CN102877631A - Floor heating insulating board - Google Patents
Floor heating insulating board Download PDFInfo
- Publication number
- CN102877631A CN102877631A CN2012103650498A CN201210365049A CN102877631A CN 102877631 A CN102877631 A CN 102877631A CN 2012103650498 A CN2012103650498 A CN 2012103650498A CN 201210365049 A CN201210365049 A CN 201210365049A CN 102877631 A CN102877631 A CN 102877631A
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- China
- Prior art keywords
- floor heating
- heat insulation
- insulating board
- insulation plate
- wire casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention provides a floor heating insulating board which comprises an insulating board body, a wire channel grid, a support grille, and pipeline channels. The insulating board body is fixedly connected with the support grille. The pipeline channels are arranged on the wire channel grid which mutually adapts to the support grille. The edges of the insulating board body are provided with connectors. The pipeline channels are in the shapes of inverted triangles. The floor heating insulating board has the advantages that the boards are connected tightly, and floor heating pipes can be distributed evenly without damage and are more convenient to mount; the floor heating insulating board is simple in structure, maintenance rate is lowered, processing cost is low, constructing efficiency is high; and the like.
Description
Technical field
The present invention relates to the heating buildings Material Field, particularly a kind of insulating board for floor heating.
Background technology
Floor heating in existing technology is because effective and do not take up room, and demand significantly improves, repercussion is fine.The layer plane foams that adopt add the layer of steel wire stratum reticulare more, and pipeline is fixed on the gauze wire cloth, then use cement floating, re-lay floor layer.Can't guarantee the circular degree of its caliber in back bending place of laying geothermal tube, often cause the back bending section deformation, have that thermal losses is large, the not smooth problem of water circulation, this structure also exists easy damage pipeline to cause to leak, infiltration, the technical problems such as maintenance cost is high, operation is many, long construction period.
Summary of the invention
The problem to be solved in the present invention provide a kind ofly be convenient to install, thermal insulation plate that speed of application is fast, especially be fit to can make between plate body closely connect, can guarantee the be evenly distributed insulating board of the floor heating special use that is not damaged of geothermal tube.
For solving the problems of the technologies described above, the technical solution used in the present invention comprises heat insulation plate body, wire casing lattice, propping bar, chase; Heat insulation plate body is fixedly connected with supportive grid, and chase is arranged on the wire casing lattice; Wire casing lattice and the coadaptation of propping bar phase have linkage on the limit of heat insulation plate body, and described chase is del.
Further, the two ends of described grid arrange.
Further, described limit is not less than two.
Further, on the described wire casing lattice or propping bar be provided with slot; On the described wire casing lattice or propping bar be provided with the groove position.
Further, described heat insulation plate body is styrofoam.
Advantage and good effect that the present invention has are: owing to adopting technique scheme, closely connect between plate body, can guarantee geothermal tube be evenly distributed be not damaged, easier for installation; Have simple in structurely, reduce maintenance rate, processing cost is low, high efficient construction.
Description of drawings
Fig. 1 is the structural representation of odd number slot of the present invention
Fig. 2 is the structural representation of even numbers slot of the present invention
Among the figure:
1, heat insulation plate body 2, wire casing lattice 3, propping bar
4, chase 5, slot 6, groove position
The specific embodiment
Shown in Fig. 1, Fig. 2 combination, the present invention includes heat insulation plate body 1, wire casing lattice 2, propping bar 3, chase 4; Heat insulation plate body 1 is fixedly connected with wire casing lattice 2 with propping bar 3, and chase 4 is arranged on the wire casing lattice 2; Wire casing lattice 2 and propping bar 3 phase coadaptations have linkage on the limit of heat insulation plate body 1, and described chase 4 is del.Can fix the heating pipe line of appointing different size, to adapt to different laying demands.
Further, the two ends slot 5 of described wire casing lattice and propping bar, groove position 6.
Further, described limit is not less than two.
Further, on the described wire casing lattice 2 or propping bar 3 be provided with slot 5; On the described wire casing lattice 2 or propping bar 3 be provided with groove position 6.
Further, described heat insulation plate body is styrofoam.
Above one embodiment of the present of invention are had been described in detail, but described content only is preferred embodiment of the present invention, can not be considered to be used to limiting practical range of the present invention.All equalizations of doing according to the present patent application scope change and improve etc., all should still belong within the patent covering scope of the present invention.
Claims (5)
1. a floor heating heat insulation plate is characterized in that: comprise heat insulation plate body, wire casing lattice, propping bar, chase; Heat insulation plate body is fixedly connected with supportive grid, and chase is arranged on the wire casing lattice; Wire casing lattice and the coadaptation of propping bar phase have linkage on the limit of heat insulation plate body, and described chase is del.
2. floor heating heat insulation plate according to claim 1 is characterized in that: the two ends setting of described supportive grid.
3. floor heating heat insulation plate according to claim 1, it is characterized in that: described limit is not less than two.
4. floor heating heat insulation plate according to claim 1 is characterized in that: on the described wire casing lattice or propping bar be provided with slot; On the described wire casing lattice or propping bar be provided with the groove position.
5. according to floor heating heat insulation plate claimed in claim 1, it is characterized in that: described heat insulation plate body is styrofoam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103650498A CN102877631A (en) | 2012-09-26 | 2012-09-26 | Floor heating insulating board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103650498A CN102877631A (en) | 2012-09-26 | 2012-09-26 | Floor heating insulating board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102877631A true CN102877631A (en) | 2013-01-16 |
Family
ID=47479129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012103650498A Pending CN102877631A (en) | 2012-09-26 | 2012-09-26 | Floor heating insulating board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102877631A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003130377A (en) * | 2001-10-29 | 2003-05-08 | Motoaki Higashida | Floor heating panel |
| CN201003235Y (en) * | 2007-01-08 | 2008-01-09 | 董俊龙 | Composite floor heating insulating board |
| CN201093621Y (en) * | 2007-08-23 | 2008-07-30 | 宋建国 | Floor heating heat insulation plate |
| CN201991181U (en) * | 2011-01-19 | 2011-09-28 | 李健 | Floor heating module |
| CN202850454U (en) * | 2012-09-26 | 2013-04-03 | 天津好为节能环保科技发展有限公司 | Floor heating insulation board |
-
2012
- 2012-09-26 CN CN2012103650498A patent/CN102877631A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003130377A (en) * | 2001-10-29 | 2003-05-08 | Motoaki Higashida | Floor heating panel |
| CN201003235Y (en) * | 2007-01-08 | 2008-01-09 | 董俊龙 | Composite floor heating insulating board |
| CN201093621Y (en) * | 2007-08-23 | 2008-07-30 | 宋建国 | Floor heating heat insulation plate |
| CN201991181U (en) * | 2011-01-19 | 2011-09-28 | 李健 | Floor heating module |
| CN202850454U (en) * | 2012-09-26 | 2013-04-03 | 天津好为节能环保科技发展有限公司 | Floor heating insulation board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130116 |