CN103016970B - Light-emitting device - Google Patents
Light-emitting device Download PDFInfo
- Publication number
- CN103016970B CN103016970B CN201210270276.2A CN201210270276A CN103016970B CN 103016970 B CN103016970 B CN 103016970B CN 201210270276 A CN201210270276 A CN 201210270276A CN 103016970 B CN103016970 B CN 103016970B
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- base plate
- installation base
- light source
- source portion
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Insulating element (3) be integrally formed as synthetic resin forming body be located in thermal component (2) the principal part (30) between main leaf (20) and light source portion (1), from the two ends (two ends along its length) of principal part (30) with close to light source portion (1) towards the abutting part erected (31) and a pair reflecting part (32) outstanding from the front end of each abutting part (31).Light source portion (1) (installation base plate (10)) abuts with each abutting part (31) of insulating element (3) along its length, thus inhibits the position of width to offset.In addition, the heat produced in luminescence (lighting) process of light source portion (1) conducts to thermal component (2) from installation base plate (10) by projecting strip part (22), dispels the heat efficiently thus.
Description
Technical field
The light-emitting device that to the present invention relates to solid-state light emitting elements such as light emitting diodes be light source.
Background technology
As the light-emitting device in the past taking light emitting diode as light source, such as, there is the device recorded in patent document 1.The device that patent document 1 is recorded possesses: flat insulating body, is formed with the through hole at the through positive back side; Metallic object, insert in through hole, engage with insulating body, thermal conductivity ratio insulating body is high; Metallic plate, engages with metallic object; And light-emitting diode chip for backlight unit, driven on the surface of metallic plate.In this past case, the heat sent by light-emitting diode chip for backlight unit is conducted to metallic object via metallic plate, thus dispels the heat efficiently.
Patent document 1: Japanese Unexamined Patent Publication 2006-128265 publication
But, in above-mentioned past case, the surface of the metallic object in the through hole being inserted into insulating body is bonded to metallic plate, but under state before joint, being difficult to metallic plate to be located relative to metallic object, there is the possibility of skew and thermal diffusivity reduction in the position that there is metallic object and metallic plate.
Summary of the invention
The present invention makes in view of above-mentioned problem, its object is to, and suppresses the position of thermal component and solid-state light emitting element to offset.
The feature of light-emitting device of the present invention is to possess: light source portion, is provided with one or more solid-state light emitting element on the surface of the installation base plate being formed as rectangular tabular and forms; Thermal component, at least partially along its length with the rear-face contact of above-mentioned installation base plate; And insulating element, be formed as rectangular tabular by insulating materials, be located between above-mentioned light source portion and above-mentioned thermal component; Above-mentioned insulating element has: a pair abutting part, abuts respectively with the end face of the both sides of the length direction along above-mentioned installation base plate; And inserting hole, that insert above-mentioned thermal component with position that the is rear-face contact of above-mentioned installation base plate.
In this light-emitting device, be preferably, above-mentioned insulating element has a pair the 2nd abutting parts, and the end face of the both sides that above-mentioned a pair the 2nd abutting parts are opposed with on the length direction of above-mentioned installation base plate abuts respectively.
In this light-emitting device, be preferably, till near the two ends that the above-mentioned solid-state light emitting element of above-mentioned light source portion is installed to the length direction of above-mentioned installation base plate, the two ends that above-mentioned insulating element is formed as the length direction of above-mentioned inserting hole do not arrive the size near the two ends of the length direction of above-mentioned installation base plate.
In this light-emitting device, be preferably, above-mentioned light source portion is formed with the electric conductor for powering to above-mentioned solid-state light emitting element on the surface of above-mentioned installation base plate, is provided with above-mentioned inserting hole in the scope that above-mentioned insulating element is overlapping with above-mentioned electric conductor when observing from thickness direction.
In this light-emitting device, be preferably, above-mentioned insulating element has reflecting part, and this reflecting part is more forwards given prominence to than the surface of above-mentioned installation base plate, reflects the light radiated from above-mentioned solid-state light emitting element.
The effect of invention:
Light-emitting device of the present invention has the effect that the position of thermal component and solid-state light emitting element can be suppressed to offset.
Accompanying drawing explanation
Fig. 1 be represent the embodiment of light-emitting device of the present invention, a part of abridged sectional view.
Fig. 2 is the same exploded perspective view.
Fig. 3 is the same exploded perspective view.
Fig. 4 is the same stereogram.
Fig. 5 (a) is the same rearview, and Fig. 5 (b) is the same side view.
Detailed description of the invention
Below, reference becomes the accompanying drawing of the part of this description, is described in detail to embodiments of the present invention.In whole accompanying drawing, same reference marks is added for same or similar part and omits the description.
Below, with reference to Fig. 1 ~ Fig. 5, embodiment technological thought of the present invention being applied to the light-emitting device employing light emitting diode (LED) as solid-state light emitting element is described in detail.
The light-emitting device (LED unit) of present embodiment possesses: light source portion 1, thermal component 2, insulating element 3, build-up member 4, cover 5 etc.Light source portion 1 has: installation base plate 10, is formed as rectangular tabular by insulating materials (such as pottery); One or more light emitting diode (hereinafter referred to as LED chip) 11, is arranged on the surface of installation base plate 10; Electric conductors (not shown) etc., are formed in the surface of installation base plate 10; Deng.The central portion (central portion of width) of one or more LED chip 11 on installation base plate 10 surface alongst with at equal intervals and linearity arrangement install, and be there is light transmission and the plastic seal member 12 being mixed with fluorescent material seals.Namely, wavelength conversion is carried out by fluorescent material from a part for the light (such as blue light) of LED chip 11 radiation, light (blue light) mixing of the light (such as sodium yellow) after wavelength conversion and non-wavelength conversion, the light radiated from light source portion 1 thus becomes white light on the whole.
Thermal component 2 forms main leaf 20 and a pair lateral plate 21 by the material (such as aluminium sheet) that thermal conductivity is higher, this main leaf 20 is formed as rectangular tabular, be placed with light source portion 1 via insulating element 3, the thickness direction of this pair lateral plate 21 from the two ends (two ends along its length) of main leaf 20 to main leaf 20 extends.In addition, (face of light source portion 1 is placed with in a face of main leaf 20.Hereinafter referred to as mounting surface) on, projecting along its length have towards the outstanding multiple projecting strip parts 22 in the direction close to light source portion 1.Therefore, if light source portion 1 is positioned on thermal component 2, then the part of thermal component 2 and the length direction of projecting strip part 22 along thermal component 2 and the rear-face contact of light source portion 1.
Insulating element 3 forms principal part 30, abutting part 31 and a pair reflecting part 32 as synthetic resin forming body, this principal part 30 is folded between the main leaf 20 of thermal component 2 and light source portion 1, this abutting part 31 erects from the two ends (two ends in the width direction) of principal part 30 to the direction close to light source portion 1, and this pair reflecting part 32 is given prominence to from the front end of each abutting part 31.A pair reflecting part 32 tilts in the mode opened toward the outer side along with away from abutting part 31, and the surface (upper surface in Fig. 1) of side opposed with light source portion 1 becomes reflecting surface, by light forwards (top in Fig. 1) reflection of radiating from light source portion 1.In addition, at insulating element 3 by under the state that is placed on the main leaf 20 of thermal component 2, the inserting hole 33 of the elongated hole-shape that projecting strip part 22 is inserted is at the middle thereof of principal part 30.In addition, in the end side of the length direction of insulating element 3, the projecting wall portion 34 having the end of blocking thermal component 2, and be formed with the 2nd abutting part 35 linked at the two ends of a pair abutting part 31.
In addition, insulating element 3 has multiple locator protrusions 36, and the plurality of locator protrusions 36 inserts multiple locating hole 20A of the main leaf 20 being located at thermal component 2 respectively.The cylindrical shape that the two ends that locator protrusions 36 is formed as in the width direction (left and right directions in Fig. 3) outstanding towards the direction () of the main leaf 20 close to thermal component 2 in Fig. 3 upward, and equally spaced arrange along its length.And insert locator protrusions 36 respectively in the locating hole 20A being located at main leaf 20, and insert projecting strip part 22 in the inserting hole 33 of principal part 30, thus, insulating element 3 is located relative to the main leaf 20 of thermal component 2.In addition, form towards the columned projection 37 that the rightabout () with locator protrusions 36 outstanding in Fig. 2 down with each locator protrusions 36.These projections 37 are for supporting the cover 5 of light transmission, and this cover 5 covers light source portion 10 and thermal component 2 from front and side.
In addition, in reflecting part 32 with on the face of reflecting surface opposite side, projecting respectively have the teat 38 given prominence to substantially in parallel with abutting part 31, projectingly in the front end of each teat 38 to have outwardly (away from principal part 30 towards) outstanding engagement pawl 38A.That is, these engagement pawl 38A are inserted in the stop hole 21A being locked on the lateral plate 21 being located at thermal component 2, thus prevent thermal component 2 and insulating element 3 from coming off (with reference to Fig. 1).
Build-up member 4, by carrying out bending machining to metallic plates such as steel plates, the base plate 40 of elongated rectangular shape shape and the pair of side plates 41 that erects from the two ends of the length direction along base plate 40 are formed integrally as roughly chamfered groove shape (Japanese: angle Gutter shape), are fixed in thermal component 2 with the state be incorporated between lateral plate 21.In addition, fixedly being screwed togather by hold-down screw (not shown) and screw 42 between build-up member 4 and thermal component 2 is carried out, the inserting hole 20B at the length direction two ends of the main leaf 20 being located at thermal component 2 inserted by this hold-down screw, and this screw 42 is formed at the length direction two ends of base plate 40.
In addition, Assembly part 43 is used to be assemblied on build-up member 4 by socket connector (receptacle connector) 6.Socket connector 6 has: splicing ear portion 60, and be connected with electric wire (not shown), this electric wire is electrically connected with the electric conductor of light source portion 1; And connector connection part 61, this connector connection part 61 inserts plug connector (plug connector) (not shown).Plug connector is connected with ignition device (not shown) via electric wire, and plug connector plug is freely inserted with socket connector 6 and is connected.That is, by plug connector and socket connector 6 are inserted connection, ignition device and light source portion 1 are electrically connected, and power and light source portion 1 luminescence (lighting) from ignition device to light source portion 1.
Assembly part 43 forms support sector 43B, a pair fixed claw 43C of rectangular box-like connector maintaining part 43A, roughly platform shape by metallic plates such as steel plates, this connector maintaining part 43A keeps socket connector 6, this support sector 43B bends up from the end of connector maintaining part 43A, and this pair fixed claw 43C gives prominence to from the front end of support sector 43B.The a pair holddown groove 40A being formed at the end of the base plate 40 of build-up member 4 inserts by fixed claw 43C, and the screw inserting the screw insertion hole 43D of through support sector 43B screws togather with the screw 42 at the length direction two ends being formed at base plate 40, is fixed on base plate 40 by Assembly part 43 thus.
Cover 5 is formed as the rectangular rectangular box in the sidewall portion 51 of the surrounding having bottom 50 and surround bottom 50 by the synthetic resin material that allyl resin or polycarbonate resin etc. have a light transmission.In addition, pair of sidewalls portion 51 is along its length formed with multiple engaging recessed part 52, the plurality of engaging recessed part 52 freely engages with multiple engaging protrusion 21B cards of the lateral plate 21 being formed at thermal component 2 are de-.
Then, the assembling sequence of the LED unit of present embodiment is described.First, light source portion 1 is placed in the mounting surface of each principal part 30 of a pair insulating element 3, is combined with each insulating element 3 by the proper method of bonding or riveted joint etc.Now, be positioned in the light source portion 1(installation base plate 10 in mounting surface) the cross section of both sides alongst abut respectively with a pair abutting part 31 of insulating element 3, thus, the position skew of width is suppressed, and along the both sides of width cross section (namely, the cross section of both sides opposed in the longitudinal direction) abut respectively when meet portion 35 with a pair the 2nd of insulating element 3, thus, the position skew of length direction is suppressed.In addition, reflecting part 32 is more forwards given prominence to than the surface of installation base plate 10.
Next, a pair insulating element 3 be combined with light source portion 1 is assembled on the main leaf 20 of thermal component 2.Now, the engagement pawl 38A of insulating element 3 is inserted in the stop hole 21A being locked on the lateral plate 21 being located at thermal component 2, prevents insulating element 3 to come off relative to thermal component 2.And the build-up member 4 being equipped with socket connector 6 by Assembly part 43 is fixed with thermal component 2.Finally, with bottom 50 opposed with light source portion 1 (relative) towards, make cover 5 cover thermal component 2, the engaging protrusion 21B of lateral plate 21 engages with the engaging recessed part 52 in sidewall portion 51, and cover 5 is combined with thermal component 2, and LED unit has been assembled thus.
According to present embodiment as above, light source portion 1(installation base plate 10) alongst abut with each abutting part 31 of insulating element 3, the position skew of width is suppressed thus, and abut along width with the 2nd abutting part 35 of each insulating element 3, the position skew of length direction is suppressed thus.In addition, the heat produced in the luminescence (lighting) of light source portion 1 conducts to thermal component 2 from installation base plate 10 by projecting strip part 22, dispels the heat efficiently thus.
In addition, the reflecting surface being located at the reflecting part 32 of insulating element 3 due to the light radiated from light source portion 1 forwards reflects, therefore, it is possible to forwards irradiated efficiently by the light of light source portion 1.And, because the reflecting part 32 with reflecting surface forms with insulating element 3, therefore with form the situation of reflecting plate independently outside insulating element 3 compared with, by the reduction of number of components, achieve the raising of assembleability and miniaturization etc.
But, the installation base plate 10 of light source portion 1 is provided with dozens of LED chip, and be connected in series by electric conductor, apply the forward voltage of LED chip (such as 3.5 volts) to be multiplied with the number be connected in series to light source portion 1 and the voltage (such as 35 volts ~ 70 volts) obtained.Therefore, in the present embodiment, ensure that the insulation distance between the electric conductor of light source portion 1 and thermal component 2 by insulating element 3.But, in the present embodiment, in order to improve the uniformity of the light on length direction, near two ends LED chip being installed to the length direction of substrate 10, therefore the insulation distance at the length direction both ends of light source portion 1 becomes shorter than the insulation distance of other part.
Therefore, in the present embodiment, the inserting hole 33 of insulating element 3 is formed as not arriving the size near the two ends of the length direction of the installation base plate 10 being placed in principal part 30.Namely, the both ends of the principal part 30 at the length direction both ends placed by installation base plate 10 do not form inserting hole 33, therefore, it is possible to guarantee from the insulation distance of end to the projecting strip part 22 of the thermal component 2 inserted inserting hole 33 of installation base plate 10 (plumbous identity distance from).
In addition, in order to improve the thermal diffusivity of light source portion 1, preferably make the projecting strip part 22 of thermal component 2 large as far as possible with the contact area of installation base plate 10.But, when in order to increase contact area increase the width dimensions of projecting strip part 22, the width dimensions of the inserting hole 33 of insulating element 3 also must increase, and the insulation distance from two ora terminalis along its length of light source portion 1 to thermal component 2 shortens.Therefore, preferably in insulating element 3, in the scope d overlapping with electric conductor when observing from thickness direction (above-below direction in Fig. 1), inserting hole 33 is set.Like this, while guaranteeing the insulation distance between electric conductor and thermal component 2, the raising of the thermal diffusivity of light source portion 1 can be realized.
In the present embodiment as light source exemplified with light emitting diode, but also can use the light source beyond light emitting diode, such as organic EL element etc.In addition, although the quantity of LED chip is set to multiple, the quantity of LED chip also can be one.
Above, preferred embodiment be illustrated of the present invention, but the present invention is not limited only to these specific embodiments, can carry out numerous variations and distortion in the scope not departing from claim, these change and distortion also belongs within category of the present invention.
Claims (3)
1. a light-emitting device, is characterized in that, possesses:
Light source portion, is provided with one or more solid-state light emitting element on the surface of the installation base plate being formed as rectangular tabular and forms;
Thermal component, at least partially along its length with the rear-face contact of above-mentioned installation base plate; And
Insulating element, is formed as rectangular tabular by insulating materials, is located between above-mentioned light source portion and above-mentioned thermal component,
Above-mentioned insulating element has:
A pair abutting part, abuts respectively with the end face of the both sides alongst of above-mentioned installation base plate; And
Inserting hole, that insert above-mentioned thermal component with position that the is rear-face contact of above-mentioned installation base plate,
Above-mentioned insulating element has reflecting part, and this reflecting part is more forwards given prominence to than the surface of above-mentioned installation base plate, by the light reflection of radiating from above-mentioned solid-state light emitting element,
Till near the two ends that the above-mentioned solid-state light emitting element of above-mentioned light source portion is installed to the length direction of above-mentioned installation base plate,
The two ends that above-mentioned insulating element is formed as the length direction of above-mentioned inserting hole do not arrive the size near the two ends of the length direction of above-mentioned installation base plate.
2. light-emitting device according to claim 1, is characterized in that,
Above-mentioned insulating element has a pair the 2nd abutting parts, and above-mentioned a pair the 2nd abutting parts abut respectively with the end face of the both sides opposed in the longitudinal direction of above-mentioned installation base plate.
3. light-emitting device according to claim 1 and 2, is characterized in that,
Above-mentioned light source portion is formed with the electric conductor for powering to above-mentioned solid-state light emitting element on the surface of above-mentioned installation base plate,
Above-mentioned inserting hole is provided with in the scope that above-mentioned insulating element is overlapping with above-mentioned electric conductor when observing from thickness direction.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP207498/2011 | 2011-09-22 | ||
| JP2011207498A JP5879558B2 (en) | 2011-09-22 | 2011-09-22 | Light emitting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103016970A CN103016970A (en) | 2013-04-03 |
| CN103016970B true CN103016970B (en) | 2015-07-29 |
Family
ID=47965889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210270276.2A Expired - Fee Related CN103016970B (en) | 2011-09-22 | 2012-07-31 | Light-emitting device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5879558B2 (en) |
| CN (1) | CN103016970B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6168449B2 (en) * | 2013-04-17 | 2017-07-26 | パナソニックＩｐマネジメント株式会社 | LED unit and lighting apparatus |
| JP6226548B2 (en) * | 2013-04-26 | 2017-11-08 | コイズミ照明株式会社 | Heat sink and lighting apparatus including the same |
| JP2016042475A (en) * | 2015-10-30 | 2016-03-31 | アイリスオーヤマ株式会社 | LED lighting device |
| JP7398882B2 (en) * | 2019-05-09 | 2023-12-15 | 三菱電機株式会社 | Light source units, lamps and lighting equipment |
| JP7479941B2 (en) | 2020-06-03 | 2024-05-09 | 三菱電機株式会社 | Lighting fixtures and lighting devices |
| CN116660866B (en) * | 2023-07-31 | 2023-12-05 | 今创集团股份有限公司 | Laser radar visual detection box and manufacturing method and application thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201368380Y (en) * | 2009-03-17 | 2009-12-23 | 南充市能星光电科技有限公司 | Bracket-type LED fluorescent lamp |
| CN102032478A (en) * | 2009-09-28 | 2011-04-27 | Ssec株式会社 | Light emitting diode lighting device |
| CN201875471U (en) * | 2010-10-20 | 2011-06-22 | 王子能 | LED (light-emitting diode) lamp tube |
| CN102121690A (en) * | 2010-12-29 | 2011-07-13 | 范靖 | Radiating device for light distribution of LED (light-emitting diode) lamp |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08104026A (en) * | 1994-10-03 | 1996-04-23 | Rohm Co Ltd | Led printing head |
| JP2006024639A (en) * | 2004-07-06 | 2006-01-26 | Mitsubishi Electric Corp | Semiconductor device |
| JP2010010523A (en) * | 2008-06-30 | 2010-01-14 | Toyoda Gosei Co Ltd | Light emitting device |
| JP5434629B2 (en) * | 2010-01-27 | 2014-03-05 | 日亜化学工業株式会社 | Light emitting device |
-
2011
- 2011-09-22 JP JP2011207498A patent/JP5879558B2/en active Active
-
2012
- 2012-07-31 CN CN201210270276.2A patent/CN103016970B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201368380Y (en) * | 2009-03-17 | 2009-12-23 | 南充市能星光电科技有限公司 | Bracket-type LED fluorescent lamp |
| CN102032478A (en) * | 2009-09-28 | 2011-04-27 | Ssec株式会社 | Light emitting diode lighting device |
| CN201875471U (en) * | 2010-10-20 | 2011-06-22 | 王子能 | LED (light-emitting diode) lamp tube |
| CN102121690A (en) * | 2010-12-29 | 2011-07-13 | 范靖 | Radiating device for light distribution of LED (light-emitting diode) lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5879558B2 (en) | 2016-03-08 |
| CN103016970A (en) | 2013-04-03 |
| JP2013069879A (en) | 2013-04-18 |
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Granted publication date: 20150729 |