CN102953445B - Vacuum ceramic thermal baffle of inorganic solder welding and preparation method thereof - Google Patents
Vacuum ceramic thermal baffle of inorganic solder welding and preparation method thereof Download PDFInfo
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- CN102953445B CN102953445B CN201210075780.7A CN201210075780A CN102953445B CN 102953445 B CN102953445 B CN 102953445B CN 201210075780 A CN201210075780 A CN 201210075780A CN 102953445 B CN102953445 B CN 102953445B
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 97
- 238000002360 preparation method Methods 0.000 title claims description 18
- 238000003466 welding Methods 0.000 title description 2
- 238000009413 insulation Methods 0.000 claims abstract description 430
- 238000007789 sealing Methods 0.000 claims description 59
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Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
- Y02A30/24—Structural elements or technologies for improving thermal insulation
- Y02A30/242—Slab shaped vacuum insulation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B80/00—Architectural or constructional elements improving the thermal performance of buildings
- Y02B80/10—Insulation, e.g. vacuum or aerogel insulation
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- Joining Of Glass To Other Materials (AREA)
Abstract
The invention provides a kind of vacuum ceramic thermal baffle, it includes thermal insulation board, lower thermal insulation board, the periphery of described upper thermal insulation board and described lower thermal insulation board is welded together by solder, described solder is inorganic solder, forming a vacuum layer closed between described upper thermal insulation board and described lower thermal insulation board, described upper thermal insulation board and described lower thermal insulation board are flat board thermal insulation board or outer flat indent thermal insulation board or convex surface thermal insulation board.The manufacture method technique of this vacuum ceramic thermal baffle of the present invention is simple, prepared vacuum ceramic thermal baffle overcomes the deficiency of existing thermal insulation board, can effectively ensure that the air-tightness of vacuum ceramic thermal baffle vacuum layer, extend the service life of vacuum ceramic thermal baffle, and intensity and heat insulation, sound insulation and fire protecting performance can be increased, the most also there is good decorative effect.
Description
Technical field
The present invention relates to energy-saving building technology field, particularly relate to a kind of vacuum ceramic thermal baffle and preparation method thereof.
Background technology
Material used by domestic construction exterior-wall heat insulation is mainly B level insulation material at present, such as organic materials such as polystyrene, polyurethane, bipeltates, these organic material heat resistances are poor, easy firing, not only discharge substantial amounts of heat during burning, produce substantial amounts of poison gas, and can speed up big fire spread；Simultaneously, organic material can occur collapsing when fire, produce density flaming droplet, on initiation heat-insulation layer, institute's tiling comes off, it is likely to cause spot fire and secondary injury, so the relevant part of country is prohibited exterior-wall heat insulation and is used organic insulation material, particularly at skyscraper and public building.In combustibility reaches the insulation material of A grade standard, the mainly inorganic material as representative with mineral wool and rock wool, but existing home made article requires there is the biggest gap at aspects such as water absorption rate, intensity, weatherabilities with Application in Building, it is directly used in construction wall insulation, will occur absorbing water, drop, the problem such as softening.Additionally, A level insulation material cost is significantly larger than organic material, complicated construction technique construction cost is far beyond the expense of B level insulation material, and its poor thermal insulation property and energy consumption are high, can not meet the needs of the current energy-saving and emission-reduction of country.
Summary of the invention
The technical problem to be solved is the defect being to exist for existing building thermal insulation board, warming plate, a kind of novel vacuum ceramic thermal baffle and preparation method thereof is provided, the manufacture method technique of this vacuum ceramic thermal baffle is simple, prepared vacuum ceramic thermal baffle can overcome the deficiency of existing thermal insulation board and warming plate, can effectively ensure that the air-tightness of vacuum ceramic thermal baffle, increase the service life, and its intensity and heat insulation, sound insulation, fire protecting performance can be increased, the most also there is good decorative effect.
In order to solve above-mentioned technical problem, the invention provides a kind of vacuum ceramic thermal baffle, it includes thermal insulation board, lower thermal insulation board, the periphery of described upper thermal insulation board and described lower thermal insulation board is welded together by solder, described solder is inorganic solder, a vacuum layer closed is formed between described upper thermal insulation board and described lower thermal insulation board, described upper thermal insulation board and described lower thermal insulation board are flat board thermal insulation board or outer flat indent thermal insulation board or convex surface thermal insulation board, and the indent facebow of described outer flat indent thermal insulation board is high or the convex surface bow height of convex surface thermal insulation board is not less than 0.1mm.
Described vacuum ceramic thermal baffle can also include one piece of middle thermal insulation board, and described middle thermal insulation board is clipped between described upper thermal insulation board and described lower thermal insulation board, and described upper thermal insulation board and described lower thermal insulation board form two vacuum layer closed respectively with described middle thermal insulation board.
Described vacuum ceramic thermal baffle may further include thermal insulation board in the middle of polylith, thus comprises the vacuum layer of multiple closing.
The upper thermal insulation board of vacuum ceramic thermal baffle and lower thermal insulation board utilize the shape of thermal insulation board to resist atmospheric pressure, make two pieces of thermal insulation boards will not press together, keep the vacuum layer between two thermal insulation boards, eliminate and make the supporter the biggest with installation difficulty；Without the conduction of supporter, the heat insulation and sound insulation value of vacuum insulation panel is more preferably；Convex configuration, makes thermal insulation board have higher comprcssive strength and bending strength；Convex configuration, makes vacuum layer have bigger space, more can keep for a long time vacuum state, vacuum insulation panel life-span longer, even if losing vacuum, its performance is also superior to general hollow heat insulation plate.
It is coated with low-radiation film, such as aluminium film etc. on the inner surface of described upper thermal insulation board or lower thermal insulation board.
High or convex surface thermal insulation board the convex surface bow height of the indent facebow of upper and lower two pieces of outer flat indent thermal insulation boards of described vacuum insulation panel is preferably 1～200mm, and more preferably 1～20mm.
The bow of described vacuum ceramic thermal baffle is high to be determined by shapes and sizes and the purposes of thermal insulation board, on the premise of satisfied opposing atmospheric pressure and purposes, bow is high as small as possible, it is advisable with 3 ~ 9mm when common building thermal insulation board, the space of 6 ~ 18mm is had between i.e. two pieces thermal insulation boards, being equivalent to existing double glazing, under atmospheric pressure almost plane is optimal, to obtain preferable visual effect and to reduce the cost of described vacuum insulation panel and the space taken.
It is high that described upper and lower thermal insulation board can have identical bow, it is also possible to has different bows high according to the requirement of construction.
Described inorganic solder includes commercially available high temp glass or ceramic glaze and low temperature glass solder, described high temp glass or the preferred melt temperature of ceramic glaze are about glass or the ceramic glaze of 1100-1300 DEG C, and the preferred melt temperature of described low temperature glass solder is about the crown glass solder of 400-750 DEG C.
Described solder is at least coated on one piece of upper and lower thermal insulation board or the solder side periphery of two pieces and the solder side periphery of described middle thermal insulation board.
Described thermal insulation board can use commercially available ceramic wafer, brick or thin plate, it would however also be possible to employ the technology of preparing of existing ceramic wafer, brick or thin plate is prepared, and its preparation process comprises the steps:
The first step, the preparation of mould: according to the shapes and sizes of the vacuum ceramic thermal baffle of required making and whether there is edge band frame or supporter prepares the making mould of thermal insulation board, the diel in the most existing ceramic wafer technology of preparing or slip casting mould；
Second step, the making of thermal insulation board: powder or the slurry of existing making ceramic wafer are loaded diel or slip casting mould, prepares the base substrate of ceramic wafer, through glazing, be dried and high temperature sintering, obtain ceramic wafer, or directly with edge band frame or the ceramic wafer of supporter；
The formation of described single vacuum layer vacuum ceramic thermal baffle can use one-step method to be formed, described one-step method refer to the evacuation of vacuum ceramic thermal baffle and the edge sealing even sintering of ceramic wafer all in vacuum edge sealing stove a step complete, comprise the steps:
By a piece in upper and lower thermal insulation board or the solder side periphery even spread solder of two pieces, solder uniformly leaves several groove passing through solder band or slit as aspirating hole；Upper and lower thermal insulation board consistency from top to bottom is stacked together, sends in vacuum edge sealing stove；To vacuum edge sealing stove evacuation to below 0.1Pa, heating makes in-furnace temperature rise to more than the melt temperature of solder, reaches edge sealing temperature, and aspirating hole disappears；Stopping heating, reduce stove and warm to room temperature, described solder welds together bubble-tight for upper and lower thermal insulation board, thus the vacuum ceramic thermal baffle required for obtaining.
The one-step method forming step of said two vacuum layer vacuum ceramic thermal baffle is as follows:
By upper thermal insulation board, lower thermal insulation board and the periphery even spread solder of middle thermal insulation board solder side, solder uniformly leaves several groove passing through solder band or slit as aspirating hole, and three pieces of thermal insulation board consistencies from top to bottom are stacked together, send in vacuum edge sealing stove；To vacuum edge sealing stove evacuation to below 0.1Pa, heating makes in-furnace temperature rise to more than the melt temperature of solder, reaches edge sealing temperature, aspirating hole disappears, stopping heating, lower the temperature with stove, three pieces of thermal insulation boards are hermetic welded together by solder, open fire door and obtain required vacuum ceramic thermal baffle.
Described vacuum edge sealing stove or the single-unit furnace of batch production, or the tunnel kiln that continuous way produces, preferably tunnel kiln.
Use the mode of automatic edge sealing in vacuum edge sealing stove, simplify technical process, reduce production cost, shorten the production cycle, improve production efficiency.
In described vacuum layer, when the planar dimension of upper and lower thermal insulation board is less or indent facebow high relatively big, shape and the intensity opposing atmospheric pressure of thermal insulation board self can be relied on time, supporter can not be set；When upper and lower thermal insulation board can not rely on self shape and intensity opposing atmospheric pressure, should arrange a small amount of necessary supporter, supporter and thermal insulation board cooperatively resist atmospheric pressure.
Above support uses printing cryogenic glass powder or solder preparation or utilizes mould to make；Directly prepare on thermal insulation board preferably by mould.
Above support minimum unit can be the lattice arrangement of equilateral triangle, and the length of side of triangle is about 30～300mm, preferably 50～150mm；Supporter is strip, its a length of 0.3～5.0 mm, preferably 0.5～2.0 mm, width is 0.1～2.0mm, is preferably 0.2～1.0mm, being highly 0.1～10.0mm, be preferably 0.5～3.0mm, the height of supporter is higher than the height 0.1～2.0mm of edge band frame, is preferably 0.1～0.5mm；Supporter can also be cylindric, its a diameter of 0.1～3.0mm, be preferably 0.3～2.0mm, height is 0.1～5.0 mm, is preferably 0.5～3.0mm, and the height of supporter closes sheet rear support thing position spatial altitude 0～0.3 higher than upper and lower two pieces of thermal insulation boards
Mm, preferably 0.1～0.2mm.
When supporter is printed on one piece of thermal insulation board, the most cylindric, the most coniform；When supporter is printed on upper and lower two pieces of thermal insulation boards simultaneously, preferably strip, the most up-narrow and down-wide, cross section is the strip of triangle, and vertical pile.
When thermal insulation board all has strip supporter up and down, supporter vertical pile supports, thermal insulation board is still point cantact by supporter up and down, and contact for linear contact lay or face between supporter with thermal insulation board, increase contact area, reduce thermal insulation board tensile stress at support, it is possible to reduce the quantity of supporter, thus improve the heat insulation of thermal insulation board and sound insulation value further.
In described upper and lower thermal insulation board, at least the periphery of one piece of thermal insulation board at least contains an edge band frame.
The highly preferred of described edge band frame is 0.1～10mm, more preferably 0.1～1mm, and width is preferably 0.2～5mm, and more preferably 1～2mm.
Several aspirating hole can be left on described edge band frame, i.e. it is perpendicular to edge band frame and along the equally distributed groove of edge band frame or slit, quantity is determined by the girth of upper and lower thermal insulation board, and spacing about 50～150mm is advisable, and can close described aspirating hole after described solder fusing；Aspirating hole can not also be stayed, the passage that the space utilizing the rough surface of the solder of coating to be formed is discharged as gas between thermal insulation board, but leave aspirating hole and can shorten the time of evacuation.
When comprising only an edge band frame, described solder is in the outside of described edge band frame, when containing multiple edge band frame, described solder is in the centre of described edge band frame or middle and outside, described edge band frame is when having the upper surface of the middle thermal insulation board of thermal insulation board of two vacuum layer, identical with described lower thermal insulation board, when the lower surface of described middle thermal insulation board, identical with described upper thermal insulation board.
When comprising only an edge band frame, the periphery of the most described lower thermal insulation board contains an edge band frame, the periphery edge of edge band frame and described lower thermal insulation board has the space of 5mm～10mm, for being coated with described solder, described edge band frame is when having the upper surface of the middle thermal insulation board of thermal insulation board of two vacuum layer, identical with described lower thermal insulation board, when the lower surface of described middle thermal insulation board, identical with described upper thermal insulation board.
When upper thermal insulation board and lower thermal insulation board respectively contain an edge band frame, the shapes and sizes or identical or different of two edge band frames, it is preferably shape identical, varying in size, now, little edge band frame is included in big edge band frame, described edge band frame is when having the upper surface of the middle thermal insulation board of thermal insulation board of two vacuum layer, identical with described lower thermal insulation board, when the lower surface of described middle thermal insulation board, identical with described upper thermal insulation board.
Further, more than the edge band frame of described upper thermal insulation board one of the edge band frame of described lower thermal insulation board, the most described upper thermal insulation board at least contains an edge band frame, described lower thermal insulation board at least contains two edge band frames, the edge band frame of described upper thermal insulation board is inserted in the middle of the edge band frame of described lower thermal insulation board, the edge band frame of described upper and lower thermal insulation board is mutually entrenched togather, vacuum layer is carried out labyrinth sealing, described edge band frame is when having the upper surface of the middle thermal insulation board of thermal insulation board of two vacuum layer, identical with described lower thermal insulation board, when the lower surface of described middle thermal insulation board, identical with described upper thermal insulation board.
The introducing of edge band frame is possible not only to limit random flowing after solder dissolves, make edge sealing the most good-looking, and play good supporting role, solder is made to keep certain thickness, strengthening sealing effectiveness, the more important thing is that itself and solder have bigger contact area, stronger combination, thus improve air-tightness and the reliability of vacuum insulation panel.
Described edge band frame is made by the way of squeezing or printing or mechanically spraying, and described edge band frame includes fin and groove, it is preferred to use the fin that mould squeezing or printing cryogenic glass powder are made.
Described squeezing mode is to be loaded by the raw material of thermal insulation board in the inner surface mold cavity with depression or protruding lines, and the after-applied pressure of matched moulds makes its periphery form fin and groove while preparing thermal insulation board.
Described mode of printing is to use silk screen printing or mould printing or the method for printer, is imprinted on thermal insulation board by solder and forms the fin being raised in thermal insulation board surface.
When described edge band frame uses printing preparation, can be one-step print, it is also possible to be repeatedly to print.
Up and down after the mutual tabling of edge band frame of thermal insulation board, not only reduce the consumption of edge sealing solder, reduce the requirement to edge sealing solder, and increase inner liner thickness, improve the sealing strength of upper and lower thermal insulation board, thus improve the qualification rate of product.
In order to solve above-mentioned technical problem, the invention provides the preparation method of above-mentioned vacuum ceramic thermal baffle, comprising:
The first step, the preparation of mould: prepare the making mould of thermal insulation board, the diel in the most existing ceramic wafer technology of preparing or slip casting mould according to the shapes and sizes of the vacuum ceramic thermal baffle of required making；
Second step, the making of thermal insulation board: powder or the slurry of existing making ceramic wafer are loaded diel or slip casting mould, prepares the base substrate of ceramic wafer, through glazing, be dried and high temperature sintering, obtain ceramic wafer；
3rd step, is coated with solder: by two pieces of thermal insulation boards or the solder side periphery even spread solder of one piece of thermal insulation board of second step acquisition, solder uniformly leaves several aspirating hole, and is stacked together by described two pieces of thermal insulation board consistencies from top to bottom, send in vacuum edge sealing stove；
4th step, high temperature edge sealing: to described vacuum edge sealing sole evacuation, limit heating, it is evacuated to below 0.1Pa, is warming up to more than the melt temperature of solder, reach edge sealing temperature, aspirating hole disappears, stopping heating, lower the temperature with stove, two pieces of thermal insulation boards are hermetic welded together by solder, and the fire door opening vacuum edge sealing stove obtains required vacuum ceramic thermal baffle.
Present invention also offers a kind of vacuum ceramic thermal baffle, it includes thermal insulation board, lower thermal insulation board and middle thermal insulation board, described middle thermal insulation board is clipped between described upper thermal insulation board and described lower thermal insulation board, described upper thermal insulation board and described lower thermal insulation board form two vacuum layer closed respectively with described middle thermal insulation board, described upper thermal insulation board, the periphery of described lower thermal insulation board and described middle thermal insulation board is welded together by solder, described solder is inorganic solder, described upper thermal insulation board and described lower thermal insulation board are flat board thermal insulation board or outer flat indent thermal insulation board or convex surface thermal insulation board, described middle thermal insulation board is flat board thermal insulation board.
The preparation method of the described vacuum ceramic thermal baffle with two vacuum layer closed is as follows:
The first step, the preparation of mould: prepare the making mould of upper and lower thermal insulation board and flat board thermal insulation board, the diel in the most existing ceramic wafer technology of preparing or slip casting mould according to the shapes and sizes of the vacuum ceramic thermal baffle of required making；
Second step, the making of thermal insulation board: the powder of existing making ceramic wafer or slurry are loaded diel or slip casting mould, prepares the base substrate of thermal insulation board, through glazing, it is dried, after high temperature sintering, obtains upper and lower thermal insulation board and flat board thermal insulation board；
3rd step, is coated with solder: second step obtains the periphery even spread solder of the solder side of thermal insulation board, solder leaves bleed-off passage, and is stacked together by described three pieces of thermal insulation board base substrate consistencies from top to bottom, sends in vacuum edge sealing stove；
4th step, high temperature sintering edge sealing: described vacuum edge sealing stove is heated and evacuation, is evacuated to below 0.1Pa, is warming up to more than the melt temperature of solder, reach edge sealing temperature；Stopping heating, lower the temperature with stove, three pieces of thermal insulation boards are hermetic welded together by solder, and the fire door opening vacuum edge sealing stove obtains required vacuum ceramic thermal baffle.
Present invention also offers a kind of vacuum ceramic thermal baffle, it includes thermal insulation board, lower thermal insulation board, described upper thermal insulation board and described lower thermal insulation board are flat board thermal insulation board or outer flat indent thermal insulation board or convex surface thermal insulation board, the solder side periphery of a described upper thermal insulation board at least edge band frame, the solder side periphery of described lower thermal insulation board at least two edge band frames, the periphery of described upper thermal insulation board and described lower thermal insulation board is welded together by solder, described solder is inorganic solder, forms a vacuum layer closed between described upper thermal insulation board and described lower thermal insulation board.
The preparation method that present invention also offers described vacuum ceramic thermal baffle is as follows:
The first step, the preparation of mould: prepare the making mould of thermal insulation board according to the shapes and sizes of the vacuum ceramic thermal baffle of required making, diel in the most existing ceramic wafer technology of preparing or slip casting mould, the periphery of mould is fluted, to form the edge band frame on thermal insulation board, wherein go up thermal insulation board at least edge band frame, lower thermal insulation board at least two edge band frame, the size of upper thermal insulation board edge band frame is between lower thermal insulation board edge band frame, after thermal insulation board closes sheet up and down, the edge band frame of upper thermal insulation board can be embedded between the edge band frame of lower thermal insulation board；
Second step, the making of thermal insulation board: the powder of existing making ceramic wafer or slurry are loaded diel or slip casting mould, prepares the base substrate of thermal insulation board, through glazing, dried, obtain the base substrate of thermal insulation board with edge band frame；
3rd step, is coated with solder: uniformly load solder in the edge band frame of the lower thermal insulation board base substrate obtained by second step, solder leaves bleed-off passage, and is stacked together by described two pieces of thermal insulation board base substrate consistencies from top to bottom, send in vacuum edge sealing stove；
4th step, high temperature sintering edge sealing: described vacuum edge sealing stove is heated and evacuation, it is evacuated to below 0.1Pa, is warming up to more than the sintering temperature of thermal insulation board base substrate and the melt temperature of solder, reach edge sealing temperature；After warm, stopping heating, lower the temperature with stove, two pieces of thermal insulation boards are hermetic welded together by solder, and the fire door opening vacuum edge sealing stove obtains required vacuum ceramic thermal baffle.
Present invention also offers a kind of vacuum ceramic thermal baffle, comprising: upper thermal insulation board, lower thermal insulation board and middle thermal insulation board, described middle thermal insulation board is clipped between described upper thermal insulation board and described lower thermal insulation board, described upper thermal insulation board and described lower thermal insulation board form two vacuum layer closed respectively with described middle thermal insulation board, described upper thermal insulation board, the periphery of described lower thermal insulation board and described middle thermal insulation board is welded together by solder, described upper thermal insulation board and described lower thermal insulation board are flat board thermal insulation board or outer flat indent thermal insulation board or convex surface thermal insulation board, described middle thermal insulation board is flat board thermal insulation board.
The preparation method that present invention also offers described vacuum ceramic thermal baffle is as follows:
The first step, the preparation of mould: prepare the making mould of thermal insulation board according to the shapes and sizes of the vacuum ceramic thermal baffle of required making, diel in the most existing ceramic wafer technology of preparing or slip casting mould, the periphery of mould is fluted, to form the edge band frame on thermal insulation board, wherein go up a thermal insulation board at least edge band frame, upper surface at least two edge band frame lower surface at least edge band frames of middle thermal insulation board, lower thermal insulation board at least two edge band frames, the size of edge band frame above is between following edge band frame, after upper, middle and lower thermal insulation board closes sheet, edge band frame above can be embedded between following edge band frame；
Second step, the making of thermal insulation board: the powder of existing making ceramic wafer or slurry are loaded diel or slip casting mould, prepares the base substrate of thermal insulation board, through glazing, dried, obtain the base substrate of thermal insulation board with edge band frame；
3rd step, is coated with solder: uniformly load solder in the lower thermal insulation board obtained by second step and the edge band frame of middle thermal insulation board base substrate, solder leaves bleed-off passage, and is stacked together by described three pieces of thermal insulation board base substrate consistencies from top to bottom, send in vacuum edge sealing stove；
4th step, high temperature sintering edge sealing: described vacuum edge sealing stove is heated and evacuation, it is evacuated to below 0.1Pa, is warming up to more than the sintering temperature of thermal insulation board base substrate and the melt temperature of solder, reach edge sealing temperature；After warm, stopping heating, lower the temperature with stove, three pieces of thermal insulation boards are hermetic welded together by solder, and the fire door opening vacuum edge sealing stove obtains required vacuum ceramic thermal baffle.
The invention has the beneficial effects as follows:
The upper and lower thermal insulation board of vacuum insulation panel of the present invention is outer flat indent thermal insulation board or convex surface thermal insulation board, owing to thermal insulation board itself has the highest comprcssive strength, so relying on the shape of outer flat indent thermal insulation board or convex surface thermal insulation board to resist atmospheric pressure, can not put or put supporter less, not only simplify the processing technology of vacuum insulation panel, reduce production cost, the production making vacuum insulation panel is the easiest, and can improve the intensity of vacuum insulation panel and heat insulation, sound insulation value.On vacuum insulation panel, the periphery of lower thermal insulation board contains edge band frame, the edge sealing making vacuum insulation panel is easier, the the most chimeric of edge band frame ensure that thermal insulation board sealing effectiveness under deformation up and down, edge band frame increases sealing area and airtight layer thickness between thermal insulation board, adhesive force and the adhesive strength of sealing-in are greatly reinforced it, add the tightness of vacuum layer between thermal insulation board, improve the life-span of vacuum insulation panel, achieve one-step method and prepare vacuum insulation panel, it is thus able to promote the industrialized production of vacuum insulation panel, it is greatly improved productivity ratio and the qualification rate of vacuum insulation panel, reduce the production cost of vacuum insulation panel.The vacuum insulation panel of the present invention can substitute for existing Ceramic Tiles, plate and thin plate, directly apply to the exterior wall of building, integrate heat-insulation and heat-preservation, sound insulation and noise reduction, waterproof, prevent fires and decorate, not only construction is simple, low cost, and life-span same with building, may not only be applied to new building, and can be used for the reducing energy consumption of existing building, solve existing building insulation and fire prevention, extraneous adornment, contradiction between service life, the development of building energy conservation cause can be greatly promoted.
Accompanying drawing explanation
Fig. 1 is the convex vacuum ceramic thermal baffle structural representation of the present invention；
Fig. 2 is the convex vacuum ceramic thermal baffle structural representation having edge band frame of the present invention；
Fig. 3 is the convex vacuum ceramic thermal baffle structural representation of the dual-gripper thing of the present invention；
Fig. 4 is the vacuum ceramic thermal baffle structural representation of single supporter of the present invention；
Fig. 5 is the outer flat indent vacuum ceramic thermal baffle structural representation of double vacuum layer of the present invention.
In figure: 1. go up thermal insulation board, 2. descend thermal insulation board, 3. solder, 4. descend the edge band frame on thermal insulation board, 5. go up the edge band frame of thermal insulation board, 6. descend the supporter on thermal insulation board, 7. go up the supporter on thermal insulation board, middle thermal insulation board.
Detailed description of the invention
Hereinafter using embodiment and accompanying drawing to describe embodiments of the present invention in detail, to the present invention, how application technology means solve technical problem whereby, and the process that realizes reaching technique effect can fully understand and implement according to this.
Embodiment 1: see Fig. 1, vacuum insulation panel is made up of upper ceramic heat-insulation board 1 and lower ceramic heat-insulation board 2, and the periphery of two pieces of thermal insulation boards is welded together by high-temperature ceramics glaze 3, and centre is vacuum layer.Its manufacture method is as follows: first prepare metal stamping die according to the shapes and sizes of made vacuum insulation panel；Secondly the raw material making ceramic heat-insulation board is loaded in mould, and through press extrusion forming, open mould and obtain the base substrate of ceramic heat-insulation board, be placed in drying machine and be dried；Again by the two sides of the base substrate of two pieces of ceramic wafers or one side and the periphery even spread high-temperature ceramics glaze of solder side, several aspirating hole is uniformly left on periphery glaze on solder side, and the base substrate consistency from top to bottom of two pieces of ceramic wafers is stacked together, send in vacuum edge sealing stove；Evacuation, limit heating backmost, is evacuated to below 0.1Pa, is warming up to the melt temperature more than 1250 DEG C of ceramic post sintering and glaze, and aspirating hole disappears, and stops heating；Lowering the temperature with stove, two pieces of thermal insulation boards are hermetic welded together by high-temperature ceramics glaze, open fire door and obtain required vacuum insulation panel.
The sintering of ceramic wafer and the sealing of thermal insulation board are combined by the present invention, have both simplified technological process, improve again production efficiency, reduce production cost.
Embodiment 2: see Fig. 2, vacuum insulation panel is made up of upper ceramic heat-insulation board and lower ceramic heat-insulation board, and the periphery of two pieces of thermal insulation boards all has edge band frame, the periphery of two pieces of thermal insulation boards to be welded together by high-temperature ceramics glaze, and centre is vacuum layer.Its manufacture method is as follows: the first shapes and sizes according to made vacuum insulation panel prepare the metal stamping die of upper and lower thermal insulation board respectively, the periphery of mould is fluted, to form the edge band frame on thermal insulation board, wherein going up thermal insulation board has an edge band frame, lower thermal insulation board to have two edge band frames, the size of upper thermal insulation board edge band frame is between two edge band frames of lower thermal insulation board, after thermal insulation board closes sheet up and down, the edge band frame of upper thermal insulation board can be embedded between two edge band frames of lower thermal insulation board；Secondly the raw material making ceramic heat-insulation board is loaded in mould, and through press extrusion forming, open mould and obtain the base substrate of ceramic heat-insulation board, be placed in drying machine and be dried；Then by two sides or an even spread high-temperature ceramics glaze of the base substrate of two pieces of ceramic wafers, the upper and lower thermal insulation board base substrate with edge band frame is obtained；Again will uniformly fill high-temperature ceramics glaze between two edge band frames of lower thermal insulation board base substrate, and two pieces of thermal insulation board consistencies from top to bottom are stacked together, send in vacuum edge sealing stove；Evacuation, limit heating backmost, it is evacuated to below 0.1Pa, it is warming up to the melt temperature more than 1250 DEG C of ceramic post sintering and glaze, the edge band frame of upper thermal insulation board embeds between two edge band frames of lower thermal insulation board under gravity, two pieces of thermal insulation boards are bonded together by melted high-temperature ceramics glaze, stopping heating, lower the temperature with stove, two pieces of thermal insulation boards are hermetic welded together by low temperature glass solder, open fire door and obtain required vacuum insulation panel.
The introducing of edge band frame is possible not only to limit random flowing after solder dissolves, make edge sealing the most good-looking, and play good supporting role, solder is made to keep certain thickness, strengthening sealing effectiveness, the more important thing is that itself and solder have bigger contact surface, stronger combination, thus improve air-tightness and the reliability of vacuum insulation panel.
Embodiment 3: see Fig. 3, vacuum insulation panel is made up of upper ceramic heat-insulation board and lower ceramic heat-insulation board, and one of Low emissivity ceramic heat-insulation board being to be coated with aluminum film, the periphery of two pieces of thermal insulation boards all has on edge band frame, inner surface all supporter.Its manufacture method is as follows: the first shapes and sizes according to made vacuum insulation panel prepare the metal stamping die of upper and lower thermal insulation board respectively, the surface of mould is fluted, to form the edge band frame on thermal insulation board and supporter, wherein going up thermal insulation board has an edge band frame, lower thermal insulation board to have two edge band frames, the size of upper thermal insulation board edge band frame is between two edge band frames of lower thermal insulation board, after thermal insulation board closes sheet up and down, the edge band frame of upper thermal insulation board can be embedded between two edge band frames of lower thermal insulation board；Supporter be cross section be the strip of triangle, upper and lower thermal insulation board closes after sheet, the supporter vertical pile of upper and lower thermal insulation board；Secondly the raw material making ceramic heat-insulation board is loaded in mould, and through press extrusion forming, open mould and obtain the base substrate of ceramic heat-insulation board, be placed in drying machine and be dried；Then by two sides or an even spread high-temperature ceramics glaze of the base substrate of two pieces of ceramic wafers, it is respectively fed in high temperature sintering furnace；It is warming up to the melt temperature more than 1250 DEG C of ceramic post sintering and glaze, stops heating；Lower the temperature with stove, obtain the upper and lower thermal insulation board with edge band frame and supporter；Again by the inner surface plated aluminum film of up or down thermal insulation board, uniformly fill low temperature glass solder between two edge band frames of lower thermal insulation board, and two pieces of thermal insulation board consistencies from top to bottom are stacked together, send in vacuum edge sealing stove；Evacuation, limit heating backmost, it is evacuated to below 0.1Pa, low temperature glass solder in edge band frame is heated to melt temperature more than 450 DEG C by the heating system of recycling vacuum edge sealing stove, the edge band frame of upper thermal insulation board embeds between two edge band frames of lower thermal insulation board under gravity, two pieces of thermal insulation boards are bonded together by melted low temperature glass solder, stop heating, lower the temperature with stove, two pieces of thermal insulation boards are hermetic welded together by low temperature glass solder, open fire door and obtain required vacuum insulation panel.
Embodiment 4: see Fig. 4, vacuum insulation panel is made up of upper ceramic heat-insulation board and lower ceramic heat-insulation board, one of Low emissivity ceramic heat-insulation board being to be coated with aluminum film, the periphery of two pieces of thermal insulation boards all has edge band frame, the periphery of two pieces of thermal insulation boards is welded together by low temperature glass solder, and centre is vacuum layer.Its manufacture method is as follows: the first shapes and sizes according to made vacuum insulation panel prepare the metal stamping die of upper and lower thermal insulation board respectively, the surface of mould is fluted, to form the edge band frame on thermal insulation board and supporter, wherein going up thermal insulation board has an edge band frame, lower thermal insulation board to have two edge band frames, the size of upper thermal insulation board edge band frame is between two edge band frames of lower thermal insulation board, after thermal insulation board closes sheet up and down, the edge band frame of upper thermal insulation board can be embedded between two edge band frames of lower thermal insulation board；Secondly the raw material making ceramic heat-insulation board is loaded in mould, and through press extrusion forming, open mould and obtain the base substrate of ceramic heat-insulation board, be placed in drying machine and be dried；Then by two sides or an even spread high-temperature ceramics glaze of the base substrate of two pieces of ceramic wafers, it is respectively fed in high temperature sintering furnace；It is warming up to the melt temperature more than 1250 DEG C of ceramic post sintering and glaze, stops heating；Lower the temperature with stove, obtain the upper thermal insulation board with edge band frame and the lower thermal insulation board with edge band frame Yu supporter；Again by the inner surface plated aluminum film of up or down thermal insulation board, uniformly fill low temperature glass solder between two edge band frames of lower thermal insulation board, and two pieces of thermal insulation board consistencies from top to bottom are stacked together, send in vacuum edge sealing stove；Evacuation, limit heating backmost, it is evacuated to below 0.1Pa, low temperature glass solder in edge band frame is heated to melt temperature more than 450 DEG C by the heating system of recycling vacuum edge sealing stove, the edge band frame of upper thermal insulation board embeds between two edge band frames of lower thermal insulation board under gravity, two pieces of thermal insulation boards are bonded together by melted low temperature glass solder, stop heating, lower the temperature with stove, two pieces of thermal insulation boards are hermetic welded together by low temperature glass solder, open fire door and obtain required vacuum insulation panel.
Embodiment 5: see Fig. 5, vacuum insulation panel is by upper thermal insulation board, middle thermal insulation board and lower thermal insulation board composition, one of Low emissivity thermal insulation board being still coated with aluminum film, three pieces of thermal insulation boards are respectively provided with edge band frame, its manufacture method is as follows: first prepare respectively according to the shapes and sizes of made vacuum insulation panel, the metal stamping die of lower thermal insulation board, the periphery of mould is fluted, to form the edge band frame on thermal insulation board, wherein go up thermal insulation board and have an edge band frame, the upper surface of middle thermal insulation board has two edge band frame lower surfaces to have an edge band frame, lower thermal insulation board has two edge band frames, the size of edge band frame above is between two following edge band frames, after upper, middle and lower thermal insulation board closes sheet, edge band frame above can be embedded between following two edge band frame；Secondly the raw material making ceramic heat-insulation board is loaded in mould, and through press extrusion forming, open mould and obtain the base substrate of ceramic heat-insulation board, be placed in drying machine and be dried；Then by two sides or an even spread high-temperature ceramics glaze of the base substrate of three pieces of ceramic wafers, it is respectively fed in high temperature sintering furnace；It is warming up to the melt temperature more than 1250 DEG C of ceramic post sintering and glaze, stops heating；Lower the temperature with stove, obtain the upper, middle and lower thermal insulation board with edge band frame；Again by the inner surface of up or down thermal insulation board or a surface plated aluminum film of middle thermal insulation board, in, uniformly fill low temperature glass solder between two edge band frames of lower thermal insulation board, and three pieces of thermal insulation board consistencies from top to bottom are stacked together, send in vacuum edge sealing stove；Evacuation, limit heating backmost, it is evacuated to below 0.1Pa, low temperature glass solder in edge band frame is heated to melt temperature more than 450 DEG C by the heating system of recycling vacuum edge sealing stove, upper edge band frame embeds between lower sealing edge bar frame under gravity, three pieces of thermal insulation boards are bonded together by melted low temperature glass solder, stopping heating, lower the temperature with stove, three pieces of thermal insulation boards are hermetic welded together by low temperature glass solder, open fire door and obtain required vacuum insulation panel.
All above-mentioned primary these intellectual properties of enforcement, do not set this new product of enforcement and/or the new method limiting other forms.Those skilled in the art will utilize this important information, and foregoing is revised, to realize similar implementation status.But, all modifications or transformation belong to the right of reservation based on new product of the present invention.
The above, be only presently preferred embodiments of the present invention, is not the restriction that the present invention makees other form, and any those skilled in the art are changed possibly also with the technology contents of the disclosure above or are modified as the Equivalent embodiments of equivalent variations.But every without departing from technical solution of the present invention content, any simple modification, equivalent variations and remodeling above example made according to the technical spirit of the present invention, still fall within the protection domain of technical solution of the present invention.
Claims (10)
1. a vacuum ceramic thermal baffle, including upper thermal insulation board, lower thermal insulation board, it is characterized in that: the periphery of the solder side of described upper thermal insulation board and lower thermal insulation board all has edge band frame, described edge band frame is produced on the lower surface of described upper thermal insulation board and on the upper surface of described lower thermal insulation board by the way of squeezing or printing or mechanically spraying；The edge band frame of described upper thermal insulation board and lower thermal insulation board can mutually be entrenched togather, and the vacuum layer of described vacuum ceramic thermal baffle is carried out labyrinth sealing；The periphery of described upper thermal insulation board and lower thermal insulation board is welded together in vacuum edge sealing stove by edge band frame and the inorganic solder being entrenched togather, and forms a vacuum layer closed between described upper thermal insulation board and described lower thermal insulation board.
2. vacuum ceramic thermal baffle as claimed in claim 1, it is characterized in that described upper thermal insulation board at least contains an edge band frame, described lower thermal insulation board at least contains two edge band frames, and the edge band frame of described upper thermal insulation board is inserted in the middle of the edge band frame of described lower thermal insulation board.
3. vacuum ceramic thermal baffle as claimed in claim 1, it is characterized in that described vacuum ceramic thermal baffle also includes one piece of middle thermal insulation board, described middle thermal insulation board is clipped between described upper thermal insulation board and described lower thermal insulation board, and described upper thermal insulation board and described lower thermal insulation board form two vacuum layer closed respectively with described middle thermal insulation board.
4. vacuum ceramic thermal baffle as claimed in claim 1, it is characterised in that described upper thermal insulation board and described lower thermal insulation board are flat board thermal insulation board or outer flat indent thermal insulation board or convex surface thermal insulation board.
5. vacuum ceramic thermal baffle as claimed in claim 4, it is characterised in that the indent facebow of described outer flat indent thermal insulation board is high or the convex surface bow a height of 1～20mm of described convex surface thermal insulation board.
6. vacuum ceramic thermal baffle as claimed in claim 1, it is characterised in that have the supporter in lattice arrangement in described vacuum layer.
7. vacuum ceramic thermal baffle as claimed in claim 1, it is characterised in that be coated with low-radiation film on the inner surface of described up or down thermal insulation board.
8. vacuum ceramic thermal baffle as claimed in claim 1, it is characterised in that described edge band frame is directly to be prepared on described ceramic heat-insulation board by mould.
9. vacuum ceramic thermal baffle as claimed in claim 6, it is characterised in that when above support is printed on one piece of thermal insulation board, for coniform；When above support is printed on upper and lower two pieces of thermal insulation boards, for strip simultaneously, and vertical pile.
10. the preparation method of the vacuum ceramic thermal baffle described in any one of claim 1 to 8, it is characterised in that including:
The first step, the preparation of mould: prepare the making mould of thermal insulation board according to the shapes and sizes of the vacuum ceramic thermal baffle of required making, diel in the most existing ceramic wafer technology of preparing or slip casting mould, the periphery of mould is fluted, to form the edge band frame on thermal insulation board, wherein go up thermal insulation board at least edge band frame, lower thermal insulation board at least two edge band frame, the size of upper thermal insulation board edge band frame is between lower thermal insulation board edge band frame, after thermal insulation board closes sheet up and down, the edge band frame of upper thermal insulation board can be embedded between the edge band frame of lower thermal insulation board；
Second step, the making of thermal insulation board: the powder of existing making ceramic wafer or slurry are loaded diel or slip casting mould, prepares the base substrate of thermal insulation board, through glazing, dried, obtain the base substrate of thermal insulation board with edge band frame；
3rd step, is coated with solder: uniformly load solder in second step obtains the edge band frame of lower thermal insulation board base substrate, solder leaves bleed-off passage, and is stacked together by described two pieces of thermal insulation board base substrate consistencies from top to bottom, send in vacuum edge sealing stove；
4th step, high temperature sintering edge sealing: described vacuum edge sealing stove is heated and evacuation, it is evacuated to below 0.1Pa, is warming up to more than the sintering temperature of thermal insulation board base substrate and the melt temperature of solder, reach edge sealing temperature；After warm, stopping heating, lower the temperature with stove, two pieces of thermal insulation boards are hermetic welded together by solder, and the fire door opening vacuum edge sealing stove obtains required vacuum ceramic thermal baffle.
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| CN201066022Y (en) * | 2007-06-06 | 2008-05-28 | 兆宁 | Metal vacuum heat-insulation plate |
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Effective date of registration: 20191212 Address after: 314416 No.318, Nanjie Road, Yuanhua Town, Haining City, Jiaxing City, Zhejiang Province Patentee after: Haining Yuanhua Town Industrial Investment Co., Ltd Address before: 266033 No. 11, Fushun Road, Sifang District, Shandong, Qingdao Patentee before: Dai Changhong |
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