CN102967266B - Thickness inequality checks device and method - Google Patents
Thickness inequality checks device and method Download PDFInfo
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- CN102967266B CN102967266B CN201210067026.9A CN201210067026A CN102967266B CN 102967266 B CN102967266 B CN 102967266B CN 201210067026 A CN201210067026 A CN 201210067026A CN 102967266 B CN102967266 B CN 102967266B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/8422—Investigating thin films, e.g. matrix isolation method
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
Abstract
The present invention is that a kind of thickness inequality checks device and method, can obtain lightness and contrast is suitable for the image that checks, and obtain and accurately check result；It is characterized in that, one side makes the substrate that surface has epithelium move in one direction, one side checks that the thickness of the epithelium at substrate is uneven, and possess the thickness test section of detection leather film thickness, light source portion is included in the indirect illumination portion of image pickup part side, and across substrate with image pickup part to transillumination portion, image pickup part includes the image pickup part angle-adjusting mechanism regulating the relative angle with substrate, indirect illumination portion comprises the indirect illumination angle-adjusting mechanism regulating indirect illumination portion with the relative angle of substrate, transillumination portion comprises the transillumination angle-adjusting mechanism regulating transillumination portion with the relative angle of substrate, and this device includes control portion, it is based on the thickness information from thickness test section, control indirect illumination angle-adjusting mechanism and transillumination angle-adjusting mechanism, regulate the light quantity of indirect illumination and transillumination。
Description
Technical field
The present invention relates to a kind of in order to, among the manufacturing step at colored filter etc., to check the device and method of the uneven thickness (so-called thickness is uneven) of the colored epithelium formed on the substrate of glass or translucent resin material etc.。
Background technology
In the past known have following situation: among the manufacturing step etc. of the colored filter for flat faced display, due to pigment disperse heterogeneity or because of composition condense, film forming time the impact of vibration and the thickness that produces is uneven, cause that color is uneven。For preventing to continue when producing described thickness and being uneven the unfavorable condition of manufacturing operation, and use camera and transillumination, check for (such as, patent documentation 1) such as color inequality and degree。
And then, recording following technology: use camera and indirect illumination, even if forming the layer at substrate surface various changes occur, also can be clearly captured produced inequality (such as, patent documentation 2) correspondingly。
[look-ahead technique document]
[patent documentation]
Patent documentation 1: Japanese Patent Laid-Open 2006-234470 publication
Patent documentation 2: Japanese Patent Laid-Open 2007-309718 publication
Summary of the invention
[inventing problem to be solved]
Various color inequalities are because in the film forming such as red, blue, green, a part for arbitrary film forming comprises the inhomogenous part of thickness (that is, thickness is uneven) and produces。The thickness inequality inspection of described assorted film forming is the angle as the substrate checking object with image pickup part to be changed, and according to this angle and inspection object, change the kind of illumination, angle or position and carry out, but when thickness inequality is difficult to detect, if the thickness of epithelium entirety is (namely, it is absent from the thickness of the uneven part of thickness, so-called represents thickness) different, then sometimes cannot fully obtain the contrast that thickness is uneven。Therefore, when repeatedly checking the different substrate of the representative thickness through the epithelium of film forming, even if checking each substrate under identical imaging conditions, sometimes also it is difficult to obtain check result accurately。
Therefore, it is an object of the invention to provide a kind of substrate for representing the different same kind of thickness, can based on common inspection condition, according to the difference representing thickness, acquisition lightness and contrast are suitable for the image checked, thus obtaining the thickness inequality inspection device and method accurately checking result。
[solving the means of problem]
For solving described problem, the invention of technical scheme 1 is that a kind of thickness inequality checks device, it is characterised in that including:
Substrate moving part, remains surface and is formed with the substrate of epithelium so as to move；
Light source portion, to described substrate illumination light；
Image pickup part, to imaging at least partially of the face being formed with epithelium of described substrate；And
Inspection portion, based on the image shot by described image pickup part, checks the uneven thickness of described epithelium；And
One side makes described substrate move in one direction, and one side checks the uneven thickness forming the epithelium at described substrate,
This thickness inequality checks that device comprises:
Inspection condition register, is set registration to the inspection condition corresponding with checking object kind；And
Representing thickness test section, detection forms the representative thickness of the epithelium at described substrate；
Described light source portion possesses:
Indirect illumination portion, is arranged in described image pickup part side, and to described substrate illumination light；And
Transillumination portion, be arranged in across described substrate and described image pickup part to position, and to described substrate illumination light；
In described image pickup part, comprise the camera angle adjustment portion of the relative angle regulating described image pickup part and described substrate,
In described indirect illumination portion, comprise the indirect illumination angle adjusting part of the relative angle regulating described indirect illumination portion and described substrate,
In described transillumination portion, comprise the transillumination angle adjusting part of the relative angle regulating described transillumination portion and described substrate,
This thickness inequality checks that device includes control portion, this control portion can based on being registered in the inspection condition of described inspection condition register and from the described representative thickness information representing thickness test section, control described image pickup part angle adjusting part, described indirect illumination angle adjustment and described transillumination angle adjusting part, regulate the light quantity of described indirect illumination and the light quantity of described transillumination。
The invention of technical scheme 5 is a kind of thickness inequality inspection method, it is characterised in that including:
Substrate moves step, remains surface and is formed with the substrate of epithelium so as to move；
Image pickup step, from light source portion to described substrate illumination light, shoots the face being formed with epithelium at least some of of described substrate；And
Check step, based on the image shot by described image pickup part, check the uneven thickness of described epithelium；And
One side makes described substrate move in one direction, and one side checks the uneven thickness forming the epithelium at described substrate, and
This thickness inequality inspection method includes:
Inspection condition register step, is set registration to the inspection condition corresponding with checking object kind；And
Representing thickness detecting step, detection forms the representative thickness of the epithelium at described substrate；
Described light source portion is configured to include:
Indirect illumination portion, is arranged in described image pickup part side, and to described substrate illumination light；And
Transillumination portion, be arranged in across described substrate and described image pickup part to position, and to described substrate illumination light；
Described image pickup step is based on the inspection condition being registered in described inspection condition register and described represents the representative thickness information detected in thickness detecting step, including
Regulate the relative angle of described image pickup part and described substrate image pickup part angle adjustment step,
Regulate the relative angle of described indirect illumination portion and described substrate indirect illumination angle adjustment step,
Regulate the relative angle of described transillumination portion and described substrate transillumination angle adjustment step and
Regulate the light quantity regulating step of the light quantity of described indirect illumination or described transillumination。
Owing to using described thickness inequality to check device and method, so, the leather film thickness becoming thickness inequality object can be measured, set the light quantity being suitable for the viewing angle of this thickness, the position of illumination and angle and illumination, automatically carry out thickness inequality inspection。
The invention of technical scheme 2 is that the thickness inequality according to technical scheme 1 checks device, it is characterised in that comprise the count section that the rechecking number of times to same described substrate counts, and
Possess: according to described counts, change the angle of described image pickup part or the function of the light quantity of described illumination。
The invention of technical scheme 6 is the thickness inequality inspection method according to technical scheme 5, it is characterised in that including:
Counting step, counts the rechecking number of times of same described substrate；
Rechecking step, to same described substrate inspection more than at least twice；And
According to described counts, change the angle of described image pickup part or the step of the light quantity of described illumination。
If using described thickness inequality to check device and method, then can check at the 1st time and in the 2nd later inspection, change viewing angle, the position of illumination or angle or the light quantity of illumination, check。Even if consequently, it is possible to be difficult to the kind just obtaining the image of suitable lightness and contrast the 1st time, it is also possible in the 2nd later inspection, obtain the image of suitable lightness and contrast。Therefore, even if thickness inequality is difficult to the kind detected, it is also possible to carefully carry out the inspection that thickness is uneven。
The invention of technical scheme 3 is that the thickness inequality according to technical scheme 2 checks device, it is characterised in that:
Described inspection portion comprises the image processing part that each image through described rechecking carries out multiple synthesis process, and
Possess: carry out the multiple composograph of multiple synthesis gained based on the image that will process through described synthesis, check the multiple composograph audit function that thickness is uneven。
The invention of technical scheme 7 is the thickness inequality inspection method according to technical scheme 6, it is characterised in that more include:
Image acquisition step, in described rechecking step, obtains each image；
Multiple synthesis processes step, and each image of described acquisition is carried out multiple synthesis process；And
Multiple composograph checks step, based on the image processed through described multiple synthesis, checks that thickness is uneven。
If using described thickness inequality to check device and method, then carry out multiple synthesis process by checking the 1st time with the image of acquisition in the 2nd later inspection, therefore, can carry out with under a certain observation condition obtain image carry out inspection compared with the less inspection of noise contribution。Therefore, compare whole the image based on only obtaining under 1 imaging conditions and check, uneven even for the thickness that only can obtain delicate contrast image, it is possible to check accurately。
The invention of technical scheme 4 is to check device according to the thickness inequality of any technology scheme in technical scheme 1 to 3, it is characterised in that:
Described image pickup part and described transillumination is made to link, and
Described image pickup part angle adjusting part doubles as described transillumination angle adjusting part。
If using described thickness inequality to check device, then described image pickup part and described transillumination can be made to rotate integratedly, therefore, the mechanism of the angle regulating described transillumination individually can be saved。Therefore, the quantity of position adjusting mechanism can be reduced, it is achieved installation cost reduces。
[effect of invention]
Even if producing change as the leather film thickness checking object, it is also possible to correspondingly obtain the image of suitable lightness and contrast, thus obtaining the inspection result that thickness is uneven exactly。
Accompanying drawing explanation
Figure 1A indicates that the plane graph of the example embodiment realizing the present invention。
Figure 1B indicates that the side view of the example embodiment realizing the present invention。
Fig. 2 indicates that the system pie graph of the example embodiment realizing the present invention。
Fig. 3 A is the light angle associated diagram with uneven intensity of each thickness of the epithelium of the application present invention。
Fig. 3 B is the leather film thickness associated diagram with light angle of the application present invention。
Fig. 4 indicates that the flow chart of the example embodiment realizing the present invention。
Fig. 5 A indicates that the plane graph realizing embodiments of the present invention the 2nd example。
Fig. 5 B indicates that the side view realizing embodiments of the present invention the 2nd example。
[explanation of symbol]
1 thickness inequality checks device
2 substrate moving parts
2a upstream side moving part
2b downstream moving part
3 light source portions
3a indirect illumination portion
3b transillumination portion
4 image pickup parts
9 control portions
10 substrates
10v represents the arrow of moving direction
11 device frames
12 carriages
23 conveying cylinders
24 conveyers drive motor
31 indirect illuminations
32 indirect illumination angle-adjusting mechanisms
33 indirect illumination position adjusting mechanisms
34 indirect illumination light amount regulating units
35 transilluminations
36 transillumination angle-adjusting mechanisms
37 transillumination position adjusting mechanisms
38 transillumination light amount regulating units
39 supports
40 film thickness sensors
41 check line
42 supports
43 supports
44 image mechanisms
45 image pickup part angle-adjusting mechanisms
46 image pickup part position adjusting mechanisms
47 image pickup part angle detectors
48 swivel mounts
49 image pickup part angle-adjusting mechanisms
90 control computers
91 information input mechanisms
92 information output mechanisms
93 alarm mechanisms
94 machine information structures
95 control units
96 graphics processing units
Detailed description of the invention
One side uses graphic, and one side illustrates in order to implement embodiments of the present invention。
Figure 1A indicates that the plane graph of the example embodiment realizing the present invention。
Figure 1B indicates that the side view of the example embodiment realizing the present invention。
In the various figures, the 3 of orthogonal coordinate system axles are set to X, Y, Z, X/Y plane are set to horizontal plane, Z-direction is set to vertical。Especially, Z-direction is to be shown as in arrow direction, its opposite direction is expressed as down。And, by be axle center with X-direction direction of rotation be set to θ direction。
Thickness inequality checks that device 1 comprises substrate moving part 2, light source portion 3, image pickup part 4, inspection portion and control portion 9 and constitutes。Herein, the substrate as inspection object is that the substrate 10 illustrating and being coated with colored epithelium on glass illustrates。
Substrate moving part 2 comprises upstream side moving part 2a and downstream moving part 2b and constitutes, and upstream side moving part 2a and downstream moving part 2b comprises carriage (conveyorframe) 12a and 12b being arranged on device frame 11, conveying cylinder (conveyorroller) 23a and 23b that be arranged on carriage 12a and 12b and the conveyer that drives in order to make conveying cylinder 23a and 23b rotate drive motor 24a and 24b to constitute。
Upstream side moving part 2a and downstream moving part 2b is in the way of substrate 10 can be made to move conveyance in the Y direction, checks that line 41 configures across substrate。Therefore, substrate moving part 2 can make the substrate 10 mobile conveyance in the Y direction of mounting so that it is checks line 41 by substrate。Substrate 10, after checking line 41 by substrate, moves to dotted line 10f。
Light source portion 3 comprises indirect illumination portion 3a and transillumination portion 3b and constitutes。
Indirect illumination portion 3a comprises indirect illumination 31, indirect illumination angle-adjusting mechanism 32, indirect illumination position adjusting mechanism 33 and indirect illumination light amount regulating unit 34 and constitutes。Indirect illumination 31 is mounted in indirect illumination angle-adjusting mechanism 32, and can rotate up in θ side, adjusts the angle with substrate 10。Indirect illumination angle-adjusting mechanism 32 is mounted in indirect illumination position adjusting mechanism 33, and mobile in the Y direction in the lump with indirect illumination 31 can adjust position。Indirect illumination position adjusting mechanism 33 is mounted in support 39, and support 39 is mounted in device frame 11。Indirect illumination 31 is the illuminating part having in the X direction and being longer than substrate 10。Therefore, indirect illumination portion 3a have can a change of location and angle, one facing to checking that line 41 irradiates the structure of light comprising particular wavelength region。
Transillumination portion 3b comprises transillumination 35, transillumination angle-adjusting mechanism 36, transillumination position adjusting mechanism 37 and transillumination light amount regulating unit 38 and constitutes。Transillumination 35 is mounted in transillumination angle-adjusting mechanism 36, and can rotate up in θ side, adjusts the angle with substrate 10。Transillumination angle-adjusting mechanism 36 is mounted in transillumination position adjusting mechanism 37, and transillumination position adjusting mechanism 37 is mounted in support 39。Transillumination 35 is the illuminating part having in the X direction and being longer than substrate 10。Therefore, transillumination portion 3b have can a change of location and angle, one facing to checking that line 41 irradiates the structure of light comprising particular wavelength region。
As indirect illumination 31 and transillumination 35, LED (LightEmittingDiode, light emitting diode), Halogen light, incandescent lamp bulb, fluorescent lamp and other lighting means can be illustrated。And then, as long as radiation comprises the light of the specific wavelength consistent with the light sensitivitys wavelength of following image pickup part 4 and light sensitivitys characteristic, and this specific wavelength is absorbed a part by the epithelium formed on the surface of substrate 10, and part reflection or a part penetrate。
Indirect illumination 31 is attached to indirect illumination light amount regulating unit 34, and transillumination 35 is attached to transillumination light amount regulating unit 38, and can adjust the light quantity exposing to substrate 10 respectively。
Image pickup part 4 is to comprise image mechanism 44, image pickup part angle-adjusting mechanism 45, image pickup part position adjusting mechanism 46 and image pickup part angle detector 47 and constitute。Image mechanism 44 is mounted in image pickup part angle-adjusting mechanism 45, and can rotate up in θ side, adjusts the angle with substrate 10。Image pickup part angle-adjusting mechanism 45 is mounted in image pickup part position adjusting mechanism 46, and can move in the Y direction in the lump with image mechanism 44, adjusts position。Image pickup part position adjusting mechanism 46 is mounted in support 42, and support 42 is mounted in device frame 11。Image mechanism 44 is the light accepting part having in the X direction and being longer than substrate 10。Therefore, image mechanism 44 have can a change of location and angle, the structure of light comprising particular wavelength region in the face of checking line 41 to receive。
As image mechanism 44, one-dimensional or two-dimentional line sensor or area sensor etc. can be illustrated, and use can be illustrated multiple make described light accepting part be arranged in 1 row in the X direction longlyer or have length-specific in the X direction, and arrange in X-direction and Y-direction specific interval make its etc. staggered (such as so-called Z-type grid) configure the sensor of several column。
Indirect illumination portion 3a be by towards become with substrate 10 angulation when checking line 41 and image pickup part 4 with substrate 10 angulation roughly the same in the way of, adjusting position and angle and configure。On the other hand, transillumination portion 3b be across check line 41 and with image pickup part 4 to, and by towards become with substrate 10 angulation when checking line 41 and image pickup part 4 with substrate 10 angulation roughly the same in the way of, adjusting position and angle and configure。Now, if image pickup part 4 checks that line 41 is arranged in downstream moving part 2b relatively, then indirect illumination portion 3a is relative with transillumination portion 3b checks that line 41 is arranged in upstream side moving part 2a。
Therefore, can simultaneously making substrate 10 move in the Y direction, one side uses self-reflection Lighting Division 3a or the transillumination portion 3b light irradiated, observe substrate 10 whole, is described in detail herein below。
And, above exemplified with glass substrate, as the embodiment of substrate, even if but the substrates such as translucent resin material can also apply。
[system composition]
Fig. 2 indicates that the system pie graph of the example embodiment realizing the present invention。As in figure 2 it is shown, described substrate moving part 2, light source portion 3, image pickup part 4 each equipment be that each equipment with control portion 9 is connected。
In control portion 9, connect ground and include control computer 90, information input mechanism 91, information output mechanism 92, alarm mechanism 93, machine information structure 94, device control cell 95 and image processing part。
As control computer 90, microcomputer, personal computer, work station etc. can be illustrated and be mounted with numerical operation unit person。
As information input mechanism 91, keyboard, mouse or switch etc. can be illustrated。
As information output mechanism 92, image display or lamp etc. can be illustrated。
As alarm mechanism 93, buzzer can be illustrated or speaker, lamp etc. can arouse the mechanism that operator notes。
As machine information structure 94, the quasiconductor record media such as storage card or data disk, magnetic record medium or magneto-optic recording medium etc. can be illustrated。
As device control cell 95, the equipment etc. being called Programmable Logic Controller or motion controller can be illustrated。
In control computer 90, via graphics processing unit 96, input has the signal of video signal from image pickup part 4 output。Described input picture is to be implemented by the graphics processing unit 96 as image processing part function to be suitable for checking the image procossing that thickness is uneven。Thereafter, checking, this inspection is the luminance signal difference according to image and intensity of variation etc., is made whether the judgement that thickness is uneven in inspection portion。And then, at image processing part, can carry out that the image that each line is shot links with time series the time series synthesis synthesizing whole the image being equivalent to a piece of substrate to process, or carry out making the multiple synthesis process of plural number image congruencing, or carry out the contrast adjustment of image。
The image processing part used when checking as the inspection portion uneven by this thickness, however it is not limited to described graphics processing unit 96, can adopt the in the past known equipment with image processing function。Such as, the mode in being commonly referred to GPU (GraphicProcessingUnit, Graphics Processing Unit) and being arranged on the mode outside control computer 90 or be connected to the housing of control computer 90 can be illustrated and utilize the image processing function person etc. of control computer 90。And, described control computer 90 and graphics processing unit 96 are to constitute the inspection portion in the present invention。
Device control cell 95 is to be connected with each control equipment (not shown) constituting thickness inequality inspection device 1, and can make each device action or static by giving control signal to such control equipment。
[with checking corresponding image pickup part angular adjustment]
When checking thickness inequality, first, use film thickness sensor 40, the representative thickness formed at uppermost epithelium is measured。Film thickness sensor 40 is equivalent to the representative thickness test section of the present invention, and the information of the representative thickness measured by film thickness sensor 40 is to export the device control cell 95 to control portion 9。As film thickness sensor 40, the size person of being measured of upper surface and lower surface to the uppermost epithelium formed at substrate can be illustrated。Such as, if substrate surface being irradiated sideling light, and measured the reflection light from upper surface and the reflection light from lower surface by triangulation, then can calculate thickness。Film thickness sensor 40 is not limited in the way of pinpoint (pinpoint) is to the place measurement on substrate, preferably, many places on substrate and specific length or scope are measured, the or given either continuously or intermittently thickness in substrate moving process is measured, and output meansigma methods。Thus, can as the information output of the representative thickness of the epithelium formed on substrate。
Before an examination, based on the set information of the inspection recipe file (recipefile) of the machine information structure 94 being equivalent to inspection condition register pre-registered in the present invention, from control computer 90, device control cell 95 is sent the control formula of each equipment。Described inspection recipe file is according to carrying out the epithelium kind of thickness inequality inspection (such as, aberration, manufacturer's difference, breed difference etc.), it is registered with a plurality of, and is registered with the inspection condition setting thickness with setting shelves information (profileinformation) of viewing angle and the optimum condition of the irradiating angle of illumination and the light quantity etc. about the illumination used when observing。Therefore, device control cell 95 based on the set information of described inspection recipe file and the described thickness information that represents, can regulate the position of each equipment when checking, angle or light quantity。
Illustrate a part for the set information having described inspection recipe file。
In Table 1, for instance as formula A, the inspection condition of for red epithelium (kind name: R00123) the 1st time to the 3rd time it is set with。In this recipe file, setting inspection number of times as 3 times, according to checking that number of times makes the angle of viewing angle and indirect illumination change, the lightness of illumination keeps 30% constant, and does not use transillumination。And, in the setting of the condition of inspection, the set angle of the illumination etc. be set with the representative film thickness value as benchmark, now setting and expression represent setting shelves title (45-5_2150-2200) of thickness and the relation of best angle。
[table 1]
Formula A
In table 2, for instance as formula B, it is set with the inspection condition of for blue epithelium (kind name: B00123) the 1st time to the 2nd time。In this recipe file, setting inspection number of times as twice, according to checking that number of times makes the lightness of transillumination change, viewing angle, the angle of indirect illumination and the angle of transillumination are all best angle, and do not use indirect illumination。And, in the setting of the condition of inspection, the set angle of the illumination etc. be set with the representative film thickness value as benchmark, now setting and expression represent setting shelves title (50-5_2250-2300) of thickness and the relation of best angle。
[table 2]
Formula B
Then, the setting shelves information of the optimum condition being set with benchmark thickness and best angle, viewing angle, the irradiating angle of illumination and light quantity is illustrated。
Fig. 3 A is the light angle associated diagram with uneven intensity of each thickness of the epithelium of the application present invention, and transverse axis represents the angle, θ of illumination, and the longitudinal axis represents uneven intensity。In Fig. 3 A, show different each described angle representing thickness and the correlation properties of described uneven intensity。In the kind of a certain epithelium, it is presented with correlation properties to representing thickness t1～t5。These correlation properties are to prepare the substrate that thickness is different in advance, and measure in advance represent thickness being absent from the uneven part of thickness。Then, based on the correlation properties obtained, select uneven intensity the highest partly as being best suitable for the angle that checks。Now, angle the highest for intensity uneven in the representative thickness t1 of pre-prepd substrate is set to θ 1, is set to θ 2 by representing the angle that in thickness t2, uneven intensity is the highest, similarly, be set to θ 3～θ 5 by representing the angle that in thickness t3～t5, uneven intensity is the highest。
Fig. 3 B indicates that the associated diagram of the dependency relation representing thickness and light angle, and transverse axis represents and represents thickness t, and the longitudinal axis represents the angle, θ f being best suitable for described inspection。Fig. 3 B indicates that and will be drawn as the angle, θ f being best suitable for checking by angle, θ 1～θ 5 that intensity uneven in the representative thickness t1～t5 of described mensuration gained is the highest, is best suitable for the angle, θ f that checks situation about proportionally changing along with representing the change of thickness t。This angle, θ f is defined as by representing the thickness t arithmetic expression calculated
θ f=f (t)
And it is applied to the present invention。
Such as, by specifying the best angle θ f in kind AA=fA(tA), and the thickness t to the epithelium measuredA, determine the best angle θ f used when measuringA。
Representing concrete example, if the representative thickness t1 of kind A is 2.15 μm, t5 is 2.20 μm, and the best angle θ 1 now illuminated is 45 degree, and θ 5 is 50 degree, and obtains the result representing the characteristic proportionally changed till t1 to t5, θ 1 to θ 5, then
According to the representative thickness t measuredACalculate the best angle θ of illuminationAFormula: θ fA=fA(tA) be defined as
fA(tA)=a tA+ b, thus calculating a, b。
A can by a=(θ5-θ1)/(t5-t1) calculate, thus obtaining a=100。
B can by b=θ1-a·t1Calculate, thus obtaining b=-170。
Therefore, θ f is calculatedAFormula by θ fA=fA(tA)=100tA-170 definition。
And, when registering inspection condition, as shown in table 1, if benchmark thickness is defined as 2.18 μm, then best angle now becomes 48 degree, therefore, if such information is shown in described recipe file, 1st time or the 2nd later inspection condition are set in recipe file, then the management of the inspection condition of each recipe file becomes easy。
Other arithmetic expressions relevant to epithelium are that the kind to each epithelium specifies。
Such as, being preferably the arithmetic expression suitable in kind B is θ fB=fB(tB), it is adaptable to the arithmetic expression of kind C is θ fC=fC(tC) etc situation。And then, each indirect illumination, transillumination also can be set by this arithmetic expression。Such as, for kind D, it is preferably the angle, θ f of indirect illuminationDr=fDf(tD), the angle, θ f of transilluminationDt=fDt(tD) etc situation。
And, as illustrated by Fig. 3 A, B used above, in each kind, the characteristic curve according to each thickness, calculate the relational expression representing thickness t and best angle θ f。
When applying the present invention, it is set as setting shelves information by the described relational expression representing thickness t and best angle θ f in advance。Accordingly, for the benchmark thickness being set with inspection condition, even if the representative thickness of practical measurement is different, it is also possible to based on described setting shelves information, calculate best angle θ f, thus desired inspection result can be obtained。
[check process]
Fig. 4 indicates that the flow chart of the example embodiment realizing the present invention。In the diagram, the thickness inequality of the colored epithelium formed over the substrate 10 carries out observe a series of flow tables checked to be shown in each step。Before an examination, described inspection recipe file is preset。
First, substrate 10 is positioned in thickness inequality and checks upstream side moving part 2a (s101) of device 1。Secondly, use film thickness sensor 40, the representative thickness of the colored epithelium formed over the substrate 10 is measured (s102)。Then, with reference to register information and setting shelves information (s103) of inspection recipe file, based on the described thickness information that represents, and based on described control formula, the position of each equipment, angle or light quantity (s104) are changed。
Make substrate 10 transport mobile (s105) in the Y direction, carry out thickness inequality inspection (s106)。Now, substrate 10 become the region checking object by checking line 41, one side gradually carries out the shooting of each line, the inspection that thickness that one side carries out carrying out differentiating in described line is uneven。
Next, it is determined that check whether end (s107), not yet terminate if judging to check, then return described step s105, repeat described action。If judging, inspection terminates, then the 1st inspection terminates。
In the inspection device of the present invention, also step s106 can be replaced, and obtain in substrate conveyance process after image, the time series synthesis carrying out synthesizing the image that each line is imaged according to time series link whole image of a piece of substrate processes, after making the image being equivalent to become a piece of substrate checking object, carry out checking (s108)。Thus, the thickness inequality of the substrate moving direction that cannot differentiate in step s106 can be differentiated, and check。The information of the representative thickness that the angle etc. of observation portion and Lighting Division measures before being based on the inspection condition registered in advance and being about to inspection, it is adjusted to and is best suitable for checking the state that thickness is uneven, therefore, compared with conventional device and method, thickness inequality detection can be carried out exactly。
And, during inspection use photographed images be not limited under a certain condition observe the image being equivalent to a piece of substrate, the multiple synthesis of multiple image congruencings that the observation condition that can also carry out making to be obtained by following rechecking is different processes, and carries out checking (s109) based on this result。Needing whole image of acquisition in based on step s108, during reinforced film thickness ununiformity, sometimes not only the part originally needing the thickness checked uneven is carried out intensive treatment, and noise contribution contained during to shooting carries out intensive treatment, cause being difficult to differentiate that thickness is uneven。But, as long as being carried out multiple synthesis by the plurality of image, then can become the state not making noise contribution strengthening and only reinforced film thickness ununiformity part, thus observing。Therefore, the inspection based on the image through multiple synthesis is compared with the situation needing to carry out intensive treatment differentiation thickness inequality for the contrast etc. of whole image of observation under some condition, can suppress noise contribution, therefore easily find that thickness is uneven。
Then, based on the information set in inspection recipe file, it may be judged whether repeating the 2nd later inspection (s110), if being judged as being repeated, then after rechecking number of times being counted, being back to described step s104。Then, change the position of each equipment, angle or light quantity, repeat described step s105～s107。If being judged as not repeating in step s110, then make substrate 10 stop mobile (s111), and take out substrate 10 (s112) from downstream moving part 3b。
[change]
Fig. 5 A indicates that the plane graph of the 2nd example embodiment realizing the present invention。
Fig. 5 B indicates that the side view of the 2nd example embodiment realizing the present invention。
This embodiment is that transillumination portion 3b is different from the composition of image pickup part 4 relative to the example embodiment realizing the present invention that use Figure 1A, B represent。Hereinafter, illustrate centered by difference。
Thickness inequality checks that transillumination portion 3b is arranged on swivel mount 48 with image pickup part 4 by device 1a。Swivel mount 48 is to be made up of the rectangular frame in X-direction with the peristome being longer than substrate 10, and is provided with transillumination 3b in the beam portion of lower side, is provided with image pickup part 4 in the beam portion of upper side。Transillumination portion 3b and image pickup part 4 be configured to be arranged at a specific intervals to position on, and towards checking that line 41 irradiate light, and this position can be imaged。
And, swivel mount 48 is to have rotating shaft on the extended line checking line 41, and described rotating shaft is supported by the support 42 being arranged on device frame 11。The described rotating shaft of swivel mount 48 is to be connected with the image pickup part angle-adjusting mechanism 49 being arranged on support 42, and is rotated the adjustment of angle by the control signal of control unit 95。At described rotating shaft, possess the angle detector of the angle of detection swivel mount 48, and described angle detector constitutes the image pickup part angle detection mechanism of the present invention。As the image pickup part angle detection mechanism of this example, other can also for the angle detection encoder of image pickup part angle-adjusting mechanism 49 or the position and the posture person that detect the swivel mount 48 change angle because of rotation after。
Swivel mount 48 is to change angle by image pickup part angle-adjusting mechanism 45, and image mechanism 44 is integrated with transillumination 35 so that produce change with substrate 10 angulation。Therefore, image pickup part angle-adjusting mechanism 45 can also have the function of the transillumination angle-adjusting mechanism as the present invention concurrently。Thus, it is not necessary to adjust position and the angle of image mechanism 44 and transillumination 35 individually, thus cost can be reduced。The situation that the atomic little thickness that offsets knifeedge and cause because of image mechanism 44 and the position of any one in transillumination 35 and angle is uneven it is additionally, since without adjusting position and angle individually, so can be prevented from failing finding。Therefore, even if when the thickness that epithelium is overall slightly changes, it is also possible to be adjusted merely by the angle of swivel mount 48, and implement the thickness inequality inspection that repeatability is higher。
Owing to thickness inequality checks that device 1a becomes such composition, so substrate 10 can be made mobile along Y-direction conveyance from upstream side moving part 2a, and by between swivel mount 48, mobile towards downstream moving part 2b conveyance。And, when substrate 10 is by checking line 41, thickness inequality inspection can be carried out。Substrate 10, after checking line 41 by substrate, moves to dotted line 10f。
Claims (7)
1. a thickness inequality checks device, it is characterised in that including:
Substrate moving part, remains surface and is formed with the substrate of epithelium so as to move；
Light source portion, to described substrate illumination light；
Image pickup part, to imaging at least partially of the face being formed with epithelium of described substrate；And
Inspection portion, based on the image shot by described image pickup part, checks the uneven thickness of described epithelium；And
One side makes described substrate move in one direction, and one side checks the uneven thickness forming the epithelium at described substrate,
This thickness inequality checks that device comprises:
Inspection condition register, is set registration to the inspection condition corresponding with checking object kind；And
Representing thickness test section, detection forms the representative thickness of the epithelium at described substrate；
Described light source portion possesses:
Indirect illumination portion, is arranged in described image pickup part side, and to described substrate illumination light；And
Transillumination portion, be arranged in across described substrate and described image pickup part to position on, and to described substrate illumination light；
In described image pickup part, comprise the camera angle adjustment portion of the relative angle regulating described image pickup part and described substrate,
In described indirect illumination portion, comprise the indirect illumination angle adjusting part of the relative angle regulating described indirect illumination portion and described substrate,
In described transillumination portion, comprise the transillumination angle adjusting part of the relative angle regulating described transillumination portion and described substrate,
This thickness inequality checks that device includes control portion, this control portion can based on being registered in the inspection condition of described inspection condition register and from the described representative thickness information representing thickness test section, control described image pickup part angle adjusting part, described indirect illumination angle adjustment and described transillumination angle adjusting part, regulate the light quantity of described indirect illumination and the light quantity of described transillumination。
2. thickness inequality according to claim 1 checks device, it is characterised in that comprise: the count section that the rechecking number of times of same described substrate is counted, and
Possess: according to described counts, change the angle of described image pickup part or the function of the light quantity of described illumination。
3. thickness inequality according to claim 2 checks device, it is characterised in that:
Described inspection portion comprises the image processing part that each image through described rechecking carries out multiple synthesis process, and
Possess: carry out the multiple composograph of multiple synthesis gained based on the image that will process through described synthesis, check the multiple composograph audit function that thickness is uneven。
4. thickness inequality according to any one of claim 1 to 3 checks device, it is characterised in that:
Described image pickup part and described transillumination are linked, and
Described image pickup part angle adjusting part doubles as described transillumination angle adjusting part。
5. a thickness inequality inspection method, it is characterised in that including:
Substrate moves step, remains surface and is formed with the substrate of epithelium so as to move；
Image pickup step, from light source portion to described substrate illumination light, shoots the face being formed with epithelium at least some of of described substrate；And
Check step, based on the image shot by described image pickup part, check the uneven thickness of described epithelium；And
One side makes described substrate move in one direction, and one side checks the uneven thickness forming the epithelium at described substrate,
This thickness inequality inspection method includes:
Inspection condition register step, is set registration to the inspection condition corresponding with checking object kind；And
Representing thickness detecting step, detection forms the representative thickness of the epithelium at described substrate；
Described light source portion is configured to include:
Indirect illumination portion, is arranged in described image pickup part side, and to described substrate illumination light；And
Transillumination portion, be arranged in across described substrate and described image pickup part to position on, and to described substrate illumination light；
Described image pickup step is based on the inspection condition being registered in described inspection condition register and described represents the representative thickness information detected in thickness detecting step, including
Regulate the relative angle of described image pickup part and described substrate image pickup part angle adjustment step,
Regulate the relative angle of described indirect illumination portion and described substrate indirect illumination angle adjustment step,
Regulate the relative angle of described transillumination portion and described substrate transillumination angle adjustment step and
Regulate the light quantity regulating step of the light quantity of described indirect illumination or described transillumination。
6. thickness inequality inspection method according to claim 5, it is characterised in that have:
Counting step, counts the rechecking number of times of same described substrate；
Rechecking step, to same described substrate inspection at least twice；And
According to described counts, change the angle of described image pickup part or the step of the light quantity of described illumination。
7. thickness inequality inspection method according to claim 6, it is characterised in that have more:
Image acquisition step, in described rechecking step, obtains each image；
Multiple synthesis processes step, and each image of described acquisition is carried out multiple synthesis process；And
Multiple composograph checks step, based on the image processed through described multiple synthesis, checks that thickness is uneven。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011055469A JP2012189544A (en) | 2011-03-14 | 2011-03-14 | Apparatus and method for inspecting film thickness unevenness |
| JP2011-055469 | 2011-03-14 |
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| CN102967266A CN102967266A (en) | 2013-03-13 |
| CN102967266B true CN102967266B (en) | 2016-06-22 |
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| JP (1) | JP2012189544A (en) |
| KR (1) | KR20120104944A (en) |
| CN (1) | CN102967266B (en) |
| TW (1) | TWI545314B (en) |
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| CN103438376B (en) * | 2013-08-30 | 2015-07-08 | 友达光电(上海)有限公司 | Test lamp box |
| JP6020829B2 (en) * | 2013-10-22 | 2016-11-02 | 株式会社村田製作所 | Coating liquid observation method, coating method, coating liquid observation apparatus and coating apparatus |
| CN103727888B (en) * | 2013-12-27 | 2016-06-15 | 深圳市华星光电技术有限公司 | Chromatic color filter film thickness measuring method and device |
| KR101850363B1 (en) * | 2016-02-16 | 2018-04-20 | 주식회사 이오테크닉스 | Photographing apparatus and photographing method |
| CN106289060A (en) * | 2016-09-14 | 2017-01-04 | 华南理工大学 | A kind of system and method measuring planar LED fluorescent coating volume |
| JP6932597B2 (en) * | 2017-09-25 | 2021-09-08 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing equipment and substrate processing method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1904547A (en) * | 2005-07-29 | 2007-01-31 | 大日本网目版制造株式会社 | Asymmetric checking device and asymmetric checking method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH06102189A (en) * | 1992-09-17 | 1994-04-15 | Toshiba Corp | Foreign substance detector |
| JP4622007B2 (en) * | 1999-06-01 | 2011-02-02 | 株式会社ニコン | Defect inspection equipment |
| JP4632564B2 (en) * | 2001-03-08 | 2011-02-16 | オリンパス株式会社 | Surface defect inspection equipment |
| JP2003263627A (en) * | 2002-03-08 | 2003-09-19 | Olympus Optical Co Ltd | Image taking-in device |
| JP5358822B2 (en) * | 2008-04-30 | 2013-12-04 | 大塚電子株式会社 | State measuring device and state measuring method |
| JP2010216974A (en) * | 2009-03-17 | 2010-09-30 | Dainippon Screen Mfg Co Ltd | Apparatus and method for irregularity inspection and program |
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2011
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- 2012-03-12 KR KR1020120024856A patent/KR20120104944A/en not_active Application Discontinuation
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| CN1904547A (en) * | 2005-07-29 | 2007-01-31 | 大日本网目版制造株式会社 | Asymmetric checking device and asymmetric checking method |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI545314B (en) | 2016-08-11 |
| TW201237398A (en) | 2012-09-16 |
| JP2012189544A (en) | 2012-10-04 |
| CN102967266A (en) | 2013-03-13 |
| KR20120104944A (en) | 2012-09-24 |
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