CN102829368B - High-power LED (Light-Emitting Diode) finger-shaped module capable of replacing halogen lamp - Google Patents
High-power LED (Light-Emitting Diode) finger-shaped module capable of replacing halogen lamp Download PDFInfo
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- CN102829368B CN102829368B CN201210363172.6A CN201210363172A CN102829368B CN 102829368 B CN102829368 B CN 102829368B CN 201210363172 A CN201210363172 A CN 201210363172A CN 102829368 B CN102829368 B CN 102829368B
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Abstract
The invention provides a high-power LED (Light-Emitting Diode) finger-shaped module capable of replacing a halogen lamp. The high-power LED finger-shaped module comprises a lamp base and a finger-shaped bulb, wherein the lamp base comprises a hollow insulating heat conduction shell; a heat conduction joint with an annular inner conical surface is formed at the top end of the hollow insulating heat conduction shell; an anti-releasing buckle groove is arranged on the outer edge of the cylindrical face of the insulating heat conduction shell; a driving assembly is arranged in the hollow insulating heat conduction shell and comprises a driver, an elastic input power supply wire joint and an elastic outlet power supply wire joint; the elastic outlet joint is connected with a finger-shaped bulb inserting pin; the finger-shaped bulb comprises a heat conductor substrate assembly and an inserting pin with an elastic contact; an outer conical face heat conduction joint is arranged at the bottom end of the heat conductor substrate assembly; the elastic contact sheet at one end of the inserting pin is communicated with a circuit of the heat conductor substrate assembly; the other end of the inserting pin is inserted into the driving assembly of the lamp base to be matched with a circuit; and a transmitting cover is sleeved on a heat conduction substrate group, and is buckled with an appearance structure reference traditional lamp base on the finger-shaped module lamp base through a buckle, so that the outer surface space of the finger-shaped module lamp is sufficiently used for heat dissipation.
Description
Technical field
The invention belongs to electronic technology field, relate to a kind of electric energy-saving product, especially long with the life-span, consume energy little, the great power LED finger-type module with the replaced Halogen lamp LED of effects of energy conservation and environmental protection is relevant.
Background technology
The LED bulb of the models such as the G4/G9 of the replacing halogen lamp on the current world, domestic market restricts due to the volume of relevant criterion, heat-dissipating space and driving space wretched insufficiency, cause cannot improving power to reach the brightness requirement of user's needs, make this kind of bulb effect in the practical application of light fixture not ideal enough.For this reason, lamps & lanterns factory wishes commercial city to obtain both being similar to conventional halogen lamp body molded dimension and brightness, does not change again the novel light bulb of conventional lamp mounting means, to meet the practical application of light fixture.
Summary of the invention
The object of the invention is to solve above problem, provide a kind of life-span long, consume energy little, the great power LED finger-type module of Halogen lamp LED can be replaced.
For reaching above-mentioned purpose, the present invention adopts following technical scheme:
Replace a great power LED finger-type module for Halogen lamp LED, comprise and cooperatively interacting:
Finger-type module lamp socket 2: the insulating heat-conductive shell 21 comprising hollow, its top is provided with internal conical surface heat conducting interface 211, and insulating heat-conductive shell 21 top cylindrical face outer rim is provided with anticreep catching groove 212, coordinates prevent finger-type from steeping slippage with the buckle 33-1 of diffuser 33; Driven unit 22 is arranged in the insulating heat-conductive shell 21 of hollow, actuator assembly comprises: driver 221, can realize elasticity input power line interface 222 in parallel and elasticity out-put supply line interface 223, elasticity output interface 223 and finger-type steep contact pin 32 grafting conducting; Insulated power supplies access flap 23 is fastened in the counterbore of insulating heat-conductive shell 21 bottom of hollow;
Finger-type bubble 3: comprise heat carrier board unit 31, its bottom is provided with outer conical surface heat conducting interface 31-11; Contact pin 32 with elastic contact blade, the elastic contact blade of one end and the circuit communication of heat carrier board unit 31, the driven unit that the other end inserts lamp socket coordinates circuit turn-on; Diffuser 33 is linked in heat-conducting substrate group 31, is fastened on finger-type module lamp socket 2 by buckle 33-1.
In described finger-type bubble, heat-conducting substrate assembly 31 comprises: heat conductive insulating dish 31-1, and its bottom is provided with outer conical surface heat conducting interface 31-11, and centre position, top is provided with double inclined plane slot 31-12, and both sides, top are provided with pin holes 31-13; Two-sided heat conductive insulating substrate 31-2, its bottom is provided with double inclined plane contact surface 31-21 and coordinates with double inclined plane slot 31-12 and locate and heat transfer, the high-pressure light source 31-22 of both sides, top laminating configuration, and both sides conducting is connected by connecting line 31-24; The flexible contact 32-1 of contact pin 32 end belt with elastic contact blade, the contact pin 32 of band elastic contact blade is plugged in pin holes 31-13, and the elastic contact blade 32-1 of end is fitted in two-sided heat conductive insulating substrate 31-2 and circuit ON; Diffuser 33 is linked on heat conductive insulating dish 31-1, is fastened on finger-type module lamp socket 2 by buckle 33-1.
In described finger-type bubble, heat-conducting substrate assembly 31 comprises: the insulation disjunctor light source substrate 31-3 and heat conducting disk 31-4 of integrated band metallic layer circuit, heat conducting disk 31-4 bottom is provided with outer conical surface heat conducting interface 31-41, both sides, top are provided with pin holes 31-42, both sides, insulation disjunctor light source substrate 31-3 top laminating configuration high-pressure light source 31-31 with metallic layer circuit, both sides conducting is connected by connecting line 31-33; The flexible contact 32-1 of contact pin 32 end belt with elastic contact blade, the contact pin 32 of band elastic contact blade is plugged in pin holes 31-13, and the elastic contact blade 32-1 of end is fitted in insulation disjunctor light source substrate 31-3 and the circuit ON of band metallic layer circuit; Diffuser 33 is linked on heat conductive insulating dish 31-1, is fastened on finger-type module lamp socket 2 by buckle 33-1.
In described finger-type bubble, heat-conducting substrate assembly 31 comprises: the disjunctor light source substrate 31-5 of integrated band metallic layer circuit and heat conducting disk 31-6, disjunctor light source substrate 31-5 both sides with metallic layer circuit directly encapsulate high-pressure light source 31-51, heat conducting disk 31-6 bottom is provided with outer conical surface heat conducting interface 31-61, both sides, top are provided with conducting jack 31-62, and conducting Socket walls has metal level and circuit communication; Inverted plug type contact pin 32 is inverted plug type placement, and end is with tongue piece 32-2, and inverted plug type contact pin 32 is plugged in conducting jack 31-62, and end tabs 32-2 equalizes rear welding and circuit ON; Diffuser 33 is linked on light source heat conducting disk 31-6, is fastened on finger-type module lamp socket 2 by buckle 33-1.
Described two-sided heat conductive insulating substrate coordinate high-pressure light source to be provided with current-limiting resistance 31-23.
The insulation disjunctor light source substrate 31-3 of described band metallic layer circuit coordinate high-pressure light source 31-31 be provided with current-limiting resistance 31-32.
Finger-type module lamp socket 2: the insulating heat-conductive shell 21 comprising hollow, its top is provided with internal conical surface heat conducting interface 211, and insulating heat-conductive shell 21 top cylindrical face is provided with anticreep catching groove 212 and coordinates with the buckle 33-1 of diffuser 33 and prevent finger-type from steeping slippage; Driven unit 22 is arranged in the insulating heat-conductive shell 21 of hollow, comprising: resistance-capacitance depressurization driver 221, which is provided with elasticity input power line interface 222 and elasticity output interface 223, and described elasticity output interface 223 coordinates turning circuit with contact pin 32; Insulated power supplies access flap 23 is fastened on the insulating heat-conductive shell 21 of hollow, fixes riveted by the soft rivet of semi-hollow or tubular rivet 24.
Adopt technique scheme, the present invention breaches at present the bottleneck of the LED bulb heat-dissipating space deficiency of replacing halogen lamp on the market, the material of heat conduction and excellent insulating property used instead by finger-type module lamp socket, contour structures is with reference to prior lamp holder, finger-type bubble transfers heat to finger-type module lamp socket by circular cone hot interface, allows finger-type module lamp socket carry out auxiliary heat dissipation, increases integral heat sink ability greatly, creating radiating condition for increasing power, also have found suitable space for built-in resistance-capacitance depressurization drives simultaneously.Due to hollow shell and the good insulating properties of heat conducting disk assembly material, also for using high-pressure light source and resistance-capacitance depressurization to drive the condition creating safe handling.
The setting that can replace the great power LED finger-type module of Halogen lamp LED helps lamp socket outer surface to bear main heat sink, finger-type bulb insulating heat-conductive dish and outer cover of lamp holder material are insulating properties and the excellent material of heat conductivility, hot interface between lamp socket and bulb adopts the taper seat of suitable tapering to realize heat transfer, belong to blind-mate, faying face does not need to add any heat filling.Appropriate cone angle has certain self-locking performance, can not come off easily, is also unlikely to produce excessive pulling capacity when dismantling.Even if the conical surface is if needs secondary operations is without any technical difficulty, adopts conventional cutting methods, as long as strictly control coning angle, external diameter is controlled in allowed band.There is not any technology difficulty.The luminous intensity distribution being the LED bubble limit breaking through existing alternative G4/G9 by it is arranged, and is that the LED bulb of alternative G4/G9 popular in the market cannot be compared.Can coordinate and meet traditional standard insulating support or jockey connects with light fixture, can not make troubles to light fixture manufacturer because needs change fitting structure.Finger-type module lamp socket and finger-type are steeped and all can be changed after corrupted, meet non-proxy that international module standards setting organizations zhaga specifies completely, replaceable, Connection Block is separated with photo engine, there is the principle of mounting interface, power interface, heat radiation interface, optical interface, wide model popularization can be carried out.
Accompanying drawing explanation
Fig. 1 is the explosive view of embodiment one;
Fig. 2 is the constitutional diagram of embodiment one;
Fig. 3 is the lamp socket explosive view of embodiment one;
Fig. 4 is the lamp holder combination figure of embodiment one;
Fig. 5 is the driven unit explosive view of embodiment one;
Fig. 6 is the constitutional diagram of the driven unit of embodiment one;
Fig. 7 is the first scheme explosive view of the finger-type bubble of embodiment one;
Fig. 8 is the first scheme heat-conducting substrate component assembling figure of the finger-type bubble of embodiment one;
Fig. 9 is the first scheme constitutional diagram of the finger-type bubble of embodiment one;
Figure 10 is the alternative plan explosive view of the finger-type bubble of embodiment one;
Figure 11 is the alternative plan heat-conducting substrate component assembling figure of the finger-type bubble of embodiment one;
Figure 12 is the alternative plan constitutional diagram of the finger-type bubble of embodiment one;
Figure 13 is the third program explosive view of the finger-type bubble of embodiment one;
Figure 14 is the third program heat-conducting substrate component assembling figure of the finger-type bubble of embodiment one;
Figure 15 is the third program constitutional diagram of the finger-type bubble of embodiment one;
Figure 16 is the circuit diagram of embodiment one;
Figure 17 is the explosive view of embodiment two;
Figure 18 is the constitutional diagram of embodiment two;
Figure 19 is the lamp socket explosive view of embodiment two;
Figure 20 is the lamp holder combination figure of embodiment two;
Figure 21 is the driven unit explosive view of embodiment two;
Figure 22 is the first scheme explosive view of the finger-type bubble of embodiment two;
Figure 23 is the first scheme constitutional diagram of the finger-type bubble of embodiment two;
Figure 24 is the alternative plan explosive view of the finger-type bubble of embodiment two;
Figure 25 is the alternative plan constitutional diagram of the finger-type bubble of embodiment two;
Figure 26 is the third program explosive view of the finger-type bubble of embodiment two;
Figure 27 is the third program constitutional diagram of the finger-type bubble of embodiment two;
Figure 28 is that the third program contact pin of the finger-type bubble of embodiment two inserts welding schematic diagram;
Figure 29 is the circuit diagram of embodiment two.
Detailed description of the invention
Below in conjunction with drawings and Examples, the present invention is described in detail.
Be the schematic diagram of the finger-type module of more high-power (5-6W ≈ 500-600lm) as Fig. 1-Figure 16 embodiment one, Figure 17-Figure 29 embodiment two is common high-power (3-4W
≈finger-type module schematic diagram 300-400lm), two kinds of embodiment structures are substantially identical, just watt level is different, size is different, drive circuit is different, therefore, is only described with finger-type module during embodiment one more high-power, replace a great power LED finger-type module for Halogen lamp LED, comprise and cooperatively interacting:
Finger-type module lamp socket 2: the insulating heat-conductive shell 21 comprising hollow, its top internal conical surface heat conducting interface 211, insulating heat-conductive shell 21 top cylindrical face outer rim is provided with anticreep catching groove 212, coordinates prevent finger-type from steeping slippage with the buckle 33-1 of diffuser 33; Driven unit 22 is arranged in the insulating heat-conductive shell 21 of hollow, actuator assembly comprises: driver 221, can realize elasticity input power line interface 222 in parallel and elasticity out-put supply line interface 223, elasticity output interface 223 and finger-type steep contact pin 32 grafting conducting; Insulated power supplies access flap 23 is fastened in the counterbore of insulating heat-conductive shell 21 bottom of hollow;
Finger-type bubble 3: comprise heat carrier board unit 31, its bottom is provided with outer conical surface heat conducting interface 31-11; Contact pin 32 with elastic contact blade, the elastic contact blade of one end and the circuit communication of heat carrier board unit 31, the driven unit that the other end inserts lamp socket coordinates circuit turn-on; Diffuser 33 is linked in heat-conducting substrate group 31 and is fastened on finger-type module lamp socket 2.
Can use by matching standard lamp socket 1.
In described finger-type bubble, heat-conducting substrate assembly 31 comprises: heat conductive insulating dish 31-1, and its bottom is provided with outer conical surface heat conducting interface 31-11, and centre position, top is provided with double inclined plane slot 31-12, and both sides, top are provided with pin holes 31-13; Two-sided heat conductive insulating substrate 31-2, its bottom is provided with double inclined plane contact surface 31-21 and coordinates with double inclined plane slot 31-12 and locate and heat transfer, and both sides conducting is connected by high-pressure light source 31-22 and current-limiting resistance 31-23, the connecting line 31-24 of the laminating configuration of both sides, top; The flexible contact 32-1 of contact pin 32 end belt with elastic contact blade, the contact pin 32 of band elastic contact blade is plugged in pin holes 31-13, and the elastic contact blade 32-1 of end is fitted in two-sided heat conductive insulating substrate 31-2 and circuit ON; Diffuser 33 is linked on heat conductive insulating dish 31-1.
In described finger-type bubble, heat-conducting substrate assembly 31 comprises: the insulation disjunctor light source substrate 31-3 and heat conducting disk 31-4 of integrated band metallic layer circuit, heat conducting disk 31-4 bottom is provided with outer conical surface heat conducting interface 31-41, both sides, top are provided with pin holes 31-42, both sides conducting is connected by both sides, insulation disjunctor light source substrate 31-3 top laminating configuration high-pressure light source 31-31 and current-limiting resistance 31-32, connecting line 31-33 with metallic layer circuit; The flexible contact 32-1 of contact pin 32 end belt with elastic contact blade, the contact pin 32 of band elastic contact blade is plugged in pin holes 31-13, and the elastic contact blade 32-1 of end is fitted in insulation disjunctor light source substrate 31-3 and the circuit ON of band metallic layer circuit; Diffuser 33 is linked on heat conductive insulating dish 31-1.
In described finger-type bubble, heat-conducting substrate assembly 31 comprises: the disjunctor light source substrate 31-5 of integrated band metallic layer circuit and heat conducting disk 31-6, disjunctor light source substrate 31-5 both sides with metallic layer circuit directly encapsulate high-pressure light source 31-51, heat conducting disk 31-6 bottom is provided with outer conical surface heat conducting interface 31-61, both sides, top are provided with conducting jack 31-62, and conducting Socket walls has metal level and circuit communication; Inverted plug type contact pin 32 is inverted plug type placement, and end is with tongue piece 32-2, and inverted plug type contact pin 32 is plugged in conducting jack 31-62, and end tabs 32-2 equalizes rear welding and circuit ON; Diffuser 33 is linked on light source heat conducting disk 31-6.
Finger-type module lamp socket 2: the insulating heat-conductive shell 21 comprising hollow, its top is provided with internal conical surface heat conducting interface 211, and insulating heat-conductive shell 21 top cylindrical face is provided with anticreep catching groove 212 and coordinates with the buckle 33-1 of diffuser 33 and prevent finger-type from steeping slippage; Driven unit 22 is arranged in the insulating heat-conductive shell 21 of hollow, comprising: resistance-capacitance depressurization driver 221, which is provided with elasticity input power line interface 222 and elasticity output interface 223, and described elasticity output interface 223 coordinates turning circuit with contact pin 32; Insulated power supplies access flap 23 is fastened on the insulating heat-conductive shell 21 of hollow, by semi-hollow soft rivet 24(general high-power time tubular rivet) fixing riveted.
Described driven unit power is at 5-6W(500-600lm) circuit structure is: the resistance-capacitance depressurization 2 of band bridge rectifier also 2 alters paster light source or chip circuit, is furnished with the multilayer protection circuit of multilayer protection circuit of current-limiting resistance, piezo-resistance.
Described driven unit power is at 3-4W(300-400lm) circuit structure is: the resistance-capacitance depressurization 2 of band bridge rectifier alters paster light source or chip circuit, is furnished with the multilayer protection circuit of multilayer protection circuit of current-limiting resistance, piezo-resistance.
Adopt technique scheme, design idea of the present invention, structure and working principle further illustrate as follows: great power LED finger-type module is the novel illumination product meeting conventional lamp use completely, light efficiency can be configured to the requirement of approximate G4/G9 incandescent lamp bulb, is the Novel LED illuminating product that can replace traditional G4/G9 incandescent lamp bulb.Maximum feature of the present invention can need to be set to 300-600lm according to different capacity, and what even can arrange if desired is larger.The luminous intensity distribution being the LED bubble limit breaking through existing alternative G4/G9 by it is arranged, and is that the LED bulb of alternative G4/G9 popular in the market cannot be compared.The high-power finger-type module of LED is the assembly that lamp socket and finger-type are steeped, lamp socket is mainly with reference to traditional G9 ceramic lamp holder structure, traditional approach is adopted to coordinate different support jockey to be connected with light fixture, light fixture need not do any change when using LED high-power finger-type module, can not make troubles because of the different change fitting structure of connected mode to light fixture manufacturer.Electrical interface changes former G9 mode, for coordinating hot interface and being communicated with built-in driven unit output, is set to contact pin mode and driven unit output interface is the conducting of petal type anatomical connectivity.Lamp socket and finger-type are steeped and all can be changed after corrupted, meet non-proxy that international module standards setting organizations zhaga specifies completely, replaceable, Connection Block is separated with photo engine, there is the principle of mounting interface, power interface, heat radiation interface, optical interface, wide model popularization can be carried out.
In order to solve because the power of increase great power LED finger-type bubble is to making heat-dissipating space wretched insufficiency, the setting of great power LED finger-type module bears main heat sink task by lamp socket outer surface, and bulb insulating heat-conductive dish and outer cover of lamp holder material are insulating properties and the excellent material of heat conductivility; Hot interface between lamp socket and bulb adopts the taper seat of suitable tapering to realize heat transfer, and belong to blind-mate, faying face does not need to add any heat filling.Appropriate cone angle has certain self-locking performance and can not come off easily, is also unlikely to produce excessive pulling capacity when dismantling.As the conical surface needs secondary operations not have technical difficulty, adopt conventional cutting methods, as long as size aspect strictly controls coning angle, external diameter is controlled in allowed band.The internal cavities of lamp socket is power supply and output interface and drives space, and driving is simple and the bridge rectifier of economy adds two protection circuit.Because lamp socket and bulb take all insulation to arrange, use ac high-voltage light source to produce potential safety hazard, use very safe, the most important thing is significantly to reduce costs.
Lamp socket is formed placing driven unit in the cavity of insulating heat-conductive shell and insulating lid riveted by two tubular rivets or soft semitubular rivet; Driven unit is on resistance-capacitance depressurization driver pcb board, weld the sub-assembly that elasticity electrical interface and elasticity export electrical interface, can reduce assembling link and enhance productivity.The configuration of lamp socket profile is substantially identical with traditional external screw thread G9 lamp socket, screw thread arranges inherently a kind of traditional fixed form, heat radiation can also be helped by increasing external surface area, also can conduct the heat to light fixture by coupling part, being conducive to outside module, carrying out heat trnasfer to greatest extent.Support connects the requirement configuring and meet prior lamp holder completely and must be applicable to two or more mounting means, and the scope of application maximizes as far as possible.Electric source line interface is with the quick straight cutting mode adopted, and power line connects very convenient.The lower end of lamp socket is recessed taper seat heat conducting interface, has holes, patch connection circuit for bulb contact pin and driver bottom the conical surface.
Great power LED finger-type bubble has three kinds of configurations, in order that adapt to different technique and production equipment, reduces thermal resistance further and improves heat sinking function and light efficiency.
The first is that insulating heat-conductive dish adopts double inclined plane rectangular opening to dock with the independently double inclined plane of vertical double-sided copper base bottom to realize heat transfer, at vertical double-sided copper base two sides use surface-mounted LED light source.Carry out embedding after contact contact pin being inserted the hole, garden of insulating heat-conductive dish to fix, the vertical double-sided copper base of the LED light source after paster is inserted double inclined plane rectangular opening, and the conical surface of exerting pressure a little is just combined closely.Now, because the elastic force of contact contact pin shell fragment part makes shell fragment and copper base circuit communication, do like this and can reduce welding link; Diffuser can be buckled and complete assembling after confirmation circuit ON.
The second is configured to insulating heat-conductive dribbling disjunctor heat conduction disjunctor double-sided metallic circuit substrate, and such arranging can reduce working link, and technique is simple, can enhance productivity.Equally also be use surface-mounted LED light source on disjunctor heat conductive insulating double-sided substrate two sides, carry out embedding after then contact contact pin being inserted the nibs of insulating heat-conductive dish and fix.Now, because the elastic force of contact contact pin shell fragment part makes shell fragment and copper base circuit communication, do like this and can reduce welding link; Diffuser can be buckled and complete assembling after confirmation circuit ON.
The third configuration directly on the heat conduction dribbling disjunctor double-sided substrate of thermal conductive ceramic material, applies stereo circuit metallic layer circuit (metallic layer circuit technique is described by other patent), in the enterprising line light source encapsulation of metallized stereo circuit.Contact pin hole wall and end face have metal layer to be connected with circuit, and contact pin contacts with the metal layer of hole wall pouring into hole surfaces externally and internally, the microtia of pin head is played the part of flat after weld with metal layer circuit, not only connection circuit but also secure contact pin; Diffuser can be buckled and complete assembling after confirmation circuit ON.。
In order to ensure that great power LED finger-type bubble is unlikely to come off, being provided with the fastener carried in the opening's edge of diffuser, preventing from coming off in dual fail-safe mode; The positioning table of the opening's edge of diffuser is convenient to a kind of fool proof measure during lamp socket insertion great power LED finger-type bubble.
For the great power LED finger-type bubble of applicable difference configuration, the versatility of lamp socket is necessary.In addition, be the power requirement adapting to high pressure 50V light source, the output current of capacitance-resistance voltage reduction circuit is set to about 100mA, employing be that the bridge rectifier of stable performance adds two protection circuit.Great power LED finger-type bubble can be arranged to two-way or multiple series series circuit, just uses electric current to be different from smaller power LED finger-type bubble.Because in lamp socket, the output current of capacitance-resistance voltage reduction circuit is constant, electric current is set to the electric current meeting great power LED finger-type bubble load needs.The increase current-limiting resistance in its circuit that only needs of the LED finger-type bubble of smaller power reduces output current, such problem just can be solved very well, can not produce the hidden danger producing damage because electric current is excessive because of the LED finger-type bubble of smaller power because using super-high-current.
The present invention breaks through at present the bottleneck of the LED bulb heat-dissipating space deficiency of replacing halogen lamp on the market, the material of heat conduction and excellent insulating property used instead by finger-type module lamp socket, contour structures is with reference to prior lamp holder, dispels the heat in the outer surface space making full use of finger-type module lamp socket.Finger-type bubble transfers heat to finger-type module lamp socket by circular cone hot interface, finger-type module lamp socket is allowed to carry out auxiliary heat dissipation, great increase integral heat sink ability, creating radiating condition for increasing power, also have found suitable space for built-in resistance-capacitance depressurization drives simultaneously.Due to hollow shell and the good insulating properties of heat conducting disk assembly material, also for using high-pressure light source and resistance-capacitance depressurization to drive the condition creating safe handling.
Claims (7)
1. can replace a great power LED finger-type module for Halogen lamp LED, it is characterized in that: comprise and cooperatively interacting:
The finger-type module lamp socket (2) of tool heat sinking function: the insulating heat-conductive shell (21) comprising hollow, its top is provided with internal conical surface heat conducting interface (211), insulating heat-conductive shell (21) top cylindrical face outer rim is provided with anticreep catching groove (212), coordinates prevent finger-type from steeping slippage with the buckle (33-1) of diffuser (33); Driven unit (22) is arranged in the insulating heat-conductive shell (21) of hollow, actuator assembly comprises: driver (221), can realize elasticity input power line interface (222) in parallel and elasticity out-put supply line interface (223), elasticity output interface (223) and finger-type steep contact pin (32) grafting conducting; Insulated power supplies access flap (23) is fastened in the counterbore of insulating heat-conductive shell (21) bottom of hollow;
Finger-type bubble (3): comprise heat-conducting substrate assembly (31), its bottom is provided with outer conical surface heat conducting interface (31-11); Contact pin (32) with elastic contact blade, the elastic contact blade of one end and the circuit communication of heat-conducting substrate assembly (31), the driven unit that the other end inserts lamp socket coordinates circuit turn-on; Diffuser (33) is linked on heat-conducting substrate assembly (31) and is fastened on finger-type module lamp socket (2) by buckle (33-1).
2. a kind of great power LED finger-type module replacing Halogen lamp LED as claimed in claim 1, it is characterized in that: in described finger-type bubble, heat-conducting substrate assembly (31) comprising: heat conductive insulating dish (31-1), its bottom is provided with outer conical surface heat conducting interface (31-11), centre position, top is provided with double inclined plane slot (31-12), and both sides, top are provided with pin holes (31-13); Two-sided heat conductive insulating substrate (31-2), its bottom is provided with double inclined plane contact surface (31-21) and coordinates with double inclined plane slot (31-12) and locate and heat transfer, the high-pressure light source (31-22) of both sides, top laminating configuration, both sides conducting is connected by connecting line (31-24); The flexible contact of contact pin (32) end belt (32-1) with elastic contact blade, the contact pin (32) of band elastic contact blade is plugged in pin holes (31-13), and the elastic contact blade (32-1) of end is fitted in two-sided heat conductive insulating substrate (31-2) and circuit ON; Diffuser (33) is linked on heat conductive insulating dish (31-1), is fastened in finger-type module lamp socket (2) anticreep catching groove (212) by buckle (33-1).
3. a kind of great power LED finger-type module replacing Halogen lamp LED as claimed in claim 1, it is characterized in that: in described finger-type bubble, heat-conducting substrate assembly (31) comprising: three-dimensional and the insulation disjunctor light source substrate (31-3) of integrated band metallic layer circuit and heat conducting disk (31-4), heat conducting disk (31-4) bottom is provided with outer conical surface heat conducting interface (31-41), both sides, top are provided with pin holes (31-42), insulation disjunctor light source substrate (31-3) both sides, top laminating configuration high-pressure light source (31-31) with metallic layer circuit, both sides conducting is connected by connecting line (31-33), the flexible contact of contact pin (32) end belt (32-1) with elastic contact blade, contact pin (32) with elastic contact blade is plugged in pin holes (31-13), and the elastic contact blade (32-1) of end is fitted in insulation disjunctor light source substrate (31-3) and the circuit ON of band metallic layer circuit, diffuser (33) is linked on heat conductive insulating dish (31-1), is fastened in the upper anticreep catching groove (212) of finger-type module lamp socket (2) by buckle (33-1).
4. a kind of great power LED finger-type module replacing Halogen lamp LED as claimed in claim 1, it is characterized in that: in described finger-type bubble, heat-conducting substrate assembly (31) comprising: three-dimensional and the disjunctor light source substrate (31-5) of integrated band metallic layer circuit and heat conducting disk (31-6), disjunctor light source substrate (31-5) both sides with metallic layer circuit directly encapsulate high-pressure light source (31-51), heat conducting disk (31-6) bottom is provided with outer conical surface heat conducting interface (31-61), both sides, top are provided with conducting jack (31-62), conducting Socket walls has metal level and circuit communication, inverted plug type contact pin (32) is inverted plug type placement, and end is with tongue piece (32-2), and inverted plug type contact pin (32) is plugged in conducting jack (31-62), and end tabs (32-2) equalizes rear welding and circuit ON, diffuser (33) is linked in light source heat conducting disk (31-6), is fastened in the upper anticreep catching groove (212) of finger-type module lamp socket (2) by buckle (33-1).
5. a kind of great power LED finger-type module replacing Halogen lamp LED as claimed in claim 2, is characterized in that: the insulator heat conducting disk that described finger-type steeps two-sided heat conductive insulating substrate or three-dimensional band metallic layer circuit coordinates high-pressure light source to be provided with current-limiting resistance (31-23).
6. a kind of great power LED finger-type module replacing Halogen lamp LED as claimed in claim 3, is characterized in that: described solid the insulation disjunctor light source substrate (31-3) of integrated band metallic layer circuit is provided with current-limiting resistance (31-32).
7. a kind of great power LED finger-type module replacing Halogen lamp LED as described in any one of claim 1,2,3,4,5 or 6, is characterized in that:
The finger-type module lamp socket (2) of tool heat sinking function: the insulating heat-conductive shell (21) comprising hollow, its top is provided with internal conical surface heat conducting interface (211), and insulating heat-conductive shell (21) top cylindrical face is provided with anticreep catching groove (212) and coordinates with the buckle (33-1) of diffuser (33) and prevent finger-type from steeping slippage; Driven unit (22) is arranged in the insulating heat-conductive shell (21) of hollow, comprise: resistance-capacitance depressurization driver (221), which is provided with elasticity input power line interface (222) and elasticity output interface (223), described elasticity output interface (223) coordinates turning circuit with contact pin (32); Insulated power supplies access flap (23) is fastened on the insulating heat-conductive shell (21) of hollow, by the soft rivet of semi-hollow or the fixing riveted of tubular rivet (24).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210363172.6A CN102829368B (en) | 2012-09-26 | 2012-09-26 | High-power LED (Light-Emitting Diode) finger-shaped module capable of replacing halogen lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210363172.6A CN102829368B (en) | 2012-09-26 | 2012-09-26 | High-power LED (Light-Emitting Diode) finger-shaped module capable of replacing halogen lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102829368A CN102829368A (en) | 2012-12-19 |
| CN102829368B true CN102829368B (en) | 2015-05-20 |
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| CN104180232B (en) * | 2014-09-12 | 2016-08-17 | 东莞市闻誉实业有限公司 | Efficient LED radiating lamp |
| CN104819413B (en) * | 2015-04-24 | 2017-06-09 | 广州供电局有限公司 | Transformer station's indicator lamp |
| CN105449404A (en) * | 2015-09-11 | 2016-03-30 | 利威光源零件(厦门)有限公司 | Bayonet base |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101968177A (en) * | 2010-11-10 | 2011-02-09 | 厦门立明光电有限公司 | Novel light-emitting diode lamp capable of replacing halogen lamp |
| CN102454889A (en) * | 2010-10-22 | 2012-05-16 | 苏州盟泰励宝光电有限公司 | LED lighting lamp |
| CN102570116A (en) * | 2010-10-01 | 2012-07-11 | 泰科电子公司 | Interface contact for an electrical connector |
| CN202884555U (en) * | 2012-09-26 | 2013-04-17 | 姚兵 | High-power light-emitting diode (LED) finger-shaped module capable of replacing halogen lamp |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102570116A (en) * | 2010-10-01 | 2012-07-11 | 泰科电子公司 | Interface contact for an electrical connector |
| CN102454889A (en) * | 2010-10-22 | 2012-05-16 | 苏州盟泰励宝光电有限公司 | LED lighting lamp |
| CN101968177A (en) * | 2010-11-10 | 2011-02-09 | 厦门立明光电有限公司 | Novel light-emitting diode lamp capable of replacing halogen lamp |
| CN202884555U (en) * | 2012-09-26 | 2013-04-17 | 姚兵 | High-power light-emitting diode (LED) finger-shaped module capable of replacing halogen lamp |
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