CN102848518A - Injection molding production technique of IML (In Mold Labelling) ultrathin workpieces - Google Patents
Injection molding production technique of IML (In Mold Labelling) ultrathin workpieces Download PDFInfo
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- CN102848518A CN102848518A CN2012103478251A CN201210347825A CN102848518A CN 102848518 A CN102848518 A CN 102848518A CN 2012103478251 A CN2012103478251 A CN 2012103478251A CN 201210347825 A CN201210347825 A CN 201210347825A CN 102848518 A CN102848518 A CN 102848518A
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- iml
- injection molding
- injection moulding
- low pressure
- production technique
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Abstract
The invention discloses an injection molding production technique of IML (In Mold Labelling) ultrathin workpieces, and the technique comprises the following steps: fulfilling an injection molding die cavity at a high injection pressure of 180-240MPa, immediately performing high pressure maintaining on the injection molding die cavity for 0.2-0.6s, transferring to low pressure maintaining operation and keeping for 2-4s. Compared with the prior art, the injection molding production technique disclosed by the invention overcomes the technology prejudice of immediately performing high pressure maintaining for 0.2-0.6s after fulfilling the injection molding die cavity and transferring to the low pressure maintaining operation for 2-4s, so that the concave deformation and smoothness problems of the IML products can be solved when forming IML products smaller than 1.0mm, and qualified IML products are formed.
Description
Technical field
The present invention relates to the Shooting Technique field, relate in particular ultra-thin injection moulding production technology of a kind of IML.
Background technology
IML technique is good by overmolding machine Forming moulding the Film film printing, produces i.e. in-mode inserts injection moulding in the injection mold through being placed into after shearing again.This Film film generally is divided into three layers of base material, ink lay and glueing materials, after injection moulding is finished, adhesive effect by glueing material is combined closely Film film and plastic cement and is combined together, because the base material of front surface own is at outermost layer, therefore have wear-resisting and effect scratch resistant.
In existing IML technique, when the attached module thickness of IML during less than 1.20mm, will occur being difficult for walking glue, red ink, the uneven distortion of flatness and drawing the phenomenons such as recessed, thus so that since the IML product history, can only accomplish the above thickness of 1.20mm.
But, along with day by day fierce market competition and the people continuous pursuit to the little thinning of product, so that the IML product of 1.20mm thickness can't adapt to fierce market competition gradually.
In view of this, the defects further investigation of the inventor during for existing IML product injection moulding has this case to produce then.
Summary of the invention
The object of the present invention is to provide ultra-thin injection moulding production technology of a kind of IML, can't mold the problem of the following thickness qualified products of 1.20mm to solve existing IML technique when the injection moulding.
In order to reach above-mentioned purpose, solution of the present invention is:
Ultra-thin injection moulding production technology of a kind of IML depressed shooting high of 180MPa to 240MPa scope the injection moulding die cavity made, and changes at once 0.2s to 0.6s under the high pressurize over to, changes low pressure holding over to again and continues 2s to 4s.
Further, the pressure of this high pressurize is in the scope of 170MPa to 190MPa.
Further, the pressure of this low pressure holding is in the scope of 40MPa to 65MPa.
After adopting said structure, ultra-thin injection moulding production technology of a kind of IML that the present invention relates to, it is after making the injection moulding die cavity, carry out immediately the high pressurize of 0.2s to 0.6s, and then change the low pressure holding of 2s to 4s over to, so when the IML product that is used for below the moulding 1.0mm, can solve recessed distortion and the flatness problem of drawing.Compared with prior art, the present invention has overcome the technology prejudice of conventional art, adopts the high pressurize of short time and the low pressure holding of long period to realize injection moulding, and has reached unexpected technique effect.
Description of drawings
Fig. 1 is the flow chart that the present invention relates to ultra-thin injection moulding production technology of a kind of IML.
The specific embodiment
In order further to explain technical scheme of the present invention, the present invention will be described in detail below by specific embodiment.
As shown in Figure 1, ultra-thin injection moulding production technology of a kind of IML that the present invention relates to, it comprises the steps:
S100: depress shooting high of 180MPa to 240MPa scope the injection moulding die cavity is made;
S200: change at once 0.2s to 0.6s under the high pressurize over to;
S300: change again low pressure holding over to and continue 2s to 4s.
Preferably, in step S200, the pressure of this high pressurize is in the scope of 170MPa to 190MPa; And in step S300, the pressure of this low pressure holding is in the scope of 40MPa to 65MPa.
In step S100, to press less than 180MPa if penetrate, the flowability of injection moulding this moment liquid then can variation, thereby so that the IML product flatness that forms out does not reach the certified products requirement; Particularly, can adopt in this step and walk fast glue and walk at a slow speed the mode that glue combines and realize making product, this speed of walking fast glue is 100 to 150mm/s, this speed of walking at a slow speed glue is 2 to 10mm/s, specifically features of shape and the injection moulding experience according to product realizes, the problem that solves red ink then is to solve by reasonable adjusting injection position and the speed of walking glue speed.In step S200, when the high dwell time is lower than 0.2s, do not reach effect, and when being higher than 0.6s, cohesive force can become large between glue and the diaphragm.
Like this, the present invention carries out the high pressurize of 0.2s to 0.6s immediately after the injection moulding die cavity is made, and then changes the low pressure holding of 2s to 4s over to, so when the IML product that is used for below the moulding 1.0mm, can solve the problem that the IML product draws recessed distortion and flatness.
The below overcomes technology prejudice to the present invention and is elaborated:
In existing Shooting Technique, in order to improve the quality of product, generally be the realizing of mode of adopting long-time low pressure holding, namely regulate size and burr with pressure; Particularly for high pressurize, then tend to have influence on because it produces burr the size of product.
The present invention then overcomes above-mentioned technology prejudice, adopt the high pressurize of 0.2s to 0.6s, and then the mode that changes the low pressure holding of 2s to 4s over to realizes the moulding to ultra-thin IML product, the selection of time of especially high pressurize and low pressure holding, greatly guarantee the injection mo(u)lding quality, so produced unexpected technique effect.
Above-mentioned carrying out is illustrated injection moulding in the IML forming process, in whole IML moulding process, comprises in fact altogether the forming sheet material, sheet material put into the steps such as mould, injection machine moulding, qualified ultra-thin IML product.
Utilize above-mentioned production technology, this enterprise has realized the exploitation to place an order:
A-exploitation OPPO-12007 battery cover wall thickness 1.0mm, width 59.68mm, length 112.48mm.Successfully changed volume production over to, delivery is to client's hundreds of thousands spare.
Above-described embodiment and graphic and non-limiting product form of the present invention and style, any person of an ordinary skill in the technical field all should be considered as not breaking away from patent category of the present invention to its suitable variation or modification of doing.
Claims (3)
1. ultra-thin injection moulding production technology of an IML is characterized in that, depresses shooting high of 180MPa to 240MPa scope the injection moulding die cavity is made, and changes at once 0.2s to 0.6s under the high pressurize over to, changes low pressure holding over to again and continues 2s to 4s.
2. ultra-thin injection moulding production technology of a kind of IML as claimed in claim 1 is characterized in that, the pressure of this high pressurize is in the scope of 170MPa to 190MPa.
3. ultra-thin injection moulding production technology of a kind of IML as claimed in claim 1 is characterized in that, the pressure of this low pressure holding is in the scope of 40MPa to 65MPa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210347825.1A CN102848518B (en) | 2012-09-18 | 2012-09-18 | Injection molding production technique of IML (In Mold Labelling) ultrathin workpieces |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210347825.1A CN102848518B (en) | 2012-09-18 | 2012-09-18 | Injection molding production technique of IML (In Mold Labelling) ultrathin workpieces |
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| Publication Number | Publication Date |
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| CN102848518A true CN102848518A (en) | 2013-01-02 |
| CN102848518B CN102848518B (en) | 2014-12-10 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103660169A (en) * | 2013-11-29 | 2014-03-26 | 福建省石狮市通达电器有限公司 | Ultra-large type injection mould adopting IMF process |
| CN106273277A (en) * | 2016-08-31 | 2017-01-04 | 深圳天珑无线科技有限公司 | The method that plastic mould and employing plastic mould carry out being molded |
| CN111070556A (en) * | 2018-10-18 | 2020-04-28 | 苏州工业园区帝冉智能科技有限公司 | Manufacturing method of PIN nail special for circuit board printing |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101439575A (en) * | 2008-12-26 | 2009-05-27 | 北京东明兴业科技有限公司 | Injection molding process of thin wall plastic products |
-
2012
- 2012-09-18 CN CN201210347825.1A patent/CN102848518B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101439575A (en) * | 2008-12-26 | 2009-05-27 | 北京东明兴业科技有限公司 | Injection molding process of thin wall plastic products |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103660169A (en) * | 2013-11-29 | 2014-03-26 | 福建省石狮市通达电器有限公司 | Ultra-large type injection mould adopting IMF process |
| CN103660169B (en) * | 2013-11-29 | 2016-02-17 | 福建省石狮市通达电器有限公司 | A kind of ultra-large type IMF technique injection mold |
| CN106273277A (en) * | 2016-08-31 | 2017-01-04 | 深圳天珑无线科技有限公司 | The method that plastic mould and employing plastic mould carry out being molded |
| CN106273277B (en) * | 2016-08-31 | 2018-09-28 | 深圳天珑无线科技有限公司 | Plastic mould and the method being molded using plastic mould |
| CN111070556A (en) * | 2018-10-18 | 2020-04-28 | 苏州工业园区帝冉智能科技有限公司 | Manufacturing method of PIN nail special for circuit board printing |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102848518B (en) | 2014-12-10 |
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| C53 | Correction of patent of invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Wang Yayu Inventor after: Xiong Jinan Inventor after: Lin Kejun Inventor before: Wang Yayu Inventor before: Li Minglang |
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| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: WANG YAYU LI MINGLANG TO: WANG YAYU XIONG JINAN LIN KEJUN |
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| C14 | Grant of patent or utility model | ||
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Effective date of registration: 20210628 Address after: 1800 Gangkou Avenue, Haijiang Town, Shishi City, Quanzhou City, Fujian Province Patentee after: Tongda (Shishi) Technology Co.,Ltd. Address before: 362700 Tongda Industrial Park, Shishi City, Quanzhou City, Fujian Province Patentee before: FUJIAN SHISHI TONGDA ELECTRICAL APPLIANCE Co.,Ltd. |