CN102898960A - Conduction type adhesive - Google Patents
Conduction type adhesive Download PDFInfo
- Publication number
- CN102898960A CN102898960A CN2012103600997A CN201210360099A CN102898960A CN 102898960 A CN102898960 A CN 102898960A CN 2012103600997 A CN2012103600997 A CN 2012103600997A CN 201210360099 A CN201210360099 A CN 201210360099A CN 102898960 A CN102898960 A CN 102898960A
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- CN
- China
- Prior art keywords
- parts
- epoxy
- iron oxide
- polyvinyl butyral
- silver powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
A conduction type adhesive comprises, by mass, 60-80 parts of E-51 epoxy resin, 10-20 parts of 600 epoxy diluents, 5-8 parts of polyvinyl butyral, 8-12 parts of carboxylated nitrile-butadiene rubber (NBR) and 300-400 parts of silver powder, and is characterized by further comprising 1-3 parts of imidazole, 0.1-0.5 part of iron oxide red, 5-10 parts of propylene oxide tert-butyl ether and 20-30 parts of methacrylate. The adhesive is provided with a resistivity of (10-4)-(10-5) omega*cm, a shear strength of 30-35MPa, an ageing resistance that the shear strength is 27-30MPa after 500h of baking under 200 DEG C, and is suitable for outdoor products.
Description
Technical field
The invention belongs to the epoxy adhesive technical field, relate in particular to a kind of conductivity type epoxy adhesive.
Background technology
Conductive adhesive is divided into organic conductive glue and conductive inorganic by the chemical constitution of glutinous material, and commonly used is organic conductive glue, and wherein most widely used is the glutinous agent of epoxide resin conductive adhesive; Be divided into the conductive adhesives such as silver system, gold system, copper system, nickel system, charcoal system by used electro-conductive material, use maximum be silver-coloredly to be and copper is conductive adhesive; Be divided into the conductive adhesives such as response type, solvent-borne type, hot-melting type, pressure sensitive, sintered type by curing mode.The agent of epoxy conductive gluing is comprised of Resins, epoxy, toughner, solidifying agent, conductive filler material, coupling agent and other auxiliary agents etc.Can be made into single component or polycomponent formulation; Arranged dividing of room temperature curing type, intermediate temperature setting type and hot setting type; Can also be no-solvent type or contain solvent-borne type.Existing conductive adhesive ageing-resistant performance is not outstanding, and under the condition, the shearing resistance behind the long-term exposure can significantly descend out of doors.
Summary of the invention
The technical problem that solves:The invention provides a kind of improved conductive adhesive, when keeping conductivity, improve its ageing resistance, be applicable to outdoor products and use.
Technical scheme:The conductivity type sizing agent, comprise 60～80 parts of E-51 Resins, epoxy in mass parts, 10～20 parts of 600 epoxide diluents, 5～8 parts of polyvinyl butyral acetals, 8～12 parts of carboxy nitrile rubbers, 300～400 parts in silver powder, characterized by further comprising 1～3 part of imidazoles, 0.1～0.5 part of red iron oxide, 5～10 parts of epoxy propane butyl ethers, 20～30 parts of methacrylic esters.
Preferred version 1: comprise 70 parts of E-51 Resins, epoxy in mass parts, 15 parts of 600 epoxide diluents, 7 parts of polyvinyl butyral acetals, 10 parts of carboxy nitrile rubbers, 350 parts in silver powder, 2 parts of imidazoles, 0.3 part of red iron oxide, 8 parts of epoxy propane butyl ethers, 25 parts of methacrylic esters.
Preferred version 2: comprise 80 parts of E-51 Resins, epoxy in mass parts, 20 parts of 600 epoxide diluents, 8 parts of polyvinyl butyral acetals, 12 parts of carboxy nitrile rubbers, 400 parts in silver powder, 3 parts of imidazoles, 0.5 part of red iron oxide, 10 parts of epoxy propane butyl ethers, 30 parts of methacrylic esters.
Beneficial effect:Conductive adhesive provided by the invention, resistivity is 10
-4～10
-5Ω cm, shearing resistance is 30～35MPa, and ageing resistance is behind 200 ℃ of baking 500h, and shearing resistance is 27～30MPa, is applicable to outdoor products and uses.
Embodiment
Embodiment 1
The conductivity type sizing agent comprises 70 parts of E-51 Resins, epoxy in mass parts, 15 parts of 600 epoxide diluents, 7 parts of polyvinyl butyral acetals, 10 parts of carboxy nitrile rubbers, 350 parts in silver powder, 2 parts of imidazoles, 0.3 part of red iron oxide, 8 parts of epoxy propane butyl ethers, 25 parts of methacrylic esters.This conductive adhesive, resistivity is 10
-4Ω cm, shearing resistance is 32MPa, and ageing resistance is behind 200 ℃ of baking 500h, and shearing resistance is 29MPa, is applicable to outdoor products and uses.
Embodiment 2
The conductivity type sizing agent comprises 80 parts of E-51 Resins, epoxy in mass parts, 20 parts of 600 epoxide diluents, 8 parts of polyvinyl butyral acetals, 12 parts of carboxy nitrile rubbers, 400 parts in silver powder, 3 parts of imidazoles, 0.5 part of red iron oxide, 10 parts of epoxy propane butyl ethers, 30 parts of methacrylic esters.Conductive adhesive provided by the invention, resistivity is 10
-5Ω cm, shearing resistance is 35MPa, and ageing resistance is behind 200 ℃ of baking 500h, and shearing resistance is 30MPa, is applicable to outdoor products and uses.
Claims (3)
1. conductivity type sizing agent, comprise 60～80 parts of E-51 Resins, epoxy in mass parts, 10～20 parts of 600 epoxide diluents, 5～8 parts of polyvinyl butyral acetals, 8～12 parts of carboxy nitrile rubbers, 300～400 parts in silver powder, characterized by further comprising 1～3 part of imidazoles, 0.1～0.5 part of red iron oxide, 5～10 parts of epoxy propane butyl ethers, 20～30 parts of methacrylic esters.
2. conductivity type sizing agent according to claim 1, it is characterized in that comprising 70 parts of E-51 Resins, epoxy in mass parts, 15 parts of 600 epoxide diluents, 7 parts of polyvinyl butyral acetals, 10 parts of carboxy nitrile rubbers, 350 parts in silver powder, 2 parts of imidazoles, 0.3 part of red iron oxide, 8 parts of epoxy propane butyl ethers, 25 parts of methacrylic esters.
3. conductivity type sizing agent according to claim 1, it is characterized in that comprising 80 parts of E-51 Resins, epoxy in mass parts, 20 parts of 600 epoxide diluents, 8 parts of polyvinyl butyral acetals, 12 parts of carboxy nitrile rubbers, 400 parts in silver powder, 3 parts of imidazoles, 0.5 part of red iron oxide, 10 parts of epoxy propane butyl ethers, 30 parts of methacrylic esters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103600997A CN102898960A (en) | 2012-09-25 | 2012-09-25 | Conduction type adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103600997A CN102898960A (en) | 2012-09-25 | 2012-09-25 | Conduction type adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102898960A true CN102898960A (en) | 2013-01-30 |
Family
ID=47571457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012103600997A Pending CN102898960A (en) | 2012-09-25 | 2012-09-25 | Conduction type adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102898960A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103881611A (en) * | 2014-03-10 | 2014-06-25 | 苏州捷德瑞精密机械有限公司 | Normal temperature conductive adhesive and preparation method thereof |
| CN106281170A (en) * | 2016-08-31 | 2017-01-04 | 强新正品（苏州）环保材料科技有限公司 | A kind of conducting resinl for bonding copper alloy element and usage thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000080146A (en) * | 1998-09-03 | 2000-03-21 | Asahi Chem Ind Co Ltd | Epoxy resin composition |
| CN1759155A (en) * | 2003-03-18 | 2006-04-12 | 陶氏康宁公司 | A conductive adhesive composition |
| CN101747855A (en) * | 2010-01-18 | 2010-06-23 | 北京海斯迪克新材料有限公司 | Low-resistivity single-component conductive silver paste and preparation method thereof |
| CN102010685A (en) * | 2010-12-03 | 2011-04-13 | 烟台德邦科技有限公司 | Epoxy resin conductive adhesive and preparation method thereof |
| CN102086364A (en) * | 2010-12-16 | 2011-06-08 | 广东风华高新科技股份有限公司 | Conductive silver paste for microelectronic packaging and preparation method thereof |
-
2012
- 2012-09-25 CN CN2012103600997A patent/CN102898960A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000080146A (en) * | 1998-09-03 | 2000-03-21 | Asahi Chem Ind Co Ltd | Epoxy resin composition |
| CN1759155A (en) * | 2003-03-18 | 2006-04-12 | 陶氏康宁公司 | A conductive adhesive composition |
| CN101747855A (en) * | 2010-01-18 | 2010-06-23 | 北京海斯迪克新材料有限公司 | Low-resistivity single-component conductive silver paste and preparation method thereof |
| CN102010685A (en) * | 2010-12-03 | 2011-04-13 | 烟台德邦科技有限公司 | Epoxy resin conductive adhesive and preparation method thereof |
| CN102086364A (en) * | 2010-12-16 | 2011-06-08 | 广东风华高新科技股份有限公司 | Conductive silver paste for microelectronic packaging and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 贺曼罗: "《环氧树脂胶粘剂》", 30 April 2004, article "环氧树脂胶粘剂", pages: 1 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103881611A (en) * | 2014-03-10 | 2014-06-25 | 苏州捷德瑞精密机械有限公司 | Normal temperature conductive adhesive and preparation method thereof |
| CN106281170A (en) * | 2016-08-31 | 2017-01-04 | 强新正品（苏州）环保材料科技有限公司 | A kind of conducting resinl for bonding copper alloy element and usage thereof |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130130 |