CN102809497B - Test member with defect is for the mthods, systems and devices of analysis project component - Google Patents

Abstract

The present invention relates to the manufacture of the engineering component with design defect of the analysis for output component.Disclose and there is the engineering component (60,100) of design defect and there is the engineering component (60,100) of design defect for assessing the use of output component.Manufacture the test member (70,300) with known defect.The flaw that this known defect is intentionally included in test member (70,300).Then test member is analyzed, to obtain the test profile (40) of defect.It addition, analyze engineering component (60,100) to be tested, to obtain output profile (40).This output profile (40) is compared with test profile (40), to determine whether engineering component (60,100) has the defect corresponding with known defect.

Description

Test member with defect is for the mthods, systems and devices of analysis project component

Technical field

The subject matter disclosed herein relates generally to component testing/assessment.It is more particularly related to the making of component With the test/assessment manufacturing the component having design defect.

Background technology

In complex machines, there are many components of the size of change, shape and function together with work, to realize machine institute The purpose of design.But, the inefficacy of component can make whole machine run improperly or fully stop operation.

Sometimes, the one or more defects in component component failure is caused.These defects can be in the initial manufacture of component Middle appearance, can be by caused by the operational stresses induced being combined with machine or can include various other factors.Sometimes, can be in the mistake of component In component, these defects are detected before effect.Briefly, however it is difficult to know to lose efficacy based on the defect detected and whether will Occur and whether must replacement part, or alternatively, it was observed that defect whether to the operation of the component in machine almost Not impact.Similarly, the component with the defect detected may unnecessarily be replaced, or can be allowed to continue behaviour Making, until it lost efficacy, every kind in situation above can consume unnecessary time and/or resource.

Summary of the invention

Disclose and there is the engineering component of design defect and there is the engineering component of design defect for assessing output component Use.Manufacture the test member with known defect.The flaw that this known defect is intentionally included in test member (flaw).Then test member is analyzed, to obtain the test profile of defect.It addition, analyze engineering component to be tested, to obtain Output profile.This output profile is compared with test profile, to determine whether engineering component has lack corresponding with known defect Fall into.

A first aspect of the present invention provides a kind of method for analysis project component, including: manufacture and there is known defect Test member, the flaw that described known defect is intentionally included in test member；Analyze test member, lack to obtain The test profile fallen into；Analysis project component, to obtain output profile；And output profile is compared with test profile, to determine Whether engineering component has the defect corresponding with known defect.

A second aspect of the present invention provides a kind of system for analysis project component, including: test member, it is manufactured Become there is known defect, the flaw that described known defect is intentionally included in test member；Analyzer, it analyzes test Component is to obtain the test profile of defect, and analysis project component is to obtain output profile；And comparator, it is by output profile Compare with test profile, to determine whether engineering component has the defect corresponding with known defect.

A third aspect of the present invention provides the journey being stored on computer-readable recording medium for analysis project component Sequence product, described program product performs method when being computer-executed, including: guidance has the test member of known defect Manufacture, the flaw that described known defect is intentionally included in test member；Analyze test member, to obtain the survey of defect Examination profile；Analysis project component, to obtain output profile；And output profile is compared with test profile, to determine engineering structure Whether part has the defect corresponding with known defect.

Accompanying drawing explanation

In conjunction with describing the accompanying drawing of various aspects of the present invention, by from of the invention below various in terms of detailed description in more Add the feature of these and other that will be readily understood that the disclosure, in accompanying drawing:

Fig. 1 is shown according to the embodiments of the invention Illustrative environment for analysis project component；

Fig. 2 illustrates example engineering component according to an embodiment of the invention；

Fig. 3 illustrates example flaw component according to an embodiment of the invention；

Fig. 4 illustrates that the figure of the defect being included according to an embodiment of the invention in test member represents；

Fig. 5 is shown according to embodiments of the invention and has the test member of known defect；And

Fig. 6 is shown according to the outline data storehouse of embodiments of the invention.

List of parts

10 environment

12 computer systems

14 calculate device

16 users

20 process component

22 memorizeies

24 I/O interfaces

26 circuits

29 storage systems

30 engineering components analyze program

32 Components Analysis device modules

34 test member design modules

36 profile comparator module

38 residual life estimator module

40 profiles

52 Components Analysis device devices

54 components manufacture device

60,100 engineering components

70,300 test member

102,202 indentures

104,204,304 holes

200 flaw components

252A-D；352A-D defect

350 figures represent

400 test profile data bases

410 records.

Detailed description of the invention

Disclose and there is the engineering component of design defect and there is the engineering component of design defect for assessing output component Use.Manufacture the test member with known defect.The flaw that this known defect is intentionally included in test member. Then test member is analyzed, to obtain the test profile of defect.It addition, analyze engineering component to be tested, to obtain output wheel Wide.This output profile is compared with test profile, to determine whether engineering component has the defect corresponding with known defect.

Accompanying drawing, Fig. 1 is turned to show according to embodiment for the Illustrative environment 10 of analysis project component 60.With regard to this Speech, environment 10 includes that computer system 12, described computer system 12 can perform process described herein with analysis project structure Part 60.In particular, it is shown that including the computer system 12 calculating device 14, described calculating device 14 includes engineering component analysis Program 30, it is operable that it makes to calculate device 14, to carry out analysis project component 60 by execution process described herein.

Show calculating device 14, described calculating device 14 include process component 20 (such as, one or more processors), Memorizer 22, storage system 29 (such as memory hierarchy), input/output (I/O) interface component 24 (such as, or many Individual I/O interface and/or device) and communication line 26.Generally, process component 20 to perform to be at least partially fixed to memorizer 22 In such as engineering component analyze program 30 program code.While performing program code, process component 20 and can process number According to, this may result in read from memorizer 22 and/or I/O interface component 24 to process further and/or to memorizer 22 and/ Or I/O interface component 24 write conversion data.Circuit 26 provide each in the component in computer system 12 between Communication link.I/O interface component 24 can include one or more peripheral I/O device, this make such as Components Analysis device device 52 and/ Or the communication between the peripheral unit of component manufacture device 54 is possibly realized.Additionally or alternatively, I/O interface component 24 can Including the I/O device of one or more people, this makes the human user 16 can be with computer system 12 and/or one or more communication Device interacts, so that system user 16 can use any kind of communication link to communicate with computer system 12.With regard to this For, engineering component analyzes program 30 can manage groups of interface (such as, (multiple) graphical user interface, application programming interfaces And/or similar interface), it makes people and/or system user 16 can analyze program 30 with engineering component to interact.Additionally, engineering Components Analysis program 30 can use any solution management (such as store, retrieve, produce, operate, organize, present) such as The data of profile 40.

Under any circumstance, computer system 12 can include that being able to carry out such as engineering component mounted thereto analyzes journey One or more general-purpose computations goods 14 of sequence 30.As used herein, it will be appreciated that " program code " refers to appoint Any set of the instruction of the form of what language, code or symbol, it enables the calculating device with information processing capability straight Ground connection or perform specific action after the most every any combination: turning of (a) to another language, code or symbol Change；B () is with the duplication of different materials form；And/or (c) decompression.Thus, engineering component analysis program 30 can be as system Software and/or any combination of application software and embody.Under any circumstance, the having the technical effect that to meter of computer system 12 Device 14 offer is provided and processes instruction, in order to analysis project component 60.

Groups of module 32-38 can be used to realize additionally, engineering component analyzes program 30.In this case, module 32-38 Computer system 12 can be made to be able to carry out as engineering component and to analyze the one-tenth group task that program 30 is used, and can be with engineering component The other parts of analysis program 30 are the most individually developed and/or realize.As used herein, term " component " is when being used as Referring to any hardware configuration with and without software during the element of computer system 12, it uses any solution to realize Be described in connection with is functional, and term " module " refers to program code, and it makes computer system 12 can use any solution Certainly scheme realizes the action being described in connection with.When being fixed in the memorizer 22 including processing the computer system 12 of component 20 Time, module is the essential part of the component realizing action.In any case, it will be appreciated that two or more components, module and/ Or system can share some in they corresponding hardware and/or software/all.Moreover, it will be understood that it is described herein Some in functional can not realize, or the additional functional part being included as computer system 12.

When computer system 12 includes multiple calculating device 14, each calculating device can only make engineering component analyze program The part (the most one or more module 32-38) of 30 is fixed thereon.It will be appreciated, however, that computer system 12 and work Journey Components Analysis program 30 only represents the various possible equivalent computer system that can perform process described herein.With regard to this Speech, in other embodiments, by computer system 12 and engineering component analysis program 30 provide functional can be at least in part Being realized by one or more calculating devices, it is general that the one or more calculates that device includes with and without program code And/or any combination of special hardware.In each example, if hardware is included with program code, can use respectively Standard engineering produces with programmatics.

In any case, when computer system 12 includes multiple calculating device 14, calculating device can be any kind of logical Communicate on letter link.Additionally, when performing process described herein, computer system 12 can use any kind of communication chain Road communicates with other computer systems one or more.In either case, communication link can include various types of wired and/ Or any combination of wireless link；Any combination including the network of one or more types；And/or use various types of biography Transferring technology and any combination of agreement.

As described herein, engineering component is analyzed program 30 and is made the computer system 20 can analysis project component 60.Just For this, it is shown that engineering component analyzes program 30, it includes Components Analysis device module 32, test member design module 34, wheel Wide comparator module 36 and residual life estimator module 38.

Referring still to Fig. 1, computer system 12 (such as Components Analysis device module 32) analysis project component 60.Performing it In the analysis of engineering component 60, Components Analysis device module 32 can use the data obtained via Components Analysis device device 52.Component Analyser device 52 can use Solution Analysis engineering component 60, described solution include but not limited to acoustics, ultrasound wave, X-ray, radiography, galvanomagnetic-effect, eddy current, magnetic particle, liquid infiltration, enhancing vision or known in the art for surveying Measurer has other solution any of the internally and/or externally geometry of the object of the composition of engineering component 60.Any In the case of, analyzing of engineering component 60 generates the profile 40 corresponding with specific engineering component 60.

Fig. 2 illustrates example engineering component 100 according to an embodiment of the invention.Engineering component 100 can include forming complexity Any component of the element of machine.Specifically, engineering component 100 can be any component that operation failure can occur.With regard to this Speech, engineering component can include any component of power generation systems, include but not limited to gas turbine, steamturbine, generator, Wind turbine, internal combustion engine etc..Alternatively, engineering component 100 can be used for including the unpowered execution process producing application, including but It is not limited to transport, aviation, commercial Application, utensil, light-duty machinery, heavy-duty machinery etc..As it can be seen, engineering component 100 is in shape On be to there is centralized positioning hole 104 and manufacture the cylindricality of indenture (indention) 102.But, those skilled in the art should Recognizing, this configuration is only used for the purpose of illustration, and therefore, engineering component 100 can present as may be adapted in complex machines Any shape of component or size.Similarly, engineering component 100 can include can be used for manufacturing appointing of the component for complex machines What material or combination of material, includes but not limited to metal, metal alloy, timber, plastics, rubber, pottery etc..In any situation Under, as illustrated, engineering component 100 does not the most comprise defect.Thus, use Components Analysis device device 52 to be component Analyzer module 32 collects the analysis of the engineering component 100 of data The future that part combines uses provides BLC.

Turning now to Fig. 3, it is shown that flaw component 200.As it can be seen, flaw component 200 has big with engineering component 100 Causing identical overall characteristic, described flaw component 200 has those holes of 100,102 being analogous respectively to engineering component 100 204 and indenture 202.It addition, flaw component 200 includes many defects 252A-D of the peripheral orientation around hole 204.Defect 252A-D is attributable to a variety of causes, includes but not limited to stress, weares and teares, corrodes and/or manufacturing defect.Should be appreciated that defect 252A-D is not limited to size, shape, position and/or orientation illustrated herein.Further, it is to be noted that defect 252A- D can fully occur on the surface of flaw component 200, in can being partly submerged in flaw component 200 or can fully flood Not in flaw component 200.Under any circumstance, use Partial parser device 52 to collect for Components Analysis device module 32 The analysis of the engineering component 200 of data can provide the output profile of flaw component 200, described output profile have include represent lack Fall into the data of the attribute of 252A-D.

Returning again to Fig. 1, computer system 12 (such as test member design module 34) instructs the manufacture of test member 70. In the manufacture performing test member 70, test member design module 34 can use component to manufacture device 54.An embodiment In, one or more design defect are manufactured into test member 70 by the manufacture with component itself simultaneously.In this embodiment, component Manufacturing device 54 can use additional manufacture process to instruct the manufacture of test member 70, in described additional manufacture process, all As incrementally made component by the application of many layers continuously.Thus, component manufactures device 54 and can use additional system Make the test member 70 that solution manufacture comprises one or more design defect, described additional manufacture solution include but It is not limited to laser sintered, stereolithography, electron-beam melting, 3D printing and/or laser clean shape cladding.Additionally, component manufacture dress 54 forms that can include adding to and/or combine additional manufacture process of putting use for currently known or develop subsequently Tradition deduct any device of component manufacturing complex machines, include but not limited to cutter sweep, drilling machine, router, milling machine, Lathe, clamp device etc..Thus, those skilled in the art will appreciate that the manufacture of the design defect making general characteristic with Any process that is currently known or that develop subsequently that the manufacture of component itself is possibly realized simultaneously can be used for manufacturing test member 70.In one embodiment, component manufactures device 54 can include the device of the additional manufacture process for laser sintered type, In the additional manufacture process of described laser sintered type, can be by depositing material layer continuously to form test member 70 Manufacture test member 70.

Under any circumstance, test member design module 34 can use profile 40 to instruct component in manufacturing test member 60 Manufacture device 54.As it has been described above, profile 40 can include the data obtained by the analysis of flaw component 200.For producing these The element of the data of profile is storable in storage system 29, and can be used for creating spy individually or in combination subsequently Fixed profile 40.Additionally or optionally, user 16 can use the data of the expection flaw represented in output component 200 to create spy Fixed profile 40.These data can in addition to alternate manner such as by use use test in computerization simulate and/or The analysis producing known or intended stress area obtains.In this case, user 16 can such as set via area of computer aided Meter (CAD) application designs module for test member and provides for all or part of data in the data of contoured 40.Should Profile 40 then with the baseline component of such as engineering component 100 or otherwise produce flaw with produce have desired The profile of the component of the testing engineering component of known defect merges.

Turning now to Fig. 4, it is shown that the figure being used for being included in defect 352A-D in test member 70 (Fig. 1) represents 350.As illustrated, defect 352A-D replicates defect 252A-D of flaw component 200 of Fig. 3.Thus, can be from by component Analyzer module 32 analysis based on flaw component 200 and one or more profiles 40 of creating retrieve defect 352A-D. Additionally or alternatively, defect 352A-D can be provided by user 16, and with reflection (baseline) flawless test member and/or That is created by the analysis of Components Analysis device module 32 baseline based on such as engineering component 100 output component one or more takes turns The data of wide 40 combine.

Under any circumstance, with reference now to Fig. 5, test member design module 34 (Fig. 1) knot of the manufacture instructed What fruit included having at least one known defect 352A-D makes test member 300.As realized by those skilled in the art Arriving, defect 352A-D is intentionally to be introduced the flaw of test member 300 during manufacture.Thus, as it can be seen, survey Examination component 300 is the copy of flaw component 200.However, it is understood by those of ordinary skill in the art that, it is not necessarily the case that so. But, defect 352A-D in test member 300 can have an attribute different from the attribute in flaw component 200, such as shape, Size, position and/or orientation.Additionally, test member 300 can have the flaw component 200 that is incorporated in defect 352A-D The base attribute that base attribute is different, such as shape, size etc..

Referring back to Fig. 1, after making test member 70, computer system 12 (such as Components Analysis device module 32) can Analyze test member 70.As a result, the test profile of the test member 70 including defect 352A-D (Fig. 5) can be obtained.Due to from Manufacture process has understood the attribute of the such as size, shape, orientation, position etc. of defect 352A-D, so this test profile can wrap Include the data can being associated with the attribute of defect 352A-D.Such as, test profile can be compared with the BLC of component.At this In example, any difference in profile is owing to the defect understanding its attribute from design and/or manufacture process.

Presently in connection with Fig. 1 with reference to Fig. 6, the test profile that the analysis from test member 70 obtains can be stored in test profile In data base 400.Test profile data base 400 can merge with the storage of other profile 40, or can be single alternatively Storage position.Under any circumstance, in addition to the test profile of test member 70, the record 410 of test profile data base 400 can Store other test profile.Thus, each test profile in test profile data base 400 may correspond to different tests Defect or multiple defect, it combines from different test member or isolates with different test member alternatively.

Be combined with Fig. 2, Fig. 3, Fig. 5 and Fig. 6 referring back to Fig. 1, computer system 12 (such as profile comparator module 36) The profile of the profile of output component 60 with test member 70 can be compared.Comparing to make this, profile comparator module 36 can From the profile that test profile data base 400 retrieval is corresponding with test member 70.Such as, the profile of test member 300 and engineering structure The profile of part 100 less likely produces coupling by the ratio of profile comparator module 36.Therefore, profile comparator module 36 determines product Go out component 100 and not there is the defect corresponding with defect 352A-D in test member.On the contrary, by by test member 300 The comparison of the profile comparator module 36 that profile compares with the profile of flaw component 200 produces coupling.Therefore, profile comparator mould Block 36 determines that flaw component 300 has and corresponding for the known defect 352A-D defect in test member.

By this way, what user 16 was worried is likely to be at the output component 60 among danger, can carry out point with regard to defect Analysis and test.Such as, the optional analysis of user 16 starts to show the component 60 of signs of wear.Alternatively, optional point of user 16 Destructed part 60, it does not show the sign of abrasion on its specific machine, but understands on another machine about its user Counterpart member 60 lost efficacy.Under any circumstance, once generate for output component 60 profile, so that it may research test profile in detail Profile in data base 400, and the profile in test profile data base 400 is compared with the profile being used for output component 60, And the decision which the test profile in multiple test profile most closely mates can be made with output profile.In doing so, Profile comparator module 32 can determine that whether output component 60 is flawless, and can determine that the attribute of any defect of existence (such as size, shape, position and orientation).Specifically, if it find that the test profile of the outline with output component 60, just May know that output component 60 has defect 352A-D mated with those known defects 352A-D in test member 70.

Referring again to Fig. 1, computer system 12 (such as, residual life estimator module 38) can character based on defect be estimated The residual life of meter output component.To this end, test member 70 can stand stress test, until the inefficacy realizing test member 70 is Only.Then the stress test of this stress test with indefectible component is compared, to determine the difference of durability.Additionally, bag can be made Test member 70 containing design defect be in actually used in, in order to experience output component experience actual loading with operation bar Part.Alternatively, in order to assess (multiple) design defect in the case of need not make test member 70 be in use to component (multiple) impact in life-span, can be carried out test member 70 under the loading condition in groups specified being designed to simulated operation environment Test.Compare based on this, the defect estimation on the impact of the residual life of test member 70 can be made.This estimation can be with test structure The profile of part 70 combines storage.At the profile of test member 70 with the profile of output component 60 by profile comparator module 36 During coupling, this estimation can be retrieved and for estimating the residual life of output component 60.

Although illustrated and described herein for being used for the method and system for electrical metering device configuration software, but it should reason Solving, the method for the present invention also provides for various optional embodiment.Such as, in one embodiment, the present invention provide be fixed on to Computer program in a few computer-readable medium, described computer program enables the computer system be when executed Electrical metering device configuration software.Thus, computer-readable medium include realizing described herein during some or Whole such as engineering components analyzes the program code of program 30 (Fig. 1).Should be appreciated that term " computer-readable medium " includes One or more in the currently known or any kind of tangible expression medium developed subsequently, can be from described computer-readable Medium understands, replicates or transmitted otherwise by calculating device the copy of program code.Such as, computer-readable medium Comprise the steps that one or more portable storage goods；Calculate one or more memorizer/means of storage of device；Paper；With/ Or the like.

In another embodiment, the present invention provides one to provide such as engineering component to analyze the program generation of program 30 (Fig. 1) The method of copy of code, described program code realize described herein during some or all.In this case, calculate Machine system can process realize described herein during the copy of some or all of program code, in order to for different The reception of second position generates and sends data signal group, and described data signal group makes the one or more settings in its characteristic And/or change, in order to the copy of the program code in data signal groups encodes.Similarly, embodiments of the invention carry For a kind of for obtain realize described herein during the method for copy of some or all of program code, the method Receive data signal group described herein including making computer system and data signal group is translated into be fixed at least one The copy of the computer program in computer-readable medium.In either case, can use any kind of communication link send/ Receive data signal group.

In another embodiment, the present invention provides a kind of for producing the side of system for electrical metering device configuration software Method.In this case, the computer system of such as computer system 12 (Fig. 1) can obtained (such as create, maintain, available Deng), and for perform process described herein one or more components can obtained (such as produce, buy, use, Change etc.) and can configure for computer system.Thus, configuration can include the most one or more: (1) is by journey Sequence code is installed on the computing device；(2) one or more calculating and/or I/O device are added to computer system；(3) merge And/or change computer system, so that computer system can perform process described herein；And/or it is similar.

Term used herein is only for describing specific embodiment, and is not intended to limit the present invention.As herein Made land used, unless context explicitly indicates that otherwise, otherwise singulative " ", " one " are intended to same with " being somebody's turn to do " Sample includes plural form.It is also understood that term " includes " and/or " comprising ", when using in the description, it is intended that stated The existence of feature, entirety, step, operation, element and/or component, but be not excluded for one or more further feature, entirety, step Suddenly, operation, element, component and/or the existence of their group or interpolation.

Although there is described herein various embodiment, but from description it should be recognized that element wherein, modification or The various combinations improved can be made by those skilled in the art, and within the scope of the invention.It addition, can many modifications may be made, To make specific situation or material be adapted to the teachings of the present invention in the case of without departing from the elemental range of the present invention.Therefore, The present invention should not be so limited to as being contemplated for carrying out the optimal mode of the present invention and disclosed specific embodiment, but the present invention The all embodiments belonging in scope of the following claims should be included.

Claims (10)

1. the method for analysis project component (60,100), including:

Analyze described engineering component (60,100), to obtain output profile；

Manufacturing the test member (70,300) with known defect, described known defect is intentionally included in described test structure Flaw in part (70,300)；

Analyze described test member (70,300), to obtain the test profile of described defect；And

Described output profile is compared with described test profile, to determine whether described engineering component (60,100) has with described The defect that known defect is corresponding.

Method the most according to claim 1, it is characterised in that also include:

Before described manufacture:

Analyze output engineering component (60,100), to obtain output component defect；And

Described test member (70,300) is designed in the way of described known defect mates with described output component defect.

Method the most according to claim 1, it is characterised in that also include:

Structured testing is applied to described test member (70,300), to realize the inefficacy of described test member (70,300)；With And

The defect corresponding with the described known defect residue to described engineering component (60,100) is estimated based on described structured testing The impact in life-span.

Method the most according to claim 1, it is characterised in that described manufacture includes the use of additional manufacturing operations.

5. the system for analysis project component (60,100), including:

Test member (70,300), it is manufactured with known defect, and described known defect is intentionally included in described Flaw in test member (70,300)；

Analyzer, its described test member of analysis (70,300) is to obtain the test profile of described defect, and analyzes described engineering Component (60,100) is to obtain output profile；And

Comparator, described output profile is compared by it with described test profile, whether to determine described engineering component (60,100) There is the defect corresponding with described known defect.

System the most according to claim 5, it is characterised in that also include:

Structured testing device, structured testing is applied to described test member (70,300) by it, with realize described test member (70, 300) inefficacy；And

Estimator, its based on described structured testing estimate the defect corresponding with described known defect to described engineering component (60, 100) impact of residual life.

System the most according to claim 5, it is characterised in that use additional manufacture process to manufacture described test member (70,300).

8. the device for analysis project component (60,100), described device includes:

Analyze described engineering component (60,100), to obtain the module of output profile；

Instructing the module of the manufacture of the test member (70,300) with known defect, described known defect is intentionally included Flaw in described test member (70,300)；

Analyze the module of described test member (70,300), to obtain the test profile of described defect；And

Described output profile is compared with described test profile, to determine whether described engineering component (60,100) has with described The module of the defect that known defect is corresponding.

Device the most according to claim 8, it is characterised in that described device also includes:

Structured testing is applied to described test member (70,300), to realize the mould of the inefficacy of described test member (70,300) Block；And

The defect corresponding with the described known defect residue to described engineering component (60,100) is estimated based on described structured testing The module of the impact in life-span.

Device the most according to claim 8, it is characterised in that described manufacture includes the use of the manufacture process added.