CN102873364A - Method for machining micropores on glass sealed alloy - Google Patents

Method for machining micropores on glass sealed alloy Download PDF

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Publication number
CN102873364A
CN102873364A CN2012103724097A CN201210372409A CN102873364A CN 102873364 A CN102873364 A CN 102873364A CN 2012103724097 A CN2012103724097 A CN 2012103724097A CN 201210372409 A CN201210372409 A CN 201210372409A CN 102873364 A CN102873364 A CN 102873364A
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China
Prior art keywords
glass sealing
machining
cooling fluid
tool
alloy
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CN2012103724097A
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CN102873364B (en
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苏勇
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ZUNYI CITY FEIYU ELECTRONIC CO Ltd
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ZUNYI CITY FEIYU ELECTRONIC CO Ltd
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  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Drilling And Boring (AREA)

Abstract

The invention discloses a method for machining micropores on glass sealed alloy. The method for drilling and machining the micropores on the glass sealed alloy mainly includes steps of (1), selecting a tool material; (2), selecting machining equipment; (3), setting cutting parameters; (4), drilling and machining the micropores; and (5), supplying cooling liquid. Tungsten-cobalt hard alloy is used as the tool material; a cam adjusting mechanism is additionally arranged on a feeding device of the machining equipment, so that automatic tool retracting and feeding effects can be realized; and the cooling liquid is timely delivered and supplied by a cooling liquid supply mechanism, so that defects of nondurable property, easiness in bending and burning, frequent seizure and the like of an existing tool due to tool adhesion, difficulty in chip removal and high hardness are overcome, production efficiency is greatly improved, and the service life of a tool is prolonged.

Description

A kind of method at glass sealing alloy processing micropore
Technical field
The invention belongs to the electronic component processing technique field, relate to a kind of method at glass sealing alloy processing micropore.
Background technology
Glass sealing alloy is again iron cobalt nickel alloy, because it has good electric conductivity, so be used widely in electronics industry.But glass sealing alloy hardness is high, sticking cutter, the chip removal performance is bad, tend to cause cutter be not durable, easy to break, the fault such as often kill, easily burn.So on glass sealing alloy during machining hole, seem and be not easy, especially process diameter less than φ 0.6mm, the degree of depth is just more difficult when surpassing the micropore of 3mm, for addressing the above problem, mainly be that the method for controlling artificially step feed solves at present, although this method is simple, but control not in placely, production efficiency is low.Therefore the processing method of exploring such micropore never stopped so far.
Summary of the invention
The present invention is directed at glass sealing alloy processing diameter less than φ 0.6mm, the degree of depth surpasses the existing technical difficulty of micropore of 3mm, high around glass sealing alloy hardness, sticking cutter, is difficult for the technical barrier of chip removal, and a kind of method at glass sealing alloy processing micropore is provided.
The objective of the invention is to be achieved by following technical solution.
A kind of method at glass sealing alloy processing micropore, mainly realize drilling processing micropore on glass sealing alloy as follows:
(1) selects cutter material: adopt the W-Co kind carbide alloy as cutter material;
(2) Choice and process equipment: process equipment is selected the miniature precision lathe, and has installed cam adjustment mechanism additional at the feed arrangement of miniature precision lathe, can realize the effect of automatic withdrawal and feed;
(3) set cutting parameter: feed speed is that 0.05-0.15mm/ turns, and the speed of mainshaft is 1500-4500 rev/min;
(4) drilling processing micropore: after setting such as the described cutting parameter of step (3), carry out capillary processing at glass sealing alloy;
(5) supply cooling fluid: in the described drilling processing micropore process such as step (4), adopt cooling fluid supply establishment in time to carry and the supply cooling fluid, iron filings can be washed out and get rid of to cooling on the other hand on the one hand.
Cooling fluid in the described step (5) adopts high-pressure coolant, and its cooling fluid pressure is 0.2~0.8Mpa.
Feed speed is that 0.1mm/ turns in the described step (3), and the speed of mainshaft is 4000 rev/mins.
Cooling fluid pressure is 0.5Mpa in the described step (5).
The invention has the beneficial effects as follows:
Compared with prior art, the present invention overcome because of sticking cutter, be difficult for chip removal, hardness high cause cutter be not durable, easy to break, the fault such as often kill, easily burn, greatly enhance productivity, prolong cutting-tool's used life.Technique of the present invention is simple, and is safe and reliable, easy to implement, and successful can extensively promote the use in machinery, electronics processing industry.
Description of drawings
Fig. 1 is process chart of the present invention.
The specific embodiment
Further describe technical scheme of the present invention below in conjunction with accompanying drawing, but that claimed scope is not limited to is described.
As shown in Figure 1, a kind of method at glass sealing alloy processing micropore of the present invention, mainly realize drilling processing micropore on glass sealing alloy as follows:
(1) select cutter material: adopt the W-Co kind carbide alloy as cutter material, through multiple contrast process, practical W-Co kind carbide alloy is more durable;
(2) Choice and process equipment: process equipment is selected miniature precision lathe CM6125, and has installed cam adjustment mechanism additional at the feed arrangement of miniature precision lathe CM6125, can realize the effect of automatic withdrawal and feed; This feeding adjusting mechanism can realize that the degree of depth of each feed is gradually to increase function, each working depth reaches approximately 0.15-0.2mm, can automatically carry out withdrawing, this moment, cooling fluid was under High Pressure, pour in the hole, and the iron filings in the hole are discharged, so pass through 15-20 repeatedly feed, withdrawing and cooling, just with the capillary processing of dark approximately 3mm out.Adopt this device, so that intermittent advance during tool feeding in time allows cooling fluid enter working environment and reduces temperature, the simultaneously timely dialysis of interrupted cut iron filings;
(3) set cutting parameter: feed speed is that 0.05-0.15mm/ turns, and the speed of mainshaft is 1500-4500 rev/min;
(4) drilling processing micropore: after setting such as the described cutting parameter of step (3), carry out capillary processing at glass sealing alloy;
(5) supply cooling fluid: in the described drilling processing micropore process such as step (4), adopt cooling fluid supply establishment in time to carry and the supply cooling fluid, iron filings can be washed out and get rid of to cooling on the other hand on the one hand.
Cooling fluid in the described step (5) adopts high-pressure coolant, and its cooling fluid pressure is 0.2~0.8Mpa.
Feed speed is that 0.1mm/ turns in the described step (3), and the speed of mainshaft is 4000 rev/mins.
Cooling fluid pressure is 0.5Mpa in the described step (5).

Claims (4)

1. method at glass sealing alloy processing micropore is characterized in that: mainly realize as follows drilling processing micropore on glass sealing alloy:
(1) selects cutter material: adopt the W-Co kind carbide alloy as cutter material;
(2) Choice and process equipment: process equipment is selected the miniature precision lathe, and installs cam adjustment mechanism additional at the feed arrangement of miniature precision lathe, can realize the effect of automatic withdrawal and feed;
(3) set cutting parameter: feed speed is that 0.05-0.15mm/ turns, and the speed of mainshaft is 1500-4500 rev/min;
(4) drilling processing micropore: after setting such as the described cutting parameter of step (3), carry out capillary processing at glass sealing alloy;
(5) supply cooling fluid: in the described drilling processing micropore process such as step (4), adopt cooling fluid supply establishment in time to carry and the supply cooling fluid, iron filings can be washed out and get rid of to cooling on the other hand on the one hand.
2. a kind of method at glass sealing alloy processing micropore according to claim 1, it is characterized in that: cooling fluid pressure is 0.2~0.8Mpa in the described step (5).
3. a kind of method at glass sealing alloy processing micropore according to claim 1, it is characterized in that: feed speed is that 0.1mm/ turns in the described step (3), and the speed of mainshaft is 4000 rev/mins.
4. a kind of method at glass sealing alloy processing micropore according to claim 2, it is characterized in that: cooling fluid pressure is 0.5Mpa in the described step (5).
CN201210372409.7A 2012-09-28 2012-09-28 A kind of method of processing micropore on glass sealing alloy Active CN102873364B (en)

Priority Applications (1)

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CN201210372409.7A CN102873364B (en) 2012-09-28 2012-09-28 A kind of method of processing micropore on glass sealing alloy

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Application Number Priority Date Filing Date Title
CN201210372409.7A CN102873364B (en) 2012-09-28 2012-09-28 A kind of method of processing micropore on glass sealing alloy

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CN102873364B CN102873364B (en) 2015-10-28

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110014328A (en) * 2019-04-16 2019-07-16 广州锻造一厂股份有限公司 A kind of machining process of coolant liquid and stainless steel material

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01183335A (en) * 1988-01-19 1989-07-21 Nissei Plastics Ind Co Machining method
CN2820392Y (en) * 2005-10-19 2006-09-27 崔建国 Multihole automatic driller for lock
CN201102086Y (en) * 2007-07-26 2008-08-20 徐炜 Self-feeding transmission device of desk type grooved bit
CN201415274Y (en) * 2009-06-13 2010-03-03 孙福祥 Drilling device of drill machine
CN102069209A (en) * 2010-12-22 2011-05-25 北京控制工程研究所 Micropore drilling machining method of copper alloy and copper alloy parts
CN102335775A (en) * 2011-09-14 2012-02-01 中国航空工业第六一八研究所 High-precision microbore drilling and machining method suitable for numerical control machining

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01183335A (en) * 1988-01-19 1989-07-21 Nissei Plastics Ind Co Machining method
CN2820392Y (en) * 2005-10-19 2006-09-27 崔建国 Multihole automatic driller for lock
CN201102086Y (en) * 2007-07-26 2008-08-20 徐炜 Self-feeding transmission device of desk type grooved bit
CN201415274Y (en) * 2009-06-13 2010-03-03 孙福祥 Drilling device of drill machine
CN102069209A (en) * 2010-12-22 2011-05-25 北京控制工程研究所 Micropore drilling machining method of copper alloy and copper alloy parts
CN102335775A (en) * 2011-09-14 2012-02-01 中国航空工业第六一八研究所 High-precision microbore drilling and machining method suitable for numerical control machining

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
叶伟昌: "《微孔的机械加工》", 《机械制造》 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110014328A (en) * 2019-04-16 2019-07-16 广州锻造一厂股份有限公司 A kind of machining process of coolant liquid and stainless steel material

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Denomination of invention: A method for machining micropores on glass sealing alloy

Effective date of registration: 20220126

Granted publication date: 20151028

Pledgee: China Construction Bank Corporation Zunyi branch

Pledgor: ZUNYI CITY FEIYU ELECTRON CO.,LTD.

Registration number: Y2022520000007

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Granted publication date: 20151028

Pledgee: China Construction Bank Corporation Zunyi branch

Pledgor: ZUNYI CITY FEIYU ELECTRON CO.,LTD.

Registration number: Y2022520000007

PC01 Cancellation of the registration of the contract for pledge of patent right