CN102956943B - Based on the microstrip line of Meta Materials - Google Patents
Based on the microstrip line of Meta Materials Download PDFInfo
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- CN102956943B CN102956943B CN201110254581.8A CN201110254581A CN102956943B CN 102956943 B CN102956943 B CN 102956943B CN 201110254581 A CN201110254581 A CN 201110254581A CN 102956943 B CN102956943 B CN 102956943B
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- microstrip line
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Abstract
The present invention relates to microstrip line field, a kind of microstrip line based on Meta Materials is provided, this microstrip line comprises metal tape, medium substrate and ground plate, described microstrip line also comprises meta-material thin film, described meta-material thin film and metal tape are positioned at the side of described medium substrate, and are all close to described medium substrate, wherein, described meta-material thin film covers described metal tape, and described ground plate is positioned at the opposite side of described medium substrate.A kind of microstrip line based on Meta Materials of the present invention can effectively suppress space wave to be revealed, and solves the problem of electromagnetic wave crosstalk between microstrip line.
Description
Technical field
The present invention relates to microstrip line field, in particular, relate to a kind of microstrip line based on Meta Materials.
Background technology
Microstrip line (MicrostripLine) is current hybrid microwave integrated circuit (HybridMicrowaveIntegratedCircuits, HMIC) and in monolithic integrated microwave circuit (MonolithicMictowaveIntegratedCircuits, MMIC) maximum a kind of plane transmission lines is used.As shown in Figure 1, from structure, microstrip line be by very thin metal tape 1 to be placed on a ground plate 3 much smaller than the interval of wavelength, separate with medium substrate 3 between metal tape 1 and ground plate 2.
The outstanding advantages of microstrip line is compact structure, lightweight, can make complicated microwave circuit by the technique such as mechanical, photoetching, corrosion in little volume, and easily and other microwave device integrated, realize the integrated of microwave component and system.
Day by day miniaturized along with microwave device and system, at some, harsh occasion is required to volume and weight, microstrip transmission line can be adopted to replace waveguide to form microwave circuit and form various different complex plane circuit on same substrate, comprise bridge circuit, matched load, attenuator antenna etc.But adopt microstrip line transmission to there is shortcoming equally, namely microstrip line loss comparatively large, easily leak electromagnetic energy cause crosstalk, Q value low, be difficult to realize to finely tune, power capacity is little.
In use microstrip line transmitting procedure, the guided electromagnetic wave on microstrip line produces leaky wave along microstrip line is axially continuous to space radiation energy, and wherein electromagnetic wave leakage has two kinds of forms: surface wave forms 5 and space wave form 4, as shown in Figure 2.Known that microstrip line exists one at high band and leaks main mould at present, this leaks main mould with the outside leakage electromagnetic wave energy of the form of surface wave; And in low-frequency range, each higher mode of microstrip line is then with the outside leakage electromagnetic wave energy of the form of space wave.No matter be that surface wave leaks or space wave leaks, in integrated circuits, these leaky waves are all harmful, it not only brings the decline of through-put power, and its energy leaked brings electromagnetic interference problem also can to other circuit of surrounding, thus overall system performance is declined, therefore need to suppress it.
In prior art, the method suppressing the main mould of microstrip line to leak mainly is adopted and applies the enough large thin dielectric layer of one deck dielectric constant on the microstrip line; But, for the suppression that microstrip line higher mode is leaked, then there is no any simple effective method.This mainly leaks cause different from the physical mechanism that higher mode is leaked due to the main mould of microstrip line, and the space wave of microstrip line higher mode leaks and is almost difficult to be curbed by complete.
Summary of the invention
The defect that the space wave that the object of the invention is to overcome microstrip line higher mode in prior art is revealed, provide the microstrip line based on Meta Materials, this microstrip line can effectively suppress space wave to be revealed, and solves the problem of electromagnetic wave crosstalk between microstrip line.
In order to achieve the above object, the following technical scheme of the present invention's employing:
Based on the microstrip line of Meta Materials, described microstrip line comprises metal tape, medium substrate and ground plate, described microstrip line also comprises meta-material thin film, described meta-material thin film and metal tape are positioned at the side of described medium substrate, and be all close to described medium substrate, wherein, described meta-material thin film covers described metal tape, described ground plate is positioned at the opposite side of described medium substrate, wherein, described meta-material thin film forms by multiple metamaterial sheet with identical refraction index profile is stacking, each metamaterial sheet described is by multiple metamaterial unit composition comprising man-made microstructure and the unit base material for man-made microstructure attachment, each metamaterial unit described is of a size of 1/10th of the electromagnetic wavelength of required response.
Further, the refraction index profile in each metamaterial sheet described is uniform, and the span of its refractive index is: 0 ~ 1, and usually, the refractive index in each metamaterial sheet described is preferably 0.7.
Further, described man-made microstructure is form by least one one metal wire the planar structure or the stereochemical structure that electromagnetic field are had to response, and described wire is copper wire or filamentary silver.
Further, described wire by etching, plating, bore quarters, photoetching, electronics carve or ion quarter method be attached on described unit base material.
Further, described man-made microstructure is flakes.
Further, described unit base material is obtained by ceramic material, epoxy resin, polytetrafluoroethylene, FR-4 composite material or F4B composite material.
The present invention is relative to prior art, there is following beneficial effect: a kind of microstrip line based on Meta Materials of the present invention by arranging one deck meta-material thin film on medium substrate, and described meta-material thin film covering metal band, effectively inhibit the leaky wave of microstrip line space wave form, reduce the electromagnetic wave crosstalk of adjacent microstrip line.
Accompanying drawing explanation
Fig. 1 is the structural representation of microstrip line in prior art;
Fig. 2 is the schematic diagram of two kinds of leaky wave forms of microstrip line in prior art;
Fig. 3 is the structural representation of the microstrip line that the present invention is based on Meta Materials;
Fig. 4 is the structural representation of meta-material thin film of the present invention;
Fig. 5 is metamaterial modular construction schematic diagram of the present invention.
Embodiment
Below in conjunction with embodiment and accompanying drawing, the present invention is described in further detail, but embodiments of the present invention are not limited thereto.
As shown in Figure 3, the present invention is based on the structural representation of the microstrip line of Meta Materials, described microstrip line comprises metal tape 10, ground plate 20 and medium substrate 30, wherein, metal tape 10 and ground plate 20 lay respectively at the both sides of described medium substrate 30, the mode that metal tape 10 is generally printed by circuit is placed on medium substrate 30, in present pre-ferred embodiments, also in the medium substrate surface-coated one deck meta-material thin film 40 with described metal tape 10 the same side, and meta-material thin film 40 covers described metal tape 10 completely.
In the present invention, described metal tape 10 and described ground plate 20 all adopt identical metal, and generally adopt copper.
In order to suppress the space wave form produced in metal tape 10 electromagnetic transmission process to be revealed, adopting meta-material thin film 40 as covering metal band 10, and then reducing the electromagnetic wave crosstalk between adjacent microstrip line.
Described meta-material thin film 40 is made up of multiple metamaterial sheet 401, and wherein each metamaterial sheet 401 forms by multiple metamaterial unit 50, the unit base material 501 that described metamaterial unit 50 comprises man-made microstructure 502 and adheres to for man-made microstructure 502.
Described multiple metamaterial sheet 401 is multiple metamaterial sheet with identical refraction index profile.
Refraction index profile in each metamaterial sheet 401 described is uniform, but refractive index span between zero and one, because this ranges of indices of refraction is the medium refraction index scope manufacturing invisible clothes, with such meta-material thin film covering metal band 10, the space wave form of microstrip line effectively can be suppressed to reveal, reduce the electromagnetic wave crosstalk of adjacent microstrip line.In preferred embodiment of the present invention, the value of the refractive index in each metamaterial sheet 401 is 0.7.
For the change making each metamaterial sheet 401 of meta-material thin film 40 realize refractive index shown in Fig. 3, through theoretical and actual proof, can to the topological structure of described man-made microstructure 502, physical dimension and its design distributed on unit base material 501, unit base material 501 adopts dielectric insulation material to make, can be ceramic material, macromolecular material, ferroelectric material, ferrite material, ferromagnetic material etc., macromolecular material can be such as, epoxy resin or polytetrafluoroethylene.Man-made microstructure 502 is be attached to the metal wire that unit base material 501 can have response to electromagnetic wave with certain geometry, metal wire can be section is copper cash that is cylindric or flat, silver line etc., general employing copper, because copper wire is relatively cheap, the section of certain metal wire also can be other shapes, metal wire is by etching, plating, bore and carve, photoetching, electronics carve or ion quarter etc. technique be attached on unit base material 501, each metamaterial sheet 401 described is made up of multiple metamaterial unit 50, each metamaterial unit 50 all has a man-made microstructure 502, each metamaterial unit 50 can produce response to by electromagnetic wave wherein, thus affect electromagnetic wave transmission wherein, the size of each metamaterial unit 50 depends on the electromagnetic wave that needs respond, be generally 1/10th of the electromagnetic wavelength of required response, otherwise the arrangement that the metamaterial unit 50 comprising man-made microstructure 502 in space forms can not be regarded as in space continuously.
When unit base material 501 selected, by adjusting the shape of man-made microstructure 502, size and the spatial distribution on unit base material 501 thereof, effective dielectric constant everywhere and equivalent permeability can be adjusted on Meta Materials and then changes Meta Materials equivalent refractive index everywhere.When man-made microstructure 502 adopts identical geometry, the size of somewhere man-made microstructure is larger, then the effective dielectric constant at this place is larger, and refractive index is also larger.
The pattern of the man-made microstructure 502 that the present embodiment adopts is alabastrine derivative pattern, and from Fig. 4 and Fig. 5, the size of flakes man-made microstructure 502 should be able to be used for calmly according to concrete.
Above-described embodiment is the present invention's preferably execution mode; but embodiments of the present invention are not restricted to the described embodiments; change, the modification done under other any does not run counter to Spirit Essence of the present invention and principle, substitute, combine, simplify; all should be the substitute mode of equivalence, be included within protection scope of the present invention.
Claims (7)
1. based on the microstrip line of Meta Materials, described microstrip line comprises metal tape, medium substrate and ground plate, it is characterized in that, described microstrip line also comprises meta-material thin film, described meta-material thin film and metal tape are positioned at the side of described medium substrate, and be all close to described medium substrate, wherein, described meta-material thin film covers described metal tape, described ground plate is positioned at the opposite side of described medium substrate, wherein, described meta-material thin film forms by multiple metamaterial sheet with identical refraction index profile is stacking, each metamaterial sheet described is by multiple metamaterial unit composition comprising man-made microstructure and the unit base material for man-made microstructure attachment, each metamaterial unit described is of a size of 1/10th of the electromagnetic wavelength of required response.
2. the microstrip line based on Meta Materials according to claim 1, is characterized in that, the refraction index profile in each metamaterial sheet described is uniform, and the span of its refractive index is: 0 ~ 1.
3. the microstrip line based on Meta Materials according to claim 2, is characterized in that, the refractive index in each metamaterial sheet described is 0.7.
4. the microstrip line based on Meta Materials according to claim 1, is characterized in that, described man-made microstructure is form by least one one metal wire the planar structure or the stereochemical structure that electromagnetic field are had to response, and described wire is copper wire or filamentary silver.
5. the microstrip line based on Meta Materials according to claim 4, is characterized in that, described wire by etching, plating, bore quarters, photoetching, electronics carve or ion quarter method be attached on described unit base material.
6. the microstrip line based on Meta Materials according to claim 4, is characterized in that, described man-made microstructure is flakes.
7. the microstrip line based on Meta Materials according to claim 1, is characterized in that, described unit base material is obtained by ceramic material, epoxy resin, polytetrafluoroethylene, FR-4 composite material or F4B composite material.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110254581.8A CN102956943B (en) | 2011-08-31 | 2011-08-31 | Based on the microstrip line of Meta Materials |
| PCT/CN2012/073683 WO2013029372A1 (en) | 2011-08-31 | 2012-04-09 | Microstrip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110254581.8A CN102956943B (en) | 2011-08-31 | 2011-08-31 | Based on the microstrip line of Meta Materials |
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| Publication Number | Publication Date |
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| CN102956943A CN102956943A (en) | 2013-03-06 |
| CN102956943B true CN102956943B (en) | 2016-04-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110254581.8A Active CN102956943B (en) | 2011-08-31 | 2011-08-31 | Based on the microstrip line of Meta Materials |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5682167A (en) * | 1995-03-22 | 1997-10-28 | The Charles Stark Draper Laboratory | Mesa antenna |
| CN102160175A (en) * | 2008-08-22 | 2011-08-17 | 台湾积体电路制造股份有限公司 | Impedance controlled electrical interconnection employing meta-materials |
-
2011
- 2011-08-31 CN CN201110254581.8A patent/CN102956943B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5682167A (en) * | 1995-03-22 | 1997-10-28 | The Charles Stark Draper Laboratory | Mesa antenna |
| CN102160175A (en) * | 2008-08-22 | 2011-08-17 | 台湾积体电路制造股份有限公司 | Impedance controlled electrical interconnection employing meta-materials |
Non-Patent Citations (2)
| Title |
|---|
| Development of Low Characteristic Impedance Transmission Line for Power Supply;Kaoru等;《VLSI Packaging Workshop of Japan》;20081231;第2306-2308页以及附图6 * |
| Tailoring Double-Negative Metamaterial Responses to Achieve Anomalous Propagation Effects Along Microstrip Transmission Lines;Ching-ying Cheng等;《IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES》;20031231;第71页以及图4 * |
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| Publication number | Publication date |
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| CN102956943A (en) | 2013-03-06 |
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