CN102884223B - Plasma treatment device - Google Patents

Abstract

Disclosed is a plasma treatment device which, capable of preventing the condensation inside a nozzle, avoids malfunctions such as short circuits even if the reactive components of the reaction gas tend to condense. A discharge space (13) is formed between the electrodes of an electrode pair (11, 12) of a plasma treatment device (1), and a treated body (9) is irradiated with plasma. A nozzle (20) is disposed near at least one of the pair of electrodes (11, 12) or the discharge space (13). A reaction gas containing a condensing reactive component is sprayed from the nozzle (20) at the treated object (9). The temperature of the nozzle (20) is adjusted by means of a nozzle temperature adjustment means (30). A temperature adjustment path (32) is formed inside the nozzle (20) as the temperature adjustment means (30), and a temperature-regulating fluid is caused to flow through said temperature adjustment path (32). By means of a liquid temperature adjustment unit (31), the temperature-regulating fluid is adjusted so as to be at a temperature higher than the condensing temperature of the reactive component.

Description

Plasma treatment appts

Technical field

The present invention relates to and make reactant gases plasma and the plasma treatment appts contacted with treated object, particularly relate to the temperature regulation structure of the supplying-nozzle of the reactant gases in plasma treatment appts.

Background technology

Such as, in the plasma treatment appts described in patent documentation 1, in the supplying-nozzle of reactant gases, imbed electric heater.By electric heater, supplying-nozzle is heated, and then the temperature of reactant gases is maintained in high temperature.By electric heater, the heating-up time is short, and response is fast.Distribution for powering is simple, and the attendant equipment of operating device etc. is easy.

In the plasma treatment appts of patent documentation 2,3, the leading section of the supplying-nozzle of reactant gases is towards the gap between pair of electrodes.Electric field is applied to above-mentioned gap and carries out plasma treatment.Supplying-nozzle is such as made up of insulating resin.

[look-ahead technique document]

[patent documentation]

[patent documentation 1] Japanese Unexamined Patent Publication 2004-124238 publication (0032, Fig. 4)

[patent documentation 2] Japanese Unexamined Patent Publication 2009-035724 publication

[patent documentation 3] No. WO2009/008284, International Publication (Fig. 5)

[summary of invention]

[inventing the problem that will solve]

The leading section of reactant gases supplying-nozzle be mostly configured in electrode vicinity or to configure towards the mode of interelectrode discharge space.Also be same in this case, if the part that leading section electric heater being configured in distance nozzle is far away, then the possibility of electric heater and electric pole short circuit is little.But, can think and fully cannot heat the leading section of nozzle.If electrode is cooled by cooling body, may be not difficult to be cooled to the leading section of nozzle.If so, reacted constituent in reactant gases is coagulability, namely reacted constituent at room temperature for liquid and be vaporized and formation reaction gas when, may above-mentioned reacted constituent especially condense (condensation) in the inside of its leading section at nozzle.On the other hand, if near leading section electric heater being configured in nozzle, then the insulation distance of electric heater and electrode shortens, there is the possibility producing short circuit.In addition, for electric heater, if thermopair equitemperature sensor experiences failure, then may catch fire because of superheated.If in order to prevent above-mentioned situation by sensor doubleization, then cost improves.

Summary of the invention

The present invention makes in view of the foregoing, and its main purpose is that providing a kind of also can prevent from when the reacted constituent of reactant gases easily condenses, in the inside of nozzle, condensation occurs and the plasma treatment appts can avoiding the unfavorable conditions such as short circuit.

[for solving the means of problem]

In order to solve above-mentioned problem, the present invention is a kind of plasma treatment appts, and it makes the reactant gases of the reacted constituent containing coagulability contact with treated object and irradiate plasma, and the feature of described plasma treatment appts is to possess:

Pair of electrodes, described pair of electrodes formed each other for described plasma irradiate close to atmospheric discharge space;

Nozzle, the leading section with ejiction opening of this nozzle is made up of isolator, and near the described leading section at least one party that is configured in described pair of electrodes or described discharge space, makes described reactant gases spray to described treated object from described ejiction opening;

Nozzle temperature regulating mechanism, it regulates the temperature of described nozzle,

Described nozzle temperature regulating mechanism comprises: temperature regulates path, and it is formed on described nozzle and passes through for temperature regulator solution; Liquid temperature adjusting portion, it configures in the mode be separated from described electrode and described nozzle, and the temperature of described temperature regulator solution is adjusted to the high temperature higher than the coagulation temperature of the reacted constituent in described reactant gases; Pipeline, described liquid temperature adjusting portion and described temperature regulate path to link by it.

Undertaken flowing in the temperature adjustment path of thermoregulator temperature regulator solution in nozzle by liquid temperature adjusting portion.Thereby, it is possible to the temperature of nozzle is adjusted to the high temperature higher than the coagulation temperature of the reacted constituent in reactant gases.Temperature regulates the possibility of the temperature regulator solution in path and electric pole short circuit little.Therefore, be configured at the spray nozzle front end portion near electrode or discharge space also can formation temperature regulate path.Thereby, it is possible to reacted constituent is reliably sprayed from nozzle with the state of gas.Thereby, it is possible to carry out the surface treatment of treated object well, thus treatment effect can be improved.Without the need to arranging electric heater and the subsidiary electrical system that it is arranged on nozzle, easily carry out the electric leakage tackling self-electrode.Even if leak electricity from electrode, also can reduce institute's leakage current and transmit in temperature regulator solution and the possibility destroying the unfavorable conditions such as the electrical system of liquid temperature adjusting portion.Even if unfavorable conditions such as the Controlling System that liquid temperature adjusting portion occurs are destroyed, temperature regulator solution almost also can not be heated to more than boiling point, and the possibility that thermal runaway occurs is little.Thus, even if reactant gases contains combustible component, the possibility of catching fire also can be avoided.Without the need to arranging dual control system in order to safety, thus can the increase of suppression equipment cost.

Preferred described temperature regulator solution is insulativity.The electric conductivity of described temperature regulator solution is preferably 50 below μ S/cm, is more preferably 30 below μ S/cm, and then is preferably 10 below μ S/cm.

Thereby, it is possible to reliably prevent the short circuit from the temperature regulator solution in the electric leakage Vent of the temperature regulator solution in the temperature adjustment path of nozzle and the temperature adjustment path of nozzle and electrode.

Such as, also can be configured to, described treated object is continuous print film, and at least one party in described pair of electrodes is wrapping with described treated object and carries out the cylinder electrode that rotates, described nozzle and described cylinder electrode close.And then described nozzle also can towards described discharge space.Plasma treatment appts can also possess film temperature regulating mechanism, and the temperature of the temperature of described cylinder electrode and described treated object is adjusted to the low temperature lower than described coagulation temperature by this film temperature regulating mechanism.

When reactant gases contacts with the treated object on cylinder electrode, reacted constituent can be made to be attached on treated object at the condense on surfaces of treated object.Thereby, it is possible to reliably make the surface molecular of reacted constituent and treated object react.

Nozzle is taken by force heat by the cylinder electrode near it, regulates path, thus reliably nozzle is maintained in high temperature by temperature regulator solution by temperature.The outer peripheral portion close to nozzle of cylinder electrode is taken heat by force from nozzle and is heated, but it leaves nozzle because of rotation, so heating is for the moment.Therefore, it is possible to electrode is maintained in low temperature, and then treated object is maintained in low temperature.Therefore, it is possible to make reacted constituent reliably condense on treated object and make it adhere to, reliably processing reaction can be there is.

When described nozzle extends along such as orthogonal with the throughput direction of described treated object process width, preferred described temperature regulates path to be set to the other end (the second end) from an end (first end) of the described process width of described nozzle.Thereby, it is possible to carry out temperature adjustment throughout roughly total length without omission to nozzle.At this, described first end comprises the first end face of the length direction of described nozzle and neighbouring part thereof.Described the second end comprises the second end face of the opposition side of described first end face of the length direction of described nozzle and neighbouring part thereof.Described temperature regulates the entry ports in path also can be arranged on first, second end face described of described nozzle, also can be arranged on the side of the neighbouring part of first, second end face described of described nozzle.

Preferably, described nozzle is provided with make reactant gases process width on homodisperse dispersion path.

Preferably, described electrode extends along described process width.The axis of preferred described cylinder electrode is towards described process width.

Also can be configured to, described temperature regulates path to comprise temperature and regulates outlet (upstream path) and temperature regulating circuit (path downstream), described temperature regulates outlet to make described temperature regulator solution towards a direction flowing of the length direction (process width) of described nozzle, described temperature regulating circuit makes described temperature regulator solution flow towards the reverse direction in a described direction, and described temperature regulates the downstream end in outlet to be connected by road of turning back (access path) with the upstream extremity of described temperature regulating circuit.

In this case, temperature regulator solution is while regulate in outlet along the length direction flowing of nozzle while heat to nozzle in temperature, then turned back by road of turning back, in temperature regulating circuit, regulate the reversed flow in outlet while heat to nozzle along temperature.Temperature regulator solution along with flowing with nozzle heat exchange, temperature reduces gradually thus.Therefore, no matter how the position of the length direction of nozzle can both heat substantially uniformly.Thus, even if the length of nozzle is large, also temperature adjustment can be carried out to nozzle-integrated roughly equably.

Preferably, described temperature regulates path to possess upstream path, path downstream and access path, described upstream path comprises and is configured to highly identical each other and supplies described temperature regulator solution according to the first upstream path part of each partial-flow respectively, second upstream path part, described path downstream is configured in the position higher than described upstream path, downward-extension on described access path, the bottom of this access path is connected with described upstream path, and this upper end is connected with described path downstream, described temperature regulator solution is according to described upstream path, described access path, the sequential flowing of described path downstream.

According to this structure, first temperature regulator solution is imported into the upstream path of the lower in the upstream path of lower and the path downstream of eminence.Therefore, temperature regulator solution flows through the first upstream path part of upstream path and the entirety of the second upstream path part, and temperature regulator solution rises in access path, and is imported into the path downstream of eminence.Thereby, it is possible to temperature regulator solution carries out situation about flowing under preventing the state of either party in first, second upstream path part of being partial in temperature adjustment path.Consequently, reliably temperature adjustment can be carried out in nozzle in the larger context.

Preferably, described upstream path comprises the branch being branched off into described first upstream path part and described second upstream path part.By making upstream path be positioned at lower, thus temperature regulator solution reliably can be made from branch to each shunting first, second upstream path part, can reliably make this two side of first, second upstream path part be full of by temperature regulator solution.

Also can be configured to, described path downstream comprises and is configured to highly identical each other and supplies described temperature regulator solution according to the first downstream path section, second downstream path section of each partial-flow respectively.Described access path comprises the first connection path part described first upstream path part be connected with described first downstream path section, the second access path part described second upstream path part be connected with described second downstream path section.The temperature regulator solution flowing through the first upstream side part is sent to the first downstream path section via first connection path part.The temperature regulator solution flowing through the second upstream side part is sent to the second downstream path section via the second access path part.As mentioned above, also flow in the second upstream path part because temperature regulator solution can reliably both flow in the first upstream path part, also flow in the second downstream path section therefore, it is possible to reliably make temperature regulator solution both flow in the first downstream path section.Consequently, temperature adjustment can be carried out in nozzle in the larger context.

Preferably, described path downstream comprises the fluidic junction that described first downstream path section and described second downstream path section converge.Thus, the temperature regulator solution flowing through the first downstream path section and the temperature flowing through the second downstream path section regulate path to be converged by fluidic junction.

Also can be configured to, the downstream end of first, second upstream path part described is converged each other and is connected with the bottom (upstream extremity) of described access path, can also be configured to, first, second downstream path section described is from upper end (downstream end) branch of described access path.

Preferably, when described nozzle extends along the process width orthogonal with the throughput direction of described treated object, first, second upstream path part described mutually arranges along in the orientation orthogonal with described process width and extends along described process width respectively.More preferably, first, second upstream path part described is formed into the second end from the first end of the described process width of described nozzle.Thereby, it is possible to carry out temperature adjustment to described nozzle in the larger context.Preferably, described process width and described orientation are towards level.

Preferably, described branch comprises the branch path extended along described orientation.Preferably, described branch is arranged on first end or the second end of described nozzle.

Preferably, first, second downstream path section described mutually arranges along described orientation and extends respectively on described process width.Preferably, first, second downstream path section described is formed into the second end from the first end of the described process width of described nozzle.

Preferably, described fluidic junction comprise extend along described orientation converge path.Preferably, described fluidic junction is arranged on first end or the second end of described nozzle.

Preferably, described surface treatment is carried out at approximately atmospheric pressure.At this, refer to 1.013 × 10 close to normal atmosphere ⁴~ 50.663 × 10 ⁴the scope of Pa, if consider the facilitation of pressure adjusting and the simplification of apparatus structure, is preferably 1.333 × 10 ⁴~ 10.664 × 10 ⁴pa, more preferably 9.331 × 10 ⁴~ ~ 10.397 × 10 ⁴pa.

The present invention is suitable for the process of the optical resin film of difficult cementability, when the optical resin film of this difficult cementability is bonding to the optical resin film of easy-adhesion, is suitable for the cementability of the optical resin film improving difficult cementability.

As the main component of the optical resin film of described difficult cementability, such as, can enumerate cellulosetri-acetate (TAC), polypropylene (PP), polyethylene (PE), cycloolefine polymer (COP), cyclenes copolymer (COC), polyethylene terephthalate (PET), polymethylmethacrylate (PMMA), polyimide (PI) etc.

As the main component of the optical resin film of described easy-adhesion, such as, can enumerate polyvinyl alcohol (PVA), ethylene vinyl acetate copolymer (EVA) etc.

In the surface treatment etc. of the cementability of the optical resin film for improving described difficult cementability, preferably use polymerizable monomer as described reacted constituent.

As described polymerizable monomer, the monomer of the functional group with unsaturated link(age) and regulation can be enumerated.The functional group of regulation preferably selects from the ester group of hydroxyl, carboxyl, ethanoyl, glycidyl, epoxy group(ing), carbon number 1 ~ 10, sulfuryl, aldehyde radical, the especially preferably hydrophilic group such as carboxyl, hydroxyl.

Methacrylic acid glycol ester, vinyl carbinol, hydroxyethyl methylacrylate etc. can be enumerated as the monomer with unsaturated link(age) and hydroxyl.

Vinylformic acid, methacrylic acid can be enumerated, methylene-succinic acid, toxilic acid, 2-methacryloyl propionic acid etc. as the monomer with unsaturated link(age) and carboxyl.

Vinyl acetate etc. can be enumerated as the monomer with unsaturated link(age) and ethanoyl.

Glycidyl methacrylate etc. can be enumerated as the monomer with unsaturated link(age) and glycidyl.

Methyl acrylate, ethyl propenoate, butyl acrylate, tert-butyl acrylate, 2-EHA, Octyl acrylate, methyl methacrylate, β-dimethyl-aminoethylmethacrylate, butyl methacrylate, Tert-butyl Methacrylate, isopropyl methacrylate, 2 ethyl methacrylate etc. can be enumerated as the monomer with unsaturated link(age) and ester group.

Propenal, crotonic aldehyde etc. can be enumerated as the monomer with unsaturated link(age) and aldehyde radical.

Preferably, described polymerizable monomer is the monomer with ethylenic unsaturated double-bond and carboxyl.Vinylformic acid (CH can be enumerated as described monomer ₂=CHCOOH), methacrylic acid (CH ₂=C (CH ₃) COOH).Described polymerizable monomer is preferably acrylic or methacrylic acid.Thereby, it is possible to reliably improve the cementability of difficult adhesive resin film.Described polymerizable monomer is more preferably vinylformic acid.

Described polymerizable monomer also can be carried by current-carrying gas.Current-carrying gas is preferably selected from the rare gas elementes such as nitrogen, argon, helium.From the viewpoint of economy, preferably use nitrogen as current-carrying gas.

The polymerizable monomer such as vinylformic acid, methacrylic acid is liquid phase mostly at normal temperatures and pressures.It is preferably made to gasify in the current-carrying gas such as rare gas element for such polymerizable monomer.The method gasified in current-carrying gas as making polymerizable monomer, can enumerate the method utilizing current-carrying gas to be extruded by the saturated vapo(u)r on the liquid level of polymerizable monomer liquid, the method in polymerizable monomer liquid, current-carrying gas being bubbled, heated polymerizable monomer liquid and the method etc. that promotes it to evaporate.Also can be used together and extrude and heat or and use foaming and heating.

When being vaporized as heating, consider the burden of well heater, preferred polymeric monomer selection boiling point is the polymerizable monomer of less than 300 DEG C.In addition, polymerizable monomer preferably selects the material that can not decompose (chemical transformation) because of heating.

[invention effect]

According to the present invention, can prevent the reacted constituent in reactant gases from condensing in nozzle.Even if nozzle arrangement is in interelectrode electric field, also electrical resistance obstacles such as being short-circuited can be avoided.

Accompanying drawing explanation

Fig. 1 is the stereographic map of the plasma treatment appts schematically shown involved by the first embodiment of the present invention.

Fig. 2 is the stereographic map of the plasma treatment appts schematically shown involved by the second embodiment of the present invention.

Fig. 3 is the side sectional view of the nozzle involved by the 3rd embodiment of the present invention.

Fig. 4 is the stereographic map of the plasma treatment appts schematically shown involved by the 4th embodiment of the present invention.

Fig. 5 is the stereographic map of the plasma treatment appts schematically shown involved by the 5th embodiment of the present invention.

Embodiment

Below, with reference to the accompanying drawings embodiments of the present invention are described.Fig. 1 is the figure representing the first embodiment of the present invention.The treated object 9 of present embodiment is made up of continuous print resin molding.Processed film 9 is such as the protective membrane of polarization plates.Protective membrane 9 contains cellulosetri-acetate (TAC) as main component.The composition of film 9 is not limited to TAC, also can be polypropylene (PP), polyethylene (PE), cycloolefine polymer (COP), cyclenes copolymer COC), polyethylene terephthalate (PET), polymethylmethacrylate (PMMA), polyimide (PI) etc.The thickness of film 9 is such as about 100 μm.

Said protection film 9 and the polarizing coating be made up of PVA film by adhesive bonds, thus form polarization plates.The water system caking agents such as the PVA aqueous solution can be used as caking agent.Before bonding process, carry out surface treatment by plasma treatment appts 1 pair of protective membrane 9, improve the cementability of protective membrane 9.

As shown in Figure 1, plasma treatment appts 1 possesses electrode 11,12 and nozzle 20.Electrode 11,12 is all consisted of the roller electrode of drum.Roller electrode 11,12 is arranged in parallel to each other.Below, the direction of the axis along electrode 11,12 is suitably called " process width ".The direction (direction orthogonal with process width) of electrode 11,12 mutual arrangement is called " orientation ".Process width and orientation are level, but are not limited to this.Narrow gap 13 is formed each other at roller electrode 11,12.A side in pair of electrodes 11,12 is connected with power supply (omit and illustrate).The electrode of the opposing party electrical ground.Electric power wavy for such as pulse supplies to electrode 11,12 by power supply.Thus, apply electric field each other in pair of electrodes 11,12, and generate plasma at pressures close to atmospheric pressure in gap 13, gap 13 becomes close to atmospheric discharge space.

The processed film 9 of continuous sheet makes its width towards the axis (process width) of electrode 11,12, and be wrapping with half cycle on the side face of the upside of roller electrode 11,12 about.Processed film 9 leads to discharge space 13 along the side face of roller electrode 11,12, hangs down and turn back under the effect of guide reel 14 from discharge space 13.Roller electrode 11,12 respectively around respective axis and synchronously with one another to same direction () rotation in Fig. 1 clockwise.Thus, processed film 9 is carried from roller electrode 11 to roller electrode 12.

Roller electrode 11,12 is incorporated with film temperature regulating mechanism 3.In the electrode that film temperature regulating mechanism 3 comprises the inside being such as formed in roller electrode 11,12, temperature regulates path 3a.Water equitemperature after being regulated by temperature regulates medium to lead to temperature and regulates path 3a.Thus, the temperature of electrode 11,12 and the temperature of processed film 9 that connects with this electrode 11,12 are adjusted to as the low temperature lower than the coagulation temperature of the reacted constituent in aftermentioned reactant gases.

The position of side more top than roller electrode 11,12 discharge space 13 to each other configures nozzle 20.At least lower portion (fore-end of emission direction) of nozzle 20 is made up of resin, and it has insulativity.Nozzle 20 is formed as the strip extending long along process width.The length along process width of nozzle 20 is roughly equal or larger than above-mentioned axial length with the axial length of roller electrode 11,12.It is roughly the same position that the both ends of nozzle 20 to be configured at the end of the same side of roller electrode 11,12 respectively processing on width.The cross section orthogonal with its bearing of trend of nozzle 20 is along with downward and front end attenuates.The position narrowed gradually between roller electrode 11,12 is inserted in the bottom (leading section) of nozzle 20, and towards the upper end of discharge space 13.

Ejection path 21 is formed in the inside of nozzle 20.The upstream extremity in ejection path 21 is connected with reacting gas source 2 via feed path 2a.Ejection path 21 comprises the reactant gases homodisperse dispersion path 22 on process width made from feed path 2a.The front end in ejection path 21 arrives the lower surface (front end face) of nozzle 20, thus forms ejiction opening 23.The leading section of nozzle 20 has ejiction opening 23.

Reactant gases comprises the reacted constituent of liquid under room temperature (15 DEG C ~ about 25 DEG C).Such as polymerizable monomer can be enumerated as such reacted constituent.At this, vinylformic acid AA can be used as the reacted constituent be made up of polymerizable monomer.Vinylformic acid steam has combustibility (explosivity).

Reactant gases is generated by reacting gas source 2.Reacting gas source 2 is made up of gasifier.Contain the vinylformic acid of reacted constituent with the state of liquid in gasifier 2.Gasifier 2 is provided with well heater (omitting diagram), by the acrylic acid temperature of this well heater regulates liquid.As current-carrying gas, nitrogen (N ₂) be imported in gasifier.Vinylformic acid is made to gasify and be mixed into this current-carrying gas (N ₂) in, formation reaction gas (vinylformic acid AA+N thus ₂).Current-carrying gas can be directed to the upside of the liquid level of the liquid propene acid in gasifier, also can import to the inside of liquid propene acid and bubble.A part for current-carrying gas can also be imported gasifier, remainder does not lead to gasifier, and makes an above-mentioned part for current-carrying gas and remainder converge in the downstream side of gasifier.According to the partition ratio of the temperature of liquid propene acid, an above-mentioned part for current-carrying gas and remainder, the acrylic acid concentration in reactant gases can be regulated.

Reacting gas source 2 is connected by reactant gases feed path 2a with nozzle 20.Feed path 2a is made up of resin hose, omits the diagram that it is detailed.This resin hose is wound with strip heater (feed path thermoregulation mechanism).Strip heater is arranged throughout the total length of feed path 2a.

Also can make a part of feed path 2a or whole utilization metal tube and replace resin hose.

And then plasma treatment appts 1 possesses nozzle temperature regulating mechanism 30.In the nozzle that nozzle temperature regulating mechanism 30 comprises liquid temperature adjusting portion 31, be formed on nozzle 20, temperature regulates path 32, links the pipeline 33,34 that described liquid temperature adjusting portion 31 and temperature regulate path 32.Temperature regulator solution is according to liquid temperature adjusting portion 31, the sequential loop of going to canal path 33, temperature adjustment path 32, return pipe path 34.

Liquid temperature adjusting portion 31 configures in the mode be separated from roller electrode 11,12 and nozzle 20.Liquid temperature adjusting portion 31 regulates the temperature of temperature regulator solution.

Specifically, liquid temperature adjusting portion 31 comprises liquid temperature configuration part 31a, liquid storage portion 31b, liquid temperature sensor 31c, liquid heat portion 31d and control part 31e.Liquid temperature configuration part 31a is made up of contact panel, driver plate etc., the design temperature of the expectation of its input temp regulator solution.The design temperature of temperature regulator solution is the high temperature higher than the coagulation temperature of the reacted constituent in above-mentioned reactant gases.Liquid storage portion 31b is the space of collecting temperature regulator solution, and can be box like, also can be tubulose.The temperature of the temperature regulator solution in liquid temperature sensor 31c tracer liquid resettlement section 31b.Liquid temperature sensor 31c also can replace the temperature regulator solution in the 31b of tracer liquid resettlement section and detect the temperature of the temperature regulator solution in canal path 33 or return pipe path 34.Or liquid temperature sensor 31c also detected temperatures can regulate the temperature of the temperature regulator solution in path 32, and then also can detect the temperature of nozzle 20 self.Liquid heat portion 31d is made up of heat exchanger, electrothermal heater etc., heats to the temperature regulator solution in liquid storage portion 31b.Control part 31e take minicomputer as representative, comprise the driving circuit etc. in the conversion process of the input signal from liquid temperature sensor 31c, liquid heat portion, it controls liquid heat portion 31d according to the temperature detection value based on liquid temperature sensor 31c in the mode making the temperature of temperature regulator solution become the temperature set at liquid temperature configuration part 31a.

Canal path 33 is connected with in the outlet port of liquid storage portion 31d.Canal path 33 is gone to extend to an end (first end is lower left quarter in FIG) of the length direction of nozzle 20.Preferably remove being made up of resin (insulating material) at least partially of canal path 33.Preferably, go the part close to nozzle 20 of canal path 33 and be made up of resin (insulating material) close to the part of electrode 11,12.Going canal path 33 is provided with liquid-feeding pump 37.Liquid-feeding pump 37 also can be arranged on return pipe path 34, also can be arranged on the inside of liquid temperature adjusting portion 31.Dispenser 35 is provided with near the first end of nozzle 20.In dispenser 35, canal path 33 is gone to be branched off into multiple (in figure, being 2).

The temperature being formed with multiple (in figure being 2) in the inside of nozzle 20 regulates path 32.At least 1 temperature regulates path 32 to be configured in the part of (front) as far as possible on the lower of nozzle 20.Each temperature regulates path 32 throughout the extension endlong of the length direction (process width) of nozzle 20.Each temperature regulates an end in path 32 (first end, be lower left quarter in FIG) to arrive an end face (the first end face) of nozzle 20, and with above-mentioned branch go in canal path 33 one to be connected.

Each temperature regulates the other end in path 32 (being upper right quarter in the second end, Fig. 1) to arrive the other end (the second end face) of nozzle 20.The second end in path 32 is regulated to be connected with return pipe path 34 respectively in described temperature.Preferred return pipe path 34 at least close to the part of nozzle 20 and be made up of resin (insulating material) close to the part of electrode 11,12.Fluidic junction 36 is provided with near the second end of nozzle 20.Multiple return pipe path 34 is converged in fluidic junction 36.1 return pipe path 34 after converging from fluidic junction 36 extends to liquid temperature adjusting portion 31.The leading section in return pipe path 34 is connected with the ingress port of liquid storage portion 31d.

Arrange along orientation 2 temperature regulate path 32,32 to be communicated with each other by ejection path 21, and it illustrates omission in detail.

Water can be used as temperature regulator solution.Especially, pure water or the ion exchanged water of insulativity can be used as temperature regulator solution.The electric conductivity of temperature regulator solution is enough less than the electric conductivity (100 μ about S/cm) of common tap water, is preferably 50 below μ S/cm, is more preferably 30 below μ S/cm, and then is preferably 10 below μ S/cm.At this, use as temperature regulator solution and utilize the conductivity tester of μ S/cm magnitude to be determined as pure water or the ion exchanged water of 0 μ S/cm.When using ion exchanged water as temperature regulator solution, preferably going canal path 33 or return pipe path 34 arrange ion-exchange filter 38 to maintain electrical insulating property.

Illustrate, by the plasma treatment appts 1 of said structure, surface-treated method is carried out to processed film 9.

Processed film 9 is wrapping with on roller electrode 11,12 and guide reel 14.

Roller electrode 11,12 is rotated to clockwise direction in Fig. 1, and the film 9 that will be processed is towards roughly dextrad conveying.

Supply electric power from power supply (omitting diagram) to electrode 11,12, between electrode 11,12, apply electric field, generate close to atmospheric plasma discharge in gap 13.

In gasifier 2, make vinylformic acid (AA) at current-carrying gas (N ₂) middle gasification, formation reaction gas (AA+N ₂).The temperature of the liquid propene acid in gasifier 2 is such as adjusted to 40 DEG C ~ 100 DEG C.Above-mentioned reactant gases is sent to gas supplying path 2a from gasifier 2.By the strip heater (feed path thermoregulation mechanism) be arranged on gas supplying path 2a, the temperature of gas supplying path 2a is maintained in the high temperature higher than the acrylic acid coagulation temperature in above-mentioned reactant gases.Such as, the temperature of feed path 2a is adjusted to 40 DEG C ~ 200 DEG C.

By above-mentioned reactant gases (AA+N ₂) import from gas supplying path 2a to the ejection path 21 of nozzle 20.Reactant gases is disperseed on the length direction (process width) of nozzle 20 equably by the dispersion path 22 in this ejection path 21, and spray to discharge space 13 from the ejection 23 of the lower end of nozzle 20, thus spray to the processed film 9 in discharge space 13.This discharging jet becomes equally distributed air-flow on process width.

By the low temperature that film temperature regulating mechanism 3 makes the temperature of roller electrode 11,12 and the temperature of processed film 9 become lower than the acrylic acid coagulation temperature in above-mentioned reactant gases.Such as, the temperature of processed film 9 is adjusted to 15 DEG C ~ 30 DEG C.Thus, when reactant gases contacts with processed film 9, the vinylformic acid in reactant gases condenses and is attached on processed film 9.This vinylformic acid is activated by the plasma of discharge space 13, and double linked cracking, polymerization etc. occur.Nitrogen in reactant gases in discharge space 13 in by plasma (comprise excite, activate, free radical (radical) change, ionization etc.).This nitrogen plasma or plasma light are irradiated on processed film 9, C-C, C-O, C-H of the surface molecular of processed film 9 etc. are combined and cut off.Can think at this in conjunction with cutting portion combination (graft polymerization) acrylic acid polymkeric substance, or combine the COOH base etc. decomposed from vinylformic acid.Thus, cementability promoting layer is formed on the surface of processed film 9.

And then, by nozzle temperature regulating mechanism 30, the temperature of nozzle 20 is adjusted to the high temperature higher than the acrylic acid coagulation temperature in above-mentioned reactant gases.Such as, the temperature of nozzle 20 is adjusted to 40 DEG C ~ 200 DEG C.

If describe in detail, be pre-enter the design temperature of nozzle 20 at the liquid temperature configuration part 31a of liquid temperature adjusting portion 31.Drive liquid-feeding pump 37, make the temperature regulator solution of nozzle temperature regulating mechanism 30 (pure water or ion exchanged water) according to liquid storage portion 31b, go canal path 33, temperature to regulate the sequential loop in path 32, return pipe path 34.By the temperature of liquid temperature sensor 31c detected temperatures regulator solution.According to this temperature detection signal, control part 31e controls liquid heat portion 31d, and regulates in the mode making temperature regulator solution become design temperature.Temperature regulator solution after being regulated by temperature is via going canal path 33 and distribute road 35 to regulate path 32 to import to each temperature of nozzle 20.This temperature regulator solution regulates the length direction along nozzle 20 in path 32 to flow in temperature.Thus, can heat to nozzle 20 and become the high temperature higher than the coagulation temperature of aforesaid propylene acid.

The upper limit of the design temperature of temperature regulator solution and nozzle 20 is set as below acrylic acid limits of explosion.Acrylic acid detonation point changes according to oxygen concn.

Because temperature regulates at least 1 of path 32 to be configured near the leading section of nozzle 20, therefore, it is possible to reliably make the high temperature that the leading section of nozzle 20 becomes higher than the coagulation temperature of aforesaid propylene acid.Even if roller electrode 11,12 is cooled, also the leading section of the nozzle 20 near it reliably can be maintained in the high temperature higher than the coagulation temperature of aforesaid propylene acid.Thereby, it is possible to prevent the vinylformic acid (reacted constituent) in the reactant gases of especially its front end in nozzle 20 from condensing.Thereby, it is possible to make vinylformic acid reliably spray with the ejiction opening 23 of the state of gas from the front end of nozzle 20, processed film 9 can be sprayed onto equably.Thereby, it is possible to guarantee the homogeneity processed, process quality can be improved.In addition, can prevent or suppress the blocking spraying path 21.

Even if temperature regulate path 32 be configured near roller electrode 11,12, but due to temperature regulator solution be insulativity, therefore can not there is electrical short in temperature regulator solution and electrode 11,12.Thereby, it is possible to avoid in temperature regulator solution conduction and destroy control part 31e and the liquid temperature sensor 31c of liquid temperature adjusting portion 31.Even if reactant gases contains the combustible components such as vinylformic acid, also can avoid because of electric leakage cause catch fire wait exception.

Because can measure at a distance and the temperature of Control Nozzle 20, therefore without the need to setting thermopair equitemperature sensor at nozzle 20.

Even if break down in the Controlling System of nozzle temperature regulating mechanism 30, nozzle 20 is also heated to more than the boiling point (100 DEG C) of temperature regulator solution (water) hardly.Therefore, without the need to arranging dual Controlling System in order to safety, can the increase of suppression equipment cost.

Because temperature regulator solution is water (pure water or ion exchanged water etc.), therefore, it is possible to reliably the equipment cost of nozzle temperature regulating mechanism 30 is suppressed low.

It should be noted that, in order to the electrical insulating property of holding temperature regulator solution, preferably periodic replacement temperature regulator solution.

By making polarization plates by bonding for the polarizing coating that forms with by PVA film etc. of processed film 9 after process.The water system caking agents such as the PVA aqueous solution are used as caking agent.Owing to being improved the cementability of processed film 9 in advance by above-mentioned surface treatment, therefore, it is possible to obtain the polarization plates with sufficient bonding strength.

Next, other embodiments of the present invention are described.In the following embodiments, for the content repeated with already described embodiment, mark same symbol in the accompanying drawings and omit the description.

Fig. 2 is the figure of the plasma treatment appts 1A represented involved by the second embodiment of the present invention.Device 1A is the device for the treatment of the wide processed film 9 of device 1 (Fig. 1) width than the first embodiment, compared with the first embodiment, and roller electrode 11,12 and nozzle 20 length on process width.In the inside of nozzle 20, multiple temperature of thermoregulation mechanism 30 regulate path 32A to be formed in the mode be separated from each other up and down.In fig. 2,1 temperature only illustrating the front (downside) of nozzle 20 regulates path 32A.Each temperature regulates path 32A to comprise temperature and regulates outlet 321 (upstream path) and temperature regulating circuit (path downstream) 322.Temperature regulates outlet 321 and temperature regulating circuit 322 all to extend on nozzle 20.Each temperature regulates the temperature of path 32A to regulate outlet 321 and the equal height place of temperature regulating circuit 322 in nozzle 20 to be arranged along orientation.At the first end (lower left quarter of Fig. 2) of nozzle 20, temperature regulates outlet 321 to be connected with going canal path 33 via fluidic junction 36 (omitting diagram).At the second end (upper right quarter of Fig. 2) of nozzle 20, temperature regulates outlet 321 and temperature regulating circuit 322 to be linked by road 323 (access path) of turning back.At the first end (lower left quarter of Fig. 2) of nozzle 20, the downstream end of temperature regulating circuit 322 is connected with return pipe path 34 via fluidic junction 36 (omitting diagram).Temperature regulates between outlet 321 and temperature regulating circuit 322 and is communicated with by ejection path 21, and its detailed diagram is omitted.

The temperature that temperature regulator solution is imported into through past canal path 33 in nozzle 20 successively from liquid temperature adjusting portion 31 regulates outlet 321, thus flows along the length direction (process width) of nozzle 20 to from first end towards the second end direction (upper right of Fig. 2).In this process, nozzle 20 is heated.Then, temperature regulator solution is transported to temperature regulating circuit 322 via road 323 of turning back, and flows to the opposite direction (lower-left of Fig. 2) in an above-mentioned direction along the length direction (process width) of nozzle 20 from the second end towards first end.In this process, nozzle 20 is heated further.Temperature regulator solution is along with flowing and the heat exchange of nozzle 20, thus its temperature reduces gradually.Thus, regardless of the position of the length direction of nozzle 20, can both heat substantially uniformly.Therefore, even if the length of nozzle 20 is large, also on length direction (process width), temperature adjustment can be carried out to nozzle 20 entirety roughly equably.Then, temperature regulator solution returns liquid temperature adjusting portion 31 via return pipe path 34.

Fig. 3 is the figure representing the 3rd embodiment of the present invention.This embodiment relates to the concrete form of nozzle 20.The part 24 of the upside (base end side of emission direction) of nozzle 20 is made up of metal, and the part 25 of downside (front of emission direction) is made up of the resin of insulativity.Nozzle cardinal extremity part 24, from discharge space 13 relative separation, is subject to the electric field action between electrode 11,12 hardly.This nozzle cardinal extremity part 24 links with pallet 5 and is supported.The part narrowed gradually between fore-end 25 electrode insertion 11,12 comprising ejiction opening 23 of nozzle 20 towards discharge space 13.The side of the part that the front end of spray nozzle front end part 25 attenuates is formed as the local cylinder concave surface of the side face of the roller electrode 11,12 along correspondence.In the inside of nozzle 20, multiple temperature regulates path 32 to be arranged to vacate interval up and down and to clip ejection path 21 in the mode that the opposed direction of electrode 11,12 is paired.

Fig. 4 is the figure of the plasma treatment appts 1B represented involved by the 4th embodiment of the present invention.In this device 1B, the reaction gas nozzle 20B of ejection reactant gases configures in the mode be separated to the upstream side of the sense of rotation of roller electrode 11 from discharge space 13.The front end face (lower surface) of nozzle 20 is opposed with the side face of the upside of roller electrode 11, and configures close to roller electrode 11.The cross section orthogonal with process width of nozzle 20B is formed as roughly tetragon.The temperature being formed with nozzle temperature regulating mechanism 30 in nozzle 20B regulates path 32 this point identical with the first embodiment.

Between pair of rolls electrode 11,12, be configured with discharging generating gas body nozzle 41 in the mode clipping discharge space 13 in upside and be configured with discharging generating gas body nozzle 42 in downside.Discharging generating gas body nozzle 41,42 is formed as the structure self put upside down.Each discharging generating gas body nozzle 41 and 42 extends along process width.The front end face of each discharging generating gas body nozzle 41,42 is to discharge space 13.The feed path 43 of discharging generating gas body is connected with discharging generating gas body nozzle 41,42 respectively.

Nitrogen (N is used as discharging generating gas body ₂).Discharging generating gas body is not containing polymerizable monomer.

It should be noted that, discharging generating gas body is not limited to nitrogen, also can use the rare gas such as argon, helium.

In the 4th embodiment, by reactant gases (vinylformic acid+N ₂) to be sprayed onto the side face of the upside of roller electrode 11 processed film 9 from the ejiction opening 23 of the lower surface of nozzle 20B on.The temperature regulator solution of nozzle temperature regulating mechanism 30 is made to circulate and carry out temperature adjustment to nozzle 20B.Thus, same with the first embodiment, also can make the high temperature that the temperature of nozzle 20B becomes higher than the acrylic acid coagulation temperature in reactant gases.Even if roller electrode 11 regulates path 3a to be cooled by temperature, also reliably the fore-end (lower portion) of the nozzle 20B near this roller electrode 11 can be maintained in high temperature.Thereby, it is possible to vinylformic acid is sprayed when or not condensing in nozzle 20B.Vinylformic acid condenses at the processed film 9 of low temperature and is attached on the surface of processed film 9 after spraying from nozzle 20.

With concurrently above-mentioned, by discharging generating gas body (N ₂) supply to discharge space 13 from least one party of discharging generating gas body nozzle 41,42 and realize plasma.The aforesaid propylene acid attachment portion of processed film 9 enters discharge space 13 very soon, and accepts plasma irradiation.Thus, the surface of the processed film 9 in discharge space 13 there is the reaction of acrylic acid plasma polymerization, form cementability promoting layer in the same manner as the first embodiment.

Because temperature regulator solution is not easily energized, even if therefore nozzle 20B configures close to electrode 11, also can prevent identical with the first embodiment to this point such as the electric leakages of thermoregulation mechanism 30 from electrode 11.

Fig. 5 is the figure representing the 5th embodiment of the present invention.In the 5th embodiment, the temperature in reaction gas nozzle 20 regulates path 32 to have the path downstream 53 of the upstream path 51 of hypomere, the stream 52 in stage casing and epimere.Upstream path 51 is configured on the lower position in reaction gas nozzle 20.Stage casing stream 52 is configured in the position higher than upstream path 51.Path downstream 53 is configured in the position (higher position reaction gas nozzle 20 in) higher than stage casing stream 52.Upstream path 51 is connected with the access path 54 of stage casing stream 52 via upper downward-extension.Stage casing stream 52 is connected with the access path 55 of path downstream 53 via upper downward-extension.Temperature regulator solution is according to the sequential flowing of upstream path 51, access path 54, stage casing stream 52, access path 55, path downstream 53.Below, the temperature further describing the 5th embodiment regulates path structure.

Upstream path 51 comprises the first upstream path part 51a and the second upstream path part 51b.Each circuit portion 51a, 51b extend horizontally to the second end (being upper right in Fig. 5) from the first end (being lower-left Fig. 5) of the length direction (process width) of reaction gas nozzle 20.First upstream path part 51a and the second upstream path part 51b arranges along orientation in mutually the same level height position and configures abreast.First upstream path part 51a is partial to the first roller electrode 11 side configuration from the vertical medullary ray of reaction gas nozzle 20.Second upstream path part 51b is partial to the second roller electrode 12 side configuration from above-mentioned medullary ray.

First end face (being lower-left in Fig. 5) of reaction gas nozzle 20 is provided with ingress port 50.Canal path 33 of going from liquid temperature adjusting portion 31 (with reference to Fig. 1) is connected with ingress port 50.The first end (upstream extremity) of upstream path 51 is connected with ingress port 50.Branch path 51c (branch) is provided with near the upstream extremity of upstream path 51.Branch path 51c extends along orientation.Upstream path part 51a, 51b is branched out from branch path 51c.First upstream path part 51a from end (upstream extremity) branch of first roller electrode 11 side of branch path 51c, and and from ingress port 50 to branch path 51c upstream path 51 be formed as same straight line.Second upstream path part 51b is connected with the end (downstream end) of second roller electrode 12 side of branch path 51c.

Stage casing stream 52 comprises first flow path part 52a and the second circuit portion 52b.Each circuit portion 52a, 52b extend horizontally to first end (being lower-left in Fig. 5) from the second end (being upper right Fig. 5) of the length direction of reaction gas nozzle 20.First flow path part 52a and the second circuit portion 52b at mutually the same level height place along orientation arrangement configured in parallel.First flow path part 52a is partial to the first roller electrode 11 side configuration from the vertical medullary ray of reaction gas nozzle 20, and the second circuit portion 52b is partial to the second roller electrode 12 side configuration from above-mentioned medullary ray.First flow path part 52a directly over the first upstream path part 51a with the first upstream path part 51a configured in parallel.Second circuit portion 52b directly over the second upstream path part 51b with the second upstream path part 51b configured in parallel.

Access path 54 is configured in the second end (end of the opposition side of branch 51c) of reaction gas nozzle 20.Access path 54 comprises first connection path part 54a and the second access path part 54b.First connection path part 54a is partial to the first roller electrode 11 side configuration from the vertical medullary ray of reaction gas nozzle 20.Downward-extension on first connection path part 54a, and its bottom (upstream extremity) is connected with the second end (downstream end) of the first upstream path part 51a.The upper end (downstream end) of first connection path part 54a is connected with the second end (upstream extremity) of first flow path part 52a.Second access path part 54b is partial to the second roller electrode 12 side configuration from above-mentioned medullary ray.Downward-extension on second access path part 54b, and its bottom (upstream extremity) is connected with the second end (downstream end) of the second upstream path part 51b.The upper end (downstream end) of the second access path part 54b is connected with the second end (upstream extremity) of the second circuit portion 52b.

For upstream path 51, stage casing stream 52 is formed " path downstream ".Now, first flow path part 52a forms " the first downstream path section ", and the second circuit portion 52b forms " the second downstream path section ".

The path downstream 53 of the epimere of reaction gas nozzle 20 comprises the first downstream path section 53a and the second downstream path section 53b.Each circuit portion 53a, 53b extend horizontally to the second end (upper right in Fig. 5) from the first end (being lower-left Fig. 5) of the length direction of reaction gas nozzle 20.First downstream path section 53a and the second downstream path section 53b configures along above-mentioned orientation arrangement abreast at mutually the same level height place.First downstream path section 53a is partial to the first roller electrode 11 side configuration from the vertical medullary ray of reaction gas nozzle 20, and the second downstream path section 53b is partial to the second roller electrode 12 side configuration from above-mentioned medullary ray.First downstream path section 53a configures abreast with first flow path part 52a directly over first flow path part 52a.Second downstream path section 53b configures abreast with the second circuit portion 52b directly over the second circuit portion 52b.

Access path 55 is configured in the first end (end of the opposition side of access path 54) of reaction gas nozzle 20.Access path 55 comprises first connection path part 55a and the second access path part 55b.First connection path part 55a is partial to the first roller electrode 11 side configuration from above-mentioned medullary ray.Downward-extension on first connection path part 55a, its bottom (upstream extremity) is connected with the first end (downstream end) of first flow path part 52a.The upper end (downstream end) of first connection path part 55a is connected with the first end (upstream extremity) of the first downstream path section 53a.Second access path part 55b is partial to the second roller electrode 12 side configuration from above-mentioned medullary ray.Downward-extension on second access path part 55b, its bottom (upstream extremity) is connected with the first end (downstream end) of the second circuit portion 52b.The upper end (downstream end) of the second circuit portion 52b is connected with the first end (upstream extremity) of the second downstream path section 53b.

For path downstream 53, stage casing stream 52 is formed " upstream path ".Now, first flow path part 52a forms " the first upstream path part ", and the second circuit portion 52b forms " the second upstream path part ".

Path downstream 53 is provided with and converges path 53c (fluidic junction).Converge path 53c to extend along orientation.The second end (downstream end) of the first downstream path section 53a and the second downstream path section 53b converges via converging path 53c each other.First downstream path section 53a is connected with the end of the first roller electrode 11 side converging path 53c.Second downstream path section 53b is connected with the end of the second roller electrode 12 side converging path 53c, and is formed as same straight line with than converging the path downstream 53 of path 53c by the second side (downstream side).Second end face of reaction gas nozzle 20 is provided with outlet port 56.The second end (downstream end) of path downstream 53 is connected with outlet port 56.Return pipe path 34 extends from outlet port 56 to liquid temperature adjusting portion 31 (with reference to Fig. 1).

In the inside of nozzle 20, the gas flow path of slit-shaped 21 (with reference to Fig. 1) is arranged on and processes on width and the orthogonal direction (being above-below direction in Fig. 5) of orientation, eliminates diagram in Figure 5 about this point.Gas flow path 21 is communicated with between the first downstream path section 53a with the second downstream path section 53b, and then be communicated with between first flow path part 52a with the second circuit portion 52b, be communicated with between the first upstream path part 51a with the second upstream path part 51b further.The bottom (downstream end) of gas flow path 21 is communicated with the ejiction opening 23 (with reference to Fig. 1) of the lower end of nozzle 20.One end of the process width of gas flow path 21 is positioned at than branch 51c by processing the center side of width, and the other end of the process width of gas flow path 21 is positioned at than fluidic junction 53c by processing the center side of width.

In the 5th embodiment, the temperature regulator solution from liquid temperature adjusting portion 31 imports to upstream path 51 from going canal path 33 via ingress port 50.A part of Lq1 of this temperature regulator solution shunts from branch 51c to the first upstream path part 51a.Remainder (another part) Lq2 of temperature regulator solution shunts from branch 51c to the second upstream path part 51b.Thus, a part of Lq1, Lq2 of temperature regulator solution move from first end side direction the second end effluent respectively in first, second upstream path part 51a, 51b.

At this, start to regulate path 32 to import temperature regulator solution to temperature.This temperature regulator solution is partial to a side, such as the first upstream path part 51a in circuit portion 51a, 51b and shunts.That is, most temperature regulator solution enters above-mentioned a part of Lq1, and the flow of remainder Lq2 is almost 0.In this case, temperature regulator solution, after the entirety being full of the first upstream path part 51a, more easily flows to the second upstream path part 51b of the opposing party with in first connection path part 54a compared with rising.Therefore, it is possible to make temperature regulator solution also throughout the second upstream path part 51b.Consequently, temperature regulator solution can flow in the circuit portion 51a of two sides, 51b.

The temperature regulator solution Lq1 that have passed through the first upstream path part 51a rises in first connection path part 54a, and is imported into first flow path part 52a.The temperature regulator solution Lq2 that have passed through the second upstream path part 52a rises in the second access path part 54b, and is imported into the second circuit portion 52b.Thus, a part of Lq1, Lq2 of temperature regulator solution move from the second end side direction first end effluent respectively in first, second circuit portion 52a, 52b.

The temperature regulator solution Lq1 that have passed through first flow path part 52a rises in first connection path part 55a, and is imported into the first downstream path section 53a.The temperature regulator solution Lq2 that have passed through the second circuit portion 52b rises in the second access path part 55b, and is imported into the second downstream path section 53b.Thus, a part of Lq1, Lq2 of temperature regulator solution move from first end side direction the second end effluent respectively in first, second downstream path section 53a, 53b.Further, described temperature regulator solution Lq1, Lq2 converge in fluidic junction 53c.Temperature regulator solution after converging returns to liquid temperature adjusting portion 31 from return pipe path 34 through outlet port 56.

Circulated on the process width and orientation of whole reaction gas nozzle 20 by temperature regulator solution, thus temperature adjustment can be carried out in the larger context to reaction gas nozzle 20.

The present invention is not limited to above-mentioned embodiment, can carry out various change in the scope not departing from its purport.

Such as, temperature regulator solution is not limited to the water such as pure water or ion exchanged water, preferably has insulativity, such as, also can use the fluorine system inert liqs such as Fluorinert (registered trademark).From the viewpoint of security, the boiling point of preferable temperature regulator solution is low.

1 temperature also only can be set in nozzle 20,20B and regulate path 32.In this case, preferably 1 temperature regulates path 32 to be configured in the position as far as possible leaning on emission direction leading section of nozzle 20,20B.

The leading section at least comprising ejiction opening 23 of nozzle 20,20B is made up of isolator, and the base end part of the opposition side of ejiction opening 23 side of nozzle 20,20B also can be made up of conductors such as metals.

Also leakage sensor can be set in the below etc. of nozzle 20,20B, thus can the spilling of detected temperatures regulator solution.

In the 5th embodiment (Fig. 5), upstream path 51 is branched off into the upstream path part of more than 3.In this case, 1 formation " the first upstream path part " of the upstream path part of described more than 3, another 1 formation " the second upstream path part ".Similarly, stage casing stream 52 also can have the circuit portion of more than 3.Path downstream 53 also can have the downstream path section of more than 3.

Also can be configured to ingress port 50 be connected with the pars intermedia of the bearing of trend of branch path 51c.

Also can be configured to outlet port 56 be connected with the pars intermedia of the bearing of trend converging path 53c.

Also can be configured to, the upstream path part 51a of upstream path 51, the downstream end of 51b are converged each other, are connected with the bottom of 1 access path 54 than fluidic junction upstream path 51 downstream.Also first, second circuit portion 52a, the 52b upper end branch from 1 access path 54 on stage casing road 52 can be configured to.Also can be configured to, first, second circuit portion 52a on stage casing road 52, the downstream end of 52b are converged each other, are connected with the bottom of 1 access path 55 than fluidic junction stage casing road 52 downstream.Also first, second circuit portion 53a, the 53b upper end branch from 1 access path 55 of path downstream 53 can be configured to.

Branch 51c also can be arranged on the pars intermedia of the length direction (process width) of reaction gas nozzle 20, and 2 circuit portion 51a, 51b sides opposite each other from branch 51c to the length direction of reaction gas nozzle 20 extend.

Fluidic junction 53c also can be arranged on the pars intermedia of the length direction (process width) of reaction gas nozzle 20, and 2 circuit portion 53a, 53b clip fluidic junction 53 and extend from the side opposite each other of the length direction of reaction gas nozzle 20 towards fluidic junction 53c and mutually converge.

The electrode structure of plasma treatment appts 1 is not limited to pair of rolls electrode 11,12.Such as, also can be parallel plate electrode, also can be roller electrode and plate electrode this pair, also can be roller electrode and local cylinder concave electrodes this pair.Nozzle 20,20B be configured in the electrode of at least one party vicinity or to configure towards the mode of discharge space 13.The electrode of one side can be plate electrode, also can be local cylinder concave electrodes.

The present invention is not limited to the surface treatment of polarization plates protective membrane, goes for the surface treatment of various resin molding.

Treated object 9 is not limited to resin molding, also can be glass substrate or semiconductor wafer etc.

Contents processing is not limited to the film forming of plasma polymerization film, can be also plasma CVD, and then be not limited to film forming, go for the various process such as cleaning, surface modification, etching.Reactant gases composition suitably can be selected according to contents processing.Such as, in plasma CVD, the reacted constituent as reactant gases can enumerate TMOS, TEOS etc.

[industrial utilizability]

The present invention can be applicable to the such as polarization plates of screen display (FPD) and the manufacture of semiconductor wafer.

[nomenclature]

1,1A, 1B plasma treatment appts

2 reacting gas sources (gasifier)

2a gas supplying path

3 film temperature regulating mechanisms

In 3a electrode, temperature regulates path

5 pallets

9 processed films (treated object)

11 electrodes

12 electrodes

13 discharge spaces

20,20B reaction gas nozzle

21 ejection paths

22 dispersion paths

23 ejiction openings

24 nozzle cardinal extremity parts

25 spray nozzle front end parts

30 nozzle temperature regulating mechanisms

31 liquid temperature adjusting portions

31a liquid temperature configuration part

31b liquid storage portion

31c liquid temperature sensor

31d liquid heat portion

31e control part

32 temperature regulate path

321 temperature regulate outlet (upstream path)

322 temperature regulating circuit (path downstream)

323 turn back road

33 go canal path

34 return pipe paths

35 dispenser

36 fluidic junction

37 liquid-feeding pumps

38 ion-exchange filters

41,42 discharging generating gas body nozzles

43 discharging generating gas body feed paths

50 ingress ports

51 upstream paths

51a first upstream path part

51b second upstream path part

51c branch path (branch)

52 stage casing streams

52a first flow path part

52b second circuit portion

53 path downstreams

53a first downstream path section

53b second downstream path section

53c converges path (fluidic junction)

54 access paths

54a first connection path part

54b second access path part

55 access paths

55a first connection path part

55b second access path part

56 outlet port

Claims (8)

1. a plasma treatment appts, make the reactant gases of the reacted constituent containing coagulability contact with treated object and irradiate plasma, the feature of described plasma treatment appts is to possess:

Pair of electrodes, forms irradiate for described plasma 1.013 × 10 each other in described pair of electrodes ⁴~ 50.663 × 10 ⁴the discharge space of Pa;

Nozzle, the leading section with ejiction opening of this nozzle is made up of isolator, and near the described leading section at least one party that is configured in described pair of electrodes or described discharge space, makes described reactant gases spray to described treated object from described ejiction opening;

Nozzle temperature regulating mechanism, it regulates the temperature of described nozzle,

Described nozzle temperature regulating mechanism comprises: temperature regulates path, and it is formed on described nozzle and passes through for temperature regulator solution; Liquid temperature adjusting portion, it configures in the mode be separated from described electrode and described nozzle, and the temperature of described temperature regulator solution is adjusted to the high temperature higher than the coagulation temperature of the reacted constituent in described reactant gases; Pipeline, described liquid temperature adjusting portion and described temperature regulate path to link by it,

Described nozzle extends along the process width orthogonal with the throughput direction of described treated object,

Described temperature regulates path to extend to the other end from an end of the described process width of described nozzle along described process width,

And, described temperature regulates path to comprise temperature and regulates outlet and temperature regulating circuit, described temperature regulates outlet to make described temperature regulator solution towards a direction flowing on described process width, described temperature regulating circuit makes described temperature regulator solution flow towards the reverse direction in a described direction, described temperature regulates the downstream end in outlet to be connected by road of turning back with the upstream extremity of described temperature regulating circuit, and described temperature regulates outlet and described temperature regulating circuit to be formed in the inside of described nozzle.

2. plasma treatment appts according to claim 1, is characterized in that,

Described temperature regulator solution has insulativity.

3. plasma treatment appts according to claim 1, is characterized in that,

The electric conductivity of described temperature regulator solution is 50 below μ S/cm.

4. plasma treatment appts according to any one of claim 1 to 3, is characterized in that,

Described treated object is continuous print film, and at least one party in described pair of electrodes is wrapping with described treated object and carries out the cylinder electrode that rotates, described nozzle and described cylinder electrode close,

Described plasma treatment appts also possesses film temperature regulating mechanism, and the temperature of the temperature of described cylinder electrode and described treated object is adjusted to the low temperature lower than described coagulation temperature by this film temperature regulating mechanism.

5. plasma treatment appts according to any one of claim 1 to 3, is characterized in that,

Described temperature regulates path to possess upstream path, path downstream and access path, described upstream path comprises and is configured to highly identical each other and supplies described temperature regulator solution according to the first upstream path part of each partial-flow respectively, second upstream path part, described path downstream is configured in the position higher than described upstream path, downward-extension on described access path, the bottom of this access path is connected with described upstream path, and the upper end of this access path is connected with described path downstream, described temperature regulator solution is according to described upstream path, described access path, the sequential flowing of described path downstream, described upstream path forms described temperature and regulates outlet, described path downstream forms described temperature regulating circuit.

6. plasma treatment appts according to claim 5, is characterized in that,

Described upstream path comprises the branch being branched off into described first upstream path part and described second upstream path part.

7. plasma treatment appts according to claim 5, is characterized in that,

Described path downstream comprises and is configured to highly identical each other and supplies described temperature regulator solution according to the first downstream path section, second downstream path section of each partial-flow respectively, and described access path comprises the first connection path part described first upstream path part be connected with described first downstream path section, the second access path part described second upstream path part be connected with described second downstream path section.

8. plasma treatment appts according to claim 7, is characterized in that,

Described path downstream comprises the fluidic junction that described first downstream path section and described second downstream path section converge.