CN102967602A - Method for detecting welding property of lead foot of electronic element - Google Patents
Method for detecting welding property of lead foot of electronic element Download PDFInfo
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- CN102967602A CN102967602A CN2012104867331A CN201210486733A CN102967602A CN 102967602 A CN102967602 A CN 102967602A CN 2012104867331 A CN2012104867331 A CN 2012104867331A CN 201210486733 A CN201210486733 A CN 201210486733A CN 102967602 A CN102967602 A CN 102967602A
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Abstract
The invention relates to the technical field of production and detection of semiconductor devices and particularly relates to a method for detecting welding property of a lead foot of an electronic element. The method comprises the following steps of: turning on a dual-light-source lamplight, and photographing and acquiring images of a batch of products to be detected by a high-speed camera; processing the images of the batch of the products acquired by the high-speed camera by an appearance inspection tester to acquire a span value of the lead foot of each product in the batch of the products; solving standard square error sigma of the span values of all the lead feet of the obtained batch of the products, then setting an upper limit value and a lower limit value of the span of the lead foot according to the standard square error sigma, if the span value of the lead foot of the product is more than the upper limit value or less than the lower limit value, the welding property of lead foot of the product is bad, and the lead foot cannot be used for production and use. According to the method for detecting the welding property of the lead foot of the electronic element, the veracity and the validity for detecting and judging whether the welding property of the lead foot of the product is good or not are greatly improved.
Description
Technical field
The present invention relates to semiconductor devices production testing technical field, particularly a kind of method of detected electrons component pin welding performance.
Background technology
Continuous increase along with electronic devices and components quantity in the automobile, must strictly control the quality of semiconductor components and devices in the Hyundai Motor to reduce the ratio of defects of per 1,000,000 parts, the problem that minimizing causes because of electronic component failure, so industry grows to even greater heights to the cry of semiconductor components and devices zero-fault demand.At present in these semiconductor devices production runes, for preventing the damage of paster electronic component (resistance, electric capacity, transistor etc.), be convenient to storage and transportation, usually the paster electronic component is placed on the packing carrier band, the carrier band that will be equipped with again electronic component is wrapped on the packing reel, and packaged product is delivered in client's hand again.In the semiconductor devices production run, the electronic component that is arranged in carrier band on the production line upwarps owing to the reasons such as external force cause the electronic component pin bending, affect the electronic component pin welding performance, therefore some electronic component becomes waste product can not use, traditional electronic component detection means is that appearance detecting instrument is taken pictures to producing electron device at the auxiliary lower of high brightness single light source by camera, then appearance detecting instrument is processed the bat picture, find the pin positions of device and the picture pixel of definite pin, be correspondingly-sized with pixel transitions again, owing to be planar imaging, the traditional appearance detector can not judge whether device upwarps, thereby can not judge electronic component pin welding performance quality.In addition, traditional appearance detecting instrument utilizes single light source will take into account simultaneously device surface lettering and pin (pin and lettering be not at same plane) when auxiliary camera is taken pictures, therefore there is certain impact in the imaging of pin, and then impact is to electronic component pin welding performance judgment accuracy.
Summary of the invention
Goal of the invention of the present invention is: for the problem that prior art exists, provide a kind of method of detected electrons component pin welding performance, it can detect the quality of judging the electronic component pin welding performance accurately and effectively.
To achieve these goals, the technical solution used in the present invention is:
A kind of method of detected electrons component pin welding performance, the method is:
Open two light source light, high speed camera is taken the image that obtains batch products to be measured; The image of this batch products of high speed camera being obtained by appearance inspector is again processed the pin span value of obtaining each product in this batch products; Then all pin span values of this batch products of obtaining are asked standard difference of two squares σ, set again higher limit and the lower limit of pin span according to this standard difference of two squares σ, if the pin span value of product is greater than this higher limit or less than this lower limit, then the pins of products welding performance is poor can not be for the production of use.
The image of the batch products that described appearance inspector also will obtain high speed camera is processed the pin shoulder length value that obtains each product in this batch products, if the pin shoulder length value of product exceeds the predetermined value scope, then the pins of products welding performance is poor can not be for the production of use.
Described predetermined value scope is 0.16 ± 0.10mm.
Principle of work of the present invention: the traditional appearance detector is product to be taken pictures at the auxiliary lower of high brightness single light source by camera, then appearance detecting instrument is processed the bat picture, find the Pin locations of product and the picture pixel of definite pin, the picture pixel transitions with pin is corresponding pin length size again.Owing to be planar imaging, the traditional appearance detector can not judge whether pins of products upwarps, thereby can not judge electronic component pin welding performance quality.The inventor finds that by the analysis and research to product picture the span of pins of products becomes certain linear inverse relation with degree of standing, and span is larger, and degree of standing is less, the degree that the upwarps height of the large explanation pin of span, so the pins of products welding performance is poor.The present invention is on the traditional detection basis, the pin span of calculating each batch products distributes, all pin span values to this batch products of obtaining are asked standard difference of two squares σ, set again higher limit and the lower limit of pin span according to this standard difference of two squares σ, if the pin span value of product is greater than this higher limit or less than this lower limit, then the pins of products welding performance is poor can not be for the production of use.
In sum, owing to adopted technique scheme, the invention has the beneficial effects as follows:
The present invention processes the pin span value of obtaining this batch products by appearance detecting instrument to the image of the batch products obtained, all pin span values to this batch products of obtaining are asked standard difference of two squares σ, set again higher limit and the lower limit of pin span according to this standard difference of two squares σ, further judge the pins of products welding performance according to higher limit and the lower limit of pin span again, accuracy validity improves greatly.When product being carried out pin span detection judgement pins of products welding performance, by the identification to pins of products shoulder length value, can further effectively judge the quality of pins of products welding performance in the preferred version of the present invention.
Description of drawings
Fig. 1 is method flow diagram of the present invention.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in detail.
In order to make purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.
As shown in Figure 1, the method for detected electrons component pin welding performance of the present invention is:
Open two light source light, high speed camera is taken the image that obtains batch products to be measured; The image of this batch products of high speed camera being obtained by appearance inspector is again processed the pin span value of obtaining each product in this batch products; Then all pin span values of this batch products of obtaining are asked standard difference of two squares σ, set again higher limit and the lower limit of pin span according to this standard difference of two squares σ, if the pin span value of product is greater than this higher limit or less than this lower limit, then the pins of products welding performance is poor can not be for the production of use.Detect a collection of detection of carrying out next batch afterwards.Wherein, set the higher limit of pin span and lower limit specifically according to the mathematical statistics principle according to standard difference of two squares σ, set pin span upper specification limit value UPL and lower limit LPL, UPL=+(4* σ according to mean value ± (4* σ) method), LPL=-(4* σ).Equipment can be out of service when poor to detect the pins of products welding performance, changed by the product that operating personnel are poor with the pin welding performance.Picture processing is specifically processed the bat product picture, finds the picture pixel of Pin locations and definite pin in product picture, and the picture pixel transitions with pin is corresponding size again.Picture processing is prior art, no longer describes in detail here.
In order to improve the accuracy validity of detection, the image of the batch products that described appearance inspector also will obtain high speed camera is processed the pin shoulder length value that obtains each product in this batch products, if the pin shoulder length value of product exceeds the predetermined value scope, then the pins of products welding performance is poor can not be for the production of use.Described predetermined value scope is 0.16 ± 0.10mm.
The traditional appearance detector is product to be taken pictures at the auxiliary lower of high brightness single light source by camera, then appearance detecting instrument is processed the bat picture, find the Pin locations of product and the picture pixel of definite pin, the picture pixel transitions with pin is corresponding pin length size again.Owing to be planar imaging, the traditional appearance detector can not judge whether pins of products upwarps, thereby can not judge electronic component pin welding performance quality.The inventor finds that by the analysis and research to product picture the span of pins of products becomes certain linear inverse relation with degree of standing, and span is larger, and degree of standing is less, and the large explanation pins of products of span welding performance is poor, can not be used for client's production and application.The present invention is on the traditional detection basis, the pin span of calculating each batch products distributes, all pin span values to this batch products of obtaining are asked standard difference of two squares σ, set again higher limit and the lower limit of pin span according to this standard difference of two squares σ, if the pin span value of product is greater than this higher limit or less than this lower limit, then the pins of products welding performance is poor can not be for the production of use.This moment, equipment can be out of service, by operating personnel the poor product of pin welding performance that detects changed.
The present invention processes the pin span value of obtaining this batch products by appearance detecting instrument to the image of the batch products obtained, all pin span values to this batch products of obtaining are asked standard difference of two squares σ, set again higher limit and the lower limit of pin span according to this standard difference of two squares σ, further judge the pins of products welding performance according to higher limit and the lower limit of pin span again, accuracy validity improves greatly.
When product being carried out pin span detection judgement pins of products welding performance, by the identification to pins of products shoulder length value, can further effectively judge the quality of pins of products welding performance.(one group of light is assisted lettering because the inventor uses high speed camera and two light source when experiment after, the auxiliary pin of another group), clearer to picture shooting, then by the comparative study to normal product and waste product picture, the device picture that discovery pin welding performance is poor and the picture of proper device have notable difference in pin shoulder light reflection effect, so when product being carried out pin span detection judgement pins of products welding performance, again the pins of products shoulder is taken measurement.According to normal product supplied materials shaping characteristic, normal product pin shoulder length is in 0.16 ± 0.10mm scope, the pins of products shoulder length value that calculates when measurement exceeds 0.16 ± 0.10mm scope, can judge then that the pins of products welding performance is poor can not be for the production of use, so just more effectively detect pins of products welding performance quality.
The present invention processes the pin span value of obtaining this batch products by appearance detecting instrument to the image of the batch products obtained, all pin span values to this batch products of obtaining are asked standard difference of two squares σ, set again higher limit and the lower limit of pin span according to this standard difference of two squares σ, further judge the pins of products welding performance according to higher limit and the lower limit of pin span again, accuracy validity improves greatly.The present invention by the identification to pins of products shoulder length value, can further effectively judge the quality of pins of products welding performance when product being carried out pin span detection judgement pins of products welding performance.Adopt two light sources and high speed camera among the present invention, the picture of taking is more clear, the picture analyzing result is more accurate, and the pin span detects judgement pins of products welding performance and the detection of pin shoulder judges that the pins of products welding performance combines, and whole detection is more accurate, more effective.
The above only is preferred embodiment of the present invention, not in order to limiting the present invention, all any modifications of doing within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (3)
1. the method for a detected electrons component pin welding performance is characterized in that the method is:
Open two light source light, high speed camera is taken the image that obtains batch products to be measured; The image of this batch products of high speed camera being obtained by appearance inspector is again processed the pin span value of obtaining each product in this batch products; Then all pin span values of this batch products of obtaining are asked standard difference of two squares σ, set again higher limit and the lower limit of pin span according to this standard difference of two squares σ, if the pin span value of product is greater than this higher limit or less than this lower limit, then the pins of products welding performance is poor can not be for the production of use.
2. the method for detected electrons component pin welding performance according to claim 1, it is characterized in that, the image of the batch products that described appearance inspector also will obtain high speed camera is processed the pin shoulder length value that obtains each product in this batch products, if the pin shoulder length value of product exceeds the predetermined value scope, then the pins of products welding performance is poor can not be for the production of use.
3. the method for detected electrons component pin welding performance according to claim 2 is characterized in that, described predetermined value scope is 0.16 ± 0.10mm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210486733.1A CN102967602B (en) | 2012-11-26 | 2012-11-26 | Method for detecting welding property of lead foot of electronic element |
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| CN201210486733.1A CN102967602B (en) | 2012-11-26 | 2012-11-26 | Method for detecting welding property of lead foot of electronic element |
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| CN102967602A true CN102967602A (en) | 2013-03-13 |
| CN102967602B CN102967602B (en) | 2014-12-03 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110672812A (en) * | 2019-09-17 | 2020-01-10 | 贵州航天电子科技有限公司 | Method for testing weldability of microwave QFN device |
| CN114688974A (en) * | 2020-12-30 | 2022-07-01 | Pyxis Cf私人有限公司 | Post-chip detection method and system for semiconductor bare chip in panel-level package |
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| JPH07229842A (en) * | 1994-02-21 | 1995-08-29 | Nec Corp | Method and equipment for inspecting dust particle in ic |
| CN102313745A (en) * | 2011-07-21 | 2012-01-11 | 华中科技大学 | Three-dimensional detection device of integrated circuit base pins and detection method |
| CN102359758A (en) * | 2011-07-21 | 2012-02-22 | 华中科技大学 | Method for detecting appearance of semiconductor chip |
| CN102374993A (en) * | 2010-08-20 | 2012-03-14 | 吴华 | Unit and method for detecting appearance of three dimensional pin of integrated circuit package chip |
-
2012
- 2012-11-26 CN CN201210486733.1A patent/CN102967602B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07229842A (en) * | 1994-02-21 | 1995-08-29 | Nec Corp | Method and equipment for inspecting dust particle in ic |
| CN102374993A (en) * | 2010-08-20 | 2012-03-14 | 吴华 | Unit and method for detecting appearance of three dimensional pin of integrated circuit package chip |
| CN102313745A (en) * | 2011-07-21 | 2012-01-11 | 华中科技大学 | Three-dimensional detection device of integrated circuit base pins and detection method |
| CN102359758A (en) * | 2011-07-21 | 2012-02-22 | 华中科技大学 | Method for detecting appearance of semiconductor chip |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110672812A (en) * | 2019-09-17 | 2020-01-10 | 贵州航天电子科技有限公司 | Method for testing weldability of microwave QFN device |
| CN114688974A (en) * | 2020-12-30 | 2022-07-01 | Pyxis Cf私人有限公司 | Post-chip detection method and system for semiconductor bare chip in panel-level package |
| CN114688974B (en) * | 2020-12-30 | 2023-09-01 | Pyxis Cf私人有限公司 | Post-chip inspection method and system for semiconductor die in panel-level package |
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| CN102967602B (en) | 2014-12-03 |
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