CN102929366A - Cooling system - Google Patents
Cooling system Download PDFInfo
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- CN102929366A CN102929366A CN2011102342298A CN201110234229A CN102929366A CN 102929366 A CN102929366 A CN 102929366A CN 2011102342298 A CN2011102342298 A CN 2011102342298A CN 201110234229 A CN201110234229 A CN 201110234229A CN 102929366 A CN102929366 A CN 102929366A
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- liquid coolant
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Abstract
A cooling system is applicable to be thermally contacted with an electronic element and comprises a first radiating system. The electronic element has a working temperature range when in operating, and the first radiating system comprises a first pipeline and a pump. The first pipeline is internally provided with first cooling liquid and is thermally contacted with the electronic element, and the boiling point of the first cooling liquid is in the working temperature range of the electronic element. When a pump enables the first cooling liquid to flow to the position of the electronic element, the first cooling liquid absorbs the heat of the electronic element so as to generate phase change, thus taking away the heat generated by the electronic element and preventing the electronic element from halting.
Description
Technical field
The present invention relates to a kind of cooling system, particularly a kind of cooling system be used to preventing the electronic component excess Temperature.
Background technology
In general, electronic installation comprises desk-top computer, mobile computer, flat computer, personal digital assistant (Personal digital assistant, PDA) or server, each electronic installation respectively has a safe working temperature higher limit that is fit to.When the temperature of electronic installation in the running exceeds the safe working temperature higher limit, electronic installation just might crash or even produce non-response destruction, such as the inner member damage, more seriously even can cause fire.Therefore, electronic installation can be turned round under the environment that is lower than the safe working temperature higher limit for each electronic installation heat abstractor of all having arranged in pairs or groups, and then prolong the mission life of electronic installation, and wherein heat abstractor for example is air-cooling apparatus or liquid cooling apparatus.
Take server as example, if existing server is when adopting air-cooling apparatus, existing is to allow fan running and make the server cool exterior air be inhaled into server.Afterwards, the cold air that is inhaled into absorbs the heat of server inside and heats up into hot-air.Then, fan is discharged these hot-airs outside the server.Yet when the heat that distributes when electronic installation was higher, the rotating speed of fan running just needed higher, carries out heat interchange to extract more substantial cold air and electronic installation, and then the temperature of electronic installation is maintained in the safe temperature range.But when the rotating speed of fan running is higher, the noise that fan produces is just larger, and the spent electric power of fan is also more.
With liquid cooling apparatus, existing liquid cooling apparatus has a pipeline and a cooling device and a fluid pump, and liquid coolant is equipped with in pipeline inside, and pipeline contacts with electronic installation.When driving liquid coolant, fluid pump flows through pipeline during with position that electronic installation contacts, liquid coolant can absorb heat that electronic installation produces and the rising temperature, and the liquid coolant of the liquid state after heating up afterwards flow to cooling device again so that the heat of liquid coolant is got rid of to cooling device.Then, the liquid coolant after the cooling is urged to pipeline and electronic installation contact position by fluid pump once again.So repeat with the heat of electronic installation marry again to cooling device to consist of a cool cycles.
Yet because the arithmetic speed of electronic installation now is more and more faster, the heat of its generation is also increasing, existing liquid cooling apparatus provides the liquid coolant of low temperature to be with and becomes popular, after but liquid coolant absorbs heat, temperature improves a lot, recycle to use, and certainly will make liquid coolant get back to low-temperature condition with compressor, the contour power consumption cooling device of frozen water machine again, therefore, temperature control has the problem of high power consumption always.
Summary of the invention
In view of above problem, the object of the present invention is to provide a kind of cooling system, use the existing temperature control of solution prior art and have the problem of high power consumption.
Be suitable for being arranged at an electronics cooling system according to one embodiment of the invention are disclosed, this electronic installation comprises at least one frame, comprise an electronic component in the frame, have a working temperature during electronic component running interval, its cooling system comprises one first cooling system and one second heat exchanger.Wherein, the first cooling system comprises one first heat exchanger and one first pipeline.And the first heat exchanger be arranged at electronic component and with the electronic component thermo-contact.The first pipeline and the first heat exchanger thermo-contact, the first pipeline inside has one first liquid coolant, and the boiling point of the first liquid coolant falls within the working temperature interval of electronic component.The second cooling system comprises the second heat exchanger.
Wherein, the first liquid coolant and the first heat exchanger in the first pipeline carries out heat interchange.Afterwards, the first liquid coolant in the first pipeline is carried out heat interchange with the second heat exchanger of the second cooling system again.
One first cooling system, the first cooling system comprise one first heat exchanger, one second heat exchanger, one first pipeline and a pump.The first heat exchanger be arranged at electronic component and with the electronic component thermo-contact.The second heat exchanger is positioned at frame.The first pipeline and the first heat exchanger and the second heat exchanger thermo-contact, the first pipeline inside has one first liquid coolant, and the boiling point of the first liquid coolant falls within the working temperature interval of electronic component.Pump and the first pipeline connection, flow to again the position that the first pipeline contacts with the second heat exchanger in order to drive the first liquid coolant after flowing to the position that the first pipeline contacts with the first heat exchanger, and then be back to pump, wherein the force value of the first pipeline inside is lower than the upper limit of pressure that pump can provide.
According to the disclosed refrigerant of one embodiment of the invention, the boiling point of this refrigerant falls within 50 degree Celsius to the interval of 60 degree Celsius.
The disclosed cooling system of above-described embodiment is to utilize the boiling point of the first liquid coolant to fall within the working temperature interval of the electronic component that needs heat radiation, and the first liquid coolant with the electronic component thermo-contact before temperature need not be excessively low.When the first liquid coolant flow to the position of electronic component, if this moment, the temperature of electronic component did not surpass the first liquid coolant, then the first liquid coolant can not absorbed heat, if the temperature of electronic component surpasses the first liquid coolant, the heat that discharges because absorbing electronic component of the first liquid coolant then, allow the first coolant temperature be promoted to boiling point, produce phase change and change steam state into by liquid state.Temperature does not have in the vicissitudinous situation when this phase change, and the energy of absorption is referred to as latent heat (1atent heat) or enthalpy of phase change.Because it is large that the heat that the latent heat that phase change absorbs absorbs because of the rising temperature far beyond liquid will come, therefore the first liquid coolant can in the situation that temperature variation is little, be taken away the used heat that electronic component produces.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 is arranged at floor map in the electronic installation for the cooling system that discloses an embodiment according to the present invention;
Fig. 2 is the enlarged diagram of the first heat exchanger of Fig. 1;
Fig. 3 is arranged at floor map in the electronic installation for the cooling system that discloses the second embodiment according to the present invention;
Fig. 4 is the enlarged diagram of the second heat exchanger of Fig. 3.
Wherein, Reference numeral
10 electronic installations
20 cooling systems
110 electronic components
200 first cooling systems
210 first heat exchangers
230 first pipelines
231 first liquid coolants
240 pumps
300 second cooling systems
310 second heat exchangers
320 second pipelines
330 cooling towers
331 second liquid coolants
340 water delivery devices
Embodiment
Below in conjunction with accompanying drawing structural principle of the present invention and principle of work are done concrete description:
Please consult simultaneously Fig. 1 to Fig. 2, Fig. 1 is arranged at floor map in the electronic installation for the cooling system that discloses the first embodiment according to the present invention, and Fig. 2 is the enlarged diagram of the first heat exchanger of Fig. 1.
In the first embodiment, electronic installation 10 can but to be not limited to be server, mobile computer or desk-top computer.Electronic installation 10 has an electronic component 110 at least, and it is interval that electronic component 110 has a working temperature.Herein the working temperature of indication interval be the temperature of electronic component 110 start of run between the default upper temperature limit, wherein this default upper temperature limit can be for the temperature protecting electronic component 110 to avoid crashing to set or avoid electronic component 110 to avoid burning the temperature that sets.Electronic component 110 is such as being the electronic integrated circuit chipset that central processing unit display chip, north and south bridge chip or memory body etc. can generate heat.The present embodiment is take central processing unit as example, and wherein, the working temperature interval of central processing unit is for example between 30 degree Celsius are spent to 80.
The cooling system 20 of the present embodiment comprises one first cooling system 200 and one second cooling system 300 at least.The first cooling system 200 comprises one first heat exchanger the 210 one the first pipelines 230 at least.The first heat exchanger 210 be arranged at electronic component 110 and with electronic component 110 thermo-contacts.Second cooling system 300 of the present embodiment comprises one second heat exchanger 310, the second heat exchanger 310 is for example for having comprised the radiating module of radiating fin and fan, radiating fin comprises a plurality of heat sinks that are arranged parallel to each other, and the heat of electronic component 110 can conduct in the air by heat sink.
The boiling point that the first pipeline 230 inside have one first liquid coolant, 231, the first liquid coolants 231 falls within the working temperature interval of electronic component 110.First liquid coolant 231 of the present embodiment can be boiling temperature under the normal pressure and falls within 50 degree Celsius to the liquid between 60 degree Celsius.In other embodiment of the present embodiment and part, the first liquid coolant 231 is environmental protection refrigerants, and wherein, so-called environmental protection refrigerant refers to not contain the refrigerant of fluorochlorohydrocarbon (CFC) and hydrogen fluorochlorohydrocarbon (HCFC).The first liquid coolant 231 for example is 3-pentafluorobutane (HFC-365mfc) or seven fluorine trimethoxy propane (HFE-7000).The first pipeline 230 and 210 thermo-contacts of the first heat exchanger, after the first liquid coolant 231 in the first pipeline 230 and the first heat exchanger 210 carried out heat interchange, the first liquid coolant 231 in the first pipeline 230 was carried out heat interchange with the second heat exchanger 310 of the second cooling system 300 again.In addition, because the boiling point of the first liquid coolant 231 under normal pressure of the present embodiment falls within 50 degree Celsius between 60 degree Celsius, therefore the first liquid coolant 231 presents liquid state under the environment of normal temperature and pressure, and wherein so-called normal temperature and pressure refers to respectively 25 degree and atmospheric pressure Celsius.
Because first liquid coolant 231 of the present embodiment is because being liquid at normal temperatures and pressures, therefore the first liquid coolant 231 can directly be received under the environment of normal temperature and pressure in the first pipeline 230.On the contrary, compared to the existing cooling recirculation system that adopts the low temperature refrigerant, because it is to be in gaseous state under normal temperature and pressure that this cooling recirculation system need adopt compressor to make refrigerant, therefore prior art must allow first the refrigerant of existing liquid state be stored in the high-pressure cylinder, so that existing refrigerant is maintained at liquid condition.Afterwards, again the refrigerant in the high-pressure cylinder is poured in the existing cooling recirculation system with compressor.As from the foregoing, because first liquid coolant 231 of above-described embodiment is liquid at normal temperatures and pressures, therefore compared to the existing cooling recirculation system that adopts compressor, in liquid coolant or the filling of refrigerant, the to-fill procedure of the present embodiment is comparatively easy.
In addition, first liquid coolant 231 of the present embodiment is in the 230 interior circulations of the first pipeline, before carrying out heat interchange with the first heat exchanger 210, need not be down to too low temperature, because mainly be that the latent heat that is absorbed with phase change is taken away heat, if the temperature of the first liquid coolant 231 is too low, can't with 210 heat interchange of the first heat exchanger the time, be promoted to boiling point at once.Simultaneously therefore compared to the existing cooling recirculation system that adopts the low temperature refrigerant, the aqueous vapor in the environment can not condense on the tube wall of system and produce dew.Specifically, the cooling recirculation system of existing employing low temperature refrigerant is to utilize the elements such as compressor, condenser to reduce the temperature of refrigerant.Yet the refrigerant temperature of low temperature tends to be lower than the dewpoint temperature of the aqueous vapor in the environment, and results in condensation of moisture in the environment in the outside surface of pipeline.Take room temperature as 29 degree and relative humidity as 73% as example, the dewpoint temperature of airborne aqueous vapor is 24 degree Celsius under such environment.Yet for the cooling recirculation system of existing employing compressor, the temperature of the refrigerant after the expansion often is reduced to about 10 degree Celsius, even lower.Thus, the aqueous vapor in the environment then can be condensed in because touching pipeline the outer wall of pipeline.When this water droplet that is condensed in the outside surface of pipeline drops down onto on the electronic component of server inside or the circuit board, just easily cause electronic component or circuit board short circuit.
First liquid coolant 231 of the present embodiment with 210 heat interchange of the first heat exchanger after, therefore temperature maintains the temperature that is equivalent to its boiling point, as long as again through after 310 heat radiations of the second heat exchanger, will be varied to liquid state by gaseous state, and discharge the latent heat of phase change.The second heat exchanger 310 is main to be exactly that the latent heat that discharges when the first liquid coolant 231 is varied to liquid state by gaseous state is taken away, and the first liquid coolant 231 is replied becomes liquid state.So the present embodiment uses compressor, the contour power consumption facility of cryocooler unlike the existing cooling recirculation system of compressor that adopts, therefore comparatively power saving of cooling system 20 of the present invention, and the present invention does not more have airborne condensation of moisture in the problem generation of the outer wall of the first pipeline 230.
Please consult Fig. 3 and Fig. 4, Fig. 3 is arranged at floor map in the electronic installation for the cooling system that discloses the second embodiment according to the present invention again, and Fig. 4 is the enlarged diagram of the second heat exchanger of Fig. 3.The electronic installation 10 of the present embodiment is with server as an illustration.Electronic installation 10 comprises an electronic component 110, and it is interval that electronic component 110 has a working temperature.Herein the working temperature of indication interval be the temperature of electronic component 110 start of run between the default upper temperature limit, wherein this default upper temperature limit can be for the temperature protecting electronic component 110 to avoid crashing to set or avoid electronic component 110 to avoid burning the temperature that sets.Electronic component 110 is such as being the electronic integrated circuit chipset that central processing unit, memory body, display chip or north and south bridge chip etc. can generate heat.The present embodiment is take central processing unit as example, and wherein the working temperature interval of central processing unit is for example between 30 degree Celsius are spent to 80.
The cooling system 20 of the present embodiment comprises one first cooling system 200 and one second cooling system 300.The first cooling system 200 comprises one first heat exchanger 210, one first pipeline 230 and a pump 240.The first heat exchanger 210 be arranged at electronic component 110 and with electronic component 110 thermo-contacts.
The boiling point that the first pipeline 230 inside have one first liquid coolant, 231, the first liquid coolants 231 falls within the working temperature interval of electronic component 110.First liquid coolant 231 of the present embodiment can be boiling temperature under the normal pressure and falls within 50 degree Celsius to the liquid between 60 degree Celsius.In other embodiment of the present embodiment and part, the first liquid coolant 231 is environmental protection refrigerants, and wherein, so-called environmental protection refrigerant refers to not contain the refrigerant of fluorochlorohydrocarbon (CFC) and hydrogen fluorochlorohydrocarbon (HCFC).The first liquid coolant 231 for example is 3-pentafluorobutane (HFC-365mfc) or seven fluorine trimethoxy propane (HFE-7000).The first liquid coolant 231 and the first heat exchanger 210 in the first pipeline 230 carry out heat interchange, because the boiling point of the first liquid coolant 231 under normal pressure of the present embodiment falls within 50 degree Celsius between 60 degree Celsius, therefore the first liquid coolant 231 presents liquid state under the environment of normal temperature and pressure, and wherein so-called normal temperature and pressure refers to respectively 25 degree and atmospheric pressure Celsius.
Because first liquid coolant 231 of the present embodiment is because being liquid at normal temperatures and pressures, therefore the first liquid coolant 231 can directly be received under the environment of normal temperature and pressure in the first pipeline 230.On the contrary, compared to the existing cooling recirculation system that adopts the low temperature refrigerant, because it is to be in gaseous state under normal temperature and pressure that this cooling recirculation system need adopt compressor to make refrigerant, therefore prior art must allow first the refrigerant of existing liquid state be stored in the high-pressure cylinder, so that existing refrigerant is maintained at liquid condition.Afterwards, again the refrigerant in the high-pressure cylinder is poured in the existing cooling recirculation system with compressor.As from the foregoing, because first liquid coolant 231 of above-described embodiment is liquid at normal temperatures and pressures, therefore compared to the existing cooling recirculation system that adopts compressor, in liquid coolant or the filling of refrigerant, the to-fill procedure of the present embodiment is comparatively easy.
In addition, this implements the first liquid coolant 231 in the 230 interior circulations of the first pipeline, before carrying out heat interchange with the first heat exchanger 210, need not be down to too low temperature, because mainly be that the latent heat that is absorbed with phase change is taken away heat, if the temperature of the first liquid coolant 231 is too low, can't with 210 heat interchange of the first heat exchanger the time, be promoted to boiling point at once, therefore compared to the existing cooling recirculation system that adopts the low temperature refrigerant, can not produce dew condensation on the tube wall of system.Specifically, the cooling recirculation system of existing employing low temperature refrigerant is to utilize the elements such as compressor, condenser to reduce the temperature of refrigerant.Yet, tend to be lower than the dewpoint temperature of the aqueous vapor in the environment through the refrigerant temperature of low temperature, and result in condensation of moisture in the environment in the outside surface of pipeline.Take room temperature as 29 degree and relative humidity as 73% as example, the dewpoint temperature of airborne aqueous vapor is 24 degree Celsius under such environment.Yet for the cooling recirculation system of existing employing compressor, the temperature of the refrigerant after the expansion often is reduced to about 10 degree Celsius, even lower.Thus, the aqueous vapor in the environment then can be condensed in because touching pipeline the outer wall of pipeline.When this water droplet that is condensed in the outside surface of pipeline drops down onto on the electronic component of server inside or the circuit board, just easily cause electronic component or circuit board short circuit.
First liquid coolant 231 of the present embodiment with 210 heat interchange of the first heat exchanger after, therefore temperature maintains the temperature that is equivalent to its boiling point, as long as again through after 300 heat radiations of the second cooling system, will be varied to liquid state by gaseous state, and discharge the latent heat of phase change.The latent heat that the second cooling system 300 discharges in the time of the first liquid coolant 231 in the first cooling system 200 can being varied to liquid state by gaseous state is taken away, and the first liquid coolant 231 is replied becomes liquid state.So the present embodiment uses compressor, the contour power consumption facility of cryocooler unlike the existing cooling recirculation system of compressor that adopts, therefore comparatively power saving of cooling system 20 of the present invention, and the present invention does not more have airborne condensation of moisture in the problem generation of the outer wall of the first pipeline 230.
With regard on the other hand, pump 240 is communicated with the first pipeline 230, pump 24 is in order to drive the first liquid coolant 231, so that the first liquid coolant 231 flow to the position of the first pipeline 230 and 300 heat interchange of the second cooling system after flowing to the position that the first pipeline 230 is connected with the first heat exchanger 210 again, and then be back to pump 240.
The second cooling system 300 comprises one second heat exchanger the 310 one the second pipelines 320, a cooling tower 330 and a water delivery device 340 in the present embodiment.Wherein, the second heat exchanger 310 for example is heat-exchangers of the plate type, heat-exchangers of the plate type comprises a plurality of heat-conducting plates that are arranged parallel to each other and at least one pipeline that runs through these heat-conducting plates, and the heat in the pipeline can conduct in the air or with other pipeline by heat-conducting plate and carry out heat interchange.In the present embodiment, the second pipeline 320 inside have one second liquid coolant 331, the second liquid coolant 331 of the second pipeline 320 and the first liquid coolant 231 of the first pipeline 230 are carried out heat interchange at the second heat exchanger 310, and second liquid coolant 331 of the present embodiment can be pure water or adds the water of condensing agent.In other words, first pipeline 230 of the present embodiment and the second pipeline 320 respectively with 310 thermo-contacts of the second heat exchanger, and allow the second interior liquid coolant 331 of the first liquid coolant 231 and the second pipeline 320 in the first pipeline 230 carry out heat interchange, namely allow the second liquid coolant 331 come the first liquid coolant 231 is lowered the temperature, take away the latent heat that the first liquid coolant 231 is discharged by the gaseous state liquefy.The second liquid coolant 331 of the second pipeline 320 second heat exchanger 310 of flowing through flow in the cooling tower 330 afterwards again and lowers the temperature, and then is back to water delivery device 340.The water delivery device 340 of the present embodiment can be a fluid pump.
The cooling tower 330 of the present embodiment can be closed cooling tower, the second pipeline 320 pile warp cooling towers 330 inside, and cooling tower 330 can be sprinkled water on the second pipeline 320, to take away the heat of the second liquid coolant 331.Afterwards, the second liquid coolant 331 is back to water delivery device 340 again.But be not limited in other embodiments use closed cooling tower, also can be the open type cooling water tower, at this moment, the second pipeline 320 be communicated with cooling tower 330, and cooling tower 330 connection water delivery devices 240, so that the second liquid coolant 331 is back to water delivery device 340 again.In addition, compared to the existing cooling recirculation system that adopts compressor, the comparatively power saving of cooling tower 330 of the present embodiment.Its main cause is that the first liquid coolant 231 is taken away the heat of electronic component 110 except the mode by difference variation, when the temperature of electronic component 110 running was greater than or equal to the boiling point of the first liquid coolant 231, the mode that the first liquid coolant 231 is depended merely on phase change was taken away the heat of electronic component 110 in a large number.At this moment, the second cooling system 300 need not as the cooling recirculation system of existing employing low temperature refrigerant the first liquid coolant 231 to be down to utmost point low temperature, and only need the first liquid coolant 231 to be condensed into saturated liquid or to make the degree of supercooling of the first liquid coolant 231 a little less than the boiling point of the first liquid coolant 231 at the second heat exchanger 310, therefore comparatively power saving of the present embodiment.
How the first liquid coolant 231 that then will describe the gas state is transformed into the first liquid coolant 231 of liquid condition when flowing through the second heat exchanger 310.The first liquid coolant 231 of gas state or liquid gas coexisting state is when flowing through the position of the second heat exchanger 310, and the first liquid coolant 231 that temperature is higher is carried out heat interchange with low the second liquid coolant 331 of temperature in the second heat exchanger 310.At this moment, under the environment of normal temperature and pressure, the first liquid coolant 231 of gas state or liquid gas coexisting state is down to the first liquid coolant 231 that is transformed into liquid condition below the boiling point of the first liquid coolant 231 because of temperature.
According to the disclosed cooling system of above-described embodiment, be to utilize the boiling point of the first liquid coolant to fall within the working temperature interval of electronic component.When the first liquid coolant flow to the position of the electronic component that is turning round, the heat that the first liquid coolant is distributed because absorbing electronic component allowed the first liquid coolant produce phase change and changes gaseous state into by liquid state.Thus, the first liquid coolant can improve by phase change the upper limit of the heat that can take away.
In addition, because the first liquid coolant is liquid when normal temperature, less than the pressure of gas in the pipeline internal flow, therefore existing compressor can be replaced by pump liquid, to save the cost of cooling system at the pressure of pipeline internal flow.
Certainly; the present invention also can have other various embodiments; in the situation that do not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make according to the present invention various corresponding changes and distortion, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.
Claims (8)
1. a cooling system is suitable for being arranged at an electronic installation, and this electronic installation comprises an electronic component, has a working temperature during this electronic component running interval, it is characterized in that, this cooling system comprises:
One first cooling system comprises:
One first heat exchanger, be arranged at this electronic component and with this electronic component thermo-contact; And
One first pipeline, with this first heat exchanger thermo-contact, this first pipeline inside has one first liquid coolant, and the boiling point of this first liquid coolant falls within this working temperature interval of this electronic component; And
One second cooling system comprises:
One second heat exchanger;
Wherein, this first liquid coolant and this first heat exchanger in this first pipeline carry out heat interchange, and afterwards, this first liquid coolant in this first pipeline is carried out heat interchange with this second heat exchanger of this second cooling system again.
2. cooling system according to claim 1 is characterized in that, this first cooling system also comprises:
One pump, with this first pipeline connection, flow to again the position that this first pipeline contacts with this second heat exchanger in order to drive this first liquid coolant after flowing to the position that this first pipeline contacts with this first heat exchanger, and then be back to this pump, wherein the force value of this first pipeline inside is lower than the upper limit of pressure that this pump can provide.
3. cooling system according to claim 1 is characterized in that, the boiling point of this first liquid coolant falls within 50 degree Celsius to the interval of 60 degree Celsius.
4. cooling system according to claim 1 is characterized in that, this first liquid coolant does not contain fluorochlorohydrocarbon and hydrogen fluorochlorohydrocarbon.
5. cooling system according to claim 4 is characterized in that, this first liquid coolant is 3-pentafluorobutane or seven fluorine trimethoxy propane.
6. cooling system according to claim 1 is characterized in that, this second heat exchanger is a hot plate heat exchanger.
7. cooling system according to claim 1 is characterized in that, this second heat exchanger is one to have comprised the radiating module of at least one radiating fin and at least one fan.
8. cooling system according to claim 1 is characterized in that, this second cooling system also comprises:
One second pipeline, with this second heat exchanger thermo-contact, this second pipeline inside has one second liquid coolant;
One cooling tower, this this cooling tower of the second pipeline connection; And
One water delivery device with this second pipeline connection, flow to the position that this second pipeline is connected with this second heat exchanger in order to drive this second liquid coolant, flow to afterwards this cooling tower again, and then is back to this water delivery device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102342298A CN102929366A (en) | 2011-08-12 | 2011-08-12 | Cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102342298A CN102929366A (en) | 2011-08-12 | 2011-08-12 | Cooling system |
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| CN102929366A true CN102929366A (en) | 2013-02-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011102342298A Pending CN102929366A (en) | 2011-08-12 | 2011-08-12 | Cooling system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107924896A (en) * | 2015-08-31 | 2018-04-17 | 株式会社ＥｘａＳｃａｌｅｒ | The cooling system of electronic equipment |
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| CN107924896A (en) * | 2015-08-31 | 2018-04-17 | 株式会社ＥｘａＳｃａｌｅｒ | The cooling system of electronic equipment |
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Application publication date: 20130213 |