CN103015681A - Substrate for building ground with wood structure - Google Patents
Substrate for building ground with wood structure Download PDFInfo
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- CN103015681A CN103015681A CN2011102815889A CN201110281588A CN103015681A CN 103015681 A CN103015681 A CN 103015681A CN 2011102815889 A CN2011102815889 A CN 2011102815889A CN 201110281588 A CN201110281588 A CN 201110281588A CN 103015681 A CN103015681 A CN 103015681A
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- substrate
- building ground
- ground
- buffer layer
- structural building
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Abstract
The invention relates to a substrate for a building ground with a wood structure. The substrate comprises a base course base plate, and is characterized in that a flexible buffer layer is laid on the base course base plate, and a ground decorating layer is laid on the flexible buffer layer. Therefore, the flexibility of the whole building ground with the wood structure can be effectively improved, and the touch feeling of footsteps is enhanced. Meanwhile, by relying on wavy fold strips, the deformation caused by long-term trampling is effectively prevented. The related pattern is adjusted by the presence of a graphic texture printing layer. Furthermore, by splicing cutting strips, the notches caused by cutting can be greatly beautified and covered up, and the overall degree of attractiveness is enhanced.
Description
Technical field
The present invention relates to a kind of substrate, relate in particular to a kind of substrate for wood structural building ground.
Background technology
Along with the raising of people's living standard, the comfort requirement degree of living is also grown with each passing day, so wooden frame structure has obtained people's favor.
Wooden frame structure roughly has following advantage: 1, the feature of environmental protection is good.This point beyond any doubt, the main constructional materials of wooden frame structure is the product of natural, ecological mostly, synthetic materials also is that Physical Processing forms basically, the relative brick mixed building of chemical products use amount is seldom.Time one is long, stays in the pure and fresh breath of the inside houseful timber, is very much pleasant.2, good energy saving property reduces energy consumption, saves use cost.Many (being that thermal resistance value is much higher) that the Timberwork wall of ordinary constitution is lower than the thermal transmittance of brick wall external insulation system, also low more than 30% specific to the thermal transmittance that on the numerical value is exactly more existing than country at least energy-conservation 65% wall thermal insulating system, if it is just more to strengthen construction measure.Owing to its construction features, all overhanging components and exterior wall ledge and door and window joint portion all can not produce cold bridge in addition, and brick-concrete composite buildings is processed the bad cold bridge that will produce at these positions, cause house mass energy loss.3, conserve space increases usable floor area.The main bearing wall thickness of wooden frame structure is all at 120-150mm, and the load bearing wall thickness with respect to brick mix structure 240-370mm has increased indoor usage space and area greatly.Above 3 points are can be tub-thumping as the attraction in housing sale.4, structural seismic performance is good.The used timber of wooden construction is elastomeric material, forms spatial integral structure by nail and connector, and is not only firm but also flexibility arranged, will be good with respect to the brick-concrete composite buildings anti-seismic performance of rigid structures many.5, the construction period short, be conducive to hand over fast the room to move in.(this point has special discussion below).6, the job site is clearly clean and tidy, and it is good that the client visits impression.7, architectural appearance effect and house, North America can reach in full accord.
But because existing substrate for wood structural building ground is more stiff, user's both feet feel of walking in the above is not good.Simultaneously, the pattern of substrate is fixed, and can't play better beautifying and decorating effect.
Summary of the invention
Purpose of the present invention is exactly in order to solve the above-mentioned problems in the prior art, and a kind of substrate for wood structural building ground is provided.
Purpose of the present invention is achieved through the following technical solutions:
Substrate for wood structural building ground includes basic unit's backing plate, wherein: be equipped with supple buffer layer on the described basic unit backing plate, be equipped with the ground decoration layer on the described supple buffer layer.
Further, above-mentioned substrate for wood structural building ground, wherein: described supple buffer layer upper surface is distributed with wavy fold bar.
Further, above-mentioned substrate for wood structural building ground, wherein: described ground decoration layer surface is the graphical textures printed layers.
Again further, above-mentioned substrate for wood structural building ground, wherein: described ground decoration layer surface distributed has splicing cutting bar.
The advantage of technical solution of the present invention is mainly reflected in: can effectively improve the extent of elasticity of wood structural building ground integral body, strengthen the step sense of touch.Simultaneously, rely on wavy fold bar, deformation occurs after effectively preventing from trampling for a long time.And, by the existence of graphical textures printed layers, adjust relevant pattern.Moreover, by splicing cutting bar, can greatly beautify and cover up the otch that causes after the cutting, promote whole aesthetic measure.
Description of drawings
Purpose of the present invention, advantage and disadvantage will be for illustration and explanation by the non-limitative illustration of following preferred embodiment.These embodiment only are the prominent examples of using technical solution of the present invention, and all technical schemes of taking to be equal to replacement or equivalent transformation and forming all drop within the scope of protection of present invention.In the middle of these accompanying drawings,
Fig. 1 is the organigram of substrate for wood structural building ground;
Fig. 2 is the cross-sectional configuration schematic diagram of supple buffer layer.
The specific embodiment
Substrate for wood structural building ground as shown in Figure 1 and Figure 2 includes basic unit's backing plate 1, and its special feature is: be equipped with supple buffer layer 2 on the basic unit of the present invention backing plate 1, improve the extent of elasticity of substrate integral body with this, strengthen the step sense of touch.Simultaneously, consider substrate is played suitable decoration function, be equipped with ground decoration layer 3 in supple buffer layer 2.
With regard to the better embodiment of the present invention one, consider the integrated buffer degree that can promote supple buffer layer 2, more with elasticity, strengthen the recovery capability after the elastic deformation, be distributed with wavy fold bar 4 at supple buffer layer 2 upper surfaces, both as shown in Figure 2.And, relying on the existence of wavy fold bar 4, the gap between the wavy fold bar 4 can be used as the glue spatial accommodation in the follow-up manufacturing bonding process, is conducive to the combination of ground decoration layer 3.
Further, consider that ground decoration layer 3 can adapt to the indoor decoration needs of timber buildings or environment is regulated needs, can not seem lofty.Ground decoration layer 3 surface that the present invention adopts are the graphical textures printed layers.Like this, the graphical textures printed layers can adopt different patterns as required, better meets the decoration needs.
Again further, consider cutting and the splicing that inevitably need to be correlated with in the indoor laying of follow-up reality, in order effectively to hide piece, promote whole aesthetic measure, ground decoration layer 3 surface distributed have splicing cutting bar 5.Like this, the splicing cutting bar 5 of can postponing in actual cutting is constructed, and also can be undertaken it by splicing cutting bar 5 during splicing, can cover up the otch that causes after the cutting thus.
Can find out by above-mentioned character express, behind employing the present invention, can effectively improve the extent of elasticity of wood structural building ground integral body, strengthen the step sense of touch.Simultaneously, rely on wavy fold bar, deformation occurs after effectively preventing from trampling for a long time.And, by the existence of graphical textures printed layers, adjust relevant pattern.Moreover, by splicing cutting bar, can greatly beautify and cover up the otch that causes after the cutting, promote whole aesthetic measure.
Claims (4)
1. substrate for wood structural building ground includes basic unit's backing plate, it is characterized in that: be equipped with supple buffer layer on the described basic unit backing plate, be equipped with the ground decoration layer on the described supple buffer layer.
2. substrate for wood structural building ground according to claim 1, it is characterized in that: described supple buffer layer upper surface is distributed with wavy fold bar.
3. substrate for wood structural building ground according to claim 1 is characterized in that: described ground decoration layer surface is the graphical textures printed layers.
4. substrate for wood structural building ground according to claim 1 is characterized in that: described ground decoration layer surface distributed has splicing cutting bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102815889A CN103015681A (en) | 2011-09-21 | 2011-09-21 | Substrate for building ground with wood structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102815889A CN103015681A (en) | 2011-09-21 | 2011-09-21 | Substrate for building ground with wood structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103015681A true CN103015681A (en) | 2013-04-03 |
Family
ID=47964738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102815889A Pending CN103015681A (en) | 2011-09-21 | 2011-09-21 | Substrate for building ground with wood structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103015681A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0411653A2 (en) * | 1989-08-03 | 1991-02-06 | Osterwald Sportboden GmbH | Sport-hall flooring |
| CN2434372Y (en) * | 2000-05-29 | 2001-06-13 | 何三贤 | Combined floor capable of simply cutting off its edge structure |
| CN2888010Y (en) * | 2006-03-07 | 2007-04-11 | 梁玲瑜 | Wood plate structure |
| CN201254809Y (en) * | 2008-08-18 | 2009-06-10 | 浙江世友木业有限公司 | Elastic wood floor |
| CN201649535U (en) * | 2010-03-22 | 2010-11-24 | 三林合板(南通)有限公司 | Printed floor |
| CN202227655U (en) * | 2011-09-21 | 2012-05-23 | 德胜（苏州）洋楼有限公司 | Substrate for wood structural building ground |
-
2011
- 2011-09-21 CN CN2011102815889A patent/CN103015681A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0411653A2 (en) * | 1989-08-03 | 1991-02-06 | Osterwald Sportboden GmbH | Sport-hall flooring |
| CN2434372Y (en) * | 2000-05-29 | 2001-06-13 | 何三贤 | Combined floor capable of simply cutting off its edge structure |
| CN2888010Y (en) * | 2006-03-07 | 2007-04-11 | 梁玲瑜 | Wood plate structure |
| CN201254809Y (en) * | 2008-08-18 | 2009-06-10 | 浙江世友木业有限公司 | Elastic wood floor |
| CN201649535U (en) * | 2010-03-22 | 2010-11-24 | 三林合板(南通)有限公司 | Printed floor |
| CN202227655U (en) * | 2011-09-21 | 2012-05-23 | 德胜（苏州）洋楼有限公司 | Substrate for wood structural building ground |
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| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130403 |