CN102995074A - Cyanide-free alkaline copper plating solution - Google Patents
Cyanide-free alkaline copper plating solution Download PDFInfo
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- CN102995074A CN102995074A CN2012104208194A CN201210420819A CN102995074A CN 102995074 A CN102995074 A CN 102995074A CN 2012104208194 A CN2012104208194 A CN 2012104208194A CN 201210420819 A CN201210420819 A CN 201210420819A CN 102995074 A CN102995074 A CN 102995074A
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- cyanide
- copper plating
- plating solution
- free alkaline
- alkaline copper
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Abstract
The invention discloses a cyanide-free alkaline copper plating solution. The cyanide-free alkaline copper plating solution is characterized in that the pH (Potential of Hydrogen) ranges from 8.0 to 9.0; and one liter of the cyanide-free alkaline copper plating solution comprises 120 to 170g of methylene diphosphate, 20 to 30g of copper chloride, 10 to 20g of silver carbonate ion, 10 to 20g of hydroxide salt, and 10 to 30g of complexing agent. The cyanide-free alkaline copper plating solution has the advantages that prescription is reasonable, temperature range is wide in application, current efficiency is high, coating is fine in crystallization and high in covering capacity, nice in appearance, color and gloss and the wastewater can be treated easily, and cyanide-free alkaline copper plating solution can be used to replace virulent cyaniding electrocoppering solution.
Description
Technical field
The present invention relates to a kind of cyanide-free alkaline copper plating solution.
Background technology
Contain cyanide ion in the cyanide electroplating, toxicity is large, and waste water and waste liquid are difficult, and contaminate environment is serious, and is detrimental to health.Existing cyanide-free copper electroplating technique mainly contains pyrophosphate electroplating copper, vitriol electro-coppering, and wherein, pyrophosphate electroplating copper system large-scale application is processed but generally also need to carry out cyanide pre-plating copper in production, and plating solution maintenance is complicated, and cost is higher.Therefore, should provide a kind of new technical scheme to address the above problem.
Summary of the invention
The objective of the invention is: for above-mentioned deficiency, provide a kind of cyanide-free alkaline copper plating solution
For achieving the above object, the technical solution used in the present invention is:
A kind of cyanide-free alkaline copper plating solution, the pH value of this cyanide-free alkaline copper plating solution is between the 8.0-9.0, and the cyanide-free alkaline copper plating solution of every 1L comprises: Medronate 120-170g, cupric chloride 20-30g, carbanion 10-20g, hydroxide salt 10-20g and complexing agent 10-30g.
Described complexing agent is citric acid three aluminium.
Described hydroxide salt is sodium hydroxide or potassium hydroxide.
The temperature of described floride-free alkaline copper plating bath is 40-60 ℃.
Described carbanion is copper carbonate or salt of wormwood.
Advantage of the present invention is: the present invention fills a prescription rationally, the use temperature wide ranges, and current efficiency is high, and the careful hiding power of coating crystallization is strong, and appearance luster is good, and wastewater treatment is easy, can substitute the cyanide electroplating process for copper that contains severe toxicity.
Embodiment
Below in conjunction with embodiment the present invention is described in further detail.Following embodiment is to illustrate of the present invention, but does not limit protection scope of the present invention.
Embodiment 1
A kind of cyanide-free alkaline copper plating solution, the pH value of this cyanide-free alkaline copper plating solution is 8.0, the cyanide-free alkaline copper plating solution of every 1L comprises: Medronate 120g, cupric chloride 20g, copper carbonate ion 10g, sodium hydroxide 10g and citric acid three aluminium 20g, the temperature of this free-floride alkaline copper plating bath is 40 ℃.
Embodiment 2
A kind of cyanide-free alkaline copper plating solution, the pH value of this cyanide-free alkaline copper plating solution is 8.5, the cyanide-free alkaline copper plating solution of every 1L comprises: Medronate 150g, cupric chloride 25g, copper carbonate ion 15g, potassium hydroxide 15g and citric acid three aluminium 15g, the temperature of this free-floride alkaline copper plating bath is 50 ℃.
Embodiment 3
A kind of cyanide-free alkaline copper plating solution, the pH value of this cyanide-free alkaline copper plating solution is 9, the cyanide-free alkaline copper plating solution of every 1L comprises: Medronate 170g, cupric chloride 25g, copper carbonate ion 20g, sodium hydroxide 15g and citric acid three aluminium 15g, the temperature of this free-floride alkaline copper plating bath is 60 ℃.
Claims (5)
1. cyanide-free alkaline copper plating solution, it is characterized in that: the pH value of this cyanide-free alkaline copper plating solution is between the 8.0-9.0, and the cyanide-free alkaline copper plating solution of every 1L comprises: Medronate 120-170g, cupric chloride 20-30g, carbanion 10-20g, hydroxide salt 10-20g and complexing agent 10-30g.
2. a kind of cyanide-free alkaline copper plating solution according to claim 1, it is characterized in that: described complexing agent is citric acid three aluminium.
3. a kind of cyanide-free alkaline copper plating solution according to claim 1, it is characterized in that: described hydroxide salt is sodium hydroxide or potassium hydroxide.
4. a kind of floride-free alkaline copper plating bath according to claim 1, it is characterized in that: the temperature of described floride-free alkaline copper plating bath is 40-60 ℃.
5. a kind of floride-free alkaline copper plating bath according to claim 1, it is characterized in that: described carbanion is copper carbonate or salt of wormwood.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104208194A CN102995074A (en) | 2012-10-30 | 2012-10-30 | Cyanide-free alkaline copper plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104208194A CN102995074A (en) | 2012-10-30 | 2012-10-30 | Cyanide-free alkaline copper plating solution |
Publications (1)
| Publication Number | Publication Date |
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| CN102995074A true CN102995074A (en) | 2013-03-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN2012104208194A Pending CN102995074A (en) | 2012-10-30 | 2012-10-30 | Cyanide-free alkaline copper plating solution |
Country Status (1)
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102021617A (en) * | 2010-12-10 | 2011-04-20 | 广州晋惠化工科技有限公司 | Cyanide-free electroplating bath for copper plating of iron and steel parts |
| CN102242381A (en) * | 2011-06-29 | 2011-11-16 | 杭州阿玛尔科技有限公司 | Alkaline non-cyanide copper plating solution with main coordination agent of methylenediphosphonate |
-
2012
- 2012-10-30 CN CN2012104208194A patent/CN102995074A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102021617A (en) * | 2010-12-10 | 2011-04-20 | 广州晋惠化工科技有限公司 | Cyanide-free electroplating bath for copper plating of iron and steel parts |
| CN102242381A (en) * | 2011-06-29 | 2011-11-16 | 杭州阿玛尔科技有限公司 | Alkaline non-cyanide copper plating solution with main coordination agent of methylenediphosphonate |
Non-Patent Citations (5)
| Title |
|---|
| 庄瑞舫: "羟基乙叉二膦酸电解液镀铜的研究和生产应用（I）待续", 《电镀与精饰》, vol. 34, no. 8, 31 August 2012 (2012-08-31), pages 10 - 13 * |
| 张强: "环保型HEDP溶液体系镀铜新工艺及动力学研究", 《中国优秀硕士学位论文全文数据库 工程科技I辑》, no. 3, 15 March 2011 (2011-03-15), pages 6 - 7 * |
| 杨发带: "HEDP镀铜综述", 《电镀与精饰》, no. 4, 31 August 1982 (1982-08-31), pages 32 - 36 * |
| 郑精武等: "亚甲基二膦酸为配位体的无情碱性镀铜", 《物理化学学报》, vol. 27, no. 1, 31 January 2011 (2011-01-31), pages 143 - 148 * |
| 钱金录等: "HEDP一次镀铜", 《电镀与精饰》, no. 4, 31 August 1982 (1982-08-31), pages 37 - 38 * |
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Application publication date: 20130327 |