CN102917530B - There is glass plate and the manufacture method thereof of conducting wire - Google Patents
There is glass plate and the manufacture method thereof of conducting wire Download PDFInfo
- Publication number
- CN102917530B CN102917530B CN201110217458.9A CN201110217458A CN102917530B CN 102917530 B CN102917530 B CN 102917530B CN 201110217458 A CN201110217458 A CN 201110217458A CN 102917530 B CN102917530 B CN 102917530B
- Authority
- CN
- China
- Prior art keywords
- conducting wire
- glass plate
- glass
- manufacture method
- metal powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Surface Treatment Of Glass (AREA)
Abstract
The invention discloses a kind of manufacture method with the glass plate of conducting wire, Qi Bao Kuo ︰ prepares glass baseplate, and the nano metal powder in the certain path of applying implenent on the glass substrate; The glass baseplate being coated with nano metal powder is carried out high-temperature baking; Remove nano metal powder, obtain the glass baseplate with metal diffusion layer; Metal diffusion layer forms conducting wire through plated surface technique.The present invention utilizes metal diffusion principle to form the metal diffusion layer combined together with glass plate, not only combines firmly, and when the coat of metal damages, has preferably recoverability.
Description
[technical field]
The present invention relates to a kind of glass plate, espespecially a kind of glass plate with conducting wire.
[background technology]
Refer to Chinese patent and announce No. 201132817 a kind of glass plate film-plating method disclosed, it adopts evaporation process, and key step is: one, glass is put into the vacuum chamber being equipped with plating material; Two, heat, plating material is evaporated or distillation; Three, plating material is deposited on glass surface and is condensed into plated film.But the adherence of glass and plated film is more weak in this kind of technique, easy to wearly to come off, and impaired rear plated film is not easily repaired.
Therefore, a kind of glass plate that can solve the problem and manufacture method thereof is needed.
[summary of the invention]
The object of invention is to provide a kind of glass plate with conducting wire, and it is not easy to wear comes off, and impaired rear plated film is easily repaired.
The object of the invention is to be achieved through the following technical solutions: the invention provides a kind of glass plate with conducting wire, it comprises glass baseplate and the coat of metal, previous glass sheet also comprises the metal diffusion layer being spread in glass substrate surface, and the described coat of metal is attached to the formation conducting wire, surface of metal diffusion layer.
Present invention also offers a kind of manufacture method with the glass plate of conducting wire, Qi Bao Kuo ︰ prepares glass baseplate, and the nano metal powder in the certain path of applying implenent on the glass substrate; The glass baseplate being coated with nano metal powder is carried out high-temperature baking; Remove nano metal powder, obtain the glass baseplate with metal diffusion layer; Metal diffusion layer forms conducting wire through plated surface technique.
Compared with prior art, the present invention utilizes metal diffusion principle to form the metal diffusion layer combined together with glass plate, not only combines firmly, and when the coat of metal damages, has preferably recoverability.
[accompanying drawing explanation]
Fig. 1 is the manufacturing step schematic diagram that the present invention has the glass plate of conducting wire.
Fig. 2 is the generalized section corresponding with Fig. 1 manufacturing step.
[embodiment]
The present invention mainly make use of the diffusion principle of atom, therefore first does a simply introduction to diffusion process.Because atom has heat energy, they can move in the material.The phenomenon that atom moves at material internal is called diffusion.Such as, if by a copper sheet and a nickel sheet welded together or lean on enough near, nickle atom will spread gradually in copper sheet, and copper atom also can spread in nickel sheet.Atom locomitivity is in the material called the stability of atom, and temperature is higher, and the heat energy that atom has is higher, and unsteadiness is higher, spreads faster.Thus, ambient temperature and time etc. require also to have an impact to the process spread and effect.
Refer to Fig. 1 and Fig. 2, the present invention is a kind of glass plate 100 with conducting wire, it comprises glass baseplate 10 and the coat of metal 14, previous glass sheet 100 also comprises the metal diffusion layer 13 being spread in glass baseplate 10 surface, and the described coat of metal 14 is attached to the formation conducting wire, surface of metal diffusion layer 13.
Introduce the manufacture method of above-mentioned glass plate 100 below in detail:
First, get out glass baseplate 10, and be coated with nano metal powder 12 on described glass baseplate, goodly in the present embodiment have employed Nanometer Copper powder.Aforementioned nano metal powder has gel (not shown) being applied to glass baseplate forward slip value, to adhere to glass baseplate 10 surface better.The coating method of nano metal powder, except common brushing, also copies on glass baseplate 10 by modes such as bat printings.This part a general purpose be: by nano metal powder according to certain conductive path sticky cloth on glass baseplate.
Then, the glass baseplate 10 being coated with nano metal powder 12 is put into high temperature furnace and carries out high-temperature baking, diffuse to the top layer of glass baseplate with the nano metal powder accelerating top layer, and then form stable infiltration binder course.High-temperature baking temperature is wherein better to be arranged between 600 ~ 700 degree, and baking time is preferably 20 ~ 40 minutes.
Then, anneal and remove nano metal powder, obtaining the glass baseplate with metal diffusion layer 13.Glass baseplate 10 after annealing is cleaned with solution by the main system of this part, and namely described metal diffusion layer 13 is removed nano metal powder on glass baseplate and gel carbon slag and remained and stablize the infiltration binder course being formed at glass baseplate top layer afterwards.The metal diffusion layer 13 that the present embodiment obtains subject to the foregoing is transparent or translucent, and the circuit now printed not yet has conducting function.Certainly, when environmental condition meets, basic conductivity can be possessed equally.
Finally, described glass baseplate 10 is made to form the coat of metal 14 be attached on metal diffusion layer 13 through plated surface technique, that is conducting wire.Here plated surface technique is better selects chemical plating, and better the selecting of plating solution has satisfactory electrical conductivity and have the gold of good combination with Nanometer Copper powder.Described conducting wire possesses conducting function because having carried out sufficient deposition on metal diffusion layer 13.In addition, certain balance can be done between the transparency of conducting wire 14 and electric conductivity, to make conducting wire while possessing necessary electric conductivity, also there is transparent or semitransparent light-transmissive, thus can meet on market that some innovate brief product design requirement better.
It is worth mentioning that, it is inner that metal diffusion layer 13 of the present invention has embedded glass plate 100, in conjunction with firmly, when the coat of metal 14 damages, only needs to repeat last plated surface technique again and get final product restore funcitons, have preferably recoverability.
In sum, foregoing description be preferred embodiment of the present invention, be certainly not limited to this.Namely every simple equivalence change done according to claims of the present invention and description with modify, all should still belong in scope that the present invention contains.
Claims (7)
1. have a manufacture method for the glass plate of conducting wire, it comprises:
Prepare glass baseplate, and the nano metal powder in the certain path of applying implenent on the glass substrate;
The glass baseplate being coated with nano metal powder is carried out high-temperature baking, diffuses to the top layer of glass baseplate with the nano metal powder accelerating top layer, and then form stable infiltration binder course;
Anneal and remove nano metal powder, obtain the metal diffusion layer infiltrating through described glass baseplate inside, this metal diffusion layer is transparence;
Metal diffusion layer forms electrically conducting transparent circuit through plated surface technique.
2. there is the manufacture method of the glass plate of conducting wire as claimed in claim 1, it is characterized in that: described plated surface technique is chemical plating.
3. there is the manufacture method of the glass plate of conducting wire as claimed in claim 2, it is characterized in that: the metal that described nano metal powder uses is Nanometer Copper.
4. there is the manufacture method of the glass plate of conducting wire as claimed in claim 3, it is characterized in that: described high-temperature baking temperature is arranged between 600 ~ 700 degree.
5. there is the manufacture method of the glass plate of conducting wire as claimed in claim 4, it is characterized in that: described high-temperature baking set of time is between 20 ~ 40 minutes.
6. the manufacture method with the glass plate of conducting wire according to any one of claim 1-5, is characterized in that: described nano metal powder has gel being applied to glass baseplate forward slip value.
7. there is the manufacture method of the glass plate of conducting wire as claimed in claim 6, it is characterized in that: described nano metal powder is applied on glass baseplate by bat printing mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110217458.9A CN102917530B (en) | 2011-08-01 | 2011-08-01 | There is glass plate and the manufacture method thereof of conducting wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110217458.9A CN102917530B (en) | 2011-08-01 | 2011-08-01 | There is glass plate and the manufacture method thereof of conducting wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102917530A CN102917530A (en) | 2013-02-06 |
| CN102917530B true CN102917530B (en) | 2016-01-06 |
Family
ID=47615702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110217458.9A Active CN102917530B (en) | 2011-08-01 | 2011-08-01 | There is glass plate and the manufacture method thereof of conducting wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102917530B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1668712A (en) * | 2002-06-13 | 2005-09-14 | 耐诺泡德斯工业有限公司 | A method for the production of conductive and transparent nano-coatings and nano-inks and nano-powder coatings and inks produced thereby |
| CN101522947A (en) * | 2005-06-10 | 2009-09-02 | 西玛耐诺技术以色列有限公司 | Enhanced transparent conductive coatings and methods for making them |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003218515A (en) * | 2002-01-25 | 2003-07-31 | Kyocera Corp | Wiring board and its manufacturing method |
| EP1667510B1 (en) * | 2003-09-09 | 2013-11-06 | Hoya Corporation | Method for manufacturing double-sided printed glass board |
| EP2145336B1 (en) * | 2007-05-10 | 2011-11-09 | LG Chem, Ltd. | Emi shield glass with blackened conductive pattern and a method for preparation thereof |
-
2011
- 2011-08-01 CN CN201110217458.9A patent/CN102917530B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1668712A (en) * | 2002-06-13 | 2005-09-14 | 耐诺泡德斯工业有限公司 | A method for the production of conductive and transparent nano-coatings and nano-inks and nano-powder coatings and inks produced thereby |
| CN101522947A (en) * | 2005-06-10 | 2009-09-02 | 西玛耐诺技术以色列有限公司 | Enhanced transparent conductive coatings and methods for making them |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102917530A (en) | 2013-02-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Cheong et al. | Silver nanowire network transparent electrodes with highly enhanced flexibility by welding for application in flexible organic light-emitting diodes | |
| Noh et al. | Cost-effective ITO-free organic solar cells with silver nanowire–PEDOT: PSS composite electrodes via a one-step spray deposition method | |
| Kumar et al. | High performing AgNW transparent conducting electrodes with a sheet resistance of 2.5 Ω Sq− 1 based upon a roll-to-roll compatible post-processing technique | |
| Park et al. | High-resolution and large-area patterning of highly conductive silver nanowire electrodes by reverse offset printing and intense pulsed light irradiation | |
| KR20190137182A (en) | Transparent conductive films with embedded metal grids | |
| CN106756840A (en) | A kind of high-temperature flexible transparent conductive film and preparation method and application | |
| CN102779944A (en) | Transparent conductive thin film and preparation method thereof | |
| CN103745829B (en) | Preparation method of graphene composite electrode material | |
| DE60213242D1 (en) | METHOD FOR PRODUCING A TOUCH-SENSITIVE SCREEN | |
| CN106847767A (en) | A kind of graphite Copper Foil heat sink compound | |
| Yoshikawa et al. | Designing a flexible and transparent ultrarapid electrothermogenic film based on thermal loss suppression effect: a self-fused Cu/Ni composite junctionless nanonetwork for effective deicing heater | |
| KR20090070471A (en) | Conductive glass for dye sensitive solar cell and method of preparing the same | |
| EP2423981A3 (en) | Method of manufacturing solar cell electrodes by paste firing | |
| CN110808266A (en) | Display substrate with transparent electrode and preparation method thereof | |
| CN104576820A (en) | Method for producing a backside contact in a solar cell device and solar cell device | |
| CN102917530B (en) | There is glass plate and the manufacture method thereof of conducting wire | |
| Luo et al. | Flexible Transparent Electrodes Formed from Template‐Patterned Thin‐Film Silver | |
| Wang et al. | Communication—Ag NW networks enhanced by Ni electroplating for flexible transparent electrodes | |
| Hu et al. | Ultra‐low resistivity copper mesh as embedded current collector layer for inkjet‐printed flexible electrochromic device realizing fast response and uniform coloration | |
| BRPI0800610A2 (en) | mirror panel, and, method for manufacturing a mirror panel | |
| JPWO2016143201A1 (en) | Transparent electrode, method for producing the same, and organic electroluminescence device | |
| CN102207792B (en) | Manufacturing method of touch sensor structure based on charge transfer | |
| CN109817393A (en) | A method of preparing network transparent conductive film | |
| Oh et al. | Efficient metallic nanowire welding using the Eddy current method | |
| CN106624371A (en) | Method for forming patterned graphene on target device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |