CN102881387A - Micro-resistance product bonded by lamination glue and its manufacturing method - Google Patents
Micro-resistance product bonded by lamination glue and its manufacturing method Download PDFInfo
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- CN102881387A CN102881387A CN2011101969752A CN201110196975A CN102881387A CN 102881387 A CN102881387 A CN 102881387A CN 2011101969752 A CN2011101969752 A CN 2011101969752A CN 201110196975 A CN201110196975 A CN 201110196975A CN 102881387 A CN102881387 A CN 102881387A
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Abstract
The invention discloses a micro-resistance product bonded by a lamination glue and its manufacturing method. The micro-resistance product bonded by a lamination glue comprises a resistance layer, a pair of electrode slices, a bonding layer and metal sheets. The resistance layer has a first surface and a second surface. The pair of electrode slices consist of a first electrode slice and a second electrode slice that are separated from each other and cover part of the second surface of the resistance layer. Positioned on the first surface of the resistance layer, the bonding layer takes a fiber structure as the substrate and is added with an inorganic filler-containing glue material, and can be used to provide sufficient processing support strength, adherence and heat dissipation. Composed of a first metal sheet and a second metal that are separated from each other and positioned on the bonding layer, the metal sheets are used for enhancing the heat dissipation of the micro-resistance product so as to improve its load power.
Description
Technical field
The present invention relates to a kind of little resistance product, particularly a kind of little resistance product with high-cooling property.
Background technology
One of the promising passive device of common installing resistive element is in order to the electric current in the sensing circuit in electronic installation.This kind must have low-resistance value (resistance value), low resistance temperature coefficient (temperature coefficient of resistance, TCR) and high resistance stability usually in order to the resistive element of current sensor.Yet when resistive element was used on the product with larger electric current (power), the temperature on resistive element surface raise, and often made resistance produce significant change, caused obtaining accurately resistance value.
Be to promote the resistance value heat stability of resistive element, prior art provides a kind of little resistive element, with pressing or adhesive means applying, increasing the thermal diffusivity of little resistive element, and improves its bearing power by former of stamping forming conducting strip in advance and resistance.
Because former of conducting strip and resistance become separately shape with in advance punch forming, fit by adhesion layer again.At first, in the punching course, former of conducting strip and resistance may produce burr or bur, thereby penetrate adhesion layer in the pressing process conducting strip and former of resistance are contacted, and make little resistive element produce short circuit problem.Secondly, in batch production technique, mostly carry out processes with the sheet material that comprises hundreds of unit, therefore will with conducting strip and former all accurately contraposition applying of resistance of each unit, will increase technique to bit time, management and control manpower etc.Moreover former of stamping forming conducting strip and resistance have many hollowed parts in advance, although useful adhesion layer is fitted, but general adhesion layer mostly is resin material, whole process support is relatively poor, affects the technique yields such as follow-up plating, resistance finishing, increases the difficulty in process degree.
Summary of the invention
A purpose of the present invention is to provide a kind of little resistance product, has high-cooling property and sufficient process support to increase processes.
In order to achieve the above object, little resistance product of one embodiment of the invention comprises resistive layer, pair of electrodes sheet, cementing layer and sheet metal.Resistive layer has first surface and second surface; The pair of electrodes sheet comprises the first electrode slice and second electrode slice of the second surface of disconnected from each other and cover part resistive layer; Cementing layer is positioned on the first surface of resistive layer, and cementing layer is take glass-fiber-fabric as substrate and interpolation contains the glue material of inorganic filler; Sheet metal comprises the first sheet metal and the second sheet metal, and the first sheet metal and the second sheet metal are to be positioned on this cementing layer disconnected from each otherly.
Because cementing layer is take fibre structure as substrate and interpolation contains the glue material of inorganic filler, so enough process support intensity, tack and thermal diffusivities can be provided.And, be positioned at the first sheet metal and the second sheet metal on the cementing layer, can increase the thermal diffusivity of little resistance product, and improve its bearing power.
In order to achieve the above object, the manufacture method of little resistance product of one embodiment of the invention can may further comprise the steps: (a) applying step: sheet metal, cementing layer and resistive layer are sequentially arranged and a combined plate body is made in pressing; (b) sheet metal patterning step: utilize etch process, the sheet metal of combined plate body is formed two sheet metals on cementing layer; (c) electrode slice forms step: utilize plating mode that two electrode slices are formed at respectively the lip-deep both sides of this resistive layer; (d) protective layer forms step on the sheet metal: form the first protective layer on two sheet metals; (e) print steps: the digital printed of resistance value carried out on the surface in the first protective layer; (f) resistance pre-shaping step: the resistance value of adjusting little resistance product; (g) protective layer forms step on the resistive layer: form the second protective layer on resistive layer; (h) cutting step: press preset distance cutting combined plate body, obtain at least one combination block; Reaching (i), outer layer forms step.
Because above-mentioned manufacture method is to utilize first the applying step, sheet metal, cementing layer and resistive layer are sequentially arranged and a combined plate body is made in pressing, carry out again afterwards follow-up processing.Therefore, can avoid the situation of each interlayer dislocation in the structure.And cementing layer is take fibre structure as substrate and interpolation contains the glue material of inorganic filler, so enough process support intensity, tack and thermal diffusivities can be provided.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
The cross-sectional schematic of little resistance product of Fig. 1 one embodiment of the invention;
The vertical view of little resistance product of Fig. 2 one embodiment of the invention;
The stereo appearance figure of the resistive layer of little resistance product of Fig. 3 one embodiment of the invention;
The partial enlarged drawing of the cementing layer of little resistance product of Fig. 4 one embodiment of the invention;
The manufacture method flow chart of little resistance product of Fig. 5 one embodiment of the invention; And
The manufacture method schematic flow sheet of little resistance product of Fig. 6 A to Fig. 6 J one embodiment of the invention.
Wherein, Reference numeral
Embodiment
Relevant detailed description of the present invention and technology contents cooperate description of drawings as follows, yet appended accompanying drawing only provides reference and explanation usefulness, and the present invention is limited.
The direction term of mentioning in following examples such as: upper and lower, left and right, front or rear etc., only is the direction of attached drawings.Therefore, the direction term of use is for explanation, is not for restriction the present invention.
See also Fig. 1 to Fig. 2, be respectively to illustrate cross-sectional schematic and the vertical view of little resistance product 10 of the present invention one first embodiment.In the present embodiment, little resistance product 10 has the relative low-resistance value of millioersted nurse (milliohm) grade, is used for the electric current of sensing circuit, and it comprises resistive layer 100, pair of electrodes sheet 120, cementing layer 130 and sheet metal 140.
In the present embodiment, resistive layer 100 has relative first surface 102, second surface 104, and a plurality of through holes 106 that run through first surface 102 and second surface 104, make and form a shape (seeing also Fig. 3) that repeatedly bends back and forth, but not as limit, the resistive layer shape also can need to and have different designs according to the product resistance, and wherein, the material of resistive layer 100 can be monel, nichrome, ferrochrome or cupromanganese etc. and has the low resistance temperature coefficient material.Pair of electrodes sheet 120 comprises the first electrode slice 122 disconnected from each other and the second electrode slice 124, the second surface 104 of cover part resistive layer 100, be preferably on the dual-side that is formed at resistive layer 100 with as surface-assembled conducting contact, its material can be copper or copper alloy, is formed on the resistive layer by techniques such as plating.
See also Fig. 2 and Fig. 4, cementing layer 130 is positioned on the first surface 102 of resistive layer 100, cementing layer 130 is take fibre structure 132 as substrate and interpolation contains the glue material 136 of inorganic filler 134, the glue material that for example will contain inorganic heat conduction powder is coated on the glass fabric and is formed, and is used for providing enough process support intensity, tack and thermal diffusivities.Glue material 136 materials of cementing layer 130 can be epoxy resin or acrylic resin, and the inorganic filler 134 of cementing layer 130 can be insulation and the conductive coefficient preferred materials such as ceramic powders, diamond powder or boron nitride.In the present embodiment, the fibre structure 132 of cementing layer 130 is to describe as an example of glass fabric example, and in other embodiment, fibre structure 132 also can such as compositions such as high-performance poly ester fibers, be mixed in the glue material with sclerosis formation cementing layer with inorganic filler.
Be subject to environmental pollution or oxidation for fear of sheet metal 140, can further form the first protective layer 150, be covered on the sheet metal 140.In like manner, the second protective layer 160 is covered in the second surface 104 of resistive layer 100 not by on the zone of the first electrode slice 122 and 124 coverings of the second electrode slice.The material of the first protective layer 150 and the second protective layer 160 can be epoxy resin or acrylic resin.Among this embodiment, can form an outer layer 172,174, coat the first electrode slice 122 and the second electrode slice 124, the first sheet metal 142 and the second sheet metal 144, be used for and other outer member welding.Outer layer 172,174 can comprise copper layer, nickel dam and the tin layer that utilizes barrel plating technique to form.
See also Fig. 5, the manufacturing flow chart of little resistance product of Fig. 5 one embodiment of the invention.The manufacture method of little resistance product 10 of the present embodiment can may further comprise the steps: (a) applying step 300: sheet metal, cementing layer and resistive layer are sequentially arranged and a combined plate body is made in pressing; (b) the sheet metal patterning step 310: utilize etch process, the sheet metal of combined plate body is formed two sheet metals on cementing layer; (c) electrode slice forms step 320: utilize plating mode that two electrode slices are formed at respectively the lip-deep both sides of this resistive layer; (d) protective layer forms step 330 on the sheet metal: form the first protective layer on two sheet metals; (e) print steps 340: the digital printed of resistance value carried out on the surface in the first protective layer; (f) the resistance pre-shaping step 350: the resistance value of adjusting little resistance product; (g) protective layer forms step 360 on the resistive layer: form the second protective layer on resistive layer; (h) cutting step 370: press preset distance cutting combined plate body, obtain at least one combination block; Reaching (i), outer layer forms step 380: it is to utilize the barrel plating mode to form outer layer in the side of combination block.The schematic flow sheet of little resistance product of Fig. 6 A to Fig. 6 J one embodiment of the invention.Cooperate Fig. 6 A to Fig. 6 J, be described in detail as follows.
(a) applying step 300 as shown in Figure 6A, is sequentially arranged sheet metal 140, cementing layer 130 and resistive layer 100 and a combined plate body is made in pressing.Wherein resistive layer 100 is made of monel, nichrome, ferrochrome or cupromanganese.Cementing layer 130 is the glue material that contains inorganic heat conduction powder to be coated on the glass fabric form.The material of sheet metal is copper or copper alloy.Because cementing layer 130 is take glass fabric as substrate and interpolation contains the glue material of inorganic heat conduction powder, so enough process support intensity, tack and thermal diffusivities can be provided.
(b) the sheet metal patterning step 310, shown in Fig. 6 B, for example utilize etch process, and the sheet metal 140 of combined plate body is formed predetermined patterns on cementing layer 130.The material of sheet metal 140 can be copper or copper alloy.In certain embodiments, can be according to demand, the combination of 140 one-tenth various shapes of pattern metal sheet further provides the thermal diffusivity of little resistance product and prevents warpage.
(c) electrode slice forms step 320, shown in Fig. 6 C, will have the pair of electrodes sheet 120 of conducting function such as modes such as utilizing plating, is attached to resistive layer 100 with respect to another lip-deep both sides of sheet metal 140.In the present embodiment, the material of pair of electrodes sheet 120 can be copper or copper alloy.
(d) protective layer forms step 330 on the sheet metal, shown in Fig. 6 D, forms the first protective layer 150 on partially patterned sheet metal 140, and is filled in the space of 140 of pattern metal sheets, is subject to environmental pollution or oxidation to avoid resistive layer.The material of the first protective layer 150 can be epoxy resin or acrylic resin.(e) print steps 340, shown in Fig. 6 E, carry out the product information printing in the surface of the first protective layer 150, for example numeral 152 printing that represents of resistance value.
(f) the resistance pre-shaping step 350, shown in Fig. 6 F, utilize the mode such as laser reconditioning to form slit 108 on the second surface 104 of resistive layer 100, remove the material of the resistive layer 100 of part, are used for the resistance value of adjusting resistance layer 100.
(g) protective layer forms step 360 on the resistive layer; shown in Fig. 6 G; form second surface 104 that the second protective layer 160 is covered in resistive layer 100 not by on this zone that electrode slice 120 is covered, be subject to environmental pollution or oxidation with the resistive layer 100 of avoiding coming out.The material of the second protective layer 160 is epoxy resin or acrylic resin.The second protective layer 160 can cover through hole 106 and slit 108.
(h) cutting step 370, shown in Fig. 6 H, combined plate body obtained at least one combination block (shown in Fig. 6 I) along x-ray and the cutting of Y line.
(i) outer layer forms step 380, shown in Fig. 6 J, utilizes the barrel plating mode to form outer layer 172,174 in the side of combination block, uses little resistance product of finishing the present embodiment.Outer layer 172,174 can comprise copper layer, nickel dam and the tin layer that utilizes barrel plating technique to form.
Because the cementing layer of the present embodiment is take glass fabric as substrate and interpolation contains the glue material of inorganic heat conduction powder, so enough process support intensity, tack and thermal diffusivities can be provided.And, be positioned at the first sheet metal and the second sheet metal on the cementing layer, can increase the thermal diffusivity of little resistance product, and improve its bearing power.
Certainly; the present invention also can have other various embodiments; in the situation that do not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make according to the present invention various corresponding changes and distortion, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (10)
1. a little resistance product that uses the pressing glue laminating is characterized in that, comprising:
One resistive layer has a first surface and a second surface opposite with this first surface;
The pair of electrodes sheet comprises one first electrode slice and one second electrode slice of this second surface of disconnected from each other and this resistive layer of cover part;
One cementing layer is positioned on this first surface of this resistive layer, and this cementing layer is take fibre structure as substrate and interpolation contains the glue material of inorganic filler; And
One sheet metal comprises one first sheet metal and one second sheet metal that are positioned on this cementing layer disconnected from each otherly.
2. little resistance product of utilization pressing glue laminating according to claim 1 is characterized in that, this resistive layer is monel, nichrome, ferrochrome or cupromanganese.
3. little resistance product of utilization pressing glue laminating according to claim 1 is characterized in that, the material of this cementing layer comprises epoxy resin or acrylic resin.
4. little resistance product of utilization pressing glue laminating according to claim 1 is characterized in that, the inorganic filler of this cementing layer is ceramic powders, diamond powder or boron nitride.
5. little resistance product of utilization pressing glue laminating according to claim 1 is characterized in that, the width of this sheet metal is less than the width of this resistive layer.
6. a manufacture method of using little resistance product of pressing glue laminating is characterized in that, may further comprise the steps:
One sheet metal, a cementing layer and a resistive layer are sequentially arranged and a combined plate body is made in pressing;
Sheet metal utilizes etch process, and this sheet metal of this combined plate body is formed disjunct two sheet metals on cementing layer; And
Utilize plating mode that two electrode slices are formed at respectively the lip-deep both sides of this resistive layer.
7. the manufacture method of little resistance product of utilization pressing glue laminating according to claim 6 is characterized in that, also comprise provide have a fibre structure, this cementing layer of an inorganic filler and a glue material.
8. the manufacture method of little resistance product of utilization pressing glue laminating according to claim 6 is characterized in that, also comprises forming one first protective layer on these two sheet metals.
9. the manufacture method of little resistance product of utilization pressing glue laminating according to claim 6 is characterized in that, also comprises this combined plate body cutting, obtains at least one combination block.
10. the manufacture method of little resistance product of utilization pressing glue laminating according to claim 9 is characterized in that, also comprises utilizing the barrel plating mode to form an outer layer in the side of this combination block.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110196975.2A CN102881387B (en) | 2011-07-14 | 2011-07-14 | Micro-resistance product bonded by lamination glue and its manufacturing method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110196975.2A CN102881387B (en) | 2011-07-14 | 2011-07-14 | Micro-resistance product bonded by lamination glue and its manufacturing method |
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| CN102881387A true CN102881387A (en) | 2013-01-16 |
| CN102881387B CN102881387B (en) | 2015-07-08 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103680787A (en) * | 2013-12-12 | 2014-03-26 | 苏州智权电子科技有限公司 | Flexible precision resistor and preparation method thereof |
| CN106274022A (en) * | 2015-06-12 | 2017-01-04 | 中国振华集团云科电子有限公司 | A kind of ceramic surface pastes the method for alloy foil |
| CN108435123A (en) * | 2018-04-28 | 2018-08-24 | 中冶焦耐(大连)工程技术有限公司 | A kind of diamond filler |
| US10083781B2 (en) | 2015-10-30 | 2018-09-25 | Vishay Dale Electronics, Llc | Surface mount resistors and methods of manufacturing same |
| US10438729B2 (en) | 2017-11-10 | 2019-10-08 | Vishay Dale Electronics, Llc | Resistor with upper surface heat dissipation |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103680787A (en) * | 2013-12-12 | 2014-03-26 | 苏州智权电子科技有限公司 | Flexible precision resistor and preparation method thereof |
| CN103680787B (en) * | 2013-12-12 | 2016-10-05 | 苏州智权电子科技有限公司 | A kind of flexible precision resistor and preparation method thereof |
| CN106274022A (en) * | 2015-06-12 | 2017-01-04 | 中国振华集团云科电子有限公司 | A kind of ceramic surface pastes the method for alloy foil |
| US10083781B2 (en) | 2015-10-30 | 2018-09-25 | Vishay Dale Electronics, Llc | Surface mount resistors and methods of manufacturing same |
| US10418157B2 (en) | 2015-10-30 | 2019-09-17 | Vishay Dale Electronics, Llc | Surface mount resistors and methods of manufacturing same |
| US10438729B2 (en) | 2017-11-10 | 2019-10-08 | Vishay Dale Electronics, Llc | Resistor with upper surface heat dissipation |
| CN108435123A (en) * | 2018-04-28 | 2018-08-24 | 中冶焦耐(大连)工程技术有限公司 | A kind of diamond filler |
| CN108435123B (en) * | 2018-04-28 | 2024-03-19 | 中冶焦耐(大连)工程技术有限公司 | Diamond-shaped filler |
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| CN102881387B (en) | 2015-07-08 |
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