CN102820205A - Installation structure of force sensor on bonder and bonder - Google Patents
Installation structure of force sensor on bonder and bonder Download PDFInfo
- Publication number
- CN102820205A CN102820205A CN2011101547924A CN201110154792A CN102820205A CN 102820205 A CN102820205 A CN 102820205A CN 2011101547924 A CN2011101547924 A CN 2011101547924A CN 201110154792 A CN201110154792 A CN 201110154792A CN 102820205 A CN102820205 A CN 102820205A
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- Prior art keywords
- transducer
- swing arm
- power
- power transducer
- briquetting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Wire Bonding (AREA)
Abstract
The invention provides an installation structure of a force sensor on a bonder. The installation structure is used for installing the force sensor and comprises a caulking groove which is located inside a Z-direction movable arm of the bonder and is matched with the force sensor. The bonder comprises the Z-direction movable arm and an ultrasonic transducer, wherein the caulking groove of which the shape is matched with the shape of the force sensor is arranged inside the Z-direction movable arm, and the force sensor is installed inside the caulking groove. The installation structure of the force sensor on the bonder is simple in structure and easy to install, the force sensor is installed inside the Z-direction movable arm, so that the force sensor is protected against external interference during usage, and measurement results are stable and accurate.
Description
Technical field
The present invention relates to a kind of equipment that is specially adapted for handling semiconductor or solid state device, particularly relate to the mounting structure and the bonding machine of the power transducer on a kind of bonding machine.
Background technology
Bonding is the welding procedure that connects one to one the metal lead wire frame of metallized circuit exit or electrode and assembling chip on the circuit chip or shell extraction electrode line.A kind of as bonding apparatus, the bonding machine is done the motion of complicated high speed through ceramic tubule (chopper) guide wire lead-in wire (gold thread) in three dimensions, form the bank of various satisfied different packing forms needs.
The bonding machine mainly comprises: parts such as XY workbench, bonding head, material grain-clamping table, handling equipment.The bonding machine to motor-driven bonding head, cooperates accurate XY motion platform by Z in the course of the work, and guide wire is done complicated motion at a high speed at three dimensions, so that form the required bank of various satisfied different Chip Packaging.Bonding head is its core component, on the bonding head usually the fitting key monitoring device of making a concerted effort monitor, survey strong size of making a concerted effort in the bonding process.The bonding force monitoring device generally includes the power transducer.Power transducer on the bonding head can effectively detect stressed, the acceleration of bonding head in motion process, cooperates fortune control algorithm, will obviously eliminate Z to the motion dynamic error, and improvement speed, acceleration following feature, reduces the steady time of becoming.Chopper on bonding head contacts with bonding face; Contact force is along with chopper; Ultrasonic wave bar and a series of fixture pass to the power transducer with partial pressure; The power transducer is converted into the signal of telecommunication with this pressure and returns to controller, and controller is through its current output value of computing correction, thus the closed-loop control of realization para-linkage head pressure output.This will improve the pressure ball quality of solder joint to the overshoot after reducing to put in place, improve the bonding wire quality and produce appreciable results.
Granted publication number discloses the technical scheme of the installing force transducer on a kind of bonding head for the Chinese utility model patent of CN 201364886 Y; Such scheme is to match with the caulking groove of grip slipper through the power transducer, and the power transducer is fixed between the main body and grip slipper of bonding head.Because the power transducer is very sensitive, rapid wear, the power transducer of such scheme in use is very easy to receive external interference, causes measurement result accurate inadequately, influences bonding head work.
Summary of the invention
The mounting structure and the bonding machine that the purpose of this invention is to provide the power transducer on the bonding machine on the bonding head that a kind of mounting structure is compact, simple effectively, the power transducer of preventing in use receives external interference.
The mounting structure of the power transducer on the bonding machine of the present invention, said mounting structure is used for the installing force transducer, said mounting structure comprise the Z that is positioned at the bonding machine to swing arm inner with the caulking groove that matches said power transducer.
The mounting structure of the power transducer on the bonding machine of the present invention, wherein, said Z has the installing hole that is used to install ultrasonic transducer on swing arm, and said caulking groove is positioned at the optional position of said installing hole circumferencial direction.
The mounting structure of the power transducer on the bonding machine of the present invention; Wherein, Said caulking groove also is used to install the transducer briquetting that is used to press said power transducer, and said transducer briquetting is the cylindrical object that the center has screwed hole, and said transducer briquetting is arranged at the outside of said power transducer.
The mounting structure of the power transducer on the bonding machine of the present invention; Wherein, Also comprise bolt; The said Z of said screw bolt passes is to swing arm, said power transducer, said transducer briquetting, and said bolt cooperates with said transducer briquetting screwed hole of centre, through said power transducer briquetting said power transducer is fixed in said Z on swing arm.
The mounting structure of the power transducer on the bonding machine of the present invention; Wherein, Said caulking groove comprises a mounting plane that is used to install said power transducer, and said mounting plane is parallel to the plane at the surface place of said Z between the transducer grip slipper of swing arm and said bonding machine.
Bonding machine of the present invention comprises Z to swing arm, ultrasonic transducer and transducer grip slipper, the caulking groove that said Z has shape to match with the shape of power transducer to the swing arm set inside, and said power transducer is installed in the said caulking groove.
Bonding machine of the present invention, wherein, said Z has the installing hole that is used to install ultrasonic transducer on swing arm, and said caulking groove is positioned at the optional position of said installing hole circumferencial direction.
Bonding machine of the present invention wherein, also is provided with the transducer briquetting that is used to press said power transducer in the said caulking groove, said transducer briquetting is the cylindrical object that the center has screwed hole, and said transducer briquetting is arranged at the outside of said power transducer.
Bonding machine of the present invention; Wherein, Also comprise bolt; The said Z of said screw bolt passes is to swing arm, said power transducer, said transducer briquetting, and said bolt cooperates with said transducer briquetting screwed hole of centre, through said power transducer briquetting said power transducer is fixed in said Z on swing arm.
Bonding machine of the present invention; Wherein, The installed surface of said power transducer is parallel to the plane at the surface place of said Z between swing arm and said transducer grip slipper; The installation direction of said power transducer is parallel to the plane at the surface place of said Z between swing arm and said transducer grip slipper, and said power sensor axis is perpendicular to the plane at the surface place of said Z between swing arm and said transducer grip slipper.
The mounting structure of the power transducer on the bonding machine of the present invention is simple in structure, be easy to install, and the power transducer is installed on the inside of Z to swing arm, and the power transducer of preventing in use receives external interference, and measurement result is more stable, accurate.
Bonding machine of the present invention, the mounting structure of the power transducer on it is simple in structure, be easy to install, and the power transducer is installed on the inside of Z to swing arm, and the power transducer of preventing in use receives external interference, and measurement result is more stable, accurate.
Description of drawings
Fig. 1 is that the axle of a kind of embodiment of the mounting structure of the power transducer on the bonding machine of the present invention is surveyed sketch map.
Fig. 2 is the front view of a kind of embodiment of the mounting structure of the power transducer on the bonding machine of the present invention.
Fig. 3 is the axonometric exploded view of Fig. 1.
Fig. 4 is a cutaway view embodiment illustrated in fig. 1.
Embodiment
The mounting structure of the power transducer on the bonding machine of the present invention, mounting structure is used for the installing force transducer, mounting structure comprise the Z that is positioned at the bonding machine to swing arm inner with the caulking groove that the matches power transducer.Bonding machine of the present invention comprises Z to swing arm, ultrasonic transducer and transducer grip slipper, the caulking groove that Z has shape to match with the shape of power transducer to the swing arm set inside, and the power transducer is installed in the said caulking groove.
Like Fig. 1, shown in Figure 2, the bonding machine that includes the mounting structure of the power transducer on the bonding machine of the present invention comprises bonding head, and bonding head comprises that Z is to swing arm 1, transducer grip slipper 2, ultrasonic transducer 3 and chopper 5.Wherein, the Z that transducer grip slipper 2 is anchored on bonding head through four screws 4 is on swing arm 1, and transducer grip slipper 2 grips ultrasonic transducer 3.Z has the installing hole 15 that is used to install ultrasonic transducer 3 on swing arm 1.The tail end of ultrasonic transducer 3 stretches into Z in the installing hole 15 of swing arm 1, and the top of ultrasonic transducer 3 connects the chopper 5 that extends to bonding face 6.
In conjunction with Fig. 3, shown in Figure 4, the mounting structure of the power transducer on the bonding machine of the present invention comprise the Z that is positioned at the bonding machine to swing arm 1 inner with the caulking groove that matches 11 power transducer 9.The optional position that is positioned at installing hole 15 circumferencial directions of caulking groove 11.Caulking groove 11 is near installing hole 15.Caulking groove 11 also is used to install the transducer briquetting 7 that is used for compaction forces transducer 9, and transducer briquetting 7 is cylindrical objects that the center has screwed hole.Transducer briquetting 7 is arranged at the outside of power transducer 9.Caulking groove 11 comprises a mounting plane that is used for installing force transducer 9, and this mounting plane is parallel to the XZ plane.
Power transducer 9 adopts the piezoeletric quartz sensor of O shape ring-type.Caulking groove 11 shapes match with the shape of power transducer 9.For guaranteeing the sensitivity of power transducer 9, the position of caulking groove 11 is as far as possible near the installing hole 15 of Z to swing arm 1.Power transducer 9 closely contacts with the mounting plane of caulking groove 11.Also be provided with the transducer briquetting 7 that is used for compaction forces transducer 9 in the caulking groove 11.Transducer briquetting 7 is arranged at power transducer 9 outsides.The mounting structure of the power transducer on the bonding machine of the present invention also comprises bolt 10; Bolt 10 passes Z successively to swing arm 1, power transducer 9, transducer briquetting 7; Bolt 10 cooperates with the screwed hole of centre of transducer briquetting 7, through power transducer briquetting 7 power transducer 9 is fixed in Z on swing arm 1.
Because power transducer 9 is very sensitive, rapid wear; So require to be positioned at Z places power transducer 9 on swing arm 1 caulking groove 11 bottoms very high flatness and roughness will be arranged, the while also requires the mating surface of Z between swing arm 1 and transducer grip slipper 2 that very high flatness, roughness, the depth of parallelism are arranged equally.The installed surface of power transducer 9 is parallel to the XZ plane, and the installation direction of power transducer 9 is parallel to the XZ plane, and power transducer 9 axis normal are in the XZ plane.The plane at the surface place of XZ plane parallel Z between swing arm and transducer grip slipper 2.
When bonding head is worked; Z rotates around the X axle under the effect of swing arm 1 in actuating force; Because Z connects as one through securing member to swing arm 1 and ultrasonic transducer 3, therefore also can produce a motion around the rotation of X axle on transducer 3 tops, this rotatablely moves in the certain angle scope; In this angular range, chopper 5 can touch chip or the lead frame on the bonding face 6.Ultrasonic transducer 3 is a kind of transducers that can convert electrical energy into the ultra sonic machinery ability, and gold thread or copper cash are drawn through the centre bore of chopper 5.At Z under the effect of the actuating force of swing arm 1; When chopper 5 points touched chip or lead frame, ultrasonic transducer 3 produced ultrasonic wave, is delivered to the tip of chopper 5; Z applies certain power between chopper 5 and chip or lead frame to swing arm 1 simultaneously, realizes the supersonic bonding process.This force transmission between chopper 5 and chip or lead frame is to power transducer 9; Power transducer 9 will produce certain voltage; The passing ratio COEFFICIENT K just can draw how much real power has between chopper 5 and chip or lead frame, thereby reaches the purpose of this device.
The mounting structure of the power transducer on the bonding machine of the present invention is simple in structure, be easy to install, and the power transducer is installed on the inside of Z to swing arm, and the power transducer of preventing in use receives external interference, and measurement result is more stable, accurate.
Bonding machine of the present invention, the mounting structure of the power transducer on it is simple in structure, be easy to install, and the power transducer is installed on the inside of Z to swing arm, and the power transducer of preventing in use receives external interference, and measurement result is more stable, accurate.
The above only is a preferred implementation of the present invention; Should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention; Can also make some improvement and retouching, these improvement and retouching also should be regarded as protection scope of the present invention.
Claims (10)
1. the mounting structure of the power transducer on the bonding machine is characterized in that said mounting structure is used for the installing force transducer, said mounting structure comprise the Z that is positioned at the bonding machine to swing arm inner with the caulking groove that matches said power transducer.
2. the mounting structure of the power transducer on the bonding machine as claimed in claim 1 is characterized in that said Z has the installing hole that is used to install ultrasonic transducer on swing arm, and said caulking groove is positioned at the optional position of said installing hole circumferencial direction.
3. the mounting structure of the power transducer on according to claim 1 or claim 2 the bonding machine; It is characterized in that; Said caulking groove also is used to install the transducer briquetting that is used to press said power transducer; Said transducer briquetting is the cylindrical object that the center has screwed hole, and said transducer briquetting is arranged at the outside of said power transducer.
4. the mounting structure of the power transducer on the bonding machine as claimed in claim 3; It is characterized in that; Also comprise bolt; The said Z of said screw bolt passes is to swing arm, said power transducer, said transducer briquetting, and said bolt cooperates with said transducer briquetting screwed hole of centre, through said power transducer briquetting said power transducer is fixed in said Z on swing arm.
5. the mounting structure of the power transducer on the bonding machine as claimed in claim 1; It is characterized in that; Said caulking groove comprises a mounting plane that is used to install said power transducer, and said mounting plane is parallel to the plane at the surface place of said Z between the transducer grip slipper of swing arm and said bonding machine.
6. a bonding machine comprises that Z to swing arm, ultrasonic transducer and transducer grip slipper, is characterized in that, the caulking groove that said Z has shape to match with the shape of power transducer to the swing arm set inside, and said power transducer is installed in the said caulking groove.
7. bonding machine as claimed in claim 6 is characterized in that said Z has the installing hole that is used to install said ultrasonic transducer on swing arm, and said caulking groove is positioned at the optional position of said installing hole circumferencial direction.
8. like claim 6 or 7 described bonding machines; It is characterized in that; Also be provided with the transducer briquetting that is used to press said power transducer in the said caulking groove, said transducer briquetting is the cylindrical object that the center has screwed hole, and said transducer briquetting is arranged at the outside of said power transducer.
9. bonding machine as claimed in claim 8; It is characterized in that; Also comprise bolt; The said Z of said screw bolt passes is to swing arm, said power transducer, said transducer briquetting, and said bolt cooperates with said transducer briquetting screwed hole of centre, through said power transducer briquetting said power transducer is fixed in said Z on swing arm.
10. bonding machine as claimed in claim 6; It is characterized in that; The installed surface of said power transducer is parallel to the plane at the surface place of said Z between swing arm and said transducer grip slipper; The installation direction of said power transducer is parallel to the plane at the surface place of said Z between swing arm and said transducer grip slipper, and said power sensor axis is perpendicular to the plane at the surface place of said Z between swing arm and said transducer grip slipper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110154792.4A CN102820205B (en) | 2011-06-09 | 2011-06-09 | Installation structure of force sensor on bonder and bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110154792.4A CN102820205B (en) | 2011-06-09 | 2011-06-09 | Installation structure of force sensor on bonder and bonder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102820205A true CN102820205A (en) | 2012-12-12 |
| CN102820205B CN102820205B (en) | 2015-02-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110154792.4A Expired - Fee Related CN102820205B (en) | 2011-06-09 | 2011-06-09 | Installation structure of force sensor on bonder and bonder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102820205B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108254003A (en) * | 2017-12-29 | 2018-07-06 | 广州市上腾电子科技有限公司 | A kind of sensor fixing structure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1428601A (en) * | 2001-12-26 | 2003-07-09 | 广东省电力工业局试验研究所 | Turbogenerator stator winding end portion vibration on-line monitoring device and its application |
| CN101039774A (en) * | 2004-09-17 | 2007-09-19 | 赫西和奈普斯有限责任公司 | Ultrasonic transducer comprising a sensor disposed in the mounting |
| CN201364886Y (en) * | 2009-02-19 | 2009-12-16 | 中国电子科技集团公司第四十五研究所 | Binding force monitoring and detecting device |
| WO2010113703A1 (en) * | 2009-04-02 | 2010-10-07 | 株式会社新川 | Bonding device, bonding sealer amplitude measurement method, and bonding sealer amplitude calibration method |
-
2011
- 2011-06-09 CN CN201110154792.4A patent/CN102820205B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1428601A (en) * | 2001-12-26 | 2003-07-09 | 广东省电力工业局试验研究所 | Turbogenerator stator winding end portion vibration on-line monitoring device and its application |
| CN101039774A (en) * | 2004-09-17 | 2007-09-19 | 赫西和奈普斯有限责任公司 | Ultrasonic transducer comprising a sensor disposed in the mounting |
| CN201364886Y (en) * | 2009-02-19 | 2009-12-16 | 中国电子科技集团公司第四十五研究所 | Binding force monitoring and detecting device |
| WO2010113703A1 (en) * | 2009-04-02 | 2010-10-07 | 株式会社新川 | Bonding device, bonding sealer amplitude measurement method, and bonding sealer amplitude calibration method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108254003A (en) * | 2017-12-29 | 2018-07-06 | 广州市上腾电子科技有限公司 | A kind of sensor fixing structure |
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| Publication number | Publication date |
|---|---|
| CN102820205B (en) | 2015-02-11 |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150211 Termination date: 20180609 |