CN102829669A - Heat dissipation module and manufacture method thereof - Google Patents
Heat dissipation module and manufacture method thereof Download PDFInfo
- Publication number
- CN102829669A CN102829669A CN2011101626733A CN201110162673A CN102829669A CN 102829669 A CN102829669 A CN 102829669A CN 2011101626733 A CN2011101626733 A CN 2011101626733A CN 201110162673 A CN201110162673 A CN 201110162673A CN 102829669 A CN102829669 A CN 102829669A
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- Prior art keywords
- groove
- radiation module
- heat radiation
- heat
- pedestal
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Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 230000017525 heat dissipation Effects 0.000 title abstract description 17
- 238000000034 method Methods 0.000 title abstract description 9
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 28
- 230000005855 radiation Effects 0.000 claims description 50
- 238000001816 cooling Methods 0.000 description 6
- 238000003466 welding Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a heat dissipation module and a manufacture method thereof. The heat dissipation module comprises a pedestal and at least one heat tube, wherein a slot is formed in one side of the pedestal, a groove is formed in the other side of the pedestal, and the slot is communicated with the groove; the heat tube is arranged in the slot; one side of the heat tube and the groove bottom are trimmed to directly contact a heat source. Therefore, the thermal resistance phenomenon can be prevented, the heat tube can be fixed, and the heat dissipation efficiency can be greatly improved.
Description
Technical field
A kind of heat radiation module and manufacturing approach thereof refer to that especially a kind of heat dissipation element sees through the assembling that cooperatively interacts and replaces tradition with heat radiation module and the manufacturing approach thereof of welding as combination.
Background technology
Existing heat abstractor and heat radiation module system see through the assembling of arranging in pairs or groups each other of a plurality of heat dissipation elements and form; These heat dissipation element systems are elements such as heat pipe, radiator, cooling base; These heat dissipation elements are arranged in pairs or groups each other and are combined main system to fix through welding; But to the made heat dissipation element of aluminium material if will carry out weld job, outside then not only need welding with the mode of extraordinary welding job, its processing cost also increases relatively.
Other is the person; Also there is industry technical staff these heat dissipation elements to be combined to fix with retaining elements such as screws; But retaining element only can carry out screw lock to the part heat dissipation element fixes (like radiating fin group and cooling base), and the mode that then can't directly see through screw lock to heat pipe is fixed.
Moreover; Known technology lies in this cooling base and offers hole or this groove that a hole or a groove are arranged in this heat pipe this cooling base; Make this heat pipe be able to combine with this cooling base, though this combination solves the problem of aforementioned welding and screw lock fixed form, heat pipe system sees through cooling base and conducts heat indirectly; Between the two easily because of having the phenomenon generation that the gap produces thermal resistance, so cause heat transfer efficiency not good.
The fixed form system of known technology heat dissipation element can't be applicable to the combination of various heat dissipation element, so known technology has disadvantage:
1. cost is higher;
2. inapplicable various heat dissipation element;
3. heat transfer efficiency is not good.
Summary of the invention
The present invention's main purpose is providing a kind of flexible heat radiation module that makes up between heat dissipation element that increases.
The present invention's secondary objective is providing a kind of heat radiation module that increases heat transfer efficiency.
The present invention's a purpose is again providing a kind of increase elasticity that makes up between heat dissipation element and the heat radiation module that increases heat transfer efficiency.
For reaching above-mentioned purpose the present invention system a kind of heat radiation module being provided, is to comprise: a pedestal, at least one heat pipe;
Said pedestal has one first plane and one second plane, and this first plane is arranged with at least one groove, and this second plane has a groove, and said groove is connected with this groove; This heat pipe correspondence is arranged in the aforementioned groove.
For reaching above-mentioned purpose the present invention system a kind of heat radiation module making method being provided, is to comprise the following step:
The pedestal and the plate body that provide at least one heat pipe and to have at least one groove;
Aforementioned heat pipe correspondence is arranged in the groove of this pedestal.
In this pedestal the opposite side of this groove is set, offers a slot part, make this slot part be communicated with aforementioned heat pipe with machining.
Seeing through above-mentioned heat radiation module and manufacturing approach thereof system can increase the hot transfer efficiency of heat radiation module, and the group that promotes between heat dissipation element is established elasticity.
Description of drawings
Fig. 1 is the three-dimensional exploded view of the present invention's heat radiation module first embodiment;
Fig. 2 is the three-dimensional combination figure of the present invention's heat radiation module first embodiment;
Fig. 3 is the three-dimensional combination figure of the present invention's heat radiation module second embodiment;
Fig. 4 is the three-dimensional combination figure of the present invention's heat radiation module the 3rd embodiment;
Fig. 5 a is the three-dimensional exploded view of the present invention's heat radiation module the 4th embodiment;
Fig. 5 b is the three-dimensional combination figure of the present invention's heat radiation module the 4th embodiment;
Fig. 6 is the three-dimensional exploded view of the present invention's heat radiation module the 5th embodiment;
Fig. 7 is the three-dimensional combination figure of the present invention's heat radiation module the 5th embodiment;
Fig. 8 is the three-dimensional exploded view of the present invention's heat radiation module the 6th embodiment;
Fig. 9 is the three-dimensional exploded view of the present invention's heat radiation module the 7th embodiment;
Figure 10 is the flow chart of steps of the present invention's heat radiation module making method first embodiment;
Figure 11 is the flow chart of steps of the present invention's heat radiation module making method second embodiment;
Figure 12 is the dispel the heat application sketch map of module of the present invention.
[main element symbol description]
Groove 113
Groove 114
Open sides 1141
Closed side 1142
First elongated end 115
Second elongated end 116
The 3rd elongated end 117
The 4th elongated end 118
Hole 119
Receive access slot 141
Convex body 142
Lock member 2
The specific embodiment
Characteristic on the present invention's above-mentioned purpose and structure thereof and the function will be explained according to appended graphic preferred embodiment.
Seeing also Fig. 1, Fig. 2, is that the solid that is the present invention's heat radiation module first embodiment is decomposed and constitutional diagram, and as shown in the figure, said heat radiation module 1 is to comprise: a pedestal 11, at least one heat pipe 12;
Said pedestal 11 has one first plane 111 and one second plane 112, and this first plane 111 is arranged with at least one groove 113, and this second plane 112 has a groove 114, and said groove 113 is connected with this groove 114.
Said heat pipe 12 correspondences are arranged in the aforementioned groove 113; This heat pipe 12 has more one first side 121 and one second side 122, and said first and second side 121,122 next-door neighbours also connect.
See also Fig. 3; System is the three-dimensional combination figure of the present invention's heat radiation module second embodiment; As shown in the figure; Present embodiment part-structure system is identical with aforementioned first embodiment so will repeat no more at this; Only not exist together be that said pedestal 11 for present embodiment has more one first elongated end 115 and one second elongated end 116 and one the 3rd elongated end 117 and one the 4th elongated end 118 for present embodiment and aforementioned first embodiment, and said first, second, third and fourth elongated end 115,116,117,118 has at least one hole 119 respectively.
See also Fig. 4; System is the three-dimensional combination figure of the present invention's heat radiation module the 3rd embodiment; As shown in the figure; Present embodiment part-structure system is identical with aforementioned first embodiment so will repeat no more at this, and it is that said groove 113 for present embodiment has more an open sides 1131 and a closed side 1132 that thought present embodiment and aforementioned first embodiment do not exist together, and the width of said open sides 1131 is less than the width of this closed side 1132.
See also Fig. 5 a, Fig. 5 b; System decomposes and constitutional diagram for the solid of the present invention's heat radiation module the 4th embodiment; As shown in the figure; Present embodiment part-structure system is identical with aforementioned first embodiment, and it is for present embodiment has more a plate body 13 that thought present embodiment and aforementioned first embodiment do not exist together so will repeat no more at this, and these plate body 13 correspondences are covered on first plane 111 of aforementioned pedestal 11.
See also Fig. 6, Fig. 7; System decomposes and constitutional diagram for the solid of the present invention's heat radiation module the 5th embodiment; As shown in the figure; Present embodiment part-structure system is identical with aforementioned the 4th embodiment so will repeat no more at this, and only not exist together be that four corners for the plate body 13 of present embodiment are provided with at least one hole 131 for present embodiment and aforementioned the 4th embodiment, and described hole 131 is can be through fixing with a lock member 2 and a substrate 3.
See also Fig. 8; System is the three-dimensional exploded view of the present invention's heat radiation module the 6th embodiment; As shown in the figure, present embodiment part-structure system is identical with aforementioned the 4th embodiment so will repeat no more at this, and it is that said heat radiation module 1 for present embodiment has more at least one combination section 14 that thought present embodiment and aforementioned first embodiment do not exist together; This combination section 14 has one and receives an access slot 141 and a convex body 142; This receives access slot 141 to be located at first plane 111 of this pedestal 11, this convex body 142 be located at 13 pairs of this plate bodys one of should first plane 111 side, and this convex body 142 receives access slot 141 corresponding fixings with this.
See also Fig. 9; System is the three-dimensional exploded view of the present invention's heat radiation module the 7th embodiment; As shown in the figure, present embodiment part-structure system is identical with aforementioned the 4th embodiment so will repeat no more at this, and it is that heat radiation module 1 for present embodiment has more at least one combination section 14 that thought present embodiment and aforementioned the 4th embodiment do not exist together; This combination section 14 has one and receives an access slot 141 and a convex body 142; This receive access slot 141 be located at 13 pairs of this plate bodys one of should first plane 111 side, this convex body 142 is located at first plane 111 of this pedestal 11, and this convex body 142 receives access slot 141 corresponding fixings with this.
Seeing also Figure 10, is the flow chart of steps for the present invention's heat radiation module making method first embodiment, and merges and to consult Fig. 1, Fig. 2, as schemes saidly, and said heat radiation module making method is to comprise the following step:
S1: provide at least one heat pipe and to have the pedestal of an at least one groove and a groove simultaneously;
System provides at least one heat pipe 12 and both sides to have the pedestal 11 of at least one groove 113 and groove 114 respectively.
S2: aforementioned heat pipe correspondence is arranged in the groove of this pedestal.
Seeing also Figure 11, is the flow chart of steps for the present invention's heat radiation module making method second embodiment, and merges and to consult Fig. 4 to Fig. 8, as schemes saidly, and said heat radiation module making method is to comprise the following step:
S1: the pedestal and the plate body that provide at least one heat pipe and to have an at least one groove and a groove simultaneously;
S2: aforementioned heat pipe correspondence is arranged in the groove of this pedestal;
S3 a: plate body is provided, and this plate body correspondence is covered aforementioned groove, and simultaneously this heat pipe is closed in this groove.
Present embodiment part steps system is identical with aforementioned first embodiment so will repeat no more at this, and the thought present embodiment is to be step S3 with not existing together of aforementioned first embodiment: cover aforementioned groove with a plate body is corresponding, and simultaneously this heat pipe is closed in this groove.
One plate body, 13 corresponding aforementioned pedestals 11 are had one of groove 113 side (i.e. first plane 111), and correspondence covers this groove 113, simultaneously this heat pipe 12 is closed in this groove 113.
See also Figure 12; System is the dispel the heat application sketch map of module of the present invention; As shown in the figure; The pedestal 1 of the present invention's heat radiation module 1 is to make first side 121 of heat pipe 12 and second side 122 contact thermal source 4 simultaneously, thereby increases radiating efficiency, and significantly increases use elasticity in the limited part of usage space.
Claims (11)
- One kind the heat radiation module, be to comprise:One pedestal has one first plane and one second plane, and this first plane is arranged with at least one groove, and this second plane has a groove, and said groove is connected with this groove;At least one heat pipe, this heat pipe correspondence is arranged in the aforementioned groove.
- 2. heat radiation module as claimed in claim 1, wherein this groove has more one first open sides and a bottom side, and the bottom that this groove has one second open sides and this bottom side, a bottom and this groove is interconnected.
- 3. heat radiation module as claimed in claim 1 wherein has more a plate body, and said plate body correspondence covers aforementioned groove.
- 4. heat radiation module as claimed in claim 3, wherein said plate body four corners are provided with at least one hole.
- 5. heat radiation module as claimed in claim 3; Wherein have more at least one combination section, this combination section has one and receives an access slot and a convex body, and this receives access slot to be located at second plane of this pedestal; This convex body be located at this plate body to one of should second plane side, and this convex body receives the corresponding fixing of access slot with this.
- 6. heat radiation module as claimed in claim 3; Wherein have more at least one combination section, this combination section has one and receives an access slot and a convex body, this receive access slot be located at this plate body to one of should second plane side; This convex body is located at second plane of this pedestal, and this convex body receives the corresponding fixing of access slot with this.
- 7. heat radiation module as claimed in claim 1, wherein this heat pipe has more one first side and one second side, and said first and second side next-door neighbour also connects.
- 8. heat radiation module as claimed in claim 1, wherein said pedestal have more one first elongated end and one second elongated end and one the 3rd elongated end and one the 4th elongated end, and said first, second, third and fourth elongated end has at least one hole respectively.
- 9. heat radiation module as claimed in claim 1, wherein said groove have more an open sides and a closed side, and the width of said open sides is greater than the width of this closed side.
- One kind the heat radiation module manufacturing approach, be to comprise the following step:Provide at least one heat pipe and to have the pedestal of an at least one groove and a groove simultaneously;Aforementioned heat pipe correspondence is arranged in the groove of this pedestal.
- 11. the manufacturing approach of heat radiation module as claimed in claim 10, wherein more comprising a step provides a plate body, and this plate body correspondence is covered aforementioned groove, and simultaneously this heat pipe is closed in this groove
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201110162673.3A CN102829669B (en) | 2011-06-16 | 2011-06-16 | Heat radiation module and manufacture method thereof |
Applications Claiming Priority (1)
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CN201110162673.3A CN102829669B (en) | 2011-06-16 | 2011-06-16 | Heat radiation module and manufacture method thereof |
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CN102829669A true CN102829669A (en) | 2012-12-19 |
CN102829669B CN102829669B (en) | 2016-02-10 |
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CN201110162673.3A Expired - Fee Related CN102829669B (en) | 2011-06-16 | 2011-06-16 | Heat radiation module and manufacture method thereof |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102855945A (en) * | 2011-06-29 | 2013-01-02 | 奇鋐科技股份有限公司 | Heat radiation module structure and manufacturing method thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2632363Y (en) * | 2003-05-20 | 2004-08-11 | 奇鋐科技股份有限公司 | CPU radiatnig module |
CN1728286A (en) * | 2004-07-27 | 2006-02-01 | 奇鋐科技股份有限公司 | Structure of heating radiator |
CN201726630U (en) * | 2010-01-18 | 2011-01-26 | 奇鋐科技股份有限公司 | Heat conducting pipe bridging structure and radiating module thereof |
-
2011
- 2011-06-16 CN CN201110162673.3A patent/CN102829669B/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2632363Y (en) * | 2003-05-20 | 2004-08-11 | 奇鋐科技股份有限公司 | CPU radiatnig module |
CN1728286A (en) * | 2004-07-27 | 2006-02-01 | 奇鋐科技股份有限公司 | Structure of heating radiator |
CN201726630U (en) * | 2010-01-18 | 2011-01-26 | 奇鋐科技股份有限公司 | Heat conducting pipe bridging structure and radiating module thereof |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102855945A (en) * | 2011-06-29 | 2013-01-02 | 奇鋐科技股份有限公司 | Heat radiation module structure and manufacturing method thereof |
CN102855945B (en) * | 2011-06-29 | 2015-03-11 | 奇鋐科技股份有限公司 | Heat radiation module structure and manufacturing method thereof |
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Publication number | Publication date |
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CN102829669B (en) | 2016-02-10 |
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