CN103012799A - Phenyl vinyl silicon resin for LED (Light-Emitting Diode) packaging and preparation method of phenyl vinyl silicon resin - Google Patents
Phenyl vinyl silicon resin for LED (Light-Emitting Diode) packaging and preparation method of phenyl vinyl silicon resin Download PDFInfo
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- CN103012799A CN103012799A CN2012105323607A CN201210532360A CN103012799A CN 103012799 A CN103012799 A CN 103012799A CN 2012105323607 A CN2012105323607 A CN 2012105323607A CN 201210532360 A CN201210532360 A CN 201210532360A CN 103012799 A CN103012799 A CN 103012799A
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- phenyl
- silicon resin
- silicone resin
- thiazolinyl
- straight
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- 229920005989 resin Polymers 0.000 title claims abstract description 28
- 239000011347 resin Substances 0.000 title claims abstract description 28
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- MJULMZZKFYNTHK-UHFFFAOYSA-N ethenyl(phenyl)silicon Chemical compound C=C[Si]C1=CC=CC=C1 MJULMZZKFYNTHK-UHFFFAOYSA-N 0.000 title abstract 4
- 238000004806 packaging method and process Methods 0.000 title abstract 2
- -1 phenyl vinyl Chemical group 0.000 claims abstract description 43
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 36
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 18
- 239000010703 silicon Substances 0.000 claims abstract description 18
- 229920002050 silicone resin Polymers 0.000 claims description 38
- 125000004432 carbon atom Chemical group C* 0.000 claims description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 15
- 229910000077 silane Inorganic materials 0.000 claims description 15
- 238000005538 encapsulation Methods 0.000 claims description 13
- 239000012153 distilled water Substances 0.000 claims description 12
- 238000000605 extraction Methods 0.000 claims description 12
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 12
- 125000004423 acyloxy group Chemical group 0.000 claims description 10
- 125000000217 alkyl group Chemical group 0.000 claims description 10
- 238000006243 chemical reaction Methods 0.000 claims description 10
- 229910052799 carbon Inorganic materials 0.000 claims description 8
- 230000035484 reaction time Effects 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 8
- 238000004821 distillation Methods 0.000 claims description 7
- 238000005374 membrane filtration Methods 0.000 claims description 7
- 125000002769 thiazolinyl group Chemical group 0.000 claims description 6
- 239000003377 acid catalyst Substances 0.000 claims description 4
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 4
- 125000003118 aryl group Chemical group 0.000 claims description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 150000001335 aliphatic alkanes Chemical class 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 24
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 abstract description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 8
- 239000000741 silica gel Substances 0.000 abstract description 8
- 229910002027 silica gel Inorganic materials 0.000 abstract description 8
- 230000005855 radiation Effects 0.000 abstract description 5
- 229920002379 silicone rubber Polymers 0.000 abstract description 3
- 239000005046 Chlorosilane Substances 0.000 abstract description 2
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 abstract description 2
- 231100000252 nontoxic Toxicity 0.000 abstract description 2
- 230000003000 nontoxic effect Effects 0.000 abstract description 2
- 238000005352 clarification Methods 0.000 abstract 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 21
- 239000012074 organic phase Substances 0.000 description 10
- 238000003756 stirring Methods 0.000 description 7
- 239000000047 product Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 238000009835 boiling Methods 0.000 description 5
- 229960000935 dehydrated alcohol Drugs 0.000 description 5
- 238000006068 polycondensation reaction Methods 0.000 description 5
- 238000010992 reflux Methods 0.000 description 5
- BANXPJUEBPWEOT-UHFFFAOYSA-N 2-methyl-Pentadecane Chemical compound CCCCCCCCCCCCCC(C)C BANXPJUEBPWEOT-UHFFFAOYSA-N 0.000 description 4
- PXJZCBUXFVZSLL-UHFFFAOYSA-N CO[SiH2]OC.C=CC Chemical compound CO[SiH2]OC.C=CC PXJZCBUXFVZSLL-UHFFFAOYSA-N 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- AUEJBKCWXPYRGZ-UHFFFAOYSA-N 1,1'-biphenyl diethoxysilane Chemical compound C(C)O[SiH2]OCC.C1(=CC=CC=C1)C1=CC=CC=C1 AUEJBKCWXPYRGZ-UHFFFAOYSA-N 0.000 description 2
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 2
- 229940043268 2,2,4,4,6,8,8-heptamethylnonane Drugs 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 239000003729 cation exchange resin Substances 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 2
- KUVMKLCGXIYSNH-UHFFFAOYSA-N isopentadecane Natural products CCCCCCCCCCCCC(C)C KUVMKLCGXIYSNH-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010189 synthetic method Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 2
- VKPSKYDESGTTFR-UHFFFAOYSA-N 2,2,4,6,6-pentamethylheptane Chemical compound CC(C)(C)CC(C)CC(C)(C)C VKPSKYDESGTTFR-UHFFFAOYSA-N 0.000 description 1
- QPURLCLLBDLDGO-UHFFFAOYSA-N CCCCCCCCCCCCCCCCCCO[Si](=O)C1=CC=CC=C1 Chemical compound CCCCCCCCCCCCCCCCCCO[Si](=O)C1=CC=CC=C1 QPURLCLLBDLDGO-UHFFFAOYSA-N 0.000 description 1
- CMPPMAWHJGPAHS-UHFFFAOYSA-N Cl[SiH3].CC=C Chemical compound Cl[SiH3].CC=C CMPPMAWHJGPAHS-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- YFCGDEUVHLPRCZ-UHFFFAOYSA-N [dimethyl(trimethylsilyloxy)silyl]oxy-dimethyl-trimethylsilyloxysilane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C YFCGDEUVHLPRCZ-UHFFFAOYSA-N 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- YGZSVWMBUCGDCV-UHFFFAOYSA-N chloro(methyl)silane Chemical compound C[SiH2]Cl YGZSVWMBUCGDCV-UHFFFAOYSA-N 0.000 description 1
- GTPDFCLBTFKHNH-UHFFFAOYSA-N chloro(phenyl)silicon Chemical compound Cl[Si]C1=CC=CC=C1 GTPDFCLBTFKHNH-UHFFFAOYSA-N 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 description 1
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000796 flavoring agent Substances 0.000 description 1
- 235000019634 flavors Nutrition 0.000 description 1
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- XJWOWXZSFTXJEX-UHFFFAOYSA-N phenylsilicon Chemical class [Si]C1=CC=CC=C1 XJWOWXZSFTXJEX-UHFFFAOYSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- ZYMHKOVQDOFPHH-UHFFFAOYSA-N trimethoxy(oct-1-enyl)silane Chemical compound CCCCCCC=C[Si](OC)(OC)OC ZYMHKOVQDOFPHH-UHFFFAOYSA-N 0.000 description 1
- RKLXSINPXIQKIB-UHFFFAOYSA-N trimethoxy(oct-7-enyl)silane Chemical compound CO[Si](OC)(OC)CCCCCCC=C RKLXSINPXIQKIB-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
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- Silicon Polymers (AREA)
Abstract
The invention relates to the field of an organic silica gel material and discloses phenyl vinyl net-shaped silicon resin with a high refraction rate for LED (Light-Emitting Diode) packaging and a preparation method of the phenyl vinyl silicon resin. The organic silicon resin is phenyl vinyl organic silicon resin with a net-shaped structure. According to the preparation method, chlorosilane and a non-toxic and harmless extracting agent in the prior art are not used to replace toluene in the prior art, so that damages to a human body are not caused and the pollution to the environment is not caused. The phenyl vinyl organic silicon resin disclosed by the invention not only has the properties of high refraction rate, high transparency, clarification and transparency and the like; and the phenyl vinyl silicon resin has good compatibility and dispersity so that silicon rubber has the excellent performances of good rebound resilience, tearing resistance, impact resistance, thermal resistance, radiation resistance, long service life and the like.
Description
Technical field
The present invention relates to the organic silica gel Material Field, is a kind of silicone resin for LED encapsulation and preparation method thereof specifically.
Background technology
LED(Lighting Emitting Diode) being led lighting, is a kind of light emitting semiconductor device.The light-emitting devices such as photodiode (LED) are emerging environmental protection light sources, and actively promote the use of countries in the world.And for the luminous element encapsulation of the type material, except requiring to possess from the function of outer protection luminous element, for the brightness that prevents luminous element reduces, also require to possess the transparency of height.
At present, mainly to adopt the Resins, epoxy with good transparency be packaged material to the LED packaged material.Use Resins, epoxy as the LED of packaged material behind life-time service owing under the UV-irradiation of led chip emission, can xanthochromia occur inevitably, cause its transmittance to descend Dimming.Based on more and more higher to the requirement of LED packaged material, Resins, epoxy can not satisfy the encapsulation requirement of LED.Through the years of researches development, have and adopt the organic silica gel material (patent No. is CN101414655) with high refractive index, optical throughput can improve 5-8%.The LED product of the encapsulation that silicone resin material is made, have high-clarity (transmittance is greater than 95%), radiation hardness, thermotolerance good, shine for a long time without xanthochromia, can not crack through high temperature, greatly prolong the work-ing life of LED packaged material and the superior advantages such as cementability, its performance is far superior to Resins, epoxy.Along with development trend now, the energy in short supply, putting before environmental protection and the strategy of sustainable development, increasing Resins, epoxy will be replaced by silicone resin.
The organic silica gel material is divided into two types: a kind of is the methylsiloxane glue material of low-refraction, and another kind is the phenyl organosilicon material with high refractive index.The organic silica gel material that generally uses on the market mainly is the methylsiloxane glue material, and current power-type LED because the specific refractory power of methylsiloxane glue material is low, can not satisfy power type LED encapsulation just in flourish and widespread use fully.Phenyl organic silica gel material has the characteristics such as high refractive index, thermotolerance be good, and the LED packaged material that more is applicable to power-type than methylsiloxane glue material uses.
The phenyl thiazolinyl organic silica gel material of report all is to use phenyl thiazolinyl silicone resin both at home and abroad.Phenyl thiazolinyl silicone resin is a kind of very unique silicone resin, and it has the excellent properties such as high refractive index, high transmission rate, the good radiation hardness of rebound resilience.Present known aminomethyl phenyl thiazolinyl silicone resin mainly is divided into two kinds: a kind of is that methyl chlorosilane, phenyl chlorosilane, methyl ethylene chlorosilane, toluene etc. are main raw material, such as the method for describing in patent CN101979427A, CN1798810A, CN101343365A, WO2004107458, US20050212008, US0040116640.The aminomethyl phenyl thiazolinyl silicone resin that this method is synthetic be because the speed difference of hydrolysis can cause the skewness of group, and produces obnoxious flavour and the material of a large amount of hydrogenchloride, contaminate environment, electronic product.This method cycle is short in addition, efficient is low, complicated operation, reaction fierce, product is complicated, the shortcomings such as the specific refractory power of the aminomethyl phenyl thiazolinyl silicone resin that finally obtains is low, poor transparency.Another is to be starting material with the alcoxyl silane of different functionality and octadecyloxy phenyl oxosilane, acidic cation-exchange resin etc., such as the method for describing in patent CN101475689A, CN101717512A, CN101109823A, CN101016446A.Long, the difficult control of preparation process of this method cycle, the various complexity of step, efficient is low, reaction product is complicated, the acidic cation-exchange resin residual color cause product not clear affect the problems such as product performance.
In sum, there are some problems in synthetic phenyl thiazolinyl silicone resin and the synthetic method thereof of existing technology.Therefore, this environmental protection light source industry is badly in need of solving provides that a kind of specific refractory power is high, the better phenyl thiazolinyl of transparency silicone resin, and provide a kind of raw material to be easy to get, simple to operate, reaction conditions is gentle, the time is short, cost is low, environmentally safe, be convenient to the silicone resin synthetic method of suitability for industrialized production.
Summary of the invention
In order to address the above problem, the invention provides a kind ofly have that high refractive index, high transmission rate, clear, rebound resilience are good, the advantages such as phenyl thiazolinyl silicone resin that performance and raw material are easy to get, the industry preparation is easy of the excellences such as anti tear, anti-impact force, thermotolerance are good, radiation hardness, long service life.
The present invention is achieved in that
Silicone resin is used in a kind of LED encapsulation, and described silicone resin is for having the cancellated thiazolinyl active group phenyl polysiloxane that contains.
Preferably, described silicone resin is represented by following general formula:
Wherein, R, R 〞, R " ' be the straight or branched aryl of straight or branched alkyl, acyloxy or 6～20 carbon atoms of identical or not identical 1～6 carbon atom or the aralkyl of 7～20 carbon atoms; R' is the straight or branched thiazolinyl of 2～6 carbon atoms.
Preferably, described R, R 〞, R " ' be identical or different methyl or ethyl or phenyl or phenmethyl or styroyls.
Preferably, described R ' is vinyl.
Another purpose of the present invention provides a kind of method that silicone resin is used in described LED encapsulation for preparing, and described method comprises the steps:
A) under acid catalyst, drip the silane agent contain phenyl functional group, polyreaction is carried out in the silane agent that contains alkenyl-functional groups;
B) add extraction agent, based target contains phenyl thiazolinyl web-like silicon resin, and the control temperature of reaction is 50～
90 ℃, 1～7 hour reaction times;
C) product is left standstill, the layer that anhydrates cleans to neutrality with distilled water with phenyl thiazolinyl web-like silicon resin, obtains being dissolved in the phenyl thiazolinyl web-like silicon resin solution of extraction agent;
D) with neutrality contain phenyl thiazolinyl web-like silicon resin solution, be the membrane filtration of 0.5 ~ 5 μ m with the aperture after, low-boiling-point substance is removed in underpressure distillation, obtains phenyl thiazolinyl web-like silicon resin.
Preferably, the described structural formula that contains the silane agent of phenyl functional group is: R
1(R
2O)
3Si or R
1(R
2O)
2Si R
3, wherein, R
1, R
3Be the straight or branched aryl of straight or branched alkyl, acyloxy or 6～20 carbon atoms of 2～6 identical or not identical carbon atoms or the aralkyl of 7～20 carbon atoms, R
2Straight or branched alkyl, acyloxy for 1-6 carbon atom.The described silane agent that contains phenyl functional group can for but be not limited to as follows:
Phenyl triethoxysilane;
Styroyl (trimethoxy) silane;
Phenyltrimethoxysila,e;
Phenylbenzene diethoxy siloxanes.
It is preferably, described that to contain alkenyl-functional groups silane agent structural formula be R
1(R
2O)
2SiR
3Or R
1(R
2O)
3Si, wherein R
1It is the straight or branched thiazolinyl of 2～6 carbon atoms; R
2, R
3Straight or branched alkyl, acyloxy for 1～6 identical or not identical carbon atom.Described contain the agent of alkenyl-functional groups silane can for but be not limited to as follows:
Methyl ethylene dimethoxy silane;
Vinyltrimethoxy silane;
Vinyltriethoxysilane;
The octenyl Trimethoxy silane.
Preferably, described extraction agent is isomeric alkane or methyl oligosiloxane.
Optionally, the in the preparation process a) step increase the organoalkoxysilane agent, be specially: under acid catalyst, polyreaction is carried out in the silane agent that drips the silane agent that contains alkenyl-functional groups, organoalkoxysilane agent, phenyl functional group.
Preferably, the structural formula of described organoalkoxysilane agent is R
1(R
2O)
2Si R
3, R wherein
1, R
2, R
3Straight or branched alkyl, acyloxy for 1～6 identical or not identical carbon atom.Described organoalkoxysilane agent agent can for but be not limited to as follows:
Dimethyldiethoxysilane;
Dimethyldimethoxysil,ne;
Phenyl thiazolinyl silicone resin provided by the invention not only has the characteristics such as high refractive index, high transmission rate, clear, has that rebound resilience is good, an excellent properties such as anti tear, anti-impact force, thermotolerance are good, radiation hardness, long service life.And this phenyl Silicon Containing Hydrogen resin has good consistency and dispersiveness, crosslinked with linking agent initiation addition reaction, thereby produce firmly Chemical bond with silicon rubber, improve the mechanical strength of silicon rubber, and along with the optimum value that is increased to of phenyl thiazolinyl web-like silicon resin demand, it is large that cross-linking density becomes, and crosslinkedly is tending towards perfect, mechanical property (such as tensile strength and tensile yield) can improve gradually, and the cementability of end properties is better, shear bonding strength has significant effect.
The preparation method of phenyl thiazolinyl silicone resin provided by the invention does not adopt chlorosilane of the prior art, nontoxic extraction agent to replace toluene of the prior art, can not damage human body, can be to environment yet.Adopt the phenyl thiazolinyl silicone resin of present method preparation to have excellent performance, reaction conditions is gentle, the reaction times is short, simple to operate, and raw material is easy to get, cost is low, environmentally safe, be convenient to suitability for industrialized production.
Embodiment
Embodiment 1:
With stirring, reflux condensing tube, add respectively 140g distilled water in the four-hole boiling flask of thermometer and dropping funnel, 1.0g1N hydrochloric acid, after mixing, drip the 360.56g phenyl triethoxysilane, 198.35g methyl ethylene dimethoxy silane, 180.11g dimethyldimethoxysil,ne, add again the 100g dehydrated alcohol, 10g37% hydrochloric acid and 170g isohexadecane extraction agent carry out cohydrolysis-polycondensation, temperature of reaction is 85 ℃, the control reaction times is standing demix behind the 2h, water is removed, with distilled water organic phase is washed neutrality, be behind the membrane filtration of 0.5 μ m with the organic phase of neutrality with the aperture, underpressure distillation (110～130 ℃/-0.096Mpa) remove low-boiling-point substance, obtain the cancellated silicone resin of phenyl thiazolinyl of clear.
Embodiment 2:
With stirring, reflux condensing tube, add respectively 200g distilled water in the four-hole boiling flask of thermometer and dropping funnel, 1.2g1N hydrochloric acid, after mixing, drip 339.51g styroyl (trimethoxy) silane, 272g phenylbenzene diethoxy silane, 198.35g methyl ethylene dimethoxy silane, add again the 100g dehydrated alcohol, 10g37% hydrochloric acid and 380g isohexadecane extraction agent carry out cohydrolysis-polycondensation, temperature of reaction is 90 ℃, the control reaction times is standing demix behind the 1h, water is removed, with distilled water organic phase is washed neutrality, be behind the membrane filtration of 0.5 μ m with the organic phase of neutrality with the aperture, underpressure distillation (110～130 ℃/-0.096Mpa) remove low-boiling-point substance, obtain the cancellated silicone resin of phenyl thiazolinyl of clear.
Embodiment 3:
With stirring, reflux condensing tube, add respectively 140g distilled water in the four-hole boiling flask of thermometer and dropping funnel, 1.g1N hydrochloric acid, after mixing, drip 408g phenylbenzene diethoxy silane, 180.11g dimethyldimethoxysil,ne, 285.47g vinyltriethoxysilane, 360.56g phenyl triethoxysilane, add again the 50g dehydrated alcohol, 10g37% hydrochloric acid and 250g decamethyl tetrasiloxane extraction agent carry out cohydrolysis-polycondensation, temperature of reaction is 85 ℃, the control reaction times is standing demix behind the 2h, water is removed, with distilled water organic phase is washed neutrality, be behind the membrane filtration of 0.5 μ m with the organic phase of neutrality with the aperture, underpressure distillation (110～130 ℃/-0.096Mpa) remove low-boiling-point substance, obtain the cancellated silicone resin of phenyl thiazolinyl of clear.
Embodiment 4:
Add respectively 98g distilled water, 0.5g hydrochloric acid in the four-hole boiling flask of stirring, reflux condensing tube, thermometer and dropping funnel, stirring at room is mixed.Drip the 360.56g phenyl triethoxysilane under the room temperature, 244.36g dimethoxydiphenylsilane, 198.35g methyl ethylene dimethoxy silane, 180.11g dimethyldimethoxysil,ne, add again the 70g dehydrated alcohol, 10g37% hydrochloric acid and 200g hexamethyldisiloxane extraction agent carry out cohydrolysis-polycondensation, temperature of reaction is 50 ℃, the control reaction times is standing demix behind the 7h, water is removed, with distilled water organic phase is washed neutrality, be behind the membrane filtration of 0.5 μ m with the organic phase of neutrality with the aperture, underpressure distillation (110～130 ℃/-0.096Mpa) remove low-boiling-point substance, obtain the cancellated silicone resin of phenyl thiazolinyl of clear.
Embodiment 5:
Add respectively 140g distilled water, 1.0g hydrochloric acid in the four-hole boiling flask of stirring, reflux condensing tube, thermometer and dropping funnel, stirring at room is mixed.Drip 240.37g phenmethyl triethoxyl silane under the room temperature, 232.40g 7-octenyl Trimethoxy silane, 180.11g dimethyldimethoxysil,ne, add again the 70g dehydrated alcohol, 10g37% hydrochloric acid and 225g Permethyl 99A. extraction agent carry out cohydrolysis-polycondensation, temperature of reaction is 70 ℃, the control reaction times is standing demix behind the 2h, water is removed, with distilled water organic phase is washed neutrality, be behind the membrane filtration of 0.5 μ m with the organic phase of neutrality with the aperture, underpressure distillation (110～130 ℃/-0.096Mpa) remove low-boiling-point substance, obtain the cancellated silicone resin of phenyl thiazolinyl of clear.
The phenyl thiazolinyl web-like silicon resin that above-described embodiment 1～5 provides is done following test to the impact of LED (luminous element) organosilicon encapsulating material performance, and test result sees Table 1, table 2:
The performance of table 1 phenyl thiazolinyl web-like silicon resin
Table 2 phenyl thiazolinyl web-like silicon resin is on the impact of LED organosilicon encapsulating material performance
Wherein SP-605, SA34-7A are the phenyl thiazolinyl silicone resin of selling on the market, and SP-605 produces for profit standing grain company, and SA34-7A is that the pretty company of reading produces.
Can find out from above-mentioned test result, adopt the LED(luminous element of phenyl thiazolinyl silicone resin provided by the invention preparation) encapsulation all obtained effectively improvement with performances such as silica gel material specific refractory power, transparency, rebound resilience, anti tear, anti-impact forces.
The above technical scheme that the embodiment of the invention is provided is described in detail, used specific case herein principle and the embodiment of the embodiment of the invention are set forth, the explanation of above embodiment is only applicable to help to understand the principle of the embodiment of the invention; Simultaneously, for one of ordinary skill in the art, according to the embodiment of the invention, all will change on embodiment and range of application, in sum, this description should not be construed as limitation of the present invention.
Claims (8)
1. silicone resin is used in a LED encapsulation, and it is characterized in that: described silicone resin is for having the cancellated thiazolinyl active group phenyl polysiloxane that contains.
2. silicone resin is used in LED encapsulation as claimed in claim 1, and it is characterized in that: described silicone resin is represented by following general formula:
Wherein, R, R 〞, R " ' be the straight or branched aryl of straight or branched alkyl, acyloxy or 6～20 carbon atoms of identical or not identical 1～6 carbon atom or the aralkyl of 7～20 carbon atoms; R' is the straight or branched thiazolinyl of 2～6 carbon atoms.
3. one kind prepares claim 1 or 2 described LED encapsulation with the method for silicone resins, and it is characterized in that: described method comprises the steps:
A) under acid catalyst, drip the silane agent contain phenyl functional group, polyreaction is carried out in the silane agent that contains alkenyl-functional groups;
B) add extraction agent, based target contains phenyl thiazolinyl web-like silicon resin, and the control temperature of reaction is 50～
90 ℃, 1～7 hour reaction times;
C) product is left standstill, the layer that anhydrates cleans to neutrality with distilled water with phenyl thiazolinyl web-like silicon resin, obtains being dissolved in the phenyl thiazolinyl web-like silicon resin solution of extraction agent;
D) with neutrality contain phenyl thiazolinyl web-like silicon resin solution, be the membrane filtration of 0.5 ~ 5 μ m with the aperture after, low-boiling-point substance is removed in underpressure distillation, obtains phenyl thiazolinyl web-like silicon resin.
4. the LED for preparing as claimed in claim 3 encapsulates the method for using silicone resin, and it is characterized in that: the described structural formula that contains the silane agent of phenyl functional group is: R
1(R
2O)
3Si or R
1(R
2O)
2Si R
3, wherein, R
1, R
3Be the straight or branched aryl of straight or branched alkyl, acyloxy or 6～20 carbon atoms of 2～6 identical or not identical carbon atoms or the aralkyl of 7～20 carbon atoms, R
2Straight or branched alkyl, acyloxy for 1-6 carbon atom.
5. as claimed in claim 3ly prepare LED encapsulation with the method for silicone resin, it is characterized in that: described to contain alkenyl-functional groups silane agent structural formula be R
1(R
2O)
2SiR
3Or R
1(R
2O)
3Si, wherein R
1It is the straight or branched thiazolinyl of 2～6 carbon atoms; R
2, R
3Straight or branched alkyl, acyloxy for 1～6 identical or not identical carbon atom.
6. the LED for preparing as claimed in claim 3 encapsulates the method for using silicone resin, and it is characterized in that: described extraction agent is isomeric alkane or methyl oligosiloxane.
7. encapsulate the method for using silicone resin such as the described LED for preparing of one of claim 4 ~ 6, it is characterized in that: a) the step increase organoalkoxysilane agent in the preparation process, be specially: under acid catalyst, polyreaction is carried out in the silane agent that drips the silane agent contain alkenyl-functional groups, organoalkoxysilane agent, phenyl functional group.
8. the LED for preparing as claimed in claim 7 encapsulates the method for using silicone resin, and it is characterized in that: the structural formula of described organoalkoxysilane agent is R
1(R
2O)
2Si R
3, R wherein
1, R
2, R
3Straight or branched alkyl or acyloxy for 1～6 identical or not identical carbon atom.
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| CN201210532360.7A CN103012799B (en) | 2012-12-11 | 2012-12-11 | A kind of LED phenylakenyl silicone resin and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210532360.7A CN103012799B (en) | 2012-12-11 | 2012-12-11 | A kind of LED phenylakenyl silicone resin and preparation method thereof |
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| CN103012799A true CN103012799A (en) | 2013-04-03 |
| CN103012799B CN103012799B (en) | 2015-08-19 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104231273A (en) * | 2014-09-16 | 2014-12-24 | 上海应用技术学院 | High-viscosity self-crosslinking LED package gum resin and preparation method thereof |
| CN109679499A (en) * | 2018-12-29 | 2019-04-26 | 中山市聚力有机硅技术有限公司 | It is a kind of with the excellent silicone release lotion and preparation method thereof that anchor performance |
| CN109694648A (en) * | 2018-12-29 | 2019-04-30 | 中山市聚力有机硅技术有限公司 | A kind of release lotion of organic fluorinated silicone and preparation method thereof with good stability energy |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101717512A (en) * | 2009-11-20 | 2010-06-02 | 苏州大学 | Method for preparing methyl phenyl vinyl silicone resin |
-
2012
- 2012-12-11 CN CN201210532360.7A patent/CN103012799B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101717512A (en) * | 2009-11-20 | 2010-06-02 | 苏州大学 | Method for preparing methyl phenyl vinyl silicone resin |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104231273A (en) * | 2014-09-16 | 2014-12-24 | 上海应用技术学院 | High-viscosity self-crosslinking LED package gum resin and preparation method thereof |
| CN109679499A (en) * | 2018-12-29 | 2019-04-26 | 中山市聚力有机硅技术有限公司 | It is a kind of with the excellent silicone release lotion and preparation method thereof that anchor performance |
| CN109694648A (en) * | 2018-12-29 | 2019-04-30 | 中山市聚力有机硅技术有限公司 | A kind of release lotion of organic fluorinated silicone and preparation method thereof with good stability energy |
| CN109694648B (en) * | 2018-12-29 | 2020-11-13 | 中山市聚力有机硅技术有限公司 | Organic fluorine-silicon release emulsion with good stability and preparation method thereof |
| CN109679499B (en) * | 2018-12-29 | 2021-01-15 | 中山市聚力有机硅技术有限公司 | Organic silicon release emulsion with excellent anchoring performance and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| CN103012799B (en) | 2015-08-19 |
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Effective date of registration: 20170330 Address after: 528400 Guangdong Torch Development Zone, Zhongshan science and Technology West Wu Song Road, No. 1, No. four, building 8, room Patentee after: Zhongshan cohesion silicone Technology Co., Ltd. Address before: 510630 Guangzhou province high tech Industrial Development Zone, Guangzhou Science City spectrum West Road, No. 108, on the first floor of the workshop on the eastern side of the room, room 69 Patentee before: Cao Jianlin |
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