CN102929064A - Electronic paper and forming method thereof - Google Patents
Electronic paper and forming method thereof Download PDFInfo
- Publication number
- CN102929064A CN102929064A CN201110231880XA CN201110231880A CN102929064A CN 102929064 A CN102929064 A CN 102929064A CN 201110231880X A CN201110231880X A CN 201110231880XA CN 201110231880 A CN201110231880 A CN 201110231880A CN 102929064 A CN102929064 A CN 102929064A
- Authority
- CN
- China
- Prior art keywords
- upper substrate
- array base
- base palte
- layer
- microcapsule granule
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 68
- 239000003094 microcapsule Substances 0.000 claims abstract description 232
- 239000000758 substrate Substances 0.000 claims abstract description 169
- 239000000853 adhesive Substances 0.000 claims abstract description 59
- 230000001070 adhesive effect Effects 0.000 claims abstract description 59
- 239000003292 glue Substances 0.000 claims abstract description 59
- 239000000945 filler Substances 0.000 claims abstract description 22
- 238000009826 distribution Methods 0.000 claims abstract description 14
- 239000008187 granular material Substances 0.000 claims description 154
- 239000002904 solvent Substances 0.000 claims description 44
- 230000015572 biosynthetic process Effects 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 11
- 239000012774 insulation material Substances 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 239000002245 particle Substances 0.000 abstract description 17
- 238000002834 transmittance Methods 0.000 abstract description 4
- 239000004744 fabric Substances 0.000 abstract 2
- 239000010409 thin film Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 11
- 238000000576 coating method Methods 0.000 description 7
- 238000009413 insulation Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000002775 capsule Substances 0.000 description 4
- 238000004040 coloring Methods 0.000 description 4
- 239000008367 deionised water Substances 0.000 description 4
- 229910021641 deionized water Inorganic materials 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000005684 electric field Effects 0.000 description 3
- 238000001962 electrophoresis Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical class [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field
- G02F1/166—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect
- G02F1/167—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect by electrophoresis
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field
- G02F1/1675—Constructional details
- G02F1/16757—Microcapsules
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/28—Adhesive materials or arrangements
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Molecular Biology (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
Abstract
The invention provides two electronic paper structures, wherein the first electronic paper structure comprises an upper substrate, an array substrate and a microcapsule particle distribution layer arranged between the upper substrate and the array substrate, wherein adhesive glue is filled between microcapsule particles in the microcapsule particle distribution layer; the upper substrate, the array substrate and the microcapsule particle arrangement layer are bonded together through the adhesive. The second type comprises an upper substrate, an array substrate and a microcapsule particle distribution layer arranged between the upper substrate and the array substrate, wherein no filler is arranged between microcapsule particles in the microcapsule particle distribution layer; the microcapsule particle cloth arranging layer is bonded with the upper substrate through adhesive glue; the microcapsule particle cloth arranging layer is bonded with the array substrate through bonding glue. The invention also provides respective methods for the two electronic papers. The two electronic papers of the invention can solve the problem of poor light transmittance of the existing electronic paper.
Description
Technical field
The present invention relates to the display technique field, relate in particular to the formation method of a kind of Electronic Paper and Electronic Paper.
Background technology
Development along with digital technology, more and more display devices that diffuse information enter into people's life, liquid crystal display (Liquid Crystal Display.LCD) for example, be widely used on the electronic product of communication, information and consumer, yet, liquid crystal display needs continued power in procedure for displaying, this is so that also can keep for a long time Electronic Paper (the Electronic Paper that shows under powering-off state, EP) shown obvious advantage, in addition, Electronic Paper is in use than liquid crystal display power saving.
Present Electronic Paper is divided into color electric paper and black and white Electronic Paper, the principle that shows is electrophoresis, be in colouring particles or the directed movement of black and white particle in the microcapsules by electric field driven, the colouring particles or the black and white particle that are in diverse location and make up with different arrangement modes demonstrate required font or pattern, and color electric paper also can adopt light filter film to realize.The Electronic Paper principle of electrophoresis of microcapsule structure as shown in Figure 1.The structure of existing Electronic Paper generally as shown in Figure 2, comprises the upper substrate 31 of public electrode, contains the array base palte 32 of pixel electrode, is clipped in ink capsule layer 33 between the two.About the way of the Electronic Paper among Fig. 2, at present general employing provides respectively the upper substrate 31 that comprises public electrode, the array base palte 32 that contains pixel electrode, ink capsule layer 33, then assembles the three, for example adopts laminating type to form Electronic Paper.For example publication number is CN101311808A, name is called the way of the Electronic Paper of mentioning in the Chinese patent application file of " method that forms electric paper display ", at first will contain the solution coat of microcapsules on carrier substrate, after removing the liquid part, the display layer that contains microcapsules is formed on the carrier substrate, then carrier substrate and the display layer that contains microcapsules is arranged between two conductive bases.Like this, because upper substrate 31, array base palte 32, ink capsule layer 33 three need to provide separately, so ink capsule layer 33 needs to adopt carrier substrate in manufacturing process, plastics for example, as shown in Figure 2 34 form microcapsule layer 33.
Because this way has been introduced carrier substrate in assembling process, this carrier substrate becomes the part of Electronic Paper afterwards.The light that black and white particle or colouring particles send must lose portion of energy, to such an extent as to when reaching in user's eye by upper substrate 31, the Electronic Paper that seems is darker through behind the described carrier substrate.Therefore the Electronic Paper transmittance that adopts said method to form is poor, in use, generally need to apply larger voltage and just can reach required brightness.
In view of this, be necessary to propose a kind of new Electronic Paper formation method in fact, to solve the problem of existing Electronic Paper printing opacity rate variance.
Summary of the invention
The problem that the present invention solves is to propose a kind of new Electronic Paper formation method, to solve the problem of existing Electronic Paper printing opacity rate variance.
For addressing the above problem, the invention provides a kind of formation method of Electronic Paper, comprising:
Form upper substrate;
Form array base palte;
Form the microcapsule granule layer of arranging with described upper substrate as carrier, arrange upper substrate and the described array base palte of layer of microcapsule granule is bonding with forming;
Wherein, described microcapsule granule arrange the layer be between described upper substrate and the described array base palte.
Alternatively, forming the microcapsule granule layer step of arranging with described upper substrate as carrier comprises:
Microcapsules are dispersed in form microcapsule solution in the solvent;
Described microcapsule solution is coated on the respective surfaces of upper substrate, the respective surfaces of described upper substrate is positioned at the side that upper substrate is formed with public electrode;
Remove described solvent, make non-filler distribution between microcapsule granule.
Alternatively, comprise forming the microcapsule granule bonding step of the upper substrate of layer and described array base palte of arranging:
At the described microcapsule granule that the is formed at upper substrate layer surface-coated adhesive glue of arranging, and make adhesive glue fill space between described microcapsules;
Described microcapsule granule arranged, and to be coated with the respective surfaces of the surface of adhesive glue and described array base palte bonding for layer, and the respective surfaces of described array base palte is positioned at the side that array base palte is formed with pixel electrode.
Alternatively, forming the microcapsule granule layer step of arranging with described upper substrate as carrier comprises:
Microcapsules are dispersed in form microcapsule solution in the solvent;
Respective surfaces at described upper substrate forms bonding glue-line, and the respective surfaces of described upper substrate is positioned at the side that upper substrate is formed with public electrode;
Described microcapsule solution is coated on the bonding glue-line;
Remove described solvent, make non-filler distribution between microcapsule granule.
Alternatively, comprise forming the microcapsule granule bonding step of the upper substrate of layer and described array base palte of arranging:
Respective surfaces at described array base palte forms bonding glue-line, and the respective surfaces of described array base palte is positioned at the side that array base palte is formed with pixel electrode;
Described array base palte is formed with the surperficial bonding of layer of arranging of the respective surfaces of bonding glue-line and the described microcapsule granule that is formed on the upper substrate.
Alternatively, described solvent is volatile substances, adopts volatility process to remove described solvent.
Alternatively, described adhesive glue is transparent and the insulation material.
The present invention also provides the formation method of another Electronic Paper, comprising:
Form upper substrate;
Form array base palte;
Form the microcapsule granule layer of arranging with described array base palte as carrier, arrange array base palte and the described upper substrate of layer of microcapsule granule is bonding with forming;
Wherein, described microcapsule granule arrange the layer be between described upper substrate and the described array base palte.
Alternatively, forming the microcapsule granule layer step of arranging with described array base palte as carrier comprises:
Microcapsules are dispersed in form microcapsule solution in the solvent;
Described microcapsule solution is coated on the respective surfaces of array base palte, the respective surfaces of described array base palte is positioned at the side that array base palte is formed with pixel electrode;
Remove described solvent, make non-filler distribution between microcapsule granule.
Alternatively, comprise forming the microcapsule granule bonding step of the array base palte of layer and described upper substrate of arranging:
At the described microcapsule granule that the is formed at array base palte layer surface-coated adhesive glue of arranging, and make adhesive glue fill space between described microcapsules;
Described microcapsule granule arranged, and to be coated with the respective surfaces of the surface of adhesive glue and described upper substrate bonding for layer, and the respective surfaces of described upper substrate is positioned at the side that upper substrate is formed with public electrode.
Alternatively, forming the microcapsule granule layer step of arranging with described array base palte as carrier comprises:
Microcapsules are dispersed in form microcapsule solution in the solvent;
Respective surfaces at described array base palte forms bonding glue-line, and the respective surfaces of described array base palte is positioned at the side that array base palte is formed with pixel electrode;
Described microcapsule solution is coated on the bonding glue-line;
Remove described solvent, make non-filler distribution between microcapsule granule.
Alternatively, comprise forming the microcapsule granule bonding step of the array base palte of layer and upper substrate of arranging:
Respective surfaces at described upper substrate forms bonding glue-line, and the respective surfaces of described upper substrate is positioned at the side that upper substrate is formed with public electrode;
Described upper substrate is formed with the surperficial bonding of layer of arranging of the respective surfaces of bonding glue-line and the described microcapsule granule that is formed on the array base palte.
Alternatively, described solvent is volatile substances, adopts volatility process to remove described solvent.
Alternatively, described adhesive glue is transparent and the insulation material.
The present invention also provides two kinds of Electronic Paper, wherein, the first Electronic Paper comprise upper substrate, array base palte and be arranged at described upper substrate and described array base palte between the microcapsule granule layer of arranging,
Described microcapsule granule is arranged and is filled with adhesive glue between the microcapsules in the layer; Described upper substrate, array base palte and microcapsule granule arrange the layer be bonded together by described adhesive glue.
Alternatively, described upper substrate near described microcapsule granule arrange the layer a side be provided with public electrode, described array base palte near described microcapsule granule arrange the layer a side be provided with pixel electrode.
Another kind of Electronic Paper comprise upper substrate, array base palte and be arranged at described upper substrate and described array base palte between the microcapsule granule layer of arranging,
Described microcapsule granule is arranged does not have filling material between the microcapsules in the layer; Described microcapsule granule arrange the layer be bonded together by adhesive glue and described upper substrate; Described microcapsule granule arrange the layer be bonded together by adhesive glue and described array base palte.
Alternatively, described upper substrate near described microcapsule granule arrange the layer a side be provided with public electrode, described array base palte near described microcapsule granule arrange the layer a side be provided with pixel electrode.
Compared with prior art, the present invention has the following advantages: adopt in the Electronic Paper manufacturing process original upper substrate or array base palte to form the microcapsule granule layer of arranging as carrier, fill afterwards adhesive glue with bonding upper substrate and array base palte in described microcapsules are arranged layer; Or adopt and to form adhesive glue at original upper substrate and array base palte, forming microcapsules layer of arranging at any one adhesive glue, afterwards bonding upper substrate and array base palte, the described microcapsules layer of arranging is positioned in the middle of both and non-filler.The necessary other base material of the microcapsule layer that provides separately in the prior art has been provided the Electronic Paper that above-mentioned way forms, and such as plastics, PET etc. because few one deck base material, thereby improved transmittance, reduced cost.
Description of drawings
Fig. 1 is the Electronic Paper principle of electrophoresis synoptic diagram of microcapsule structure;
Fig. 2 is the structural representation of existing Electronic Paper;
Fig. 3 is the method for making schematic flow sheet of the Electronic Paper that provides of embodiment one;
Fig. 4 is the schematic cross-section of the upper substrate that provides of embodiment one;
Fig. 5 is the structural representation that the method for making intermediate steps of the array base palte that provides of embodiment one forms;
Fig. 6 is the final structure vertical view that forms of the method for making of the array base palte that provides of embodiment one;
Fig. 7 is the cross-sectional view of doing along the A-A among Fig. 6;
Fig. 8 is the schematic cross-section of the Electronic Paper structure that provides of embodiment one;
Fig. 9 is the method for making schematic flow sheet of the Electronic Paper that provides of embodiment two;
Figure 10 is the schematic cross-section of the Electronic Paper structure that provides of embodiment three;
Figure 11 is the schematic cross-section of the first Electronic Paper structure of providing of embodiment five;
Figure 12 is the schematic cross-section of the second Electronic Paper structure of providing of embodiment five.
Embodiment
For above-mentioned purpose of the present invention, feature and advantage can more be become apparent, below in conjunction with accompanying drawing the specific embodiment of the present invention is described in detail, owing to focus on illustrating principle of the present invention, so do not draw to scale.
Embodiment one
In conjunction with process flow diagram shown in Figure 3, the formation method of the Electronic Paper that present embodiment one provides comprises:
Step S11 forms upper substrate 11;
Step S12 forms array base palte 12;
Step S13 forms the microcapsule granule layer 13 of arranging with described upper substrate 11 as carrier, and the arrange upper substrate 11 of layer 13 of microcapsule granule is bonding with described array base palte 12 with forming; Wherein, the described microcapsule granule layer of arranging 13 is between described upper substrate 11 and the described array base palte 12.
Step S11 can by transparency carrier 111 is provided, then make upper substrate public electrode 112 at transparency carrier 111 and realize, as shown in Figure 4 in implementation process.Preferably, the adopted glass of transparency carrier 111 also can adopt quartz.The material of upper substrate public electrode 112 can be tin indium oxide (Indium Tin Oxides, ITO).
Execution in step S122 makes tft array at described transparency carrier 121.This tft array comprises many grid lines; Intersect many data lines of (being preferably vertical) with many grid lines; Be formed at thin film transistor (TFT) and the pixel electrode layer of the pixel region that adjacent two grid lines and adjacent two data lines surround; Thin film transistor (TFT) couples as pixel switch and the grid line that intersects, data line and pixel electrode layer, and namely the grid of thin film transistor (TFT) is electrically connected with grid line, the source electrode of thin film transistor (TFT) (or drain electrode) is electrically connected with data line, the drain electrode (or source electrode) of described thin film transistor (TFT) is electrically connected with pixel electrode layer.Two pixel regions that intersect to form take two grid lines 124 and data line 125 are as example, and array base palte 12 vertical views that step S122 forms are seen Fig. 6.As can be seen from Figure 6 each pixel region is formed with pixel electrode 122 and thin film transistor (TFT) T, and the grid of thin film transistor (TFT) (not indicating among the figure) is electrically connected with grid line 124, the source electrode of thin film transistor (TFT) (or drain electrode) (not indicating among the figure) is electrically connected with data line 125, drain electrode (or source electrode) 123 of described thin film transistor (TFT) is electrically connected with pixel electrode 122.The material of pixel electrode 122 can be tin indium oxide (Indium tin oxide, ITO).Particularly, Fig. 6 sees Fig. 7 along the cut-open view of A-A, each layer of described thin film transistor (TFT) T be grid 124 (with grid line 124 be positioned at the layer and be electrically connected, be generally metal), the first insulation course 126 (also claiming gate insulator), semiconductor layer 127 (being preferably polysilicon), source electrode (or drain electrode) 125 (is positioned at layer with data line 125 and is electrically connected, be generally metal) with the drain electrode (or source electrode) 123 (with data line 125 be positioned at the layer, be generally metal), passivation layer 128.Each of pixel electrode area layer is followed successively by infrabasal plate public electrode 129 (be positioned at layer with grid line 124, be generally metal), the first insulation course 126, drain electrode (or source electrode) 123, passivation layer 128, pixel electrode 122.Need to prove that grid is the part of grid line, all represent with 124 that source electrode (or drain electrode) is the part of data line, all represents with 125.
Described the first insulation course 126 can selective oxidation silicon.
This S122 step also can adopt other to make the prior art of array base palte.
In the step S13 implementation, above substrate 11 forms microcapsule granule layer 13 step of arranging as carrier and may further comprise the steps S131-S133.
At first, execution in step S131 is dispersed in microcapsules and forms microcapsule solution in the solvent.
Described solvent can be easy volatile solvent; Alcohol for example, deionized water.
Then, execution in step S132 is coated on described microcapsule solution on the respective surfaces of upper substrate 11, and the respective surfaces of described upper substrate 11 is the side that upper substrate 11 is formed with public electrode 112; Described coating process can adopt cylindric brush coating, also can adopt spin coating or ink-jet.
Then execution in step S133 removes described solvent, and non-filler is arranged.
In specific implementation process, can static a period of time, after described solvent evaporates, microcapsule granule presents with close arrangement mode.
Need to prove, the meaning of described carrier has been the main support effect, do not represent to be formed directly into its surface, namely microcapsule granule can be formed directly on the carrier surface, also can be formed on other walls that also have between carrier and the microcapsule granule.
Then, may further comprise the steps S134-S135 with forming arrange upper substrate 11 and the described array base palte 12 bonding steps of layer 13 of microcapsule granule.
Execution in step S134 at the described microcapsule granule that the is formed at upper substrate 11 layer 13 surface-coated adhesive glue of arranging, and makes adhesive glue fill space between described microcapsules.
Execution in step S135 arranges described microcapsule granule that to be coated with the respective surfaces of the surface of adhesive glue and described array base palte 12 bonding for layer 13, and the respective surfaces of described array base palte 12 is the side that array base palte 12 is formed with pixel electrode 122.
In specific implementation process, use the space between the described microcapsules of adhesive glue 30 (referring to Fig. 8) filling, described adhesive glue is used for upper substrate 11, the array base palte 12 of bonding correspondence simultaneously.The adhesive glue 30 that uses, need transparent and insulation, for example can select Toshiba to produce model is the optics silica gel of OP2431, described adhesive glue 30 is because its molecule is less, (1) can flow into the gap of described microcapsule granule, the gap that adhesive glue 30 penetrates microcapsule granule arrives upper substrate 11 near a side of public electrode 112, plays the effect of further fixing described microcapsule granule layer 13 on upper substrate 11 close sides of public electrode 112; (2) play the bonding described effect that contains upper substrate 11 with the array base palte 12 of microcapsule granule layer 13.
Finish the Electronic Paper of adhesion step, the Electronic Paper that the Electronic Paper formation method that namely adopts present embodiment one to provide forms, sectional view as shown in Figure 8, structure comprises upper substrate 11, array base palte 12 and is arranged at microcapsule granule between described upper substrate 11 and the described array base palte 12 layer 13 of arranging, and described microcapsule granule is arranged and is filled with adhesive glue 30 between the microcapsule granule in the layer 13; Described upper substrate 11, array base palte 12 and the microcapsule granule layer 13 of arranging is bonded together by described adhesive glue 30.Adopt circular signal microcapsule granule among Fig. 8, be covered with adhesive glue 30 around the microcapsules in the microcapsule granule layer.
The pixel electrode 122 of Fig. 7 and array base palte 12 shown in Figure 8 is used for the microcapsule granule layer 13 of arranging directly bonding, need to prove, the fluctuating quantity of pixel electrode 122 is about 100 nanometers, the size of microcapsule granule is about tens microns, both are not at an order of magnitude, therefore, the fluctuating quantity of pixel electrode 122 can not impact arranging of microcapsule granule.
It is a side that is provided with public electrode 112 that described upper substrate 11 is used for making the arrange surface of layer 13 of microcapsule granule, it is a side that is provided with pixel electrode 122 that described array base palte 12 is used for the microcapsule granule bonding surface of layer 13 of arranging, do not represent that the microcapsule granule layer of arranging 13 must be set directly at public electrode 112 or pixel electrode 122 surfaces, also megohmite insulant can be set between the two, as long as form electric field in microcapsule granule layer 13 the upper and lower surface of arranging.
Embodiment two
The Electronic Paper structure (referring to shown in Figure 8) that present embodiment two forms is identical with embodiment one, and different being forms the method for Electronic Paper.Particularly, present embodiment two provides the formation method of another Electronic Paper, as shown in Figure 9, comprising:
Step S21 forms upper substrate 11;
Step S22 forms array base palte 12;
Step S23 forms the microcapsule granule layer 13 of arranging with described array base palte 12 as carrier, and the arrange array base palte 12 of layer 13 of microcapsule granule is bonding with described upper substrate 11 with forming; Wherein, the described microcapsule granule layer of arranging 13 is between described upper substrate 11 and the described array base palte 12.
Can find out that step S21 is identical with the first embodiment one step S11, step S22 is identical with the first embodiment one step S11, and this two step can with reference to embodiment one, no longer be repeated at this.
Below introduce in detail step S23, particularly, form microcapsule granule layer 13 step of arranging with described array base palte 12 as carrier and may further comprise the steps S231-S233.
At first, execution in step S231 is dispersed in microcapsules and forms microcapsule solution in the solvent.
Described solvent can be easy volatile solvent; Alcohol for example, deionized water.
Then, execution in step S232 is coated on described microcapsule solution on the respective surfaces of array base palte 12, and the respective surfaces of described array base palte 12 is the side that array base palte 12 is formed with pixel electrode 122; Described coating process can adopt cylindric brush coating, also can adopt spin coating or ink-jet.Described microcapsule solution is coated on the side that array base palte 12 is formed with pixel electrode 122, do not represent that the microcapsule granule layer of arranging 13 must directly be coated on pixel electrode 122 surfaces, also megohmite insulant can be set between the two, as long as formation electric field between the upper surface that layer 13 lower surface and follow-up adhesion step form so that microcapsule granule is arranged.
Then execution in step S233 removes described solvent, and non-filler is arranged.
In specific implementation process, can static a period of time, after described solvent evaporates, microcapsule granule presents with close arrangement mode.
Need to prove that the meaning of described carrier has been the main support effect, do not represent to be formed directly into its surface.
Then, may further comprise the steps S234 and S235 with forming arrange array base palte 12 and the described upper substrate 11 bonding steps of layer 13 of microcapsule granule.
Execution in step S234 at the described microcapsule granule that the is formed at array base palte 12 layer 13 surface-coated adhesive glue of arranging, and makes adhesive glue fill space between described microcapsules.
Execution in step S235 arranges described microcapsule granule that to be coated with the respective surfaces of the surface of adhesive glue and described upper substrate 11 bonding for layer 13, and the respective surfaces of described upper substrate 11 is the side that upper substrate 11 is formed with public electrode 112.
In specific implementation process, the space of using adhesive glue 30 to fill between described microcapsules, described adhesive glue 30 is used for upper substrate 11, the array base palte 12 of bonding correspondence simultaneously.The adhesive glue 30 that uses, need transparent and insulation, for example can select Toshiba to produce model is the optics silica gel of OP2431, described adhesive glue 30 is because its molecule is less, (1) can flow into the gap of described microcapsule granule, the gap that adhesive glue 30 penetrates microcapsule granule arrives array base palte 12 near a side of pixel electrode 122, plays the effect of further fixing described microcapsule granule layer 13 on array base palte 12 close sides of pixel electrode 122; (2) play the bonding described effect that contains upper substrate 11 with the array base palte 12 of microcapsule granule layer 13.
Finish the Electronic Paper of adhesion step, the Electronic Paper that namely adopts Electronic Paper formation method that present embodiment two provides to form is identical with embodiment one, sectional view as shown in Figure 8,
Embodiment three
Embodiment one adopts adhesive glue 30 to fill the microcapsule granule space with the Electronic Paper structure that embodiment two forms, present embodiment three provides two kinds of methods that are different from the first two embodiment with the embodiment four that follows, form a kind of Electronic Paper structure that the first two embodiment provides that is different from, particularly, non-filler between the microcapsule granule in the Electronic Paper structure that provides of embodiment three and embodiment four.The present inventor finds in actual production, the gap of microcapsule granule is during greater than 15 microns, for so that Electronic Paper reaches good display effect, need to adopt adhesive glue 30 padding schemes that provide among the embodiment one and two, when the gap is not more than 15 microns, can adopt the scheme of the non-filler that embodiment three and four provides.
In conjunction with shown in Figure 10, below introduce the first formation method of the Electronic Paper of non-filler between microcapsule granule, described formation method comprises:
Execution in step S31 forms upper substrate 11;
Execution in step S32 forms array base palte 12;
Execution in step S33 forms the microcapsule granule layer 13 of arranging with described upper substrate 11 as carrier, and the arrange upper substrate 11 of layer 13 of microcapsule granule is bonding with described array base palte 12 with forming; Wherein, the described microcapsule granule layer of arranging 13 is between described upper substrate 11 and the described array base palte 12.
The S11 with embodiment one is identical with the S12 step respectively with the S32 step for the S31 of this method.
Step S33 forms the microcapsule granule layer 13 of arranging with described upper substrate 11 as carrier, comprises following S331-S334 step in specific implementation process.
Execution in step S331 is dispersed in microcapsules and forms microcapsule solution in the solvent; It is large that the microcapsule solution concentration that forms in the described microcapsule solution concentration ratio embodiment one step S131 step is wanted.
Described solvent can be easy volatile solvent; Alcohol for example, deionized water.
Execution in step S332, at the respective surfaces formation bonding glue-line 40 (referring to Figure 10) of described upper substrate 11, the respective surfaces of described upper substrate 11 is the side that upper substrate 11 is formed with public electrode 112.
Execution in step S333 is coated on described microcapsule solution on the bonding glue-line 40.
Execution in step S334 removes described solvent, makes non-filler distribution between microcapsule granule.
In specific implementation process, can static a period of time, after described solvent evaporates, microcapsule granule presents with close arrangement mode.
Need to prove that the meaning of described carrier has been the main support effect, do not represent to be formed directly into its surface that in the present embodiment, the microcapsule granule layer 13 of arranging in fact is formed on the bonding glue-line 40 that step S332 forms.
Then, may further comprise the steps S335-S336 with forming arrange upper substrate 11 and the described array base palte 12 bonding steps of layer 13 of microcapsule granule.
Execution in step S335, at the respective surfaces formation bonding glue-line 50 (referring to shown in Figure 10) of described array base palte 12, the respective surfaces of described array base palte 12 is positioned at the side that array base palte 12 is formed with pixel electrode 122.
Execution in step S336 is formed with the surperficial bonding of layer 13 of arranging of the respective surfaces of bonding glue-line 50 and the described microcapsule granule that is formed on the upper substrate 11 with described array base palte 12.
In specific implementation process, the bonding glue- line 40,50 that step S332 and step S335 form respectively plays upper substrate 11, array base palte 12 effects of bonding correspondence.The adhesive glue that bonding glue- line 40,50 uses needs transparent and insulation, and for example can select Toshiba to produce model is the optics silica gel of OP2431, also can adopt the adhesive glue that uses in the prior art.
Finish the Electronic Paper of adhesion step, the Electronic Paper that the Electronic Paper formation method that namely adopts present embodiment three to provide forms, sectional view as shown in figure 10, structure comprises upper substrate 11, array base palte 12 and is arranged at microcapsule granule between described upper substrate 11 and the described array base palte 12 layer 13 of arranging, the described microcapsule granule non-filler between the microcapsule granule of layer in 13 of arranging, and bonding with corresponding upper substrate 11, array base palte 12 by bonding glue- line 40,50 respectively.Adopt circular signal microcapsule granule among Figure 10.
Embodiment four
Present embodiment four is introduced the second formation method of the Electronic Paper of non-filler between microcapsule granule.Particularly, the formation method of the Electronic Paper that present embodiment four provides comprises:
Step S41 forms upper substrate 11;
Step S42 forms array base palte 12;
Step S43 forms the microcapsule granule layer 13 of arranging with described array base palte 12 as carrier, and the arrange array base palte 12 of layer 13 of microcapsule granule is bonding with described upper substrate 11 with forming; Wherein, the described microcapsule granule layer of arranging 13 is between described upper substrate 11 and the described array base palte 12.
Can find out that step S41 is identical with the first embodiment one step S11, step S42 is identical with the first embodiment one step S11, and this two step can with reference to embodiment one, no longer be repeated at this.
Below introduce in detail step S43, particularly, form microcapsule granule layer 13 step of arranging with described array base palte 12 as carrier and may further comprise the steps S431-S434.
Execution in step S431 is dispersed in microcapsules and forms microcapsule solution in the solvent;
Described solvent can be easy volatile solvent; Alcohol for example, deionized water.
Execution in step S432, at the respective surfaces formation bonding glue-line 50 (referring to Figure 10) of described array base palte 12, the respective surfaces of described array base palte 12 is the side that array base palte 12 is formed with pixel electrode 122.
Execution in step S433 is coated on described microcapsule solution on the bonding glue-line 50.
Execution in step S434 removes described solvent, makes non-filler distribution between microcapsule granule.
In specific implementation process, can static a period of time, after described solvent evaporates, microcapsule granule presents with close arrangement mode.
Need to prove that the meaning of described carrier has been the main support effect, do not represent to be formed directly into its surface that in the present embodiment, the microcapsule granule layer 13 of arranging in fact is formed on the bonding glue-line 50 that step S432 forms.
Then, may further comprise the steps S435-S436 with forming arrange array base palte 12 and the described upper substrate 11 bonding steps of layer 13 of microcapsule granule.
Execution in step S435, at the respective surfaces formation bonding glue-line 40 (referring to shown in Figure 10) of described upper substrate 11, the respective surfaces of described upper substrate 11 is the side that upper substrate 11 is formed with public electrode 112.
Execution in step S436 is formed with the surperficial bonding of layer 13 of arranging of the respective surfaces of bonding glue-line 40 and the described microcapsule granule that is formed on the array base palte 12 with described upper substrate 11.
In specific implementation process, the bonding glue- line 50,40 that step S432 and step S435 form respectively plays array base palte 12, upper substrate 11 effects of bonding correspondence.The adhesive glue that bonding glue- line 40,50 uses needs transparent and insulation, and for example can select Toshiba to produce model is the optics silica gel of OP2431, also can adopt the adhesive glue that uses in the prior art.
Finish the Electronic Paper of adhesion step, the Electronic Paper that the Electronic Paper formation method that namely adopts present embodiment four to provide forms is identical with the Electronic Paper structure that embodiment three forms, sectional view as shown in figure 10, structure comprises upper substrate 11, array base palte 12 and is arranged at microcapsule granule between described upper substrate 11 and the described array base palte 12 layer 13 of arranging, the described microcapsule granule non-filler between the microcapsule granule of layer in 13 of arranging, and bonding with corresponding upper substrate 11, array base palte 12 by bonding glue- line 40,50 respectively.Adopt circular signal microcapsule granule among Figure 10.
Embodiment five
Among the embodiment one to four, be understandable that when containing the black and white particle in the microcapsules, said method can form the black and white Electronic Paper, when containing colouring particles in the microcapsules, said method can form color electric paper.Forming color electric paper also can be by arranging color filter or photoresistance district, to realize the purpose of colour filter at upper substrate.The method for making in described photoresistance district elaborates in present embodiment five.
In the present embodiment five, step S51 forms upper substrate, comprising:
S511 provides transparency carrier 111 (referring to Figure 11);
S512 is at transparency carrier 111 coating R look resistance materials;
S513 utilizes masterplate, exposure, arrangement mode and position that the R look that obtains needing after the development hinders;
S514, the transparency carrier 111 coating G looks with the resistance of R look that form at step S513 hinder materials;
S515 utilizes masterplate, exposure, arrangement mode and position that the G look that obtains needing after the development hinders;
S516, the transparency carrier 111 coating B looks with R, the resistance of G look that form at step S115 hinder materials;
S517 utilizes masterplate, exposure, arrangement mode and position that the B look that obtains needing after the development hinders;
S518 makes flatness layer in RGB look resistance layer;
S519 makes public electrode 112 at flatness layer.
Need to prove, S512-S513 forms R look resistance arrangement mode and position, S514-S515 forms G look resistance arrangement mode and position, S516-S517 formation B look resistance arrangement mode and position three order can be replaced, the optional 1-2 micron of thickness of the look resistance that is coated with in S512, S514, the S516 step.
In addition, if in the less demanding situation of resistance layer flatness of checking colors, step S518 can omit, replace with in the step S519 implementation in RGB look resistance layer and make public electrode 112.
Execution in step S52 forms array base palte 12; Identical with embodiment one step S12.
Step S53 forms the microcapsule granule layer 13 of arranging with described array base palte 12 as carrier, and the arrange array base palte 12 of layer 13 of microcapsule granule is bonding with described upper substrate 11 with forming; Wherein, the described microcapsule granule layer of arranging 13 is between described upper substrate 11 and the described array base palte 12.Step S53 also can adopt with described upper substrate 11 and form the microcapsule granule layer 13 of arranging as carrier, and the arrange upper substrate 11 of layer 13 of microcapsule granule is bonding with described array base palte 12 with forming; Wherein, the described microcapsule granule layer of arranging 13 is between described upper substrate 11 and the described array base palte 12.Arrange the scheme of adhesive glue filling 30 is provided between the microcapsule granule that upper substrate 11 and described array base palte 12 adhesive bonding methods of layer 13 adopt embodiment one and embodiment two to provide forming microcapsule granule.The Electronic Paper structure that so forms as shown in figure 11.
Also can adopt the scheme of non-filler between the microcapsule granule gap that embodiment three and embodiment four provide with forming the arrange upper substrate 11 of layer 13 and described array base palte 12 adhesive bonding methods of microcapsule granule.The Electronic Paper structure that so forms as shown in figure 12.
Compared with prior art, the method for making of a kind of Electronic Paper provided by the invention adopts upper substrate or array base palte to form the microcapsule granule layer of arranging as carrier, fills afterwards adhesive glue with bonding upper substrate and array base palte in described microcapsules are arranged layer; The method for making of another kind of Electronic Paper adopts and forms adhesive glue at original upper substrate and array base palte, form the microcapsules layer of arranging take any one adhesive glue as carrier, afterwards bonding upper substrate and array base palte, the described microcapsules layer of arranging is positioned in the middle of both and non-filler.The necessary other base material of the microcapsule layer that provides separately in the prior art all has been provided the Electronic Paper that above-mentioned two kinds of ways form, such as plastics, PET etc., because few one deck base material, thereby improved transmittance.
Although the present invention with preferred embodiment openly as above; but it is not to limit the present invention; any those skilled in the art without departing from the spirit and scope of the present invention; can utilize method and the technology contents of above-mentioned announcement that technical solution of the present invention is made possible change and modification; therefore; every content that does not break away from technical solution of the present invention; to any simple modification, equivalent variations and modification that above embodiment does, all belong to the protection domain of technical solution of the present invention according to technical spirit of the present invention.
Claims (18)
1. the formation method of an Electronic Paper is characterized in that, comprising:
Form upper substrate;
Form array base palte;
Form the microcapsule granule layer of arranging with described upper substrate as carrier, arrange upper substrate and the described array base palte of layer of microcapsule granule is bonding with forming;
Wherein, described microcapsule granule arrange the layer be between described upper substrate and the described array base palte.
2. the formation method of Electronic Paper according to claim 1 is characterized in that, forms the microcapsule granule layer step of arranging with described upper substrate as carrier and comprises:
Microcapsules are dispersed in form microcapsule solution in the solvent;
Described microcapsule solution is coated on the respective surfaces of upper substrate, the respective surfaces of described upper substrate is positioned at the side that upper substrate is formed with public electrode;
Remove described solvent, make non-filler distribution between microcapsule granule.
3. the formation method of Electronic Paper according to claim 2 is characterized in that, comprises forming the microcapsule granule bonding step of the upper substrate of layer and described array base palte of arranging:
At the described microcapsule granule that the is formed at upper substrate layer surface-coated adhesive glue of arranging, and make adhesive glue fill space between described microcapsules;
Described microcapsule granule arranged, and to be coated with the respective surfaces of the surface of adhesive glue and described array base palte bonding for layer, and the respective surfaces of described array base palte is positioned at the side that array base palte is formed with pixel electrode.
4. the formation method of Electronic Paper according to claim 1 is characterized in that, forms the microcapsule granule layer step of arranging with described upper substrate as carrier and comprises:
Microcapsules are dispersed in form microcapsule solution in the solvent;
Respective surfaces at described upper substrate forms bonding glue-line, and the respective surfaces of described upper substrate is positioned at the side that upper substrate is formed with public electrode;
Described microcapsule solution is coated on the bonding glue-line;
Remove described solvent, make non-filler distribution between microcapsule granule.
5. the formation method of Electronic Paper according to claim 4 is characterized in that, comprises forming the microcapsule granule bonding step of the upper substrate of layer and described array base palte of arranging:
Respective surfaces at described array base palte forms bonding glue-line, and the respective surfaces of described array base palte is positioned at the side that array base palte is formed with pixel electrode;
Described array base palte is formed with the surperficial bonding of layer of arranging of the respective surfaces of bonding glue-line and the described microcapsule granule that is formed on the upper substrate.
6. according to claim 2 or the formation method of 4 described Electronic Paper, it is characterized in that described solvent is volatile substances, adopt volatility process to remove described solvent.
7. according to claim 3 to the formation method of the described Electronic Paper of 5 any one, it is characterized in that described adhesive glue is transparent and the insulation material.
8. the formation method of an Electronic Paper is characterized in that, comprising:
Form upper substrate;
Form array base palte;
Form the microcapsule granule layer of arranging with described array base palte as carrier, arrange array base palte and the described upper substrate of layer of microcapsule granule is bonding with forming;
Wherein, described microcapsule granule arrange the layer be between described upper substrate and the described array base palte.
9. the formation method of Electronic Paper according to claim 8 is characterized in that, forms the microcapsule granule layer step of arranging with described array base palte as carrier and comprises:
Microcapsules are dispersed in form microcapsule solution in the solvent;
Described microcapsule solution is coated on the respective surfaces of array base palte, the respective surfaces of described array base palte is positioned at the side that array base palte is formed with pixel electrode;
Remove described solvent, make non-filler distribution between microcapsule granule.
10. the formation method of Electronic Paper according to claim 9 is characterized in that, comprises forming the microcapsule granule bonding step of the array base palte of layer and described upper substrate of arranging:
At the described microcapsule granule that the is formed at array base palte layer surface-coated adhesive glue of arranging, and make adhesive glue fill space between described microcapsules;
Described microcapsule granule arranged, and to be coated with the respective surfaces of the surface of adhesive glue and described upper substrate bonding for layer, and the respective surfaces of described upper substrate is positioned at the side that upper substrate is formed with public electrode.
11. the formation method of Electronic Paper according to claim 8 is characterized in that, forms the microcapsule granule layer step of arranging with described array base palte as carrier and comprises:
Microcapsules are dispersed in form microcapsule solution in the solvent;
Respective surfaces at described array base palte forms bonding glue-line, and the respective surfaces of described array base palte is positioned at the side that array base palte is formed with pixel electrode;
Described microcapsule solution is coated on the bonding glue-line;
Remove described solvent, make non-filler distribution between microcapsule granule.
12. the formation method of Electronic Paper according to claim 11 is characterized in that, comprises forming the microcapsule granule bonding step of the array base palte of layer and upper substrate of arranging:
Respective surfaces at described upper substrate forms bonding glue-line, and the respective surfaces of described upper substrate is positioned at the side that upper substrate is formed with public electrode;
Described upper substrate is formed with the surperficial bonding of layer of arranging of the respective surfaces of bonding glue-line and the described microcapsule granule that is formed on the array base palte.
13. according to claim 9 or the formation method of 11 described Electronic Paper, it is characterized in that described solvent is volatile substances, adopt volatility process to remove described solvent.
14. to the formation method of the described Electronic Paper of 12 any one, it is characterized in that according to claim 10 described adhesive glue is transparent and the insulation material.
15. an Electronic Paper, comprise upper substrate, array base palte and be arranged at described upper substrate and described array base palte between the microcapsule granule layer of arranging, it is characterized in that,
Described microcapsule granule is arranged and is filled with adhesive glue between the microcapsules in the layer; Described upper substrate, array base palte and microcapsule granule arrange the layer be bonded together by described adhesive glue.
16. Electronic Paper according to claim 15 is characterized in that, described upper substrate near described microcapsule granule arrange the layer a side be provided with public electrode, described array base palte near described microcapsule granule arrange the layer a side be provided with pixel electrode.
17. an Electronic Paper, comprise upper substrate, array base palte and be arranged at described upper substrate and described array base palte between the microcapsule granule layer of arranging, it is characterized in that,
Described microcapsule granule is arranged does not have filling material between the microcapsules in the layer; Described microcapsule granule arrange the layer be bonded together by adhesive glue and described upper substrate; Described microcapsule granule arrange the layer be bonded together by adhesive glue and described array base palte.
18. Electronic Paper according to claim 17 is characterized in that, described upper substrate near described microcapsule granule arrange the layer a side be provided with public electrode, described array base palte near described microcapsule granule arrange the layer a side be provided with pixel electrode.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110231880.XA CN102929064B (en) | 2011-08-12 | 2011-08-12 | Electronic paper and forming method thereof |
| PCT/CN2012/078231 WO2013023502A1 (en) | 2011-08-12 | 2012-07-05 | Electronic paper and method for producing electronic paper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110231880.XA CN102929064B (en) | 2011-08-12 | 2011-08-12 | Electronic paper and forming method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102929064A true CN102929064A (en) | 2013-02-13 |
| CN102929064B CN102929064B (en) | 2015-09-23 |
Family
ID=47643898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110231880.XA Active CN102929064B (en) | 2011-08-12 | 2011-08-12 | Electronic paper and forming method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102929064B (en) |
| WO (1) | WO2013023502A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107238922A (en) * | 2017-07-14 | 2017-10-10 | 京东方科技集团股份有限公司 | The method of filling ink and the method for preparing Electrowetting display panel in electricity moistening display base plate |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1678954A (en) * | 2002-09-03 | 2005-10-05 | 伊英克公司 | Electro-optic displays |
| CN1784632A (en) * | 2003-07-29 | 2006-06-07 | Tdk株式会社 | Display device |
| CN1904709A (en) * | 2005-07-29 | 2007-01-31 | 精工爱普生株式会社 | Electrophoretic display sheet, electrophoretic display apparatus, and method of manufacturing electrophoretic display sheet |
| CN101013243A (en) * | 2006-02-02 | 2007-08-08 | 精工爱普生株式会社 | Electronic apparatus and method for manufacturing electro-optical device |
| US20080204855A1 (en) * | 2007-02-23 | 2008-08-28 | Seiko Epson Corporation | Electrophoretic display sheet, electrophoretic display, method for producing electrophoretic display, and electronic apparatus |
| CN101382718A (en) * | 2007-09-04 | 2009-03-11 | 比亚迪股份有限公司 | Electronic paper display with touching function |
| US20090207477A1 (en) * | 2008-02-20 | 2009-08-20 | Seiko Epson Corporation | Electrophoretic display device, method of manufacturing electrophoretic display device, and electronic device |
| US20090208730A1 (en) * | 2008-02-20 | 2009-08-20 | Seiko Epson Corporation | Method of manufacturing electrophoretic display device, electrophoretic display device and electronic device |
| CN102062984A (en) * | 2010-11-29 | 2011-05-18 | 广州奥熠电子科技有限公司 | Electrophoretic display device and manufacturing method thereof |
-
2011
- 2011-08-12 CN CN201110231880.XA patent/CN102929064B/en active Active
-
2012
- 2012-07-05 WO PCT/CN2012/078231 patent/WO2013023502A1/en active Application Filing
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1678954A (en) * | 2002-09-03 | 2005-10-05 | 伊英克公司 | Electro-optic displays |
| CN1784632A (en) * | 2003-07-29 | 2006-06-07 | Tdk株式会社 | Display device |
| CN1904709A (en) * | 2005-07-29 | 2007-01-31 | 精工爱普生株式会社 | Electrophoretic display sheet, electrophoretic display apparatus, and method of manufacturing electrophoretic display sheet |
| CN101013243A (en) * | 2006-02-02 | 2007-08-08 | 精工爱普生株式会社 | Electronic apparatus and method for manufacturing electro-optical device |
| US20080204855A1 (en) * | 2007-02-23 | 2008-08-28 | Seiko Epson Corporation | Electrophoretic display sheet, electrophoretic display, method for producing electrophoretic display, and electronic apparatus |
| CN101382718A (en) * | 2007-09-04 | 2009-03-11 | 比亚迪股份有限公司 | Electronic paper display with touching function |
| US20090207477A1 (en) * | 2008-02-20 | 2009-08-20 | Seiko Epson Corporation | Electrophoretic display device, method of manufacturing electrophoretic display device, and electronic device |
| US20090208730A1 (en) * | 2008-02-20 | 2009-08-20 | Seiko Epson Corporation | Method of manufacturing electrophoretic display device, electrophoretic display device and electronic device |
| CN102062984A (en) * | 2010-11-29 | 2011-05-18 | 广州奥熠电子科技有限公司 | Electrophoretic display device and manufacturing method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107238922A (en) * | 2017-07-14 | 2017-10-10 | 京东方科技集团股份有限公司 | The method of filling ink and the method for preparing Electrowetting display panel in electricity moistening display base plate |
| US10919749B2 (en) | 2017-07-14 | 2021-02-16 | Boe Technology Group Co., Ltd. | Method for filling printing ink in electrowetting display substrate and method for producing electrowetting display panel |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102929064B (en) | 2015-09-23 |
| WO2013023502A1 (en) | 2013-02-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101640816B1 (en) | Electrophoretic display device and method for fabricating the same | |
| CN203133452U (en) | Array substrate and liquid crystal display device | |
| CN101424852A (en) | Liquid crystal display device and driving method for the same | |
| TWI691775B (en) | Closed display plasma module and manufacturing method thereof | |
| CN202145251U (en) | Liquid crystal display panel | |
| KR101719158B1 (en) | Electrophoretic display device and method for manufacturing the same | |
| CN103838044B (en) | Substrate and its manufacture method, display device | |
| CN102445807B (en) | Electrophoretic display device and method for manufacturing the same | |
| CN103018950A (en) | Color film substrate and manufacturing method and display device thereof | |
| CN101303505A (en) | Flexible electrophoretic display and method of fabricating the same | |
| WO2019080884A1 (en) | Electronic paper display screen, display device, and binding method | |
| WO2009119156A1 (en) | Display panel, display device equipped with the same, and method for manufacturing charged particle to be used in display panel | |
| CN103645582A (en) | Color film substrate, manufacturing method thereof, display device and display method | |
| JP2007298894A (en) | Display device, its manufacturing method and display system | |
| CN103928471A (en) | Array substrate, manufacturing method of array substrate and display device | |
| WO2019140758A1 (en) | High-resolution display plasma module, and manufacturing method thereof | |
| CN102929064A (en) | Electronic paper and forming method thereof | |
| CN100434982C (en) | Liquid crystal display device and production method thereof | |
| CN104460105A (en) | Color membrane substrate, manufacturing method for color membrane substrate and display device | |
| CN100409092C (en) | Array substrate, liquid crystal display apparatus having the same and method for driving liquid crystal display apparatus | |
| TWI431569B (en) | Display device | |
| KR20140015829A (en) | Electrophoresis display device and method for manufacturing the same | |
| CN103941514B (en) | A kind of electrophoretic display panel and its manufacture method, electrophoretic display apparatus | |
| JP2005265921A (en) | Display device and manufacturing method therefor | |
| WO2006103604A1 (en) | Method of manufacturing an electrophoretic display device and an electrophoretic display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |