CN102959781A - Flexible circuit substrate, manufacturing method thereof, and fuel cell employing said flexible circuit substrate - Google Patents
Flexible circuit substrate, manufacturing method thereof, and fuel cell employing said flexible circuit substrate Download PDFInfo
- Publication number
- CN102959781A CN102959781A CN2012800013049A CN201280001304A CN102959781A CN 102959781 A CN102959781 A CN 102959781A CN 2012800013049 A CN2012800013049 A CN 2012800013049A CN 201280001304 A CN201280001304 A CN 201280001304A CN 102959781 A CN102959781 A CN 102959781A
- Authority
- CN
- China
- Prior art keywords
- collector
- current
- base material
- flexible pcb
- flexible base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/02—Details
- H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
- H01M8/0269—Separators, collectors or interconnectors including a printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/02—Details
- H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
- H01M8/0204—Non-porous and characterised by the material
- H01M8/0206—Metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/02—Details
- H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
- H01M8/0204—Non-porous and characterised by the material
- H01M8/0223—Composites
- H01M8/0228—Composites in the form of layered or coated products
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/02—Details
- H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
- H01M8/0258—Collectors; Separators, e.g. bipolar separators; Interconnectors characterised by the configuration of channels, e.g. by the flow field of the reactant or coolant
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/02—Details
- H01M8/0271—Sealing or supporting means around electrodes, matrices or membranes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/02—Details
- H01M8/0271—Sealing or supporting means around electrodes, matrices or membranes
- H01M8/0273—Sealing or supporting means around electrodes, matrices or membranes with sealing or supporting means in the form of a frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/24—Grouping of fuel cells, e.g. stacking of fuel cells
- H01M8/241—Grouping of fuel cells, e.g. stacking of fuel cells with solid or matrix-supported electrolytes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/24—Grouping of fuel cells, e.g. stacking of fuel cells
- H01M8/2457—Grouping of fuel cells, e.g. stacking of fuel cells with both reactants being gaseous or vaporised
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/02—Details
- H01M8/0271—Sealing or supporting means around electrodes, matrices or membranes
- H01M8/0276—Sealing means characterised by their form
- H01M8/0278—O-rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/10—Fuel cells with solid electrolytes
- H01M8/1009—Fuel cells with solid electrolytes with one of the reactants being liquid, solid or liquid-charged
- H01M8/1011—Direct alcohol fuel cells [DAFC], e.g. direct methanol fuel cells [DMFC]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/50—Fuel cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Fuel Cell (AREA)
Abstract
To provide a flexible circuit substrate which is used as an electricity collector plate of a fuel cell, with which it is possible to avoid corrosion or dissolution of a conductor layer which configures the electricity collector plate and obtain sufficient electrical connection with a film electrode binder even in high temperature and high pressure usage conditions. [Solution] A flexible circuit substrate according to the present invention, whereon a fuel cell electricity collector plate is disposed, comprises: an insulating flexible substrate (1); a plurality of aperture parts (5) which pass through the flexible substrate (1) in the thickness direction in regions wherein electricity collector bodies (7, 8) are formed, to supply either fuel or air; a conducting layer made from copper foil (2, 3) and a plating film (6) which are formed on the obverse faces and the reverse faces of the flexible substrate (1) in the regions and the interior walls of the plurality of aperture parts (5) and which configure the electricity collector bodies (7, 8); and an obverse face processed film (9) which is formed upon the plating film (6), is formed from a conductive material, and is more corrosion-resistant than the plating film (6).
Description
Technical field
The present invention relates to a kind of flexible PCB, relate more specifically to a kind of flexible PCB and manufacture method thereof that is used as the collector plate (current collecting plate) of fuel cell, and a kind of fuel cell that uses flexible PCB.
Background technology
In recent years, lithium ion battery lightweight and high power capacity mainly is used as the power supply of the electronic equipment take cell phone, personal computer etc. as representative.
Yet, along with the development with more high performance electronic equipment, the increase of power consumption is just causing following problem: (1) can't guarantee sufficient electric power, and (2) are even guaranteed necessary electric power, continuous working period also can shorten, and (3) charging interval that will rectificate.
In these cases, the power supply of lithium ion battery instead, fuel cell just receives much concern.Especially, think that the direct methanol fuel cell (DMFC) of using methyl alcohol to act as a fuel is promising.DMFC has by fuel electrode, air electrode and is used for providing the methanol aqueous solution membrane electrode assembly (MEA) that the while provides the dielectric film of air to consist of to air electrode to fuel electrode.Offer the methyl alcohol of fuel electrode by catalyst decomposes and generation hydrogen ion.Hydrogen ion pass dielectric film and the air electrode place be present in airborne oxygen and react.DMFC reacts to generate electric power by a series of these.
Because comparing DMFC with lithium ion battery can provide high density energy, so they can deal with the power consumption of the increase of electronic equipment.In addition, can realize that for DMFC preparation deposit fuel the lasting use of electronic equipment does not need as the long-time charging in the lithium ion battery.In addition, because the equipment that DMFC need to be such as the converter that produces hydrogen is possible so reduce size and the weight of DMFC, think that this is that DMFC surpasses in the advantage of other fuel cell.
A member that consists of DMFC is collector plate.In order to realize less and lighter fuel cell, flexible PCB is used as collector plate (referring to for example patent documentation 1).In flexible PCB, the conductor layer that consists of current-collector is formed on the one side of the flexible base material of being made by polyimides etc.Current-collector has the opening that arranges for providing methyl alcohol or air to MEA.
In order to keep the characteristic such as the output voltage of fuel cell, require current-collector to have opposing methyl alcohol and the corrosion resistance of intermediate product that produce, such as formic acid in decomposing the process of methyl alcohol.Therefore, patent documentation 2 discloses a kind of flexible PCB, wherein as the conductor layer of current-collector by carbon-containing bed covering.This is carbon-containing bed is made by the resin composition that comprises the carbon such as carbon black in the resin material such as polyimides.
Reference listing
Patent documentation
Patent documentation 1: Japanese Patent Laid-Open No. 2004-200064
Patent documentation 2: Japanese Patent Laid-Open No. 2010-050378.
Summary of the invention
Technical problem
Yet, because carbon-containing bed resistance ratio is higher by the metal conductor layer such as copper, so unfortunately, is coated with carbon-containing bed current-collector and has higher conductive resistance value.Also have such possibility, namely the resin material as adhesive may decompose under the hot operation condition.
In addition, covered by the coating such as carbon-containing bed even work as conductor layer, particularly be connected in series in the situation of a plurality of batteries with the output high pressure, the metal that consists of conductor layer also may be owing to the wash-out via the corrosion at the interface between flexible base material and the coating.Explain this problem with reference to Fig. 6 (1) and 6 (2).
Fig. 6 (1) shows the viewgraph of cross-section of the conventional flexible PCB 100 of the current-collector that is provided with fuel cell on it.In flexible PCB 100, the conductor layer 102 that consists of current-collector is formed on the one side of the flexible base material 101 of being made by polyimides etc.Conductor layer 102 is made by copper etc.Formed coating (all described above carbon-containing bed) 103 to cover this conductor layer 102.Flexible PCB 100 has the opening 105 that is formed for providing the opening 104 of methyl alcohol and is formed for providing air.
As shown in Fig. 6 (1), coating 103 covers conductor layer 102, so that conductor layer 102 is not exposed to the outside.Yet among the interface S between coating 103 and flexible base material 101, coating 103 and flexible base material 101 only contact with each other and are not adhering to each other.Therefore, when with flexible PCB 100 during as the collector plate of fuel cell, methyl alcohol and as the acid of product in the middle of it along and pass the inside that interface S enters flexible PCB 100.Thereby, corrosion and the wash-out of conductor layer 102 have occured.Therefore, as shown in Fig. 6 (2), the side of conductor layer 102 forms breach, and this makes the lateral parts of coating 103 enter floating state.Although also do not clarify up to now the mechanism of corrosion process, the according to estimates electrolytic corrosion (electrolytic corrosion) that causes owing near the partial potential difference that the S of interface, produces of this corrosion.
Therefore, especially under condition of high voltage, the local corrosion that begins from interface S has occured.Therefore, the corrosion and the wash-out that provide coating 103 can not prevent conductor layer 102.
Should be noted in the discussion above that coating 103 can be made of the plated metal that is electroplated onto on the conductor layer 102, carbon-containing bed to replace, plated metal (for example, gold) has the less ionization tendency of ionization tendency than the copper that consists of conductor layer 102.Yet such as the situation in patent documentation 2, the adhesion at the interface between electrodeposited coating and flexible base material is unstable, and this just can not be avoided occuring the corrosion from the interface.
Therefore, even the purpose of this invention is to provide a kind of corrosion of the conductor layer that under the high temperature and high pressure condition of work, also can prevent from consisting of current-collector and wash-out, realize the flexible PCB that fully is electrically connected with MEA simultaneously, and manufacture method, and provide a kind of fuel cell that uses flexible PCB.
The technical scheme of dealing with problems
Flexible PCB according to an aspect of the present invention is the flexible PCB that is provided with the current-collector of fuel cell on it, comprising: the insulation flexible base material; A plurality of openings of fuel or air are provided, and described opening is arranged in the regulation zone, to penetrate described flexible base material at thickness direction; Consist of the conductor layer of described current-collector, described conductor layer is formed on the front and back of flexible base material described in the regulation zone and on the inwall of described a plurality of openings; And the conductive surface that is formed on the conductor layer processes film, and described conductive surface is processed film and had the higher corrosion resistance of corrosion resistance than described conductor electricity layer.
Fuel cell according to one aspect of the invention comprises: membrane electrode assembly (MEA), and it is made of dielectric film, the fuel electrode on a surface that is attached to described dielectric film and another the surperficial air electrode that is attached to described dielectric film; And according to flexible PCB of the present invention, described flexible PCB is arranged so that described current-collector contacts described fuel electrode or described air electrode.
A kind of method for the manufacture of flexible PCB according to an aspect of the present invention, comprise: prepare two-sided metal-coated laminated board, described two-sided metal-coated laminated board has the insulation flexible base material and is separately positioned on the first and second metal formings on the two sides of described flexible base material; Forming a plurality of openings of formation in the expected areas at current-collector on the described two-sided metal-coated laminated board, described opening penetrates described two-sided metal-coated laminated board at thickness direction; By the described two-sided metal-coated laminated board that is formed with described opening on it is used electroplating processes, on described the first and second metal formings and at the inwall of described opening, form electroplated film disk; By etching described the first and second metal formings and electroplated film disk formation pattern are formed current-collector; And by the described two-sided metal-coated laminated board application electroplating processes that is formed with described current-collector on it is formed surface treatment on described electroplated film disk, described surface treatment has the corrosion resistance higher than the corrosion resistance of described electroplated film disk.
A kind of method for the manufacture of flexible PCB according to an aspect of the present invention comprises: preparation insulation flexible base material; Current-collector forms and forms a plurality of openings in the expected areas on described flexible base material, and described opening penetrates described flexible base material at thickness direction; Front and back at described flexible base material forms resist plating, and described resist plating forms in the expected areas at described current-collector has opening; By the described flexible base material that is formed with described resist plating on it is used electroplating processes, do not covering on the described flexible base material of described resist plating and forming electroplated film disk at the inwall of described a plurality of openings; And by peeling off described resist plating and subsequently the described flexible base material application electroplating processes that is formed with described electroplated film disk on it being formed surface treatment on described electroplated film disk, described surface treatment has the corrosion resistance higher than the corrosion resistance of described electroplated film disk.
The beneficial effect of the invention
In flexible PCB according to the present invention, the conductor layer that consists of current-collector is formed on the two sides of flexible base material and on the inwall of opening.On conductor layer, formed the surface treatment of being made by electric conducting material, this surface treatment has the corrosion resistance higher than the corrosion resistance of conductor layer.In brief, with act as a fuel and the each several part of the current-collector that the methyl alcohol of intermediate product and acid contact is all covered by surface treatment.Different from conventional cases, there are not the coating of protecting conductor layer and the interface between the flexible base material.Therefore, in the time will being used as the collector plate of fuel cell according to flexible PCB of the present invention, even under the high temperature and high pressure condition of work, also can prevent corrosion and the wash-out of conductor layer.Thus, provide the possibility that becomes of the fuel cell with the stability characteristic (quality) such as output voltage with making.
Description of drawings
Figure 1A is for explaining according to the first embodiment of the present invention, for the manufacture of the cross section process view of the method for flexible PCB.
Figure 1B be follow being used for after Figure 1A explain according to the first embodiment of the present invention, for the manufacture of the cross section process view of the method for flexible PCB.
Fig. 2 A is for explaining according to the first embodiment of the present invention, for the manufacture of the main procedure plan view of the method for flexible PCB.
Fig. 2 B be follow being used for after Fig. 2 A explain according to the first embodiment of the present invention, for the manufacture of the main procedure plan view of the method for flexible PCB.
Fig. 3 A for explain according to a second embodiment of the present invention, for the manufacture of the cross section process view of the method for flexible PCB.
Fig. 3 B be follow being used for after Fig. 3 A explain according to a second embodiment of the present invention, for the manufacture of the cross section process view of the method for flexible PCB.
Fig. 4 shows the according to an embodiment of the invention part viewgraph of cross-section of the ios dhcp sample configuration IOS DHCP of fuel cell.
Fig. 5 is for the plan view of explaining the flexible PCB that accommodates therein two MEA.
Fig. 6 (1) is the viewgraph of cross-section as the conventional flexible PCB of fuel cell collector plate, and Fig. 6 (2) show just be corroded and the state of wash-out under the viewgraph of cross-section of conductor layer of flexible PCB.
Embodiment
Below with reference to accompanying drawing three embodiment of the present invention are described.The first embodiment and the second embodiment relate to as the flexible PCB of the collector plate of fuel cell and and manufacture method, and the 3rd embodiment relates to the direct methanol fuel cell (DMFC) of using flexible PCB of the present invention.
Should be noted in the discussion above that the identical component members that has identical function in each figure indicated by identical Reference numeral.The specific descriptions of the component members of identical Reference numeral will do not repeated to have.Accompanying drawing only is exemplary expression, wherein, thickness and the planar dimension of each component members is suitably changed.
(the first embodiment)
Will with the main procedure plan view shown in the cross section process view shown in Figure 1A and the 1B and Fig. 2 A and the 2B describe according to the first embodiment of the present invention, for the manufacture of the method for flexible PCB.
(1) at first, as shown in Figure 1A (1), prepared double-sided copper-clad laminated sheet 4.Double-sided copper-clad laminated sheet 4 has flexible base material 1, and is separately positioned on Copper Foil 2 and Copper Foil 3 on the two sides of flexible base material 1.Flexible base material 1 is for having flexible dielectric base material, and it can be formed by the resin film that for example PETG (PET) and PEN (PEN) are made.
Use the thick polyimide film of the 25 μ m be provided with respectively the thick Copper Foil of 12 μ m on its two sides as the double-sided copper-clad laminated sheet 4 among this embodiment.Should be noted in the discussion above that laminated sheet to be used can be the two-sided metal-coated laminated board with metal forming, this metal forming is made by the metal that is different from copper (nickel, aluminium etc.) and it is arranged on the two sides of flexible base material 1.Can also use the flexible PCB that has by the interconnection that forms at the conductive paste of the two sides of flexible base material 1 printing such as silver paste.
(2) next, as shown in Figure 1A (2) and 2A (1), the current-collector that will be formed at a plurality of openings 5 that thickness direction penetrates double-sided copper-clad laminated sheet 4 on the double-sided copper-clad laminated sheet 4 forms among the expected areas C.
In this embodiment, as shown in Fig. 2 A (1), a plurality of openings 5 (pitch of holes that for example has bore dia and the 600 μ m of 500 μ m) have been formed with the mesh state.
Should be noted in the discussion above that opening 5 forms by the laser processing of using carbon dioxide laser, ultraviolet laser etc. to have high manufacturing accuracy.Preferably, consider the impact that is subjected to thermal history and machinability of opening and use ultraviolet laser.Bore dia and pitch of holes at opening 5 do not need in other situation of high manufacturing accuracy greatly and therefore, can form opening 5 by boring or punching press.
In the situation of using laser processing, actuating surface is stained Transformatin after laser processing, because flexible base material 1 can be owing to the heat during laser processing produces depression.Therefore, prevented the reduction of throwing power (throwing power) in Copper Foil 2 and Copper Foil 3 are electroplated.Should be noted in the discussion above that owing to staining on the surface and carried out wet etching in the Transformatin, Copper Foil 2 and Copper Foil 3 will reduce in Figure 1A (2).
(3) next, as shown in Figure 1A (3), electroplating processes is applied to wherein to be formed with the whole surface of the double-sided copper-clad laminated sheet 4 of opening 5.Thus, on Copper Foil 2 and Copper Foil 3 and at the inwall of opening 5, formed electroplated film disk 6.
In this embodiment, carry out electroless copper (or conductive processing etc.) and subsequent electrolytic copper plating and process to form the thick copper facing film of 5 μ m as electroplated film disk 6.Should be noted in the discussion above that electroplating type is not limited to copper facing.For example, can also use nickel plating and silver-plated.
(4) next, as shown in Figure 1B (4) and Fig. 2 A (2), Copper Foil 2,3 and electroplated film disk 6 form pattern to form current- collector 7 and 8 by etching.Current-collector 7 is the anode tap current-collector, and current-collector 8 is the cathode terminal current-collector.Also formed extraction electrode 7a and extraction electrode 8a, they separately along flexible base material 1 from current-collector 7 and current-collector 8 extend.
Here, electroplated film disk 6 (copper facing film) and Copper Foil 2 and 3 form pattern by the general light processing method.
(5) next, as shown in Figure 1B (5), electroplating processes is applied thereon the whole surface of the double-sided copper-clad laminated sheet 4 that is formed with current-collector 7 and current-collector 8.Therefore, formed the surface treatment 9 with corrosion resistance higher than the corrosion resistance of electroplated film disk 6 at electroplated film disk 6.
In this embodiment, making substrate, and gold-plated so that it has strong corrosion resistance to the copper facing film to the nickel plating of copper facing film.Therefore, form by have the thick nickel plating film of 5 μ m and have that the thick gold coated films of 1 μ m forms nickel plating/conduct of gold (Ni/Au) film is surface treatment 9.Have no particular limits for nickel plating and gold plating method, therefore can use metallide processing, electroless-plating processing etc.Can also directly use gold-plated and need not carry out nickel plating.
Should be noted in the discussion above that surface treatment 9 can be made by for example gold (Au), platinum (Pt) or titanium (Ti).
Can also be by electroplated film disk 6 be applied masking liquid, then dry and calcine the masking liquid that applies and form surface treatment 9, described masking liquid comprises: metallic compound, and it has from iridium (Ir), ruthenium (Ru), rhodium (at least one platinum group metal of selecting among Rh), Palladium (Pd), the platinum (Pt); And organic solvent.
(6) next, as shown in Figure 1B (6) and 2B (3), formed insulating barrier 10 (it is thick for example to have 20 μ m) to cover the form peripheral edge portions of current-collector 7 and current-collector 8 across the border between current-collector 7 and the current-collector 8.
Insulating barrier 10 has opening 10a and opening 10b, provides these openings so that the zone that forms a plurality of openings 5 with the mesh state is exposed to the bottom surface.Insulating barrier 10 also has opening 10c and 10d, provides these openings so that extraction electrode 7a and extraction electrode 8a are exposed to the bottom surface.
The cap rock that adhesive layer on the resin film that insulating barrier 10 can be made by polyimides etc. by lamination and the one side that is arranged on resin film forms form, and perhaps forms by printing the resin printing ink of being made by polyimides etc.Can also utilize the photoresistance solder flux to form insulating barrier 10.
Because insulating barrier 10 forms across the border between current-collector 7 and the current-collector 8, institute is so that protect interface between surface treatment 9 and the flexible base material 1 possibility that becomes.
After having formed insulating barrier 10, carrying out is shaped processes.Therefore, obtained to be applicable to the flexible PCB 20 of the collector plate of fuel cell.Described flexible PCB 20 comprises: insulation flexible base material 1; A plurality of openings 5 of fuel or air are provided, and this opening 5 is arranged in the regulation zone (current-collector bubble zone) to penetrate flexible base material 1 at thickness direction; Consist of the electroplated film disk (conductor layer) 6 of current-collector 7 and current-collector 8, this electroplated film disk 6 is formed on the front and back of the flexible base material 1 in the regulation zone and on the inwall of a plurality of openings 5; And process film 9 at the conductive surface that electroplated film disk 6 forms, this surface treatment 9 has the corrosion resistance higher than the corrosion resistance of electroplated film disk 6.
Should be noted in the discussion above that after a while and will in the 3rd embodiment, be elaborated to the broken line B shown in Figure 1B (6) and Fig. 2 B (3).In the process of making fuel cell, flexible PCB 20 is folding so that MEA is contained in wherein along broken line B.
As indicated above, in the flexible PCB 20 according to present embodiment, the current-collector 7 that contact with acid as product in the middle of it with methyl alcohol and the each several part of current-collector 8 are all by surface treatment 9 coverings.That is to say, with methyl alcohol and each several part that acid as product in the middle of it contacts in, different from traditional handicraft, do not have the coating of protecting conductor layer and the interface between the flexible base material.Therefore, even under the high temperature and high pressure condition of work, also can prevent corrosion and the wash-out of electroplated film disk 6.
In addition, because surface treatment 9 made by conducting metal or conducting metal oxide, so guarantee fully the possibility that becomes that is electrically connected with MEA.
(the second embodiment)
Next, will with the cross section process view shown in Fig. 3 A and the 3B describe according to a second embodiment of the present invention, for the manufacture of the method for flexible PCB.One of difference between the second embodiment and the first embodiment is that the parent material among the second embodiment is not double-sided copper-clad laminated sheet but flexible base material.Hereinafter, the description of the part that is different from the first embodiment will mainly be provided.
(1) at first, as shown in Fig. 3 A (1), prepared insulation flexible base material 11.In this embodiment, have the thick polyimide film of 25 μ m and be used as flexible base material 11.Should be noted in the discussion above that flexible base material 11 is to have flexible dielectric base material, it can be formed by the resin film that for example PETG (PET) and PEN (PEN) are made.
(2) next, as shown in Fig. 3 A (2), the current-collector that a plurality of openings 12 are formed on the flexible base material 11 forms in the expected areas, and opening 12 penetrates flexible base material 11 at thickness direction.
As the situation that forms opening 5 among the first embodiment, according to bore dia, pitch of holes etc., from the methods such as the laser processing that utilizes the laser such as carbon dioxide laser and ultraviolet laser, boring, punching press, select to be used to form the mode of opening 12.Under opening 12 is relatively large other situation, can opening 12 be formed in the flexible base material 11 by the resin engraving method that uses polyimides etching solution etc.
In the situation of using laser processing, actuating surface is stained Transformatin after laser processing, because flexible base material 11 may be owing to the heat during laser processing caves in.
(3) next, as shown in Fig. 3 A (3), at the front and back formation resist plating 13 of flexible base material 11, this resist plating 13 forms in the expected areas at current-collector has opening 13a.
(4) next, as shown in Fig. 3 B (4), electroplating processes is applied thereon the whole surface of the flexible base material 11 that is formed with resist plating 13.Therefore, on flexible base material 11 and at the inwall of a plurality of openings 12 that do not cover this resist plating 13, formed electroplated film disk 14.
In this embodiment, carry out electroless copper (or conductive processing etc.) and subsequent electrolytic copper plating and process to form the thick copper facing film of 5 μ m as electroplated film disk 14.Should be noted in the discussion above that before carrying out electroless copper, can carry out electroless nickel plating to form nickel coating (crystal seed layer) at flexible base material 11.This copper facing film that makes formation have strong bonding strength becomes possibility.
(5) next, peel off resist plating 13.Therefore, as shown in Fig. 3 B (4), anode tap current-collector 15 and cathode terminal current-collector 16 have been formed.
After resist plating 13 is stripped from, electroplating processes is applied to the whole surface of flexible base material 11, to form surface treatment 17 on the electroplated film disk 14 shown in Fig. 3 B (5), this surface treatment 17 has the corrosion resistance higher than the corrosion resistance of electroplated film disk 14.
In this embodiment, as the situation of surface treatment 9 among the first embodiment, with electroplated film disk 14 nickel plating and gold-plated.Therefore, form by having the thick nickel plating film of 5 μ m and having the nickel plating that the thick gold coated films of 1 μ m forms/gold (Ni/Au) film, as surface treatment 17.There are not special restriction in nickel plating and gold plating method, therefore can use metallide processing, electroless-plating processing etc.In addition, surface treatment 17 can be made of the material identical with surface treatment 9.
(7) next, as shown in Fig. 3 B (6), form have with the first embodiment in the insulating barrier 18 of the similar configuration of the configuration of insulating barrier 10.
Then, carrying out is shaped processes, and obtains the flexible PCB 20A according to the second embodiment.As shown in Fig. 3 B (6), similar flexible PCB 20 according to the first embodiment, in flexible PCB 20A, the current-collector 15 that contact with acid as product in the middle of it with methyl alcohol and the each several part of current-collector 16 are all covered by surface treatment 17, and the part that covers comprises serves as the side that fuel is supplied the opening of port.Therefore, according to the second embodiment, can obtain to be similar to those operating effects among the first embodiment.In addition, can obtain thinner flexible PCB.
(the 3rd embodiment)
Now provide use according to the description of the fuel cell of the flexible PCB of the first embodiment.Fig. 4 is the viewgraph of cross-section according to the part of the fuel cell 30 of present embodiment.
As shown in Figure 4, fuel cell 30 is direct methanol fuel cell (DMFC), and it comprises: the MEA 34 that is made of dielectric film 31, fuel electrode 32 and air electrode 33; Folding along broken line B, MEA 34 is held flexible PCB 20 wherein; Shell 35; And sealant 36.
As shown in Figure 4, MEA 34 and flexible PCB 20 are fixed on the inside of shell 35.More specifically, as shown in Figure 4, shell 35 is made of casing half 35a and 35b, and these casing halves 35a and 35b are assembled into a shell 35, so that the flexible PCB 20 that wherein accommodates MEA 34 is from being contained in up and down between these casing halves.
Equally as shown in Figure 4, casing half 35a has a plurality of groove 35a1 of being formed on wherein to be used for providing methyl alcohol.Casing half 35b has a plurality of seam 35b1 of being formed on wherein to be used for providing air.
When operation of fuel cells 30 with when generating, the methanol aqueous solution that the acts as a fuel opening 5 by current-collector 7 is offered fuel electrode 32, and the opening 5 of air by current-collector 8 is offered air electrode 33.
The methanol aqueous solution that offers fuel electrode 32 contacts with the catalyst of fuel electrode 32.Thus, methanol aqueous solution changes into hydrogen ion and carbon dioxide, and has produced electronics, shown in hereinafter shown equation (1):
CH
3OH + H
2O → CO
2 + 6H
﹢+ 6e
﹣ ... (1)
The electronics that produces passes through the current-collector 7 of flexible PCB 20, and is directed to the outside in order to offer electronic equipment from extraction electrode 7a.Then, the electronics of operating electronic equipment is directed into current-collector 8 via extraction electrode 8a.
On the other hand, the hydrogen ion that is produced by equation (1) passes dielectric film 31 and arrives air electrode 33, here hydrogen ion reacts with the airborne oxygen that provides via the opening 5 of current-collector 8, and react with the electronics that is directed into current-collector 8, shown in equation (2).Thus, produced water.
3/2O
2 + 6H
﹢+ 6e
﹣ → 3H
2O ... (2)
In the fuel cell 30 according to present embodiment, the metal ( Copper Foil 2,3 and electroplated film disk 6) that consists of current-collector 7 and current-collector 8 is seamlessly covered by the surface treatment 7 with fabulous corrosion resistance.Therefore, though when fuel cell 30 be exposed to methyl alcohol or by the oxidation of methyl alcohol generate sour the time, avoid corrosion and wash-out by surface treatment 7 protection current-collectors 7 and current-collector 8.Thus, can stably decompose the methyl alcohol that acts as a fuel, make it possible to stably keep the characteristic such as output voltage.
Should be noted in the discussion above that and to consist of the stack of cells that comprises a plurality of fuel cells that are connected in series.Fig. 5 shows the plan view according to the flexible PCB 20B of modification.
In flexible PCB 20B, four current-collector 7A, 7B, 8A, 8B are arranged on the flexible base material 1.Current-collector 7B and current-collector 8A are electrically connected via bonding part 40.These current-collectors 7A, 7B, 8A, 8B all by Copper Foil 2,3 and electroplated film disk 6 consist of, and the same at above-mentioned current-collector 7 and current-collector 8, their surface is all covered by surface treatment 9.
Flexible PCB 20B is folding along broken line B1, so that a MEA (not shown) is contained between current-collector 7A and the current-collector 8A, and the 2nd MEA (not shown) is contained between current-collector 7B and the current-collector 8B.Current-collector 7A contacts with the fuel electrode of a MEA, and current-collector 7B contacts with the fuel electrode of the 2nd MEA.Current-collector 8A contacts with the air electrode of a MEA, and current-collector 8B contacts with the air electrode of the 2nd MEA.Therefore, obtained to comprise the fuel cell of two fuel cells that are connected in series.
Should be noted in the discussion above that to consist of in this wise fuel cell that it is folding along the broken line B2 among Fig. 5 to be about to flexible PCB 20B.In this case, current-collector 7A contacts with the fuel electrode of the first and second MEA respectively with current-collector 8A, and current-collector 7B contacts with the air electrode of the first and second MEA with current-collector 8B.
In addition, increase the number of the structure that is consisted of by current-collector 7B, 8A and bonding part 40, can easily increase the number of fuel cell, thereby obtain to have the fuel cell of high pressure.
In aforementioned description, disclose according to three embodiment of the present invention.
Although in the aforementioned embodiment, double-sided copper-clad laminated sheet and flexible base material are used as parent material, also can be with the single face copper clad laminate as parent material.
In addition, in the first embodiment (the second embodiment), current-collector 7 and current-collector 8 (current-collector 15 and current-collector 16) both are formed on the flexible base material, and this flexible base material is folding in order to be used in the fuel cell along broken line B.Yet, when anode tap collector plate and cathode terminal collector plate are formed as independent entity, can only one in the current-collector be formed on the flexible base material.
Based on aforementioned description, those skilled in the art can conceive bonus effect of the present invention and various modification.Yet each aspect of the present invention is not limited to each embodiment disclosed above.It should be understood that in the situation that does not deviate from the of the present invention conceptual spirit that is derived from claim and defined scope of equal value thereof and meaning various interpolations of the present invention, modification and part deletion all are possible.
Reference numerals list
1,11 flexible base material
2,3 Copper Foils
4 double-sided copper-clad laminated sheets
5,12 openings
6 electroplated film disks
7,8,15,16 current-collectors
7a, the 8a extraction electrode
9,17 surface treatments
10,18 insulating barriers
10a, 10b, 10c, 10d opening
13 resist platings
The 13a opening
14 electroplated film disks
20,20A, the 20B flexible PCB
30 fuel cells
31 dielectric films
32 fuel electrodes
33 air electrodes
34 membrane electrode assemblies (MEA)
35 shells
35a, the 35b casing half
The 35a1 groove
The 35b1 seam
36 sealants
40 bonding parts
100 flexible PCBs
101 flexible base materials
102 conductor layers
103 coatings
104,105 openings
The S interface
The C current-collector forms expected areas
The B broken line
Claims (15)
1. flexible PCB that is provided with the current-collector of fuel cell on it comprises:
The insulation flexible base material;
A plurality of openings of fuel or air are provided, and described opening is arranged in the regulation zone in order to penetrate described flexible base material at thickness direction;
Consist of the conductor layer of described current-collector, described conductor layer is formed on the front and back of flexible base material described in the regulation zone and on the inwall of described a plurality of openings; And
The conductive surface that is formed on the described conductor layer is processed film, and described conductive surface is processed film and had the corrosion resistance higher than the corrosion resistance of described conductor layer.
2. flexible PCB according to claim 1, wherein
Described conductor layer is made by copper (Cu), and
Described surface treatment is the electroplated film disk of being made by gold (Au), platinum (Pt) or titanium (Ti).
3. flexible PCB according to claim 2, wherein
Described surface treatment with nickel plating (Ni) film as substrate.
4. flexible PCB according to claim 2 further comprises
Insulating barrier arranges described insulating barrier in order to hide the form peripheral edge portions of described current-collector across the border of described current-collector.
5. flexible PCB according to claim 2 further comprises
Along the extraction electrode of described flexible base material from described current-collector extension.
6. flexible PCB according to claim 5 further comprises
Insulating barrier arranges described insulating barrier in order to hide the form peripheral edge portions of described current-collector across the border of described current-collector.
7. fuel cell comprises:
Membrane electrode assembly (MEA), described membrane electrode assembly is made of dielectric film, the fuel electrode on a surface that is attached to described dielectric film and another the surperficial air electrode that is attached to described dielectric film; And
According to claim 6, flexible PCB arranged described flexible PCB so that described current-collector contacts described fuel electrode or described air electrode.
8. fuel cell comprises:
Membrane electrode assembly (MEA), described membrane electrode assembly is made of dielectric film, the fuel electrode on a surface that is attached to described dielectric film and another the surperficial air electrode that is attached to described dielectric film; And
According to claim 2, flexible PCB arranged described flexible PCB so that described current-collector contacts described fuel electrode or described air electrode.
9. flexible PCB according to claim 1 further comprises
Insulating barrier arranges described insulating barrier in order to hide the form peripheral edge portions of described current-collector across the border of described current-collector.
10. flexible PCB according to claim 1 further comprises
Along the extraction electrode of described flexible base material from described current-collector extension.
11. a fuel cell comprises:
Membrane electrode assembly (MEA), it is made of dielectric film, the fuel electrode on a surface that is attached to described dielectric film and another the surperficial air electrode that is attached to described dielectric film; And
According to claim 1, flexible PCB arranged described flexible PCB so that described current-collector contacts described fuel electrode or described air electrode.
12. the method for the manufacture of flexible PCB comprises:
The two-sided metal-coated laminated board that preparation has the insulation flexible base material and is separately positioned on the first and second metal formings on the two sides of described flexible base material;
Forming a plurality of openings of formation in the expected areas at current-collector on the two-sided metal-coated laminated board, described opening penetrates described two-sided metal-coated laminated board at thickness direction;
By the described two-sided metal-coated laminated board that is formed with described opening on it is used electroplating processes, on described the first and second metal formings and at the inwall of described opening, form electroplated film disk;
By etching described the first and second metal formings and electroplated film disk formation pattern are formed current-collector; And
Form surface treatment by the described two-sided metal-coated laminated board that is formed with described current-collector on it is used electroplating processes on described electroplated film disk, described surface treatment has the corrosion resistance higher than the corrosion resistance of described electroplated film disk.
13. the method for the manufacture of flexible PCB according to claim 12 further comprises:
After forming Surface Treated Films, form insulating barrier in order to hide the form peripheral edge portions of described current-collector across the border of described current-collector.
14. the method for the manufacture of flexible PCB comprises:
Preparation insulation flexible base material;
Forming a plurality of openings of formation in the expected areas at current-collector on the described flexible base material, described opening penetrates described flexible base material at thickness direction;
Front and back at described flexible base material forms resist plating, and described resist plating forms in the expected areas at described current-collector has opening;
By the described flexible base material that is formed with described resist plating on it is used electroplating processes, do not covering on the described flexible base material of described resist plating and the inwall of described a plurality of openings forms electroplated film disk; And
Form surface treatment by peeling off described resist plating and subsequently the described flexible base material that is formed with described electroplated film disk on it being used electroplating processes on described electroplated film disk, described surface treatment has the corrosion resistance higher than the corrosion resistance of described electroplated film disk.
15. the method for the manufacture of flexible PCB according to claim 14 further comprises:
After forming surface treatment, form insulating barrier in order to hide the form peripheral edge portions of described current-collector across the border of described current-collector.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-139589 | 2011-06-23 | ||
| JP2011139589 | 2011-06-23 | ||
| PCT/JP2012/052508 WO2012176488A1 (en) | 2011-06-23 | 2012-02-03 | Flexible circuit substrate, manufacturing method thereof, and fuel cell employing said flexible circuit substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102959781A true CN102959781A (en) | 2013-03-06 |
| CN102959781B CN102959781B (en) | 2015-06-17 |
Family
ID=47422340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280001304.9A Active CN102959781B (en) | 2011-06-23 | 2012-02-03 | Flexible circuit substrate, manufacturing method thereof, and fuel cell employing said flexible circuit substrate |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9076997B2 (en) |
| EP (1) | EP2725645B1 (en) |
| JP (1) | JP5833003B2 (en) |
| CN (1) | CN102959781B (en) |
| WO (1) | WO2012176488A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105789658A (en) * | 2016-03-21 | 2016-07-20 | 武汉众宇动力系统科技有限公司 | Collector plate of fuel cell |
| CN115332734A (en) * | 2022-09-13 | 2022-11-11 | 四川启睿克科技有限公司 | Integrated chip and battery integration method |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2529173B (en) * | 2014-08-12 | 2016-08-24 | Novaerus Patents Ltd | Flexible electrode assembly for plasma generation and air ducting system including the electrode assembly |
| US11821655B2 (en) | 2014-08-12 | 2023-11-21 | Novaerus Patents Limited | Air treatment system, method and apparatus |
| FR3069107B1 (en) * | 2017-07-13 | 2022-01-14 | Commissariat Energie Atomique | ELECTROCHEMICAL CELL RETAINING PLATE WITH IMPROVED SEALING |
| JP7229648B2 (en) * | 2020-07-29 | 2023-02-28 | 矢崎総業株式会社 | battery connection module |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1516904A (en) * | 2002-04-17 | 2004-07-28 | ���µ�����ҵ��ʽ���� | Polymeric electrolyte type fuel cell |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1516907A (en) | 2000-09-14 | 2004-07-28 | ���Ͷ�����Ӧ�ü����о�Ժ | Electrochemically activable layer or film |
| JP4177090B2 (en) * | 2002-12-19 | 2008-11-05 | 富士通コンポーネント株式会社 | Fuel cell and fuel cell stack |
| JP4031740B2 (en) | 2003-07-15 | 2008-01-09 | 日東電工株式会社 | Fuel cell separator and fuel cell using the same |
| TWI257189B (en) * | 2004-12-08 | 2006-06-21 | Nan Ya Printed Circuit Board C | Electrode plate of a flat panel direct methanol fuel cell and manufacturing method thereof |
| JP4886581B2 (en) * | 2007-04-18 | 2012-02-29 | 日東電工株式会社 | Wiring circuit board and fuel cell |
| JP5251062B2 (en) * | 2007-10-04 | 2013-07-31 | 日立電線株式会社 | Composite current collector plate for fuel cell and fuel cell |
| US8383280B2 (en) * | 2008-08-12 | 2013-02-26 | Amir Niroumand | Fuel cell separator plate with integrated heat exchanger |
| JP2010050378A (en) | 2008-08-25 | 2010-03-04 | Nitto Denko Corp | Wiring circuit board and fuel cell |
| JP5395625B2 (en) * | 2009-11-11 | 2014-01-22 | 日東電工株式会社 | Wiring circuit board and fuel cell |
-
2012
- 2012-02-03 JP JP2012523135A patent/JP5833003B2/en active Active
- 2012-02-03 WO PCT/JP2012/052508 patent/WO2012176488A1/en active Application Filing
- 2012-02-03 CN CN201280001304.9A patent/CN102959781B/en active Active
- 2012-02-03 US US13/697,151 patent/US9076997B2/en active Active
- 2012-02-03 EP EP12756062.1A patent/EP2725645B1/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1516904A (en) * | 2002-04-17 | 2004-07-28 | ���µ�����ҵ��ʽ���� | Polymeric electrolyte type fuel cell |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105789658A (en) * | 2016-03-21 | 2016-07-20 | 武汉众宇动力系统科技有限公司 | Collector plate of fuel cell |
| CN105789658B (en) * | 2016-03-21 | 2018-10-26 | 武汉众宇动力系统科技有限公司 | A kind of fuel cell collector plate |
| CN115332734A (en) * | 2022-09-13 | 2022-11-11 | 四川启睿克科技有限公司 | Integrated chip and battery integration method |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2725645A4 (en) | 2015-04-22 |
| WO2012176488A1 (en) | 2012-12-27 |
| CN102959781B (en) | 2015-06-17 |
| US20130202985A1 (en) | 2013-08-08 |
| EP2725645A1 (en) | 2014-04-30 |
| EP2725645B1 (en) | 2017-04-12 |
| US9076997B2 (en) | 2015-07-07 |
| JP5833003B2 (en) | 2015-12-16 |
| JPWO2012176488A1 (en) | 2015-02-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102959781B (en) | Flexible circuit substrate, manufacturing method thereof, and fuel cell employing said flexible circuit substrate | |
| US7229564B2 (en) | Method for manufacturing bipolar plate and direct methanol fuel cell | |
| US6749959B2 (en) | Fuel cell gas separator, manufacturing method thereof, and fuel cell | |
| KR100525643B1 (en) | Separator for flat type polyelectrolyte fuel cell and polyelectrolyte fuel cell employing that separator | |
| TWI243505B (en) | Method of manufacturing a flat panel direct methanol fuel cell | |
| KR100990465B1 (en) | Fuel cell module | |
| CN103518265A (en) | Sheet assembly with aluminum based electrodes | |
| US20060040170A1 (en) | Flat panel direct methanol fuel cell and method for making the same | |
| US20070184968A1 (en) | Flat panel direct methanol fuel cell and method of making the same | |
| JP2009117114A (en) | Fuel battery cell and manufacturing method therefor | |
| JP5082275B2 (en) | Separator for fuel cell and manufacturing method thereof | |
| CN101442885B (en) | Method for preparing circuit board guide hole | |
| EP2388850A2 (en) | Printed circuit board, fuel cell and method of manufacturing printed circuit board | |
| TW201136007A (en) | Printed circuit board and fuel cell | |
| JP2008235250A (en) | Fuel cell module | |
| US20100047653A1 (en) | Printed circuit board and fuel cell | |
| US8921005B2 (en) | Fuel cell separator manufacturing method and fuel cell separator | |
| JP2008065993A (en) | Fuel cell separator and manufacturing method therefor, and fuel cell | |
| CN100359731C (en) | Method for producing direct methanol fuel battery and its double pole plate base board | |
| TWI246371B (en) | Electronic circuit board for integrating fuel cell | |
| JP2009043504A (en) | Cell for fuel battery, and its manufacturing method | |
| JP4703551B2 (en) | Wiring circuit board and manufacturing method thereof | |
| JPWO2004054019A1 (en) | Method for forming reaction layer on electrolyte membrane of fuel cell and electrolyte membrane | |
| JP3127445U (en) | Current collector for fuel cell | |
| WO2023118466A1 (en) | Electronic device of a biofuel cell and a printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |