CN102865969B - 压力传感器温度特性的测试装置 - Google Patents
压力传感器温度特性的测试装置 Download PDFInfo
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US9571904B2 (en) * | 2013-11-21 | 2017-02-14 | Ge Healthcare Bio-Sciences Ab | Systems and methods for status indication in a single-use biomedical and bioprocess system |
CN107664556B (zh) * | 2017-09-27 | 2019-12-31 | 安徽格太信控科技有限公司 | 一种压力传感器温度特性的测试装置 |
CN108362321B (zh) * | 2017-12-26 | 2021-02-05 | 清华大学苏州汽车研究院(吴江) | 一种超声波传感器高温测试方法及系统 |
CN108709688A (zh) * | 2018-07-20 | 2018-10-26 | 江苏集萃智能传感技术研究所有限公司 | 一种体内植入式压力传感器测试装置和方法 |
CN113865635A (zh) * | 2021-09-18 | 2021-12-31 | 温州大学 | 一种mems传感器校准装置 |
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CN1217157C (zh) * | 2002-10-24 | 2005-08-31 | 中国科学院电子学研究所 | 集成温湿度大气压力传感器芯片 |
US7517790B2 (en) * | 2002-10-31 | 2009-04-14 | International Business Machines Corporation | Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification |
US6845670B1 (en) * | 2003-07-08 | 2005-01-25 | Freescale Semiconductor, Inc. | Single proof mass, 3 axis MEMS transducer |
JP5445065B2 (ja) * | 2009-11-25 | 2014-03-19 | セイコーエプソン株式会社 | 剪断力検出素子、触覚センサー、および把持装置 |
CN202853845U (zh) * | 2012-09-28 | 2013-04-03 | 江苏物联网研究发展中心 | 压力传感器温度特性的测试装置 |
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Effective date of registration: 20210105 Address after: 610200 in the concentration area of Chengdu Xingu Industrial Park, Dongsheng Street, Shuangliu District, Chengdu City, Sichuan Province Patentee after: China core Microelectronics Technology Chengdu Co.,Ltd. Address before: 100029 room 328, building 15, 3 Beitucheng West Road, Chaoyang District, Beijing Patentee before: Beijing Zhongke micro Investment Management Co.,Ltd. |