CN102881624B - Stably-running variable-pitch clamp for reversing silicon wafers - Google Patents
Stably-running variable-pitch clamp for reversing silicon wafers Download PDFInfo
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- CN102881624B CN102881624B CN201210382883.8A CN201210382883A CN102881624B CN 102881624 B CN102881624 B CN 102881624B CN 201210382883 A CN201210382883 A CN 201210382883A CN 102881624 B CN102881624 B CN 102881624B
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a stably-running variable-pitch clamp for reversing silicon wafers. The stably-running variable-pitch clamp comprises a top plate, a bottom plate, a frame formed by two lateral plates and multiple layers of silicon wafer placing plates located in the frame and capable of vertically sliding along the inner surfaces of the two lateral plates. The silicon wafer placing plates have thick portions and thin portions, the thickness of the thick portions is identical the height of small pitches, and gaps are formed at the positions of the thin portions of adjacent layers of silicon wafer placing plates. Two sides of the multiple layers of silicon wafer placing plates are further respectively provided with spacing gaskets fixed on an adjusting plate at intervals and corresponding to the positions of each layer of gaps. The sum of the thickness of the spacing gaskets and the thin portions of the silicon wafer placing plates is identical to the height of large pitches, and the length from the lower-layer spacing gaskets to top-layer spacing gaskets decreases progressively in an equal-difference mode layer by layer. In addition, the stably-running variable-pitch clamp further comprises a drive mechanism for driving the adjusting plate to enable the spacing gaskets to be inserted into or pulled out of the gap. The stably-running variable-pitch clamp for reversing the silicon wafers can quickly change a distance between every two silicon wafers and accordingly can quickly, half-stably and conveniently reverse the silicon wafers in two different pitch carrying tool rooms.
Description
Technical field
The invention belongs to photovoltaic silicon wafer production equipment technical field, particularly relate to the stable pitches fixture for reviewing in photovoltaic silicon wafer production equipment.
Background technology
In order to improve the production capacity of photovoltaic silicon wafer diffusion technology, when not changing technique main equipment, be the method for the most convenient and extensive employing by silicon chip carrier quartz boat pitch gets finer (as become 4.05mm from 4.76mm).Before diffusion technology is carried out, silicon chip needs to pour quartz boat into from the another kind of carrier gaily decorated basket; After technique completes, silicon chip needs to pour the gaily decorated basket into silicon chip is sent to one technique from quartz boat.Because the silicon chip between technique transmits the gaily decorated basket all adopting 4.76mm, so when quartz boat pitch is 4.76mm, during artificial reviewing, only silicon chip just can need be pushed into another carrier from a carrier by two carrier alignment.But when quartz boat pitch is not 4.76mm, just can not adopt in this way.The artificial reviewing method of current employing is: picked up from a carrier by silicon chip one by one with sucker and then insert another one carrier.This method inefficiency, labour intensity is large, and fragment rate is uncontrollable.
Summary of the invention
For this reason, technical problem to be solved by this invention is to provide a kind of stable pitches fixture for reviewing, and this pitches fixture can carry out reviewing fast, steadily, easily between two kinds of different pitch carriers, to overcome the deficiency that prior art exists.
For solving the problems of the technologies described above, the present invention adopts following technical scheme:
A kind of stable pitches fixture for reviewing, it is characterized in that: comprise the framework surrounded by top board, base plate and biside plate, the Multi-layer silicon that can slide up and down along biside plate inner surface being positioned at framework shelves plate, described silicon chip is shelved plate and is had thick portion and thin section, the thickness in described thick portion equals fine pith height, and described adjacent layer silicon chip shelves plate in formation gap, thin section position; Described Multi-layer silicon shelve plate both sides also respectively corresponding every position, lamellar spacing be provided with interval and be fixed on spacing pad on adjustable plate, the thick portion sum that the thickness of described spacing pad and silicon chip shelve the thin section of plate equals coarse pitch height, described lower interlamellar spacing pad to top layer spacing pad length successively equal difference successively decrease; In addition, also include driving described adjustable plate spacing pad is inserted or extracts the driving mechanism in described gap.
In the specific embodiment of the present invention, described side wall inner surfaces has the vertical chute of twice, and described silicon chip is shelved plate two ends and had the protrusion slide block that two are positioned at described chute respectively.Like this, side plate can retrain silicon chip and shelves plate and vertically can slide up and down along side wall inner surfaces.
In order to reduce the friction with silicon chip, can be easy to push and release silicon chip to make silicon chip and shelving plate, described in shelve plate there is etched-off area.
Described thin section is positioned at longitudinal centre position that silicon chip shelves plate, and both sides of the edge are wedge shape, and the head end of described spacing pad is also wedge shape.Such structure, is conducive to spacing pad and inserts below thin section.
Described driving mechanism comprises the adjusting screw(rod) be arranged on framework, and described adjustable plate has screwed hole, is enclosed within described adjusting screw(rod).
Adopt technique scheme, the stable pitches fixture for reviewing of the present invention can spacing between Fast transforms silicon chip, thus can realize between two kinds of different pitch carriers, carrying out reviewing fast, steadily, easily.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the present invention is described in detail:
Fig. 1 is schematic perspective view of the present invention;
Fig. 2 is the structural representation of side plate;
Fig. 3 is the structural representation that silicon chip shelves plate;
Fig. 4 is the structural representation of spacing pad;
Fig. 5 is the structural representation of adjustable plate;
Fig. 6 is that silicon chip of the present invention is shelved plate, spacing pad and adjustable plate and to be cooperatively interacted simple and easy schematic diagram;
Fig. 7 is the close-up schematic view of Fig. 6 right-hand member.
Embodiment
As shown in Figure 1, the stable pitches fixture for reviewing of the present invention, comprises framework 100, Multi-layer silicon shelves plate 200, spacing pad 300 and driving mechanism.
Wherein, the side plate 130 that framework 100 separates from the left and right sides by a top board 110, base plate 120 and two pieces surrounds and forms, and the front and back of framework 100 form opening, and silicon chip can be allowed to pass in and out.
As shown in Figure 2, the inner surface of side plate 130 is positioned at both sides and has the vertical chute 131 extended, and centre has the vertical strip breach 132 extended.
As shown in Figure 3, it is 4.05mm that every block silicon chip shelves plate 200 integral thickness, and namely thick portion 210, equals fine pith height.Silicon chip is shelved plate 200 and is had thin section 220 in longitudinal centre position, and its thickness is 2.76mm, and edge is made into wedge shape.Like this, the silicon chip of adjacent layer shelves plate in formation gap, thin section position.Silicon chip is shelved plate 200 two ends and is had two protrusion slide blocks 201 respectively, when this protrusion slide block 201 assembles, is positioned at the chute 131 of side plate 130.Like this, silicon chip shelves plate 200 under the constraint of the chute 131 of side plate 130, can move up and down along side plate 130.For reducing the friction with silicon chip, can be easy to push and release silicon chip to make silicon chip and shelve plate, the side, front and back that silicon chip shelves plate 200 all has etched-off area 202.
The position of shelving the corresponding thin section in both sides of plate at Multi-layer silicon is provided with spacing pad 300, and as shown in Figure 4, spacing pad 300 is strip pad, and thickness is 2mm, and head end 301 is wedge shape.
For another example, shown in Fig. 1 composition graphs 6, driving mechanism comprises screw rod 401, knob 402 and guide post 404.Two adjustable plates 403 have the screwed hole coordinated with screw rod 401 in sustained height position, the direction of two screwed holes is contrary.Two adjustable plates 403 are arranged on the both sides that silicon chip shelves plate respectively, and correspond to strip breach 132 position of side plate, strip breach 132 can allow adjustable plate 403 pass through.Screw rod 401 then through side plate, its termination is provided with knob 402.Based on ergonomics, knob is positioned at upper end on the right side of fixture so that manual adjustment.Have at the two ends of base plate 120 and have a back-up block 406 respectively, be fixed with a guide post 405 between back-up block 406, this guide post 405 passes from the strip breach 132 of side plate, and the lower end of adjustable plate 403 has pilot hole, is enclosed within guide post 405.Thus making when rotation 402, adjustable plate 403 can along guide post 405 side-to-side movement, thus drives the thick portion of spacing pad 300 can inject or extract silicon chip to shelve gap between plate 200.Adopt such structure, can ensure that left and right adjusting synchronously can not have the problem that mechanism is blocked, except adopting above-mentioned screw rod, cylinder push-and-pull adjustable plate can also be adopted.
Adopt such structure, can ensure that left and right adjusting synchronously can not have the problem that mechanism is blocked, except adopting above-mentioned screw rod, cylinder push-and-pull adjustable plate can also be adopted.
Spacing pad 300 is on the adjustable plate 403 fixed as shown in Figure 5 of uniform intervals.As shown in Figure 6 and Figure 7, lower interlamellar spacing pad to top layer spacing pad length successively equal difference successively decrease.
Be exactly more than the stable pitches fixture for reviewing of the present invention, shown in composition graphs 6, its working method is as follows:
By turn knobs 402, screw rod 401 rotates, and the adjustable plate 403 of both sides can be driven to both sides or center position motion.
In initial state, when not having spacing pad to insert, pitch is the thickness that silicon chip shelves plate, i.e. 4.05mm.
When adjustable plate 403 moves to center position, first be that the spacing pad of the bottom is inserted into silicon chip and shelves in the gap of the bottom of plate, make pitch become 4.76mm, and then successively upwards spacing pad insert every lamellar spacing, make the pitch of every layer become become 4.76mm successively.
When adjustable plate 403 is to two lateral movements, be first that the spacing pad in most top layer gap exits, make the pitch of most top layer change back to 4.05mm, and then make spacing pad exit successively downwards, pitch changes back to 4.05mm successively.
Can find from above-mentioned, the adjustment of pitch is that the adjustment from lower floor to upper strata progressively completes.Therefore, the stationarity of the pitch of whole fixture pitch is very good.
Claims (5)
1. the stable pitches fixture for reviewing, it is characterized in that: comprise the framework surrounded by top board, base plate and biside plate, the Multi-layer silicon that can slide up and down along biside plate inner surface being positioned at framework shelves plate, described silicon chip is shelved plate and is had thick portion and thin section, the thickness in described thick portion equals fine pith height, and adjacent layer silicon chip shelves plate in formation gap, thin section position; Described Multi-layer silicon shelve plate both sides also respectively corresponding every position, lamellar spacing be provided with interval and be fixed on spacing pad on adjustable plate, the thick portion sum that the thickness of described spacing pad and silicon chip shelve the thin section of plate equals coarse pitch height, lower interlamellar spacing pad to top layer spacing pad length successively equal difference successively decrease; In addition, also include driving described adjustable plate spacing pad is inserted or extracts the driving mechanism in described gap.
2. the stable pitches fixture for reviewing according to claim 1, is characterized in that: described side wall inner surfaces has the vertical chute of twice, and described silicon chip is shelved plate two ends and had the protrusion slide block that two are positioned at described chute respectively.
3. the stable pitches fixture for reviewing according to claim 1, is characterized in that: described in shelve plate there is etched-off area.
4. the stable pitches fixture for reviewing according to claim 1, is characterized in that: described thin section is positioned at longitudinal centre position that silicon chip shelves plate, and both sides of the edge are wedge shape, the head end of described spacing pad is also wedge shape.
5. the stable pitches fixture for reviewing according to claim 1, it is characterized in that: described driving mechanism comprises the adjusting screw(rod) be arranged on framework, described adjustable plate has screwed hole, is enclosed within described adjusting screw(rod).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210382883.8A CN102881624B (en) | 2012-10-11 | 2012-10-11 | Stably-running variable-pitch clamp for reversing silicon wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210382883.8A CN102881624B (en) | 2012-10-11 | 2012-10-11 | Stably-running variable-pitch clamp for reversing silicon wafers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102881624A CN102881624A (en) | 2013-01-16 |
| CN102881624B true CN102881624B (en) | 2015-03-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210382883.8A Active CN102881624B (en) | 2012-10-11 | 2012-10-11 | Stably-running variable-pitch clamp for reversing silicon wafers |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101303999A (en) * | 2008-06-06 | 2008-11-12 | 无锡中微高科电子有限公司 | Multipurpose clamper for bonding machine worktable |
| CN101409253A (en) * | 2008-11-19 | 2009-04-15 | 高佳太阳能（无锡）有限公司 | Clamper for cleaning and degumming silicon chip |
| CN202259219U (en) * | 2011-08-24 | 2012-05-30 | 苏州日和科技有限公司 | Liquid crystal sheet load bearing support capable of being adjusted accurately |
| CN202839580U (en) * | 2012-10-11 | 2013-03-27 | 苏州罗博特科自动化设备有限公司 | Varying pitch clamp with stable operation for slice replacing |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001044260A (en) * | 1999-08-02 | 2001-02-16 | Tokyo Electron Ltd | Carrying device for substrate to be treated and removal method of support plate thereof |
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2012
- 2012-10-11 CN CN201210382883.8A patent/CN102881624B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101303999A (en) * | 2008-06-06 | 2008-11-12 | 无锡中微高科电子有限公司 | Multipurpose clamper for bonding machine worktable |
| CN101409253A (en) * | 2008-11-19 | 2009-04-15 | 高佳太阳能（无锡）有限公司 | Clamper for cleaning and degumming silicon chip |
| CN202259219U (en) * | 2011-08-24 | 2012-05-30 | 苏州日和科技有限公司 | Liquid crystal sheet load bearing support capable of being adjusted accurately |
| CN202839580U (en) * | 2012-10-11 | 2013-03-27 | 苏州罗博特科自动化设备有限公司 | Varying pitch clamp with stable operation for slice replacing |
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| Publication number | Publication date |
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| CN102881624A (en) | 2013-01-16 |
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Address after: Suzhou City, Jiangsu province 215122 Suzhou Industrial Park Weiting Fengting Avenue No. 598 Patentee after: Robert C intelligent Polytron Technologies Inc Address before: Suzhou City, Jiangsu province 215000 Suzhou Industrial Park Weiting Chunhui Road No. 5 kuachun industrial plant No. 6 Patentee before: Suzhou ?Robo-Technik Automation Equipment Co., Ltd. |