CN102965620A - Sputtering target and manufacturing method thereof, film obtained by utilizing the target, film sheet and laminating sheet - Google Patents
Sputtering target and manufacturing method thereof, film obtained by utilizing the target, film sheet and laminating sheet Download PDFInfo
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- CN102965620A CN102965620A CN2012102699384A CN201210269938A CN102965620A CN 102965620 A CN102965620 A CN 102965620A CN 2012102699384 A CN2012102699384 A CN 2012102699384A CN 201210269938 A CN201210269938 A CN 201210269938A CN 102965620 A CN102965620 A CN 102965620A
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Abstract
A zinc oxide-aluminum oxide group sputtering target consists of zinc oxide and aluminum oxide as a main component. The relative density of the sintered compact is 95% or more. The molar ratio of zinc oxide and aluminum oxide is 50:50-95:5.
Description
Technical field
The present invention relates to a kind of be suitable for forming sputtering target and the manufacture method thereof of the film of the various characteristics excellences such as the transparency, gas barrier property, film, the diaphragm that possesses this film and the lamination sheets of utilizing this target to obtain.More specifically, relate to a kind of these various characteristicses excellences that is used to form, especially be suitable as sputtering target and the manufacture method thereof of the film of the gas barrier property materials such as liquid-crystal display, OLED display, Electronic Paper or solar module, film, the diaphragm that possesses this film and the lamination sheets of utilizing this target to obtain.
Background technology
The equipment such as liquid-crystal display, OLED display or solar cell are unable to undergo moisture usually, make its characteristic promptly deteriorated because of moisture absorption, so must be equipped with the assembly that has highly moistureproof, namely prevents the gas barrier property that block or water vapour etc. see through or enter.
For example, in the example of solar cell, be provided with backboard at the back side of the opposite side of the sensitive surface of solar module.About this backboard, representational have on base material a backboard that is made of the gas barrier property material with highly moistureproof and their parts of protection etc.
Backboard as this formation solar module; for example disclose by high-strength heat-resistant, weathering resistance resin sandwich moisture resistance tinsel, the back-protective that the solar module that glassiness evaporation epithelium forms is set in one side in addition is with sheet material (for example referring to Patent Document 1).In this sheet material, as tinsels such as gas barrier property materials'use aluminium foil, zinc-plated iron foil, zinc-plated iron foils.
And, disclose stacked high moisture barrier films and high Weather-proof film and make its integrated solar cell cover plate materials that forms be used for the solar cell (for example referring to Patent Document 2) of rear side guard block.High moisture barrier films in this solar cell cover plate materials uses following film, namely by the CVD(chemical vapor deposition), the PVD(evaporation reaction) method etc. forms moisture barrier films as gas barrier property material at base material films such as PET films, described moisture barrier films is made of filming of the inorganic oxides such as silicon-dioxide, aluminum oxide.In addition, disclose and have base material film and blocking layer, and the blocking layer is for by the inorganic nitride film of hollow cathode type ion plating film forming or the transparent blocking film (for example referring to Patent Document 3) of inorganic nitrogenize sull.In addition, disclose the solar module (for example referring to Patent Document 4) that is provided with the blocking layer that sees through more than a kind that stops water vapour, oxygen, resolvent or additive on the surface of solar cell device.In this solar module as blocking layer filming of using that the composition that is made of the vapor-deposited film by resin molding, barrier property resin molding, inorganic oxide, the polycondensate that obtained by the hydrolysis of silicon compound forms or by the composite membrane that wherein consists of more than 2 kinds.
In addition, disclose the photovoltaic module (for example referring to Patent Document 5) that possesses by the blocking layer that is inorganic oxide layer and is consisted of by plastic film or plastics composite.In this inorganic oxide layer, use aluminum oxide or silicon oxide as its coated material.And, disclose by the used for solar batteries backside protective sheet (for example referring to Patent Document 6) that the inorganic oxide film layer is set at heat-resisting, weathered plastics film and folded other duplexers heat-resisting, the weathered plastics film that are made of same resin consist of on this film aspect upper strata.Use any thin film layer that forms by silicon oxide or aluminum oxide as the inorganic oxide film layer in this used for solar batteries backside protective sheet.
In addition, disclose and stack gradually metal more than 3 valencys that mix or semi-conductor at the base material film with transparency and form and have a duplexer (for example referring to Patent Document 7) that the metal oxide layer of the zinc oxide film of ultraviolet screener characteristic and gas barrier property excellence forms.Metal oxide layer as this duplexer uses silicon oxide, aluminum oxide or magnesium oxide.
In addition, disclose at least one side of polymeric membrane base material and interdict layer by the vapour deposition process film forming by the gas that metal or metal oxide consist of, and form the transparent gas barrier property composite film material (for example referring to Patent Document 8) with ultraviolet protection of the resin layer that contains ultrafine particle at this gas blocking layer.As the gas of this transparency gas barrier property composite film material blocking layer, use the single layer structure that consisted of by aluminium or multilayered structure or by at least a single layer structure that consists of or the multilayered structure of aluminum oxide, Si oxide and magnesium oxide.
Patent documentation 1: Japanese Utility Model is announced flat 2-44995 communique (the 41st～44 row on the requirement of utility model logon right and 5 hurdles)
Patent documentation 2: Japanese Patent Publication 2000-174296 communique (claim 1, claim 7 and [0019] section)
Patent documentation 3: Japanese Patent Publication 2000-15737 communique (claim 1)
Patent documentation 4: Japanese Patent Publication 2001-217441 communique (claim 1 and 3)
Patent documentation 5: the public table of Japanese Patent 2002-520820 communique (claim 1 and [0019] section)
Patent documentation 6: Japanese Patent Publication 2002-134771 communique (claim 1 and 2)
Patent documentation 7: Japanese Patent Publication 7-256813 communique (claim 1,3 reaches [0015]～[0016] section)
Patent documentation 8: Japanese Patent Publication 2000-6305 communique (claim 1,7,8 reaches [0020] section)
Yet the back-protective shown in the above-mentioned patent documentation 1 is used as gas barrier property material with sheet material with tinsels such as aluminium foils, if therefore this sheet material is applied to the backboard of solar module, might reduce and current leakage by proof voltage.And, with regard to the sheet material of using tinsel, if the thickness of tinsel becomes below the 20 μ m, then being increased in the pin hole that produces between thermotolerance weathering resistance resin and the tinsel, the gas barrier property obviously descends.On the other hand, if the thickness of thickening tinsel, then can produce the problem that manufacturing cost rises, and, therefore need to distinguish as waste, owing to not transmission of light can't be used at the sensitive surface of solar cell, and, exist in power supply terminal danger of short circuit with the flash that produces tinsel around the punching hole.
In addition, when being the inorganic oxide such as the silicon-dioxide that uses in the above-mentioned patent documentation 2～8, aluminum oxide,, the thickness of film must be guaranteed more than 100nm then that the gas barrier property is abundant even if this size also is far from being if will obtain higher gas barrier property.
Summary of the invention
The object of the present invention is to provide a kind of sputtering target and manufacture method thereof that is suitable for forming the film of the transparency and gas barrier property excellence.
Another object of the present invention is to provide a kind of transparency and the film of gas barrier property excellence, the diaphragm that possesses this film and lamination sheets.
The 1st viewpoint of the present invention, be a kind of ZnO-Al
2O
3The class sputtering target, wherein, by with zinc oxide (ZnO) and aluminum oxide (Al
2O
3) consist of as the sintered compact of main component, the relative density of sintered compact is more than 95%, the mol ratio of zinc oxide and aluminum oxide is 50:50～95:5.
The 2nd viewpoint of the present invention, be a kind of ZnO-Al
2O
3The manufacture method of class sputtering target wherein, is ZnO powder and the Al of 0.1～5.0 μ m with the median size of primary particle
2O
3Powder is mixed into zinc oxide (ZnO) and aluminum oxide (Al
2O
3) mol ratio be 50:50～95:5, dose tackiness agent and extrusion forming, carrying out sintering more than 1000 ℃, be sintered compact more than 95% thereby make relative density after the demoulding.
The 3rd viewpoint of the present invention is the invention based on the 2nd viewpoint, wherein, being further used as to remove organic solvent and moisture etc. is the predrying of purpose, with 50～150 ℃ of processing of carrying out 1～10 hour, as being the skimming treatment of purpose so that tackiness agent disappears, with 400～600 ℃ of processing of carrying out 3～15 hours, and as putting forward highdensity sintering circuit, with 1000～1500 ℃ of processing of carrying out 3～15 hours.
The 4th viewpoint of the present invention, be a kind of ZnO-Al
2O
3The manufacture method of class film, wherein, by utilizing the ZnO-Al based on the 1st viewpoint
2O
3The sputtering method of class sputtering target forms ZnO-Al at substrate surface
2O
3The class film.
The 5th viewpoint of the present invention, be a kind of ZnO-Al
2O
3The class film wherein, forms by the manufacture method based on the 4th viewpoint.
The 6th viewpoint of the present invention, be a kind of diaphragm, wherein, possess ZnO-Al based on the 5th viewpoint at the 1st base material film
2O
3The class film, the water vapor transmission rate (WVTR) S when placing 1 hour under the condition of 20 ℃ of temperature, relative humidity 50%RH is 0.3g/m
2Below it.
The 7th viewpoint of the present invention, be a kind of lamination sheets, this lamination sheets forms stacked the 2nd base material film of side by tack coat at the film based on the diaphragm of the 6th viewpoint and forms.
In the sputtering target of the 1st viewpoint of the present invention, by with zinc oxide (ZnO) and aluminum oxide (Al
2O
3) consist of as the sintered compact of main component, the relative density of sintered compact is more than 95%, zinc oxide (ZnO) and aluminum oxide (Al
2O
3) mol ratio be 50:50～95:5, can form thus the film that significantly improves the gas barrier property than gas barrier property material in the past.And the barrier property of the single film layer that obtains is excellent, and therefore available less stacked number obtains higher barrier property, therefore can boost productivity, and can also reduce cost.And by being made as the blocking film of individual layer or less stacked number, the thickness attenuation of total can reduce and break warpage etc. when making the blocking sheet.When but the blocking film that this thickness is thinner is used in the solar cell of bending, improves resistance to bending and improve the weather resistance of solar cell.
In the manufacture method of the sputtering target of the 2nd viewpoint of the present invention, be ZnO powder and the Al of 0.1～5.0 μ m with the median size of primary particle
2O
3Powder is mixed into zinc oxide (ZnO) and aluminum oxide (Al
2O
3) mol ratio be 50:50～95:5, dose tackiness agent and extrusion forming, carrying out sintering more than 1000 ℃, be sintered compact 95% or more thereby make relative density after the demoulding, so can access and to form the target that significantly improves the film of gas barrier property than gas barrier property material in the past.
In the manufacture method of the sputtering target of the 3rd viewpoint of the present invention, as to remove predrying as purpose such as organic solvent and moisture, with 50～150 ℃ of processing of carrying out 1～10 hour, as being the skimming treatment of purpose so that tackiness agent disappears, with 400～600 ℃ of processing of carrying out 3～15 hours, and as putting forward highdensity sintering circuit, with 1000～1500 ℃ of processing of carrying out 3～15 hours, warpage in the time of can relaxing thus mixing raw material powder and moulding punching press, become sintering circuit when easily carrying out formal sintering, its result improves density.
In the diaphragm of the 6th viewpoint of the present invention, the water vapor transmission rate (WVTR) when placing 1 hour under the condition of 20 ℃ of temperature, relative humidity 50%RH is very high, up to 0.3g/m
2My god, and have because the deteriorated less gas barrier property that the process of time causes.
In the lamination sheets of the 7th viewpoint of the present invention, adopt by tack coat and form the further structure of stacked the 2nd base material film of side at the film of the diaphragm of the 6th viewpoint.Thus, the 2nd base material film can protective film, so can keep higher gas barrier property and make its stabilization.
Description of drawings
Fig. 1 is the sectional view that schematically represents the stepped construction of the diaphragm of embodiment of the present invention and lamination sheets.
Fig. 2 is the figure that schematically represents the cross section structure of diaphragm in the past.
Fig. 3 is the figure of cross section structure that schematically represents the diaphragm of embodiment of the present invention.
Fig. 4 is the synoptic diagram of sputter equipment.
Nomenclature
The 10-diaphragm, 11-the 1st base material film, 12-ZnO-Al
2O
3The class film, 13-tack coat, 14-the 2nd base material film, 20-lamination sheets.
Embodiment
Then, describe being used for implementing mode of the present invention with reference to the accompanying drawings.
ZnO-Al of the present invention
2O
3The class sputtering target can be applicable to the formation of film.The film that utilizes this sputtering target to form is the film that plays a role as the gas barrier property material that anti-block or water vapour etc. see through or enter.
This sputtering target forms by mixed oxidization zinc powder and alumina powder.The oxide compound purity of the Zinc oxide powder that uses in the making of sputtering target is more than 98%, is preferably more than 99.5%, and the oxide compound purity of alumina powder is more than 98%, to be preferably more than 99.5%.At this, it is because if worsen because of impurity less than 98% crystallinity, the result is interdicted characteristic and descended that the oxide compound purity in the Zinc oxide powder is limited to more than 98%.In addition, the oxide compound purity of alumina powder being limited to more than 98% is because if worsen because of impurity less than 98% crystallinity, the result is interdicted characteristic and descended.In addition, the purity of the powder in this specification sheets is according to spectrum analysis method (inductively coupled plasma emmission spectrometric analysis device: the purity of the Japanese Jarrell Ash ICAP-88 processed of company) measuring.And this sputtering target preferably is made of the polycrystalline that contains Zinc oxide particles and alumina particle, and its relative density is more than 95%, to be preferably more than 98%.With relative density be made as more than 95% be because, if easy abnormal discharge during less than 95% film forming is prone to defective in the film that obtains.Relative density in this specification sheets is according to volumetric method, by the density of calculating divided by the quality of measuring with mass spectrograph with the volume of vernier scale size up and calculating.In addition, in this embodiment, the tissue of sputtering target is made as polycrystalline, but also can be monocrystalline.
And, the median size of contained Zinc oxide particles is 0.1～5.0 μ m in this sputtering target, and the median size of alumina particle is 0.1～5.0 μ m, zinc oxide in the sputtering target and the mol ratio of aluminum oxide are 50:50～95:5, be preferably 60:40～80:20, especially be preferably 80:20.Manifest higher gas barrier property by containing Zinc oxide particles and the alumina particle of miniaturization like this with predetermined proportion, can make the film that utilizes this sputtering target to form.
Its technology reason is as follows: normal operation (1) does not comprise alumina particle and only comprises the sputtering target of Zinc oxide particles, (2) do not comprise Zinc oxide particles and only comprise the sputtering target of alumina particle, (3) comprise Zinc oxide particles and alumina particle both sides but Zinc oxide particles contain proportional less sputtering target, or (4) comprise Zinc oxide particles and alumina particle both sides but alumina particle contain proportional less sputtering target the time, as shown in Figure 2, be formed at sull 32 on the 1st base material film 11 and become the structure that the crystallization phases of column crystal is gathered abreast to the infiltration direction of gas.Because the gas molecules such as water vapour advance along the interface of the crystal boundary of gathering abreast, so in the film 32 of the structure that the crystallization of above-mentioned column crystal is gathered abreast, barrier property is lower.On the other hand; when utilizing when containing the sputtering target of the Zinc oxide particles of miniaturization or alumina particle in the mode that becomes predetermined proportion; the part of formed column crystal is burst apart and near the microtexture of the densification of non-crystalline state when as shown in Figure 3, being formed at sull 12 on the 1st base material film 11 and becoming the sputtering target that utilizes single component.Because in the microtexture near the densification of non-crystalline state, the gas molecules such as water vapour need to be in labyrinth-like minister's distance moving, so in the film 12 of the microtexture of above-mentioned densification near non-crystalline state, barrier property improves.Like this, infer that by the crystalline texture film forming be structure rather than the column crystal that is fit to prevent that moisture etc. from seeing through or entering, the gas barrier property improves.At this, with Zinc oxide particles contained in the sputtering target and alumina particle both sides' median size be limited in the above-mentioned scope be because, if each median size is less than lower value, then in the manufacturing process of sputtering target, it is obvious that the cohesion of powder becomes, hinder equably and mix, if each median size surpasses higher limit, then can not fully obtain being formed with the effect of the virtual sosoloid that helps to improve the gas barrier property.Wherein, especially the median size of preferential oxidation zinc particle is in the scope of 0.1～5.0 μ m, and the median size of alumina particle is in the scope of 0.1～5.0 μ m.In addition, in this specification sheets, so-called median size refers to according to laser diffraction, scattering method (Microtrack method), utilizes day machine dress company's system (FRA type), use sodium hexametaphosphate as dispersion agent, 1 time minute is made as the particle diameter that made the value equalization of measuring 3 times in 30 seconds.
And; with the mol ratio of zinc oxide contained in the sputtering target and aluminum oxide be limited in the above-mentioned scope be because; if the mol ratio of zinc oxide less than 50 or the mol ratio of aluminum oxide less than 5; then proportionally become very few containing of Zinc oxide particles or alumina particle; near single component; thereby the structure that the crystallization phases of taking easily column crystal of becoming is gathered abreast to the infiltration direction of gas, so can't form the film with fine and close microtexture.
The ZnO-Al that utilizes sputtering target of the present invention to form
2O
3Therefore the class film can obtain higher barrier property with less stacked number because the barrier property of individual layer is excellent, therefore can boost productivity, and can also reduce the cost.And, by being made as the blocking film of individual layer or less stacked number, the thickness attenuation of total, breaking in the time of can reducing to make the blocking sheet, warpage etc.When but the blocking film that this thickness is thinner is used in the solar cell of bending, improves resistance to bending and improve the weather resistance of solar cell.And, owing to have higher gas barrier property, therefore except the purposes of the gas barrier property materials such as moisture barrier films of the backboard that consists of solar cell, can also be suitable as liquid-crystal display, OLED display, illumination with gas barrier property materials such as OLED display or Electronic Paper.And, this ZnO-Al
2O
3It is about 85～95% the transparency that the class film has transmitance, so also be suitable as be used to the gas barrier property of having relatively high expectations and as require the gas barrier property material etc. of the sensitive surface side of parts such as solar cell of printing opacity or the image vision side of indicating meter etc.
Then, describe take the situation of making by sintering process as the manufacture method of representative to sputtering target of the present invention.At first, mix purity as Zinc oxide powder and be high purity powdered form 98% or more, be high purity powdered form, tackiness agent and organic solvent more than 98% as the purity of alumina powder that preparing concentration is the slurry of 30～75 quality %.The slurry of preferred preparation 40～65 quality %.In addition, Zinc oxide powder and alumina powder adjustment and be mixed into manufacturing after sputtering target in zinc oxide and the mol ratio of aluminum oxide satisfy above-mentioned scope.With the concentration limits of slurry fix on 30～75 quality % be because, if surpass 75 quality %, then because above-mentioned slurry is non-water system, therefore there is the problem points that is difficult to carry out stable mixing granulation, if less than 30 quality %, then can't obtain having the sintered compact of the densification of uniform tissue.And, the median size of relevant employed Zinc oxide powder, the median size of alumina powder, consider according to the median size of Zinc oxide powder contained in the sputtering target after will making, the reason that the median size of alumina powder is adjusted in the above-mentioned scope, preferably Zinc oxide powder is made as in the scope of 0.1～5.0 μ m, alumina powder is made as in the scope of 0.1～5.0 μ m.
Preferably utilize polyoxyethylene glycol or polyvinyl butyral acetal etc. as tackiness agent, and preferably utilize ethanol or propyl alcohol etc. as organic solvent.Tackiness agent preferably adds 0.2～5.0 quality %.
And, the wet mixing of high purity powdered form, tackiness agent and organic solvent, especially high purity powdered form with as the wet mixing of the organic solvent of dispersion agent by wet ball-milling or stir mill and carry out.In wet ball-milling, when utilizing ZrO
2During ball processed, utilize a plurality of ZrO of diameter 5～10mm
2Ball wet mixing processed 8～24 hours, preferred wet mixing 20～24 hours.With ZrO
2It is because if less than 5mm, then mixing can become insufficient, if surpass 10mm, then has the unfavorable condition that impurity increases that the diameter of ball processed is limited to 5～10mm.And mixing time is long to be because even long-time continuous is mixed, also seldom produce impurity by the longest 24 hours.
In stirring mill, utilize the ZrO of diameter 1～3mm
2Ball processed, wet mixing 0.5～1 hour.With ZrO
2It is because if less than 1mm, then mixing can become insufficient, if surpass 3mm, then has the unfavorable condition that impurity increases that the diameter of ball processed is limited to 1～3mm.And it is because if above 1 hour, then be not only the mixing of raw material, ball itself also can wear and tear, and therefore becomes the reason that produces impurity, and as long as just can mix fully in 1 hour that mixing time is short to the longest 1 hour.
Secondly, the mixing granulation powder that it is 50～250 μ m that the above-mentioned slurry of spraying drying obtains median size, be preferably 50～200 μ m.This prilling powder is put into predetermined mold, and with predetermined pressure forming.Above-mentioned spraying drying preferably utilizes spray-dryer to carry out, and predetermined mold is utilized uniaxial pressing machine or isostatic cool pressing (CIP; Cold Isostatic Press) forming machine.In the uniaxial pressing machine, with 750～2000kg/cm
2(73.55～196.1MPa), preferably with 1000～1500kg/cm
2(98.1～147.1MPa) pressure carries out the single shaft extrusion forming to prilling powder, in the CIP forming machine, with 1000～3000kg/cm
2(98.1～294.2MPa), preferably with 1500～2000kg/cm
2(147.1～196.1MPa) pressure carries out the CIP moulding to prilling powder.It is in order to improve the density of formed body that pressure is limited in the above-mentioned scope, and prevents the distortion behind the sintering, and eliminates post-treatment.
In addition, after the demoulding with the preset temperature sintered moulded body.Sintering in atmosphere, rare gas element, vacuum or reducing gas atmosphere with more than 1000 ℃, preferably with 1200～1400 ℃ temperature, carry out 1～10 hour, preferably carried out 2～5 hours.Can access thus relative density and be the sputtering target more than 95%.Although above-mentioned sintering under atmospheric pressure carries out, such as hot pressing (HP) sintering or hip moulding (HIP; When Hot Isostatic Press) sintering carries out pressure sintering like that, preferably in rare gas element, vacuum or reducing gas atmosphere, carried out 1～5 hour with the temperature more than 1000 ℃.
In addition, preferably before above-mentioned sintering, formed body is carried out predrying, skimming treatment.Can be used as to remove organic solvent and moisture etc. is the predrying of purpose, with 50～150 ℃ of processing of carrying out 1～10 hour, as being the skimming treatment of purpose so that tackiness agent disappears, with 400～600 ℃ of processing of carrying out 3～15 hours, and as putting forward highdensity sintering circuit, with 1000 ℃～1500 ℃ processing of carrying out 3～15 hours.By carrying out these predrying and skimming treatments, the warpage in the time of can relaxing mixing raw material powder and moulding punching press, the sintering circuit when easily carrying out formal sintering of becoming, its fruit density improves.
Then, diaphragm of the present invention and lamination sheets and its manufacture method are together described.As shown in Figure 1, diaphragm 10 of the present invention has the 1st base material film 11 and preferably utilizes above-mentioned sputtering target and the ZnO-Al of the present invention that forms
2O
3Class film 12.And lamination sheets 20 of the present invention has the diaphragm 10 of the invention described above and passes through the 2nd base material film 14 of tack coat 13 bondings in the film formation side of this diaphragm 10.
The 1st base material film 11 and the 2nd base material film 14 preferably have the physical strength of withstanding long hot and humid degree environmental testing or weathering resistance etc.For example, can enumerate the resin moldings such as polyethylene terephthalate (PET), polycarbonate, polymethylmethacrylate, polyacrylic ester, PEN (PEN), polyarylester, polyethersulfone, cellulosetri-acetate (TAC), cyclic olefin (being total to) polymers.These resin moldings also can be combined with fire retardant, antioxidant, UV light absorber and static inhibitor etc. as required.The thickness of the 1st base material film 11 and the 2nd base material film 14 is preferably 5～300 μ m, more preferably 10～150 μ m.
On the 1st base material film 11, preferably utilize the sputtering target of the invention described above, form the ZnO-Al as gas barrier property material
2O
3Class film 12.Wherein, ZnO-Al
2O
3The thickness of class film 12 especially is preferably in the scope of 20～100nm.
ZnO-Al of the present invention
2O
3The formation method of class film is utilized above-mentioned resulting sputtering target and is passed through sputtering method, such as forming ZnO-Al at substrate surfaces such as above-mentioned the 1st base material films
2O
3The class film.Spendable substrate can be known substrate in the past, especially restriction, but be preferably the resin substrate such as PET.
Sputtering method is physical vapor deposition (PVD method; Physical Vapor Deposition) a kind of, sputter refers to that the particle (or ion) that accelerates impacts when solid surface, obtains a momental part that its particle holds and near the solid surface atom is spilt the phenomenon to the space.Utilizing this sputtering phenomenon to carry out film forms.The dc sputtering of applying direct current electric field and the high-frequency sputtering of applying high frequency electric field are arranged in the sputtering method.And also be categorized as 2 utmost point formulas, 4 utmost point formula sputtering methods etc. according to number of electrodes.
Fig. 4 represents general sputter equipment 40.Vacuum vessel 41 has gas inlet 42 and vaccum exhaust outlet 43, and these container 41 inside arrange the electrode 44,46 of slab construction abreast.Electrode 44,46 links to each other with direct supply or high frequency electric source 47 at external container, and is grounded.Negative electrode 44 becomes can arrange target material 48, and anode 46 becomes the structure that also doubles as substrate holder, in order to substrate 49 can be set.
Utilize the sputter equipment of this structure to form ZnO-Al
2O
3During the class film, at first at negative electrode 44 sputtering target 48 of the present invention is set, at anode 46 substrate 49 is set.Then, will be vented to 5 * 10 in the vacuum vessel 41 with vacuum pumping hardware
-4After Pa was following, the mode that becomes about 0.3～1.0Pa with the atmosphere of vacuum vessel 41 inside imported Ar gas 51 or oxygen by gas inlet 42.And substrate 49 does not heat, or is heated to the temperature below 150 ℃.Then, if to electrode 44,46 in addition direct current or high-frequency electric field, then produce among Ar ion 52(Fig. 4 in the Ar gas 51 interior generation glow discharges that are directed into vacuum vessel 41 inside be labeled as+).The Ar ion 52 that produces by this glow discharge is attracted by the negative voltage of negative electrode 44 and is accelerated, with target material 48 collisions that are arranged at negative electrode 44, and each metallic element and the Sauerstoffatom sputter vaporization of the target material that is ejected because of this impact.The atom of each metallic element 53 of sputter vaporization (being labeled as M among Fig. 4) all with the Sauerstoffatom of sputter vaporization or the combination with oxygen that imports by gas inlet 42, arrive and remain on the substrate 49 of anode 46, piled up by these and formed ZnO-Al
2O
3The class film.
In addition, although do not illustrate among Fig. 1, in order to improve and ZnO-Al
2O
3The adhesion strength of class film 12 can be as required arranges the prime coat that be made of acrylic polyol, isocyanic ester, silane coupling agent at the 1st base material film 11, or implements to utilize the surface treatment of plasma body etc. before the evaporation operation.
On the other hand, at formed ZnO-Al
2O
3Under the state that expose on class film 12 surfaces, if when installation sheet, scratch or wearing and tearing film surface, then the gas barrier property is brought considerable influence.Therefore, preferably at ZnO-Al
2O
3Protection ZnO-Al is set on the class film 12
2O
3The gas barrier property tunicle (not shown) on class film 12 surfaces etc.This gas barrier property tunicle can be at ZnO-Al
2O
3The solution that class film 12 surface coated are for example mixed silicon compound, titanium compound, zirconia compound, tin compound or its hydrolyzate with alkoxyl group and the water-soluble polymer with hydroxy forms by heat drying afterwards.This gas barrier property tunicle is not only as ZnO-Al
2O
3The protective layer of class film 12 plays a role, and also has the effect that improves the gas barrier property.
For example after placing 1 hour under the condition of 20 ℃ of temperature, relative humidity 50%RH, the water vapor transmission rate (WVTR) of measuring under the condition of 40 ℃ of temperature, relative humidity 90%RH is shown as 0.3g/m to the diaphragm of the present invention 10 that forms like this
2Below it.
In addition, in lamination sheets 20 of the present invention, form side, be ZnO-Al at the film of the diaphragm 10 of the invention described above
2O
3Form tack coat 13 on the class film 12 or on the above-mentioned gas barrier property tunicle, this tack coat 13 is formed with ZnO-Al as being used for fitting
2O
3The 1st base material film 11 of class film 12 and the binding agent of the 2nd base material film 14 play a role.Therefore, need cohesive strength through can deteriorated, not producing delamination etc. for a long time and not, and can flavescence etc. condition, such as enumerating polyurethanes, polyester, polyester-polyurethane class, polycarbonate-based, poly-epoxy-amine class, hot melt class binding agent etc.The laminating method of tack coat 13 can be stacked with known methods such as dry laminate methods.
By at this tack coat 13 bonding the 2nd base material films 14 and fit complete layer lamination 20.In addition, as shown in Figure 1, ZnO-Al
2O
3Class film 12 and tack coat 13 may not be defined in separately 1 layer of 1 layer of lamination sheets that ground is stacked, also can be made as alternately laminated ZnO-Al
2O
3Class film 12 and tack coat 13 or stacked ZnO-Al alternately or brokenly
2O
32～10 layers multilayer of the miscellaneous parts such as class film 12, above-mentioned gas barrier property tunicle and tack coat 13.Thus, can further improve gas barrier property or weathering resistance.
The backboard, liquid-crystal display, OLED display, illumination that this lamination sheets 20 can be suitable as solar module is with purposes such as OLED display or Electronic Paper.
[embodiment]
Secondly, embodiments of the invention and comparative example together are elaborated.
＜embodiment 1 〉
Preparing at first, respectively median size and be 0.8 μ m and purity and be 99.8% high purity ZnO powder, median size is that 1.5 μ m and purity are 99.8% high purity Al
2O
3Powder, as the PVB resin of tackiness agent, as ethanol and the acetone of organic solvent.
Then, mix ZnO powder, Al by the wet mixing based on ball mill with predetermined proportion
2O
3Powder, tackiness agent and organic solvent, preparation concentration is the slurry of 40 quality %.And, ZnO powder and Al
2O
3The combined amount of powder is adjusted into that contained ZnO is 50 % by mole, Al in the sputtering target after the formation
2O
3It is 50 % by mole.
Then, the slurry that utilizes the spray-dryer spraying drying to prepare obtains median size and is this prilling powder being put into predetermined mould, by the impact briquetting of uniaxial pressing machine after the mixing granulation powder of 200 μ m.After the demoulding, in air atmosphere, with the resulting formed body of 1 300 ℃ temperature sintering 5 hours, obtain sputtering target.
＜embodiment 2 〉
With ZnO powder and Al
2O
3The combined amount of powder is adjusted into that contained ZnO is 61 % by mole, Al in the sputtering target after the formation
2O
3Be 39 % by mole, obtain in the same manner sputtering target with embodiment 1 in addition.
＜embodiment 3 〉
With ZnO powder and Al
2O
3The combined amount of powder is adjusted into that contained ZnO is 80 % by mole, Al in the sputtering target after the formation
2O
3Be 20 % by mole, obtain in the same manner sputtering target with embodiment 1 in addition.
＜embodiment 4 〉
With ZnO powder and Al
2O
3The combined amount of powder is adjusted into that contained ZnO is 95 % by mole, Al in the sputtering target after the formation
2O
3Be 5 % by mole, obtain in the same manner sputtering target with embodiment 1 in addition.
＜embodiment 5～9 〉
With ZnO powder and Al
2O
3The combined amount of powder is adjusted into that contained ZnO is 80 % by mole, Al in the sputtering target after the formation
2O
3Be 20 % by mole, obtain in the same manner sputtering target with embodiment 1 in addition.
＜embodiment 10 〉
Using median size is that 0.1 μ m and purity are that 99.8% high purity ZnO powder and median size are that 0.1 μ m and purity are 99.8% high purity Al
2O
3Powder, and with ZnO powder and Al
2O
3The combined amount of powder is adjusted into that contained ZnO is 80 % by mole, Al in the sputtering target after the formation
2O
3Be 20 % by mole, obtain in the same manner sputtering target with embodiment 1 in addition.
＜embodiment 11 〉
Using median size is that 5.0 μ m and purity are that 99.8% high purity ZnO powder and median size are that 5.0 μ m and purity are 99.8% high purity Al
2O
3Powder, and with ZnO powder and Al
2O
3The combined amount of powder is adjusted into that contained ZnO is 80 % by mole, Al in the sputtering target after the formation
2O
3Be 20 % by mole, obtain in the same manner sputtering target with embodiment 1 in addition.
＜comparative example 1 〉
Do not mix Al
2O
3Powder and adjusting obtains sputtering target in the same manner with embodiment 1 in addition.
＜comparative example 2 〉
With ZnO powder and Al
2O
3The combined amount of powder is adjusted into that contained ZnO is 98 % by mole, Al in the sputtering target after the formation
2O
3Be 2 % by mole, obtain in the same manner sputtering target with embodiment 1 in addition.
＜comparative example 3 〉
With ZnO powder and Al
2O
3The combined amount of powder is adjusted into that contained ZnO is 40 % by mole, Al in the sputtering target after the formation
2O
3Be 60 % by mole, obtain in the same manner sputtering target with embodiment 1 in addition.
＜comparative example 4 〉
Do not mix ZnO powder and adjust, obtain in the same manner sputtering target with embodiment 1 in addition.
＜comparison test 〉
The sputtering target that utilization obtains in embodiment 1～11 and comparative example 1～4 is to carry out evaporation by the RF sputtering method on the PET film of 75 μ m to come film forming thickness be the film of 100nm at thickness, forms diaphragm.Sputtering condition is that film forming speed is 1nm/sec, and substrate temperature, oxygen partial pressure are as shown in the following Table 1.These diaphragms are measured water vapor transmission rate (WVTR) estimate the gas barrier property.And, these diaphragms are measured transmittance estimate the transparency.These be the results are shown in following table 1.
(1) gas barrier property: diaphragm is placed in the clean room that is set as 20 ℃ of temperature, relative humidity 50%RH after 1 hour, the water vapor transmission rate (WVTR) determinator (model name is PERMATRAN-W type 3/33) that utilizes MOCON company to make is measured water vapor transmission rate (WVTR) under the condition of 40 ℃ of temperature, relative humidity 90%RH.
(2) transmittance: utilize the spectrophotometer (model name is U-4000) of manufacturing company of Co., Ltd. Hitachi manufacturing, measure the transmittance of diaphragm in 380～780nm wavelength.
[table 1]
As can be known clear and definite from table 1, if comparing embodiment 1～11 and comparative example 1～4, then in embodiment 1～11, transmittance is higher, and the water vapor transmission rate (WVTR) of placing at room temperature after 1 hour is 0.28g/m
2Below it, show excellent barrier property.And, ZnO and Al
2O
3Mol ratio more more show excellent water vapor transmission rate (WVTR) near 80:20.
On the other hand, at the comparative example 1 that utilizes the sputtering target consisted of by single component to form, 4 diaphragm or to utilize the containing ratio of ZnO be 40 % by mole or Al
2O
3Containing ratio be in the comparative example 2 that forms of 2 % by mole sputtering target, 3 the diaphragm, become the higher but very large result of water vapor transmission rate (WVTR) of transmittance.
And, if pay close attention to filming condition, can find that then the substrate for film deposition temperature more uprises the blocking characteristic and more improves the tendency that the larger transmittance of oxygen partial pressure more uprises.
Claims (7)
1. ZnO-Al
2O
3The class sputtering target is characterized in that,
By with zinc oxide ZnO and aluminium oxide Al
2O
3Sintered compact as main component consists of, and the relative density of described sintered compact is more than 95%, and the mol ratio of described zinc oxide and described aluminum oxide is 50:50～95:5.
2. ZnO-Al
2O
3The manufacture method of class sputtering target is characterized in that,
Be ZnO powder and the Al of 0.1～5.0 μ m with the median size of primary particle
2O
3Powder is mixed into described zinc oxide ZnO and described aluminium oxide Al
2O
3Mol ratio be 50:50～95:5, dose tackiness agent and extrusion forming, carrying out sintering more than 1000 ℃, be sintered compact more than 95% thereby make relative density after the demoulding.
3. ZnO-Al as claimed in claim 2
2O
3The manufacture method of class sputtering target, wherein,
As to remove predrying as purpose such as organic solvent and moisture, with 50～150 ℃ of processing of carrying out 1～10 hour, as being the skimming treatment of purpose so that tackiness agent disappears, with 400～600 ℃ of processing of carrying out 3～15 hours, and as putting forward highdensity sintering circuit, with 1000～1500 ℃ of processing of carrying out 3～15 hours.
4. ZnO-Al
2O
3The manufacture method of class film is characterized in that,
By utilizing ZnO-Al claimed in claim 1
2O
3The sputtering method of class sputtering target forms ZnO-Al at substrate surface
2O
3The class film.
5. ZnO-Al
2O
3The class film is characterized in that,
Form by manufacture method claimed in claim 4.
6. a diaphragm is characterized in that,
Possesses ZnO-Al claimed in claim 5 at the 1st base material film
2O
3The class film,
Water vapor transmission rate (WVTR) S when placing 1 hour under the condition of 20 ℃ of temperature, relative humidity 50%RH is 0.3g/m
2Below it.
7. lamination sheets, this lamination sheets forms stacked the 2nd base material film of side by tack coat at the film of diaphragm claimed in claim 6 and forms.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-186034 | 2011-08-29 | ||
| JP2011186034A JP5741325B2 (en) | 2011-08-29 | 2011-08-29 | Sputtering target, manufacturing method thereof, thin film using the target, thin film sheet including the thin film, and laminated sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102965620A true CN102965620A (en) | 2013-03-13 |
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ID=47796053
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| CN (1) | CN102965620A (en) |
Cited By (3)
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| CN104416160A (en) * | 2013-09-11 | 2015-03-18 | 安泰科技股份有限公司 | High-density zinc oxide based target and preparation method thereof |
| CN106187100A (en) * | 2015-05-04 | 2016-12-07 | 清华大学 | Sputtering target and preparation method thereof |
| CN111439997A (en) * | 2020-05-25 | 2020-07-24 | 先导薄膜材料（广东）有限公司 | Zinc-aluminum oxide target material and preparation method thereof |
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Also Published As
| Publication number | Publication date |
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| JP2013047362A (en) | 2013-03-07 |
| JP5741325B2 (en) | 2015-07-01 |
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