CN102833991B - A kind of protection lid of printed circuit board - Google Patents
A kind of protection lid of printed circuit board Download PDFInfo
- Publication number
- CN102833991B CN102833991B CN201210250614.6A CN201210250614A CN102833991B CN 102833991 B CN102833991 B CN 102833991B CN 201210250614 A CN201210250614 A CN 201210250614A CN 102833991 B CN102833991 B CN 102833991B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- protection lid
- material layer
- electromagnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 claims abstract description 37
- 230000005670 electromagnetic radiation Effects 0.000 claims abstract description 10
- 238000010521 absorption reaction Methods 0.000 claims abstract description 9
- 229910000859 α-Fe Inorganic materials 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 229940087654 iron carbonyl Drugs 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 238000012163 sequencing technique Methods 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- -1 iron carbonyl Inorganic materials 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 3
- 230000005672 electromagnetic field Effects 0.000 abstract 2
- 238000004891 communication Methods 0.000 description 5
- 238000007639 printing Methods 0.000 description 2
- 239000011358 absorbing material Substances 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000021715 photosynthesis, light harvesting Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0029—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials intermixed with electro-conductive particles
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Embodiments provide the protection lid of a kind of printed circuit board; the electromagnetic radiation of printed circuit board can be shielded; and the electromagnetic field outside printed circuit board (PCB) can not only be prevented for the electromagnetic interference of this printed circuit board (PCB), also can prevent the electromagnetic field electromagnetic interference for its outside electronic component of printed circuit board (PCB). This protection lid includes protection lid body, and described protection lid body is fixed on described printed circuit board, and described protection lid body is provided with the material layer of electromagnetic wave absorption. The embodiment of the present invention is applicable to printed circuit board technology field.
Description
Technical field
The present invention relates to printed circuit board technology field, particularly relate to the protection lid of a kind of printed circuit board.
Background technology
Printing board PCB (PrintedCircuitBoard) is to adopt electron printing to make, with insulation board for base material, it is cut into certain size, at least with a conductive pattern on it, and cloth porose (such as component hole, fastener hole, plated through-hole etc.), it is used for replacing the chassis of conventional device electronic devices and components, it is achieved being connected with each other between electronic devices and components.
Owing to printed circuit board being laid with electronic devices and components, in the circuit design process of printed circuit board, so often it is required for carrying out the design of electromagnetic shielding, evades the electromagnetic interference of electronic devices and components with this. Design of Electromagnetic Shielding of the prior art generally adopts circuit design to evade certain electromagnetic interference, or alternate manner evades electromagnetic interference, but generally make the complex circuit designs of printed circuit board or the shell structure complexity of carrying printed circuit board so that manufacturing cost increases.
Summary of the invention
Embodiments of the invention provide the protection lid of a kind of printed circuit board, it is possible to effectively shield the electromagnetic interference of printed circuit board, can reduce the cost of printed circuit board simultaneously.
For reaching above-mentioned purpose, embodiments of the invention adopt the following technical scheme that
The protection lid of a kind of printed circuit board, this protection lid includes protection lid body, and described protection lid body is fixed on described printed circuit board, and described protection lid body is provided with the material layer of electromagnetic wave absorption.
Optionally, the height of the described material layer that described protection lid body is provided with is 0.5mm-5mm.
Optionally, the electromagnetic wave radiant intensity that the density of described material layer shields as required is determined.
Optionally, the electromagnetic frequency that the height of described material layer shields as required is determined.
Optionally, described material layer is any one in following material: complex ferrite, carborundum, graphite, ferrite, iron carbonyl, metal fine powder.
Optionally, the structure of described material layer is wedge shape micro structure.
The protection lid of the printed circuit board that the embodiment of the present invention provides; printed circuit board is protected owing to described protection lid is fixed on described printed circuit board; described protection lid body is provided with the material layer of electromagnetic wave absorption simultaneously; so can effectively shield the electromagnetic radiation of electronic devices and components on printed circuit board; the modes such as circuit design can be adopted to shield electromagnetic interference simultaneously, and then effectively reduce the cost of printed circuit board.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
The structural representation of the protection lid of a kind of printed circuit board that Fig. 1 provides for the embodiment of the present invention;
Fig. 2 is the structural representation of the protection lid of the printed circuit board of the drive circuit of protection liquid carrying LCD panel.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments. Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of protection of the invention.
The protection lid 10 of the printed circuit board that the embodiment of the present invention provides, as it is shown in figure 1, the material layer 12 of bag protection lid body 11 and electromagnetic wave absorption, described material layer 12 is located on described protection lid body 11. Described protection lid 10 is fixed on described printed circuit board; it is used for protecting described printed circuit board on the one hand; absorbed the electromagnetic radiation of the electronic devices and components on described printed circuit board on the other hand by described material layer 12, described material layer 12 converts the electromagnetic wave of absorption to heat energy or other energy dissipation is fallen. Wherein, described protection lid 10 can being provided with connection member, this connection member may be used for being fixed on described printed circuit board by described protection lid 10, such as screw. It is of course also possible to adopt glue class to be fixed on described printed circuit board by described protection lid 10.
Further, described protection lid 10 is used for protecting described printed circuit board, and the shape of so described protection lid 10 is determined according to the shape of described printed circuit board.
Optionally, the height of described material layer 12 is 05mm-5mm.
Optionally, the electromagnetic radiation intensity that the density of described material layer 12 can shield as required is determined.
For example, shown in Figure 2, Fig. 2 is the protection lid 20 of the printed circuit board of the drive circuit of protection liquid carrying LCD panel, for being used for driving the drive circuit of display panels, the electromagnetic interference of the electronic devices and components A of usual sequencing contro is maximum, so can protection lid 20 to should printed circuit board sequencing contro electronic devices and components A region increase material layer 12 density, preferably, the density of the material layer 12 in the region of the corresponding electronic devices and components A of protection lid can be 2-10 times that the density of the material layer 12 in other region is covered in protection, such that it is able to better shield the electromagnetic interference of printed circuit board.
Optionally, the wave frequency that the height of the material layer 12 of described protection lid can shield as required is determined. Assume that printed circuit board is for having the equipment of network communication function, in order to prevent the electromagnetic radiation impact on network communication function, it is possible to determine the height of described material layer 12 according to the operating frequency of this communication function.
Such as, there is the electronic equipment of the WiFi communication function of 2.4GHZ working frequency range, in order to shield electronic devices and components on the printed circuit board electromagnetic interference to the WiFi communication function of 2.4GHZ working frequency range, the height of described material layer 12 can be determined according to this electromagnetic frequency 2.4GHZ.
Optionally, described material layer 12 is complex ferrite, it is possible to for electromagnetic wave absorption. If wherein described material layer 12 is complex ferrite, then the height of material layer 12 can adopt formula (1) to obtain:
Formula (1): h=c/f, wherein c is the light velocity, and f is the wave frequency of electromagnetic radiation.
For example, being 2.4GHZ electromagnetic radiation to shield wave frequency, the height of described complex ferrite is 1.25cm.
Optionally, described material layer 12 can also is that the absorbing materials such as carborundum, graphite, ferrite, iron carbonyl or metal fine powder.
Optionally, the structure of described material layer 12 can be wedge shape micro structure. Described wedge shape micro structure is commonly divided into tip and base portion two parts, adopts this wedge shape micro structure can realize good impedance matching, it is possible to better absorption of electromagnetic radiation.
The protection lid of the printed circuit board that the embodiment of the present invention provides; described protection lid is fixed on described printed circuit board and protects printed circuit board; described protection lid body is provided with the material layer of electromagnetic wave absorption simultaneously; so can effectively shield the electromagnetic radiation of electronic devices and components on printed circuit board; the modes such as circuit design can be adopted to shield electromagnetic interference simultaneously, and then effectively reduce the cost of printed circuit board.
The above; being only the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, any those familiar with the art is in the technical scope that the invention discloses; change can be readily occurred in or replace, all should be encompassed within protection scope of the present invention. Therefore, protection scope of the present invention should be as the criterion with described scope of the claims.
Claims (3)
1. a protection lid for printed circuit board, including protection lid body, described protection lid is for fixing on a printed circuit board, it is characterised in that described protection lid also includes the material layer of electromagnetic wave absorption, and described material layer is located on described protection lid body; Wherein, the drive circuit of printed circuit board (PCB) liquid carrying LCD panel, for being used for driving the drive circuit of display panels, the density of the protection cover material layer in the electronic devices and components region of corresponding sequencing contro is 2-10 times that the density of the material layer in other regions is covered in described protection;
Described material layer is any one in following material: complex ferrite, carborundum, graphite, ferrite, iron carbonyl, metal fine powder; The height of described material layer is 0.5mm-5mm.
2. protection lid according to claim 1, it is characterised in that the electromagnetic radiation intensity that the density of described material layer shields as required is determined.
3. the protection lid according to any one of claim 1-2, it is characterised in that the structure of described material layer is wedge shape micro structure.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210250614.6A CN102833991B (en) | 2012-07-19 | 2012-07-19 | A kind of protection lid of printed circuit board |
| PCT/CN2012/086383 WO2014012329A1 (en) | 2012-07-19 | 2012-12-11 | Protective cover of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210250614.6A CN102833991B (en) | 2012-07-19 | 2012-07-19 | A kind of protection lid of printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102833991A CN102833991A (en) | 2012-12-19 |
| CN102833991B true CN102833991B (en) | 2016-06-08 |
Family
ID=47336875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210250614.6A Expired - Fee Related CN102833991B (en) | 2012-07-19 | 2012-07-19 | A kind of protection lid of printed circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102833991B (en) |
| WO (1) | WO2014012329A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107300956B (en) * | 2017-07-03 | 2020-05-19 | 英业达科技有限公司 | Noise suppression assembly and mainboard with same |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2737088Y (en) * | 2004-03-30 | 2005-10-26 | 杨国清 | Radiation proof handset cover |
| CN101005754A (en) * | 2006-01-17 | 2007-07-25 | 华为技术有限公司 | Device for screening electromagnetic wave interference |
| CN101346059A (en) * | 2007-07-12 | 2009-01-14 | 阿尔卑斯电气株式会社 | Electromagnetic wave restraint sheet metal |
| CN201429632Y (en) * | 2009-07-06 | 2010-03-24 | 北京邮电大学 | Portable electromagnetic shielded box |
| CN201601710U (en) * | 2010-03-19 | 2010-10-06 | 程春雷 | Radiation protection handset |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6309742B1 (en) * | 2000-01-28 | 2001-10-30 | Gore Enterprise Holdings, Inc. | EMI/RFI shielding gasket |
| CN102523731A (en) * | 2011-12-06 | 2012-06-27 | 惠州Tcl移动通信有限公司 | Mobile terminal |
-
2012
- 2012-07-19 CN CN201210250614.6A patent/CN102833991B/en not_active Expired - Fee Related
- 2012-12-11 WO PCT/CN2012/086383 patent/WO2014012329A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2737088Y (en) * | 2004-03-30 | 2005-10-26 | 杨国清 | Radiation proof handset cover |
| CN101005754A (en) * | 2006-01-17 | 2007-07-25 | 华为技术有限公司 | Device for screening electromagnetic wave interference |
| CN101346059A (en) * | 2007-07-12 | 2009-01-14 | 阿尔卑斯电气株式会社 | Electromagnetic wave restraint sheet metal |
| CN201429632Y (en) * | 2009-07-06 | 2010-03-24 | 北京邮电大学 | Portable electromagnetic shielded box |
| CN201601710U (en) * | 2010-03-19 | 2010-10-06 | 程春雷 | Radiation protection handset |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102833991A (en) | 2012-12-19 |
| WO2014012329A1 (en) | 2014-01-23 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160608 |
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| CF01 | Termination of patent right due to non-payment of annual fee |