CN102888205A - Organopolysiloxane packaging adhesive composition - Google Patents
Organopolysiloxane packaging adhesive composition Download PDFInfo
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- CN102888205A CN102888205A CN2012104127680A CN201210412768A CN102888205A CN 102888205 A CN102888205 A CN 102888205A CN 2012104127680 A CN2012104127680 A CN 2012104127680A CN 201210412768 A CN201210412768 A CN 201210412768A CN 102888205 A CN102888205 A CN 102888205A
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- organopolysiloxane
- organic radical
- hydrogen polysiloxanes
- radical hydrogen
- resin
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Abstract
The invention provides an organopolysiloxane packaging adhesive composition. The composition comprises (A) organopolysiloxane resins, (B) organic base hydrogen polysiloxane resins, (C) platinum group metal catalysts and (D) fillers. The refractive index of the organopolysiloxane composition is 1.50-1.55. The composition provided by the invention can effectively distribute fluorescent powder uniformly, simultaneously greatly improve and reduce the color temperature differences of LEDs (light-emitting diodes) and promote the brightness of the packaging materials.
Description
Technical field
The present invention relates to the encapsulation adhesives technical field, relate in particular to a kind of organopolysiloxane encapsulation glue composition with high refractive index, high transmission rate.
Background technology
Present photodiode (light-emitting diode) is in encapsulation process, its fluorescent material is subjected to gravity factor and serious precipitation easily, so that the fluorescent material skewness in the LED package colloid, and then cause colour temperature inhomogeneous and form significantly yellow dizzy or blue dizzy phenomenon.In addition, if fluorescent material directly contacts with chip because precipitation makes it, cause easily then that fluorescent material is bad because dispelling the heat, accumulation of heat makes packing colloid be subject to thermogenesis xanthochromia and catabiosis, and the problems such as Efficiency Decreasing and wastage rate increase.
Moreover, needing silicone gums packaged material specific refractory power is increased to more than 1.5 in order to improve light extraction efficiency, existing Molecular Structure Design is to reach with the kenel of the mixing of straight chain and the coexistence of side chain polymer, the complicated operation of production process is difficult for.
Summary of the invention
The present invention is directed to Shortcomings part in the prior art, a kind of simple in structure and 100% pure silicone encapsulation glue composition that links structure is provided.The said composition fluorescent material that can effectively evenly distribute is realized the requirement of high refractive index equally.
To achieve these goals, the invention provides a kind of organopolysiloxane encapsulation glue composition, the organopolysiloxane encapsulation is with comprising (A) organopolysiloxane resins, (B) organic radical hydrogen polysiloxanes resin, (C) platinum metal catalysts, (D) weighting agent in the glue composition, the specific refractory power of described organopolysiloxane composition is 1.50 ~ 1.55; The side chain that has two above aliphatics unsaturated link(age)s and at least one and the aryl of silicon bonding in the every a part of described (A) organopolysiloxane resins, (B) organic radical hydrogen polysiloxanes resin is the side chain organic radical hydrogen polysiloxanes resin that has the aryl of the hydrogen atom that is connected with Siliciumatom more than two and at least one and silicon bonding in every a part.
Wherein, described aryl is preferably and is selected from phenyl, alkyl-substituted phenyl, naphthyl, alkyl-substituted naphthaline base.Such as phenyl, naphthyl, aminomethyl phenyl, xylyl etc., most preferably be phenyl.
Wherein, described unsaturated link(age) can be alkenyls such as vinyl, allyl group, propenyl, pseudoallyl, butenyl, pentenyl, hexenyl or such as cycloalkenyl groups such as cyclohexenyls, most preferably is vinyl and allyl group.
Wherein, the viscosity of organopolysiloxane resins generally is preferably: be 100 ~ 500000 MPas under 25 ℃, especially be preferably: be 500 ~ 100000 MPas under 25 ℃.
In the preferred embodiment provided by the invention, with respect to the organic group of all and silicon bonding, be no less than 30mol% with the quantity of the aryl of silicon bonding in described (A) organopolysiloxane resins.
Wherein, the viscosity of organic radical hydrogen polysiloxanes resin generally is preferably: be 50 ~ 250000 MPas under 25 ℃, especially be preferably: be 100 ~ 75000 MPas under 25 ℃.
In the preferred embodiment provided by the invention, with respect to the organic group of all and silicon bonding, be no less than 10mol% with the quantity of the aryl of silicon bonding in described (B) organic radical hydrogen polysiloxanes resin.
In the preferred embodiment provided by the invention, the mol ratio of the hydrogen atom that is connected with Siliciumatom in the unsaturated link(age) in described (A) organopolysiloxane resins and (B) organic radical hydrogen polysiloxanes resin is 1
:0.7 ~ 4.0.
In the preferred embodiment provided by the invention, by (A) organopolysiloxane resins with (B) in the resin Composition that organic radical hydrogen polysiloxanes resin forms, (A) weight percent of organopolysiloxane resins is that the weight percent of 5.0 ~ 95.0 wt%, (B) organic radical hydrogen polysiloxanes resin is 5.0 ~ 95.0 wt% in the described organopolysiloxane composition.
In the preferred embodiment provided by the invention, the weight of described (C) platinum metal catalysts is (A) organopolysiloxane resins and (B) 0.1 to 10.0 wt% of the gross weight of organic radical hydrogen polysiloxanes resin.
Wherein, platinum metal catalysts can be platinum group, palladium system, rhodium series catalysts, the available material that the platiniferous such as platinum, platinum black, Platinic chloride are arranged, for example H
2PtCl
6MH
2O, K
2PtCl
6, KHPtCl
6MH
2O, K
2PtCl
4, K
2PtCl
4MH
2O, PtO
2MH
2O(wherein m be 0 or positive integer) etc.
In the preferred embodiment provided by the invention, described (D) weighting agent is any one or a few material that is selected from silicon-dioxide, clay, nano silicon, silica powder, light magnesium oxide, light calcium carbonate, talcum powder and the titanium dioxide.
In the preferred embodiment provided by the invention, the weight of described (D) weighting agent is (A) organopolysiloxane resins and (B) 0.1 ~ 50.0 wt% of the gross weight of organic radical hydrogen polysiloxanes resin.
Organopolysiloxane provided by the invention encapsulation significantly improves simultaneously the color temperature difference problem that reduces photodiode, and promotes the brightness that encapsulates material with the glue composition fluorescent material that can effectively evenly distribute.
Embodiment
The invention provides a kind of organopolysiloxane composition of the fluorescent material that can effectively evenly distribute, significantly improve simultaneously the color temperature difference problem that reduces photodiode, and promote the brightness of encapsulation material.
By the following examples organopolysiloxane encapsulation provided by the invention is described in further detail with glue composition, in order to better understand the content of the invention, but the content of embodiment does not limit the protection domain of the invention.
Organopolysiloxane composition is comprised of (A) organopolysiloxane resins, (B) organic radical hydrogen polysiloxanes resin, (C) platinum metal catalysts, (D) weighting agent etc., and the specific refractory power that forms organopolysiloxane composition is 1.50 ~ 1.55.
The weight percent of (A) organopolysiloxane resins is between 5.0 ~ 95.0 wt% in the organopolysiloxane composition, in the time of the containing quantity not sufficient 5.0 wt% or surpass 95 wt% of (A) organopolysiloxane resins, the incomplete situation of hardening can appear in organopolysiloxane composition.(A) organopolysiloxane resins is the branched organopolysiloxanes resin that every a part has the aryl of two above aliphatics unsaturated link(age)s and at least one and silicon bonding.Unsaturated link(age) can be alkenyls such as vinyl, allyl group, propenyl, pseudoallyl, butenyl, pentenyl, hexenyl or such as cycloalkenyl groups such as cyclohexenyls.Wherein, vinyl and allyl group are best unsaturated link(age).Aryl can be phenyl, tolyl, xylyl and naphthyl etc., and phenyl is best aryl.
(A) in the organopolysiloxane resins with respect to the organic group of all and silicon bonding, be no less than 30mol% with the content of the aryl of silicon bonding, preferred version is for being no less than 40mol%.(A) to be generally under 25 ℃ be 100 ~ 500000 MPas to the viscosity of organopolysiloxane resins, especially take (A) organopolysiloxane resins of 500 ~ 100000 MPas as best.
The weight percent of (B) organic radical hydrogen polysiloxanes resin is 5.0 ~ 95.0 wt% in the organopolysiloxane composition, in the time of the containing quantity not sufficient 5.0 wt% or surpass 95 wt% of (B) organic radical hydrogen polysiloxanes resin, the incomplete situation of hardening can appear in organopolysiloxane composition.(B) consumption of organic radical hydrogen polysiloxanes resin is closely related with the consumption of (A) organopolysiloxane resins, and the mol ratio of the hydrogen atom that (A) is connected with Siliciumatom in the unsaturated link(age) in the organopolysiloxane resins and (B) organic radical hydrogen polysiloxanes resin is 1
:0.7 ~ 4.0, the mol ratio that is more preferably is 1
:0.9 ~ 3.0, highly preferred mol ratio is 1:1.0 ~ 2.0.(B) in the organic radical hydrogen polysiloxanes resin with respect to the organic group of all and silicon bonding, be no less than 10mol% with the content of the aryl of silicon bonding, comparatively preferred content is no less than 20mol%.(B) to be generally under 25 ℃ be 50 ~ 250000 MPas to the viscosity of organic radical hydrogen polysiloxanes resin, especially take (B) organic radical hydrogen polysiloxanes resin of 100 ~ 75000 MPas as best.
The weight of (C) platinum metal catalysts in the organopolysiloxane composition and (A) organopolysiloxane resins and (B) gross weight of organic radical hydrogen polysiloxanes resin sum than between 0.1 to 10.0 wt%.(C) the available material that the platiniferous such as platinum, platinum black, Platinic chloride are arranged of platinum metal catalysts, for example H
2PtCl
6MH
2O, K
2PtCl
6, KHPtCl
6MH
2O, K
2PtCl
4, K
2PtCl
4MH
2O, PtO
2MH
2O(wherein m be 0 or positive integer) etc.Above-mentioned (C) platinum metal catalysts can select the multiple mixing of a kind of independent use or selection to use.
(D) weighting agent is a kind of material in optional freely aerosil (fumed silica), clay (clay), nano silicon (nano-silica), silica powder, light magnesium oxide, light calcium carbonate, talcum powder and the titanium dioxide.The weight of (D) weighting agent in the organopolysiloxane composition and (A) organopolysiloxane resins and (B) gross weight of organic radical hydrogen polysiloxanes resin sum than between 0.1 ~ 50.0 wt%.
Below form embodiment 1 ~ 12 and comparative example's 1 ~ 4 organopolysiloxane composition according to component in each experiment shown in the table 1, afterwards this organopolysiloxane composition is placed the deposited phenomenon of observing fluorescent material in the tapered plastics tubing, and observations is recorded in the table 2.
Each moiety (unit: g) in table 1 organopolysiloxane composition
Table 2 experimental result
| ? | The anti-settling effect | ? | The anti-settling effect | ? | The anti-settling effect |
| Embodiment 1 | Poor | Embodiment 7 | Poor | The comparative example 1 | Poor |
| Embodiment 2 | Good | Embodiment 8 | Can | The comparative example 2 | Poor |
| Embodiment 3 | Good | Embodiment 9 | Can | The comparative example 3 | Poor |
| Embodiment 4 | Poor | Embodiment 10 | Poor | The comparative example 4 | Poor |
| Embodiment 5 | Good | Embodiment 11 | Can | ? | ? |
| Embodiment 6 | Good | Embodiment 12 | Can | ? | ? |
In table 2, be shown as the constituent that " good " refer in the tapered plastics tubing in the anti-settling effect and have equally distributed fluorescent material, deposited phenomenon appears in the fluorescent material that " poor " refers to the interior constituent of tapered plastics tubing, " can " refer to the distribution situation of the interior contained fluorescent material of constituent of tapered plastics tubing between between the two aforementioned.
The organopolysiloxane composition that has better anti-settling effect in the table 2 is used for carrying out PLCC(Plastic Leaded Chip Carrier again, the plastic chip carrier of band lead-in wire, be one of surface attaching type encapsulation) positive light type (Top View) encapsulation, and with itself and commercially available product comparison brightness, observations is recorded in the table 3.
Table 3 brightness contrast result
| ? | Embodiment 2 | Embodiment 3 | Embodiment 5 | Embodiment 6 | Commercially available 1 | Commercially available 2 |
| Brightness (lumen/Lm) | 7.3 | 6.6 | 7.1 | 6.5 | 6.9 | 7.0 |
Show by above-mentioned each experimental data and comparing result, used in the organopolysiloxane composition by encapsulation provided by the invention, by absorb fillers fluorescent material can be distributed in wherein equably, and can effectively reduce the color temperature difference of photodiode and promote the brightness of encapsulation material.Secondly, because fluorescent material is evenly distributed, therefore be difficult for directly contacting with chip, can reduce fluorescent material because of the bad problem that causes its Efficiency Decreasing and wastage rate to increase of dispelling the heat, so encapsulation provided by the invention can also the improving product yield with organopolysiloxane composition.
More than specific embodiments of the invention are described in detail, but it is just as example, the present invention is not restricted to specific embodiment described above.To those skilled in the art, any equivalent modifications that the present invention is carried out and substituting also all among category of the present invention.Therefore, not breaking away from impartial conversion and the modification of doing under the spirit and scope of the present invention, all should contain within the scope of the invention.
Claims (8)
1. an organopolysiloxane encapsulates and uses glue composition, it is characterized in that, organopolysiloxane encapsulation is with including (A) machine polyorganosiloxane resin, (B) organic radical hydrogen polysiloxanes resin, (C) platinum metal catalysts, (D) weighting agent in the glue composition;
The side chain that has the aryl of two above aliphatics unsaturated link(age)s and at least one and silicon bonding in the every a part of described (A) organopolysiloxane resins; Described (B) organic radical hydrogen polysiloxanes resin is the side chain organic radical hydrogen polysiloxanes resin that has the aryl of the hydrogen atom that is connected with Siliciumatom more than two and at least one and silicon bonding in every a part.
2. described composition according to claim 1 is characterized in that, with respect to the organic group of all and silicon bonding, is no less than 30mol% with the quantity of the aryl of silicon bonding in described (A) organopolysiloxane resins.
3. described composition according to claim 1 is characterized in that, with respect to the organic group of all and silicon bonding, is no less than 10mol% with the quantity of the aryl of silicon bonding in described (B) organic radical hydrogen polysiloxanes resin.
4. described composition according to claim 1 is characterized in that, the mol ratio of the hydrogen atom that is connected with Siliciumatom in the unsaturated link(age) in described (A) organopolysiloxane resins and (B) organic radical hydrogen polysiloxanes resin is 1
:0.7 ~ 4.0.
5. described composition according to claim 1, it is characterized in that described (D) weighting agent is any one or a few material that is selected from aerosil, clay, nano silicon, silica powder, light magnesium oxide, light calcium carbonate, talcum powder and the titanium dioxide.
6. described composition according to claim 1, it is characterized in that, by (A) organopolysiloxane resins with (B) in the resin Composition that organic radical hydrogen polysiloxanes resin forms, (A) weight percent of organopolysiloxane resins is that the weight percent of 5.0 ~ 95.0 wt%, (B) organic radical hydrogen polysiloxanes resin is 5.0 ~ 95.0 wt% in the described organopolysiloxane composition.
7. according to claim 1 or 6 described compositions, it is characterized in that the weight of described (C) platinum metal catalysts is (A) organopolysiloxane resins and (B) 0.1 to 10.0 wt% of the gross weight of organic radical hydrogen polysiloxanes resin.
8. according to claim 1 or 6 described compositions, it is characterized in that the weight of described (D) weighting agent is (A) organopolysiloxane resins and (B) 0.1 ~ 50.0 wt% of the gross weight of organic radical hydrogen polysiloxanes resin.
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|---|---|---|---|
| CN2012104127680A CN102888205A (en) | 2012-10-25 | 2012-10-25 | Organopolysiloxane packaging adhesive composition |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104127680A CN102888205A (en) | 2012-10-25 | 2012-10-25 | Organopolysiloxane packaging adhesive composition |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107384535A (en) * | 2017-06-28 | 2017-11-24 | 北京优材百慕航空器材有限公司 | A kind of solid lubricant film and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006249327A (en) * | 2005-03-11 | 2006-09-21 | Shin Etsu Chem Co Ltd | Curable silicone rubber composition and method for producing composite molded product of liquid crystal polymer with silicone rubber |
| CN101787254A (en) * | 2009-10-23 | 2010-07-28 | 中外合资江苏稳润光电有限公司 | Preparation method of white light LED gluewater |
| CN102643627A (en) * | 2012-05-04 | 2012-08-22 | 浙江润禾有机硅新材料有限公司 | Light emitting diode (LED) encapsulation adhesive composition |
-
2012
- 2012-10-25 CN CN2012104127680A patent/CN102888205A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006249327A (en) * | 2005-03-11 | 2006-09-21 | Shin Etsu Chem Co Ltd | Curable silicone rubber composition and method for producing composite molded product of liquid crystal polymer with silicone rubber |
| CN101787254A (en) * | 2009-10-23 | 2010-07-28 | 中外合资江苏稳润光电有限公司 | Preparation method of white light LED gluewater |
| CN102643627A (en) * | 2012-05-04 | 2012-08-22 | 浙江润禾有机硅新材料有限公司 | Light emitting diode (LED) encapsulation adhesive composition |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107384535A (en) * | 2017-06-28 | 2017-11-24 | 北京优材百慕航空器材有限公司 | A kind of solid lubricant film and preparation method thereof |
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