum plane;
According to formula
Calculate the projection of normal vector n on the XY plane and the angle α of X-axis on plane to be measured
1, and according to formula
Calculate the projection of normal vector n on the XZ plane and the angle α of Z axis on plane to be measured
2x
BFor the B point with respect to the displacement of A point on directions X, y
CFor the C point with respect to the displacement of A point in Y-direction.
The present invention also provides the measuring system of a kind of chip and substrate relative inclination, comprises that XY is to motion module, Z-direction motion module, the second height sensor, the first height sensor and mounting head; Described the second height sensor be connected in described Z-direction motion module under, described mounting head is positioned at the left side of described Z-direction assembly and the second height sensor, described mounting head connects chip, substrate is positioned at the horizontal plane of described the second height sensor below, and described the first height sensor is positioned at the horizontal plane of described mounting head below; Control respectively XY carries out X, Y, Z direction to motion module and Z-direction motion module movement and rotation by the motion control mechanism of outside.
Further, measuring system also comprises scaling board, is arranged at the position, middle of described the first height sensor and the second height sensor, is used for the inclination angle is demarcated.
Further, during to the substrate measurement of dip angle, the second height sensor be positioned at described substrate directly over, the measuring distance between described the second height sensor camera lens and the substrate is 25mm ~ 35mm.
Further, during to the chip measurement of dip angle, described mounting head be positioned at described the first height sensor directly over, the dead in line of the axis of described mounting head and described the first height sensor camera lens.
The invention provides a kind of high-precision method of measurement and leveling system that is applied to small inclination in the paster technique.Measure the inclination angle by utilizing height sensor to measure the multiple spot height, and then the mode of utilizing the inclination angle to demarcate can measure the relative inclination of chip and substrate easily and fast, accurately, utilize corresponding sports motion module to finish the chip leveling.The method realizes simple, and certainty of measurement is high, measures with leveling system small and exquisite.
Description of drawings
Fig. 1 is the principle schematic of the measurement plane Angle Method that provides of the embodiment of the invention;
Fig. 2 is the chip that provides of the embodiment of the invention and the realization flow figure of substrate relative inclination method of measurement;
Fig. 3 is that the chip that provides of the embodiment of the invention and substrate relative inclination are measured the structural representation with leveling system;
Fig. 4 is the realization flow schematic diagram of inclination angle measurement method in the paster process that provides of the embodiment of the invention.
Embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.
The invention provides a kind of high-precision method of measurement and leveling system that is applied to small inclination in the paster technique.Measure the inclination angle by utilizing height sensor to measure the multiple spot height, and then the mode of utilizing the inclination angle to demarcate can measure the relative inclination of chip and substrate easily and fast, accurately, utilize corresponding sports motion module to finish the chip leveling.The method realizes simple, and certainty of measurement is high, measures with leveling system small and exquisite.
In embodiments of the present invention, the method for measurement plane angle specifically comprises the steps:
S11: in datum plane, get three some A1, B1, C1, so that 3 line form right angle triangle;
S12: set up the frame of reference according to three points getting, the described frame of reference is respectively X-axis and Y-axis take the summit, right angle as initial point with two right-angle sides, take by initial point and perpendicular to the straight line on plane, 3 places as Z axis;
S13: the distance h of respective point A on A1 point and the plane to be measured on the employing height sensor measuring basis plane
A, the line of A and A1 is perpendicular to described datum plane;
S14: repeating step S3 also records respectively on the datum plane distance h of respective point B on the B1 point and plane to be measured
BDistance h with respective point C on C1 point and the plane to be measured on the datum plane
cThe line of B and B1 is perpendicular to described datum plane; The line of C and C1 is perpendicular to described datum plane;
S15: according to formula
Calculate the projection of normal vector n on the XY plane and the angle α of X-axis on plane to be measured
1, and according to formula
Calculate the projection of normal vector n on the XZ plane and the angle α of Z axis on plane to be measured
2x
BFor the B point with respect to the displacement of A point on directions X, y
CFor the C point with respect to the displacement of A point in Y-direction.
As shown in Figure 1, plane, height sensor place is the X1Y1 plane, and ABC is plane to be measured, supposes that there is certain inclination angle on plane to be measured and plane, height sensor place.It is h that A1 point on the X1Y1 plane records level to be measured
A(be on the plane to be measured A point to the distance on X1Y1 plane); From the A1 point along the X1 axle with height sensor translation x
BTo the B1 point, measuring level to be measured is h
BFrom the A1 point along the Y1 axle with height sensor translation y
C, measuring level to be measured is h
CThis moment, the B point only had translation x at directions X with respect to the A point
B, the C point only has the translation y of Y-direction with respect to the A point
C, so A, B, 3 relative coordinates of ordering with respect to A of C are respectively A (0,0,0), B (x
B, 0, h
B-h
A), C (0, y
C, h
C-h
A).If vector
Be (x
1, y
1, z
1),
Be (x
2, y
2, z
2), the normal vector on plane to be measured is
Then
Therefore
The substitution coordinate Calculation is as follows:
So
X wherein
1=x
B, y
1=0, z
1=h
B-h
Ax
2=0, y
2=y
C, z
2=h
C-h
ASo normal vector
Projection on the XY plane and the angle of X-axis are:
Normal vector
Projection on the XZ plane and the angle of Z axis are:
In datum plane, get three points in the method for the method measurement plane angle of the measurement plane angle that the embodiment of the invention provides, and set up thus corresponding coordinate system, on three points, measure respectively the height on plane to be measured with height sensor, can be calculated the space angle of plane normal to be measured by its height value and three point coordinates; The method is simple and certainty of measurement is high.
As shown in Figure 2, chip provided by the invention and substrate relative inclination method of measurement specifically comprise the steps:
S21: the mode that employing is demarcated obtains the angular error α between the first datum plane and the second datum plane; Described the first datum plane is the plane that the motion of the first height sensor forms, and described the second datum plane is the plane that the motion of the second height sensor forms;
S22: obtain the first tilt angle gamma of chip and the first datum plane according to the method for measurement plane angle and in conjunction with the height distance that the first height sensor records, and the height distance acquisition substrate that records according to the method for measurement plane angle and in conjunction with the second height sensor and the second angle of inclination beta of the second datum plane;
S23: described the second inclination angle, the first inclination angle and angular error are done the vector subtraction computing obtain relative inclination β-γ-α between described chip and the described substrate.
Wherein, the mode of demarcation is specially:
Adopt the first height sensor to measure the first normal inclination angle b1 on plane, scaling board place,
Adopt the second height sensor to measure the second normal inclination angle b2 on plane, scaling board place,
The first normal inclination angle b1 and the second normal inclination angle b2 are done the vector subtraction computing obtain angular error α between the first datum plane and the second datum plane.
In embodiments of the present invention, in step S22, the method for measurement plane angle is specially:
In datum plane, get three some A1, B1, C1, so that 3 line form right angle triangle;
Set up the frame of reference according to three points getting, the described frame of reference is respectively X-axis and Y-axis take the summit, right angle as initial point with two right-angle sides, take by initial point and perpendicular to the straight line on plane, 3 places as Z axis;
The distance h of respective point A on A1 point and the plane to be measured on the employing height sensor measuring basis plane
A, the line of A and A1 is perpendicular to described datum plane;
Repeat above-mentioned steps and record respectively on the datum plane distance h of respective point B on the B1 point and plane to be measured
BDistance h with respective point C on C1 point and the plane to be measured on the datum plane
cThe line of B and B1 is perpendicular to described datum plane; The line of C and C1 is perpendicular to described datum plane;
According to formula
Calculate the projection of normal vector n on the XY plane and the angle α of X-axis on plane to be measured
1, and according to formula
Calculate the projection of normal vector n on the XZ plane and the angle α of Z axis on plane to be measured
2x
BFor the B point with respect to the displacement of A point on directions X, y
CFor the C point with respect to the displacement of A point in Y-direction.
The present invention also provides a kind of chip and substrate relative inclination to measure and leveling system, comprises that XY consists of to motion module 1, Z-direction motion module 2, the second height sensor 3, substrate 4, the first height sensor 5, chip 6, mounting head 7, scaling board 8.Wherein the second height sensor 3 is to be fixed together with Z-direction motion module 2, is connected under it, and mounting head 7 is fixed together with Z-direction assembly 2, is positioned at the left side of the second height sensor 3.Substrate 4 is fixed in the horizontal plane, and is positioned at the below of the second height sensor 3.The first height sensor 5 is fixed in the horizontal plane, is positioned at the below of mounting head 7.X, Y, Z-direction motion module have X, Y, Z-direction rotation and one-movement-freedom-degree, and by the control of corresponding sports controlling organization, can carry out movement and the rotation of X, Y, Z direction.
Must keep certain position relationship when in embodiments of the present invention, using this system to carry out inclination angle demarcation, substrate measurement of dip angle and chip measurement of dip angle.Carry out the inclination angle timing signal, the second height sensor is directly over the first height sensor, and the first height sensor and the second height sensor camera lens dead in line, and scaling board is positioned at the centre of both heights transducer.Scaling board only uses at the inclination angle timing signal, takes off in other situations.When carrying out the substrate measurement of dip angle, the second height sensor be positioned at substrate directly over, and the second height sensor camera lens and substrate to keep suitable measuring distance be 25mm ~ 35mm, can prevent that mounting head and substrate from interfering.When carrying out the chip measurement of dip angle, mounting head successfully has been drawn to chip in the time of must guaranteeing to measure.Mounting head be positioned at the first height sensor directly over, the dead in line of mounting head axis and the first height sensor camera lens.
For further description the present invention, existing in conjunction with Fig. 3 with Fig. 4 describes chip in detail and the substrate relative inclination is measured with the workflow of leveling system as follows:
Controlled motion motion module with the second height sensor move to the first height sensor directly over.Then scaling board is installed in the middle of two height sensors.As plane to be measured, measure respectively the normal inclination angle of scaling board with scaling board this moment with the second height sensor and chip sensor, offset angle α (α is space angle, i.e. normal and XY plane included angle) is subtracted each other to get at the inclination angle.After the inclination angle is demarcated and finished, just can carry out the measurement of dip angle of chip and substrate.The advantage of this method is, do not need to make the second height sensor and the first height sensor measurement plane exactly parallel, even relative inclination is arranged, also available offset angle is eliminated error.As long as measuring system does not change, offset angle is constant, namely only need carry out an inclination angle and demarcate.
Controlled motion motion module moves to the second height sensor directly over the substrate, and use second height sensor to measure the normal angle of inclination beta (β also be space angle) of substrate take substrate as plane to be measured this moment.Because after substrate installed, the position was constant, so the substrate inclination angle also only needs to measure once.
Controlled motion motion module moves to the first height sensor directly over the mounting head, and use first height sensor to measure the normal tilt angle gamma (γ also be space angle) on chip plane take plane, chip place as plane to be measured this moment.All need to carry out one time the chip measurement of dip angle during each paster.
Can be calculated chip by the inclination angle of the measured substrate of height sensor and chip is β-γ-α (each angle all is the space angle vector here, namely with the X-axis Y-axis certain angle is arranged) at paster to the go forward relative inclination of chip and substrate of substrate.According to the relative inclination that calculates gained, controlled motion motion module makes mounting head rotate respectively corresponding angle along X-axis with along Y-axis, finally can realize the front chip of paster and substrate keeping parallelism.
Those skilled in the art will readily understand; the above only is preferred embodiment of the present invention; not in order to limiting the present invention, all any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., all should be included within protection scope of the present invention.
Claims (9)
1. the method for a measurement plane angle is characterized in that, comprises the steps:
S11: in datum plane, get three some A1, B1, C1, so that 3 line form right angle triangle;
S12: set up the frame of reference according to three points getting, the described frame of reference is respectively X-axis and Y-axis take the summit, right angle as initial point with two right-angle sides, take by initial point and perpendicular to the straight line on plane, 3 places as Z axis;
S13: the distance h of respective point A on A1 point and the plane to be measured on the employing height sensor measuring basis plane
A, the line that A point and A1 are ordered is perpendicular to described datum plane;
S14: repeating step S13 also records respectively on the datum plane distance h of respective point B on the B1 point and plane to be measured
BDistance h with respective point C on C1 point and the plane to be measured on the datum plane
cThe line that B point and B1 are ordered is perpendicular to described datum plane; The line that C point and C1 are ordered is perpendicular to described datum plane;
S15: according to formula
Calculate the projection of normal vector n on the XY plane and the angle α of X-axis on plane to be measured
1, and according to formula
Calculate the projection of normal vector n on the XZ plane and the angle α of Z axis on plane to be measured
2x
BFor the B point with respect to the displacement of A point on directions X, y
CFor the C point with respect to the displacement of A point in Y-direction.
2. the method for measurement of a chip and substrate relative inclination is characterized in that, comprises the steps:
S21: the mode that employing is demarcated obtains the angular error α between the first datum plane and the second datum plane;
S22: obtain the first tilt angle gamma of chip and the first datum plane according to the method for measurement plane angle and in conjunction with the height distance that the first height sensor records, and the height distance acquisition substrate that records according to the method for measurement plane angle and in conjunction with the second height sensor and the second angle of inclination beta of the second datum plane;
S23: described the second inclination angle, the first inclination angle and angular error are done the vector subtraction computing obtain relative inclination β-γ-α between described chip and the described substrate.
3. method of measurement as claimed in claim 2 is characterized in that, in step S21, the mode of described demarcation is specially:
Adopt the first height sensor to measure the first normal inclination angle b1 on plane, scaling board place,
Adopt the second height sensor to measure the second normal inclination angle b2 on plane, scaling board place,
The first normal inclination angle b1 and the second normal inclination angle b2 are done the vector subtraction computing obtain angular error α between the first datum plane and the second datum plane.
4. method of measurement as claimed in claim 2 or claim 3 is characterized in that, described the first datum plane is the plane that the motion of the first height sensor forms, and described the second datum plane is the plane that the motion of the second height sensor forms.
5. method of measurement as claimed in claim 2 is characterized in that, in step S22, the method for described measurement plane angle is specially:
In datum plane, get three some A1, B1, C1, so that 3 line form right angle triangle;
Set up the frame of reference according to three points getting, the described frame of reference is respectively X-axis and Y-axis take the summit, right angle as initial point with two right-angle sides, take by initial point and perpendicular to the straight line on plane, 3 places as Z axis;
The distance h of respective point A on A1 point and the plane to be measured on the employing height sensor measuring basis plane
A, the line of A and A1 is perpendicular to described datum plane;
Repeat above-mentioned steps and record respectively on the datum plane distance h of respective point B on the B1 point and plane to be measured
BDistance h with respective point C on C1 point and the plane to be measured on the datum plane
cThe line of B and B1 is perpendicular to described datum plane; The line of C and C1 is perpendicular to described datum plane;
According to formula
Calculate the projection of normal vector n on the XY plane and the angle α of X-axis on plane to be measured
1, and according to formula
Calculate the projection of normal vector n on the XZ plane and the angle α of Z axis on plane to be measured
2x
BFor the B point with respect to the displacement of A point on directions X, y
CFor the C point with respect to the displacement of A point in Y-direction.
6. the measuring system of a chip and substrate relative inclination is characterized in that, comprises that XY is to motion module, Z-direction motion module, the second height sensor, the first height sensor and mounting head; Described the second height sensor be connected in described Z-direction motion module under, described mounting head is positioned at the left side of described Z-direction assembly and the second height sensor, described mounting head connects chip, substrate is positioned at the horizontal plane of described the second height sensor below, and described the first height sensor is positioned at the horizontal plane of described mounting head below; Control respectively XY carries out X, Y, Z direction to motion module and Z-direction motion module movement and rotation by the motion control mechanism of outside.
7. measuring system as claimed in claim 6 is characterized in that, also comprises scaling board, is arranged at the position, middle of described the first height sensor and the second height sensor, is used for the inclination angle is demarcated.
8. measuring system as claimed in claim 6 is characterized in that, during to the substrate measurement of dip angle, the second height sensor be positioned at described substrate directly over, the measuring distance between described the second height sensor camera lens and the substrate is 25mm ~ 35mm.
9. measuring system as claimed in claim 6 is characterized in that, during to the chip measurement of dip angle, described mounting head be positioned at described the first height sensor directly over, the dead in line of the axis of described mounting head and described the first height sensor camera lens.
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| CN111380509B (en) * | 2018-12-28 | 2022-04-01 | 上海微电子装备（集团）股份有限公司 | Mask posture monitoring method and device and mask granularity detection equipment |
| TWI769423B (en) * | 2018-12-28 | 2022-07-01 | 大陸商上海微電子裝備（集團）股份有限公司 | A method and device for monitoring attitude of photomask and device for detecting particle size of photomask |
| CN113295134A (en) * | 2021-06-08 | 2021-08-24 | 北京普利永华科技发展有限公司 | Method for measuring rotating angle of rotating shaft unrelated airplane control surface |
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Effective date of registration: 20161201 Address after: 430074 Hubei Province, Wuhan city Hongshan District Luoyu Road No. 1037 Patentee after: Huazhong University of Science and Technology Patentee after: GUANGDONG HUST INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE Address before: 430074 Hubei Province, Wuhan city Hongshan District Luoyu Road No. 1037 Patentee before: Huazhong University of Science and Technology |