CN102976360B - Thiocyanate-containing gold complex as well as preparation method and application thereof - Google Patents
Thiocyanate-containing gold complex as well as preparation method and application thereof Download PDFInfo
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Abstract
本发明涉及一种含硫氰酸根的金络合物及其制备方法和应用,该化合物的通式为Mr[AuLm]q·xH2O,L代表充当金配体的硫氰酸根,m代表其配位数,[AuLm]是该络合物的核心成份,q代表[AuLm]的数量,M代表与[AuLm]平衡的阳离子,r代表M的数目,x代表该金络合物分子中含有的结晶水的数量;Au的价态为正1价;[AuLm]整体价态为零价或负1价;其中,m、q均为正整数,r、x均为零或正整数。该类络合物可应用于电镀金、化学沉金、药物、陶瓷、催化剂及金纳米材料制造等领域;含硫氰酸根的金络合物也可作为中间体而进一步用于其它金化合物的合成。The present invention relates to a gold complex containing thiocyanate and its preparation method and application. The general formula of the compound is M r [AuL m ] q xH 2 O, L represents the thiocyanate acting as a gold ligand, m represents its coordination number, [AuL m ] is the core component of the complex, q represents the number of [AuL m ], M represents the cation in balance with [AuL m ], r represents the number of M, and x represents the gold The amount of crystal water contained in the complex molecule; the valence of Au is positive 1 valence; [AuL m ] the overall valence is zero valence or negative 1 valence; where, m and q are both positive integers, and r and x are both is zero or a positive integer. This type of complex can be applied to the fields of electroplating gold, chemical immersion gold, medicine, ceramics, catalyst and gold nanomaterials manufacturing; the gold complex containing thiocyanate can also be used as an intermediate and further used in the production of other gold compounds. synthesis.
Description
技术领域 technical field
本发明涉及一类不含腈、氰{CN—}的金络合物(也称配位化合物)的制备方法及其应用。 The present invention relates to a preparation method and application of a kind of gold complex compound (also called coordination compound) without nitrile and cyanide {CN — }.
背景技术 Background technique
在印刷线路板(简称PCB)生产、五金电镀、金属粉末、药物(如治疗风湿病)、催化剂制造和湿法提金等行业中,均涉及到在水或其它介质中有一定溶解性的亚金络合物,这类化合物的特点是中心金属金与配体之间形成了配位健。含氰或腈的金络合物是当前镀金所用的主要金盐,如电镀金、化学镀金所用的亚金氰化物M+[Au(CN)2]—(M=Na+,K+,NH4 +)、含丙二腈的柠檬酸金盐[CN200710193015.4;CN200710193014.X ]等,以及黄金提取中用的氰化物和有机腈类化合物等,氰、腈的存在使得它们在生产、使用过程和使用后的废水处理中均存在着极大的安全隐患及环境危害问题。以亚硫酸根、硫代硫酸根作为配体的金配合物及其溶液,其稳定性低因而限制了它们的使用;以卤素阴离子作为配体的金配合物及其溶液,其腐蚀性、稳定性、成本和具体的应用性能等问题也限制了它在表面处理等领域的应用。硫氰酸根可作为金配体而与金形成相关的金络合物,其中室温下“亚金—硫氰酸根”络阴离子的稳定常数的对数值高达23以上[①黎鼎鑫,贵金属提取与精炼,中南工业大学出版社(1991),PP:64],是一种毒性低、环境友好而值得探索的金络合物;但是,全球市场上至今仍无相关的络合物产品出现[②余健民,贵金属化合物及配合物合成手册,化学工业出版社(2009),PP:65;③http://www.jandjmaterials.com;④http://www.surepure.com;⑤http://en.wikipedia.org],也无该类亚金络合物纯品的合成、性能及使用报道。开发相关的合成工艺和制取方法以制备出含有亚金和硫氰酸根的金络合物,并将其应用在表面处理等领域是本发明的目的。 In industries such as printed circuit board (referred to as PCB) production, metal plating, metal powder, medicine (such as treatment of rheumatism), catalyst manufacturing and wet gold extraction, etc. Gold complexes, this type of compound is characterized by the formation of a coordination bond between the central metal gold and the ligand. Gold complexes containing cyanide or nitrile are the main gold salts currently used in gold plating, such as gold cyanide M + [Au(CN) 2 ] — (M=Na + ,K + ,NH 4 + ), citrate gold salt containing malononitrile [CN200710193015.4; CN200710193014.X], etc., as well as cyanide and organic nitrile compounds used in gold extraction. There are great potential safety hazards and environmental hazards in both the process and the wastewater treatment after use. Gold complexes and their solutions using sulfite and thiosulfate as ligands have low stability and thus limit their use; gold complexes and solutions using halogen anions as ligands are corrosive, stable Problems such as safety, cost and specific application performance also limit its application in fields such as surface treatment. Thiocyanate can be used as a gold ligand to form gold complexes related to gold, in which the logarithmic value of the stability constant of the "aureous-thiocyanate" complex anion at room temperature is as high as 23 or more [①Li Dingxin, Extraction and Refining of Precious Metals, Central South University of Technology Press (1991), PP: 64], is a gold complex with low toxicity, environmental friendliness and worth exploring; however, there is still no related complex product on the global market [② Yu Jianmin, Handbook of Noble Metal Compounds and Complex Synthesis, Chemical Industry Press (2009), PP: 65; ③http://www.jandjmaterials.com; ④http://www.surepure.com; ⑤http://en.wikipedia.org] , and there is no report on the synthesis, performance and use of pure gold metal complexes of this class. It is the purpose of the present invention to develop related synthesis techniques and preparation methods to prepare gold complexes containing aurous and thiocyanate groups, and to apply them in the fields of surface treatment and the like.
发明内容 Contents of the invention
针对现有技术的不足,本发明旨在提供一种含硫氰酸根的金络合物及其制备方法和应用。该金络合物不含有毒的腈、氰{CN—},可以应用于电镀金、化学沉金、药物、陶瓷、催化剂及金纳米材料制造等领域;也可作为中间体而进一步用于其它金化合物的合成。 Aiming at the deficiencies of the prior art, the present invention aims to provide a gold complex containing thiocyanate and its preparation method and application. The gold complex does not contain toxic nitrile, cyanide {CN — }, and can be used in the fields of electroplating gold, chemical immersion gold, medicine, ceramics, catalyst and gold nanomaterials; it can also be used as an intermediate for other Synthesis of gold compounds.
为实现上述目的,本发明的技术方案是: For realizing the above object, technical scheme of the present invention is:
技术方案之一: One of the technical solutions:
一种含硫氰酸根的金络合物,该化合物的通式为Mr[AuLm]q·xH2O, L代表充当金配体的硫氰酸根,m代表其配位数,[AuLm]是该络合物的核心成份,q代表[AuLm]的数量,M代表与[AuLm]平衡的,且使得所述金络合物能在水或其它溶剂中溶解的阳离子,r代表M的数目,x代表该金络合物分子中含有的结晶水的数量;Au的价态为正1价;其中,m、q均为正整数,r、x均为零或正整数。 A gold complex containing thiocyanate, the general formula of the compound is M r [AuL m ] q xH 2 O, L represents the thiocyanate acting as a gold ligand, m represents its coordination number, [AuL m ] is the core component of the complex, q represents the number of [AuL m ], M represents the cation that is in balance with [AuL m ] and enables the gold complex to dissolve in water or other solvents, r Represents the number of M, and x represents the quantity of crystal water contained in the gold complex molecule; the valence of Au is positive 1; wherein, m and q are both positive integers, and r and x are both zero or positive integers.
所述M优选为钾离子、铵离子、钠离子或镁离子。 Said M is preferably potassium ion, ammonium ion, sodium ion or magnesium ion.
所述[AuLm]整体价态优选为零价或负1价。 The overall valence state of [AuL m ] is preferably zero valence or minus 1 valence.
所述金络合物更优选为AuSCN·H2O、NH4[Au(SCN)2]·2H2O或者AuSCN。 The gold complex is more preferably AuSCN·H 2 O, NH 4 [Au(SCN) 2 ]·2H 2 O or AuSCN.
技术方案之二: The second technical solution:
制备所述含硫氰酸根的金络合物的方法:选择不与金化合物原料和硫氰酸盐发生副反应的物质作为分散介质,将含有金化合物的物料与含硫氰酸根的物料按照金与含硫氰酸根的摩尔比为1~5的比例进行混合和反应,以生成含核心成份[AuLm]的物质,然后经浓缩、结晶、固液分离、洗涤纯化、干燥以得到所述含硫氰酸根的金络合物。 The method for preparing the gold complex containing thiocyanate: select a material that does not have a side reaction with the gold compound raw material and thiocyanate as a dispersion medium, and mix the material containing the gold compound and the material containing thiocyanate according to the gold Mix and react with the molar ratio of 1 to 5 containing thiocyanate to generate a substance containing the core component [AuL m ], then concentrate, crystallize, separate solid-liquid, wash and purify, and dry to obtain the substance containing Gold complex of thiocyanate.
所述含金化合物优选选自氯化亚金、硫脲亚金、氯金酸或三氯化金;所述含硫氰酸根的物料优选为硫氰酸铵、硫氰酸钠或硫氰酸钾;所述的分散介质优选为不与金化合物原料、含硫氰酸根原料发生化学反应的惰性物;更优选所述分散介质优选丙酮、乙二醇丁醚等有机溶剂。 The gold-containing compound is preferably selected from aurous chloride, aurous thiourea, chloroauric acid or gold trichloride; the material containing thiocyanate is preferably ammonium thiocyanate, sodium thiocyanate or thiocyanate Potassium; the dispersion medium is preferably an inert substance that does not chemically react with the gold compound raw material and the thiocyanate-containing raw material; more preferably, the dispersion medium is preferably an organic solvent such as acetone, ethylene glycol butyl ether, or the like.
技术方案之三: The third technical solution:
本发明提供了所述含硫氰酸根的金络合物在制备混配型金络合物中的应用,所述混配型金络合物是以硫氰酸根作为外配体,以中性配体作为内配体所形成的混配型金络合物,其化学式为[Au(L* n)Lm]q·xH2O,其中L*代表中性配体,L*选自硫脲类化合物、二甲基海因(Hydantoin)或咪唑类物质,n代表L*的数量,n为正整数;L代表充当金配体的硫氰酸根,m代表其配位数, q代表[Au(L* n)Lm]的数量, x代表该金络合物分子中含有的结晶水的数量;其中,m、s均为不等于零的正整数。 The invention provides the application of the thiocyanate-containing gold complex in the preparation of mixed gold complexes. The mixed gold complex uses thiocyanate as an external ligand, and neutral Ligand as a mixed-type gold complex formed by an internal ligand, its chemical formula is [Au(L * n )L m ] q xH 2 O, where L * represents a neutral ligand, and L * is selected from sulfur Urea compounds, dimethylhydantoin (Hydantoin) or imidazoles, n represents the number of L * , n is a positive integer; L represents the thiocyanate as a gold ligand, m represents its coordination number, q represents [ Au(L * n )L m ], x represents the quantity of crystal water contained in the gold complex molecule; where m and s are both positive integers not equal to zero.
所述混配型金络合物的化学式优选为[Au(ATU)SCN]·H2O,其中ATU是烯丙基硫脲。 The chemical formula of the miscible gold complex is preferably [Au(ATU)SCN]·H 2 O, wherein ATU is allylthiourea.
所述含硫氰酸根的金络合物在电镀金、化学沉金方面、制备陶瓷金水方面的应用。本发明也提供了所述含硫氰酸根的金络合物在药物的制备、催化剂的制备或金纳米材料的制备方面的应用。 The application of the gold complex containing thiocyanate in electroplating gold, chemical immersion gold, and preparation of ceramic gold water. The present invention also provides the application of the thiocyanate-containing gold complex in the preparation of medicines, catalysts or gold nanomaterials.
技术方案之四: The fourth technical solution:
一种混配型金络合物,以硫氰酸根作为外配体,以中性配体作为内配体所形成的混配型金络合物,其化学式为[Au(L* n)Lm]s·xH2O,其中L*代表中性配体,L*选自硫脲类化合物、二甲基海因或咪唑类物质,n代表L*的数量,n为正整数,L代表充当金配体的硫氰酸根,m代表其配位数, s代表[Au(L* n)Lm]的数量, x代表该金络合物分子中含有的结晶水的数量;其中,m、s均为不等于零的正整数。 A mixed gold complex, with thiocyanate as the external ligand and a neutral ligand as the internal ligand, its chemical formula is [Au(L * n ) L m ] s ·xH 2 O, wherein L * represents a neutral ligand, L * is selected from thiourea compounds, dimethylhydantoin or imidazoles, n represents the number of L * , n is a positive integer, L represents Thiocyanate acting as a gold ligand, m represents its coordination number, s represents the number of [Au(L * n )L m ], x represents the number of crystallization water contained in the gold complex molecule; where, m , s are both positive integers not equal to zero.
所述混配型金络合物的化学式优选为[Au(ATU)SCN]·H2O,其中ATU是烯丙基硫脲。 The chemical formula of the miscible gold complex is preferably [Au(ATU)SCN]·H 2 O, wherein ATU is allylthiourea.
下面对本发明做进一步的解释和说明: The present invention is further explained and illustrated below:
该类络合物的化学式通式为Mr[AuLm]q . xH2O,其中:[AuLm]是该络合物的核心成份,q代表在金络合物中这种核心成份的数量,其取值可为1、2、3等整数;m代表这类络合物中的配位数,其取值为不等于零的正整数如1,2,3等。M代表与[AuLm]平衡的阳离子如:钾离子、铵离子、钠离子、镁离子等;以及由有机化合物所形成的阳离子,如由含氨基NH2的有机胺类化合物阳离子化后的阳离子,例如乙二胺(分子式C2H8N2)阳离子化后形成的正一价阳离子(离子式C2H9N2 +),等等。r代表这种阳离子的数目,其取值可为0或1、2、3等整数;x代表该类金络合物分子中可能含有的结晶水的数量,其取值为0或1、2、3等整数。当r为零时该类络合物通式简化为[AuLm]q . xH2O。 The chemical formula of this type of complex is M r [AuL m ] q . xH 2 O, wherein: [AuL m ] is the core component of the complex, and q represents the value of the core component in the gold complex. Quantity, its value can be an integer such as 1, 2, 3; m represents the coordination number in this type of complex, and its value is a positive integer not equal to zero, such as 1, 2, 3, etc. M represents cations balanced with [AuL m ], such as potassium ions, ammonium ions, sodium ions, magnesium ions, etc.; and cations formed by organic compounds, such as cations cationized by organic amine compounds containing amino NH 2 , such as positive monovalent cations (ionic formula C 2 H 9 N 2 + ) formed after cationization of ethylenediamine (molecular formula C 2 H 8 N 2 ), and so on. r represents the number of such cations, and its value can be an integer such as 0 or 1, 2, 3; x represents the amount of crystal water that may be contained in the gold complex molecule, and its value is 0 or 1, 2 , 3 and other integers. When r is zero, the general formula of this kind of complex is simplified to [AuL m ] q . xH 2 O.
与现有技术相比,本发明的优势在于: Compared with the prior art, the present invention has the advantages of:
本发明提供了一种含硫氰酸根的金络合物及其制备方法和应用。该金络合物不含有毒的腈、氰{CN—},可以应用于电镀金、化学沉金、药物、陶瓷、催化剂及金纳米材料制造等领域;也可作为中间体而进一步用于其它金化合物的合成。 The invention provides a gold complex compound containing thiocyanate, its preparation method and application. The gold complex does not contain toxic nitrile, cyanide {CN — }, and can be used in the fields of electroplating gold, chemical immersion gold, medicine, ceramics, catalyst and gold nanomaterials; it can also be used as an intermediate for other Synthesis of gold compounds.
具体实施方式 Detailed ways
下面结合实施例对本发明 做进一步的说明。 Below in conjunction with embodiment the present invention will be further described.
实施例1:Example 1:
取含金量为1克的氯化亚金,将其溶于1升含盐酸和氯化铵的混合液中,室温下向该混合液中滴加质量浓度为5%的硫氰酸铵溶液,使得硫氰酸根与金的摩尔比为1,发生配位沉淀反应,至不再产生沉淀物为止,固液分离,用水或其它亲水性溶剂对所得沉淀物进行洗涤,低温(≤80℃)干燥后得一种固体产品,重1.2克。产品的元素C、H、O、N、S分析的结果表明它为含一个结晶水的硫氰酸亚金AuSCN.H2O,试金法测量的结果表明它的纯度为98%,红外光谱结果显示出它是由硫作为配位元素与亚金进行配位;说明按本法可制备出相应的亚金络合物产品。 Get the aurous chloride that gold content is 1 gram, it is dissolved in 1 liter of the mixed solution that contains hydrochloric acid and ammonium chloride, in this mixed solution, drip the ammonium thiocyanate solution that mass concentration is 5% under room temperature, make The molar ratio of thiocyanate to gold is 1, a coordination precipitation reaction occurs, until no more precipitates are produced, the solid and liquid are separated, the resulting precipitates are washed with water or other hydrophilic solvents, and dried at low temperature (≤80°C) A solid product was obtained, weighing 1.2 g. The analysis results of the elements C, H, O, N, and S of the product show that it is gold thiocyanate AuSCN.H 2 O containing a crystal water, and the results of the gold assay show that its purity is 98%. Infrared spectrum The results show that it is coordinated with aurite by sulfur as a coordinating element; it shows that the corresponding aurite complex product can be prepared according to this method.
应用:将上述AuSCN.H2O产品溶于硫氰酸铵溶液中,调节其金浓度为1~2g/L、pH为2~5,在温度为40~60℃、施镀时间为9~12分钟(min)的条件下对PCB(印刷线路板)镀镍板进行了化学镀金测试,发现所得的沉金厚度达0.11μm以上,结合力和色泽等品质指标均可满足PCB行业的要求。 Application: Dissolve the above AuSCN.H 2 O product in ammonium thiocyanate solution, adjust its gold concentration to 1~2g/L, pH to 2~5, at a temperature of 40~60°C, and a plating time of 9~ The electroless gold plating test was carried out on the nickel-plated PCB (printed circuit board) under the condition of 12 minutes (min), and it was found that the thickness of the immersion gold obtained was more than 0.11 μm, and the quality indicators such as bonding force and color could meet the requirements of the PCB industry.
实施例2:Example 2:
取含金量为2克的三氯化金,将其溶于1升含盐酸浓度为10%(V∕V)的液中,在20~45℃范围内向该液中滴加5%的蛋氨酸溶液至不再产生新的浑浊物为止,倾析法分去上清液,必要时用水或其它亲水性溶剂对所得浑浊物进行洗涤,对于得到的浑浊物,向将其按1:1.2的摩尔比与质量浓度为5%的硫氰酸铵溶液混合,发现产生明显的沉淀物,至不再产生沉淀物为止;对所得沉淀物进行固液分离,向其中加入质量浓度为5%的硫氰酸钾溶液至沉淀物全部溶解,所得母液经低温(≤80℃)干燥后得一种固体产品,重2.7克。产品的元素C、H、O、N、S分析的结果表明它为含两个结晶水的硫氰酸亚金钾K[Au(SCN)2].2H2O,试金法测量的结果表明它的纯度为96%,红外光谱结果显示出它是由硫作为配位元素与亚金进行配位;说明按本法可制备出以硫氰酸根作为配体的亚金络合物产品。 Take gold trichloride with a gold content of 2 grams, dissolve it in 1 liter of a solution containing 10% hydrochloric acid (V/V), add 5% methionine solution dropwise to the solution at 20-45°C to Until no new turbidity is produced, the supernatant is separated by decantation, and the resulting turbidity is washed with water or other hydrophilic solvents if necessary. For the obtained turbidity, the molar ratio of 1:1.2 Mixed with ammonium thiocyanate solution with a mass concentration of 5%, it was found that obvious precipitates were produced until no more precipitates were produced; the resulting precipitate was subjected to solid-liquid separation, and thiocyanic acid with a mass concentration of 5% was added thereto Potassium solution until the precipitate is completely dissolved, and the resulting mother liquor is dried at low temperature (≤80°C) to obtain a solid product weighing 2.7 grams. The analysis results of the elements C, H, O, N, and S of the product show that it is potassium aurous thiocyanate K[Au(SCN) 2 ].2H 2 O containing two crystal waters. Its purity is 96%, and the results of infrared spectroscopy show that it is coordinated with aurous metal by sulfur as a coordinating element; it shows that an aurous complex product with thiocyanate as a ligand can be prepared according to this method.
应用:将上述K[Au(SCN)2].2H2O产品溶于水中,调节其金浓度为2~4g/L、pH为1~4,在温度为35~50℃、电流密度为150~250安/平方米、施镀时间为5~15分钟(min)的条件下以黄铜为基材板进行了电镀金测试,发现所得镀金层的金颗粒细致、结合力好、色泽光亮,品质指标可满足五金电镀的要求。 Application: Dissolve the above K[Au(SCN) 2 ].2H 2 O product in water, adjust its gold concentration to 2~4g/L, pH to 1~4, at a temperature of 35~50°C and a current density of 150 Under the conditions of ~250 amps/square meter and a plating time of 5 to 15 minutes (min), the electroplating test was carried out with brass as the substrate plate. It was found that the gold particles of the obtained gold plating layer were fine, the bonding force was good, and the color was bright. Quality indicators can meet the requirements of metal plating.
实施例3:Example 3:
取含金量为1.5克的氯金酸,将其溶于1升丙酮中,在10~40℃范围内向该混合液中滴加质量浓度为2%的硫氰酸铵在丙酮中的溶液,使得硫氰酸根与金的摩尔比为2.3~3.1,3~6小时后对反应器底部的沉淀物收集,固液分离,用丙酮或其它亲水性溶剂对所得沉淀物进行洗涤、真空干燥后得到一中间固体产物,其元素分析和试金法测量均表明其主成份为AuSCN,重0.85克; Take chloroauric acid with a gold content of 1.5 grams, dissolve it in 1 liter of acetone, and add dropwise a solution of ammonium thiocyanate in acetone with a mass concentration of 2% in the mixed solution within the range of 10 to 40 ° C, so that the sulfur The molar ratio of cyanate to gold is 2.3 to 3.1. After 3 to 6 hours, the precipitate at the bottom of the reactor is collected, separated from solid and liquid, washed with acetone or other hydrophilic solvents, and dried in vacuum to obtain a The intermediate solid product, whose elemental analysis and assay measurement all show that its main component is AuSCN, weighing 0.85 grams;
应用1:向上述AuSCN固体产物加入质量浓度2%的烯丙基硫脲(缩写为ATU,下同)溶液至上述沉淀物刚好溶解,所得母液于低温(≤25℃)下浓缩并经低温干燥后得一种无色固体,重1.6克;该产品的元素C、H、O、N、S分析的结果表明它为含1个结晶水的混配型亚金络合物[Au(ATU)SCN].H2O,试金法测量的结果表明它的纯度为97.5%,红外光谱结果显示出与亚金配位最近的元素硫来自ATU。说明按本法可制备出以硫氰酸根作为外配位基团、硫脲类中性配体作为内配位基团的混配型亚金络合物。 Application 1: Add 2% allylthiourea (abbreviated as ATU, the same below) solution to the above-mentioned AuSCN solid product until the above-mentioned precipitate is just dissolved, and the obtained mother liquor is concentrated at low temperature (≤25°C) and dried at low temperature Obtain a kind of colorless solid afterward, weigh 1.6 gram; The element C of this product, H, O, N, the result of S analysis show that it is the mixed type gold metal complex [Au(ATU) containing 1 water of crystallization. SCN].H 2 O. Assay results show that its purity is 97.5%. Infrared spectrum results show that the element sulfur closest to sub-golden coordination comes from ATU. It shows that this method can be used to prepare mixed aurite complexes with thiocyanate as the external coordination group and thiourea neutral ligands as the internal coordination group.
应用2:以上述[Au(ATU)SCN].H2O作为金源,用现在陶瓷行业普遍使用的钛化合物(钛白粉)、铋化合物(氧化铋)、铬化合物(氧化铬)、铑化合物(硫酸铑)作配料,工业洒精、环己酮、四氢呋喃、松节油为溶剂,配制了含量分别为Au10%、Bi0.3%、Cr0.5%、Rh0.06%的陶瓷金水,发现其稳定性好,不沉淀;按ZBY 24004-89标准在750~850℃范围内进行了相关的陶瓷饰金性能测试,结果表明所得的金层耐磨性好(达1200次以上)、色泽光亮、无杂色、无白点,不冲金。 Application 2: Use the above [Au(ATU)SCN].H 2 O as the gold source, and use titanium compounds (titanium dioxide), bismuth compounds (bismuth oxide), chromium compounds (chromium oxide), and rhodium compounds that are commonly used in the ceramic industry (rhodium sulfate) as ingredients, industrial alcohol, cyclohexanone, tetrahydrofuran, and turpentine as solvents, prepared ceramic gold water with contents of Au10%, Bi0.3%, Cr0.5%, Rh0.06%, and found that it was stable Good wear resistance, no precipitation; according to the ZBY 24004-89 standard, the relevant ceramic gold decoration performance test was carried out in the range of 750-850 °C, and the results showed that the obtained gold layer had good wear resistance (up to 1200 times), bright color, no Variegated, no white spots, no red gold.
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