CN102807675A - Flexible transparent polyimide film material and preparation method thereof - Google Patents

Flexible transparent polyimide film material and preparation method thereof Download PDF

Info

Publication number
CN102807675A
CN102807675A CN2012102959343A CN201210295934A CN102807675A CN 102807675 A CN102807675 A CN 102807675A CN 2012102959343 A CN2012102959343 A CN 2012102959343A CN 201210295934 A CN201210295934 A CN 201210295934A CN 102807675 A CN102807675 A CN 102807675A
Authority
CN
China
Prior art keywords
polyimide film
flexible transparent
ladder
dianhydride
hour
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012102959343A
Other languages
Chinese (zh)
Inventor
屠国力
张子龙
方省众
姜鹏飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanjing Yimaide Photoelectric Material Technology Co Ltd
Original Assignee
Nanjing Yimaide Photoelectric Material Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanjing Yimaide Photoelectric Material Technology Co Ltd filed Critical Nanjing Yimaide Photoelectric Material Technology Co Ltd
Priority to CN2012102959343A priority Critical patent/CN102807675A/en
Publication of CN102807675A publication Critical patent/CN102807675A/en
Pending legal-status Critical Current

Links

Images

Abstract

The invention discloses a flexible transparent polyimide film material. The flexible transparent polyimide film material contains a novel diamine monomer. The adopted monoether bond bridged diamine monomer is high in reaction activity and moderate for polymerization condition, the adopted alicyclic dianhydride breaks off the conjugation and is high in rigidity, and the obtained polyimide film is high in transparency and excellent in thermal performance. The ultraviolet transmission cutoff wavelength of the polyimide film is 280-402 nm; and the glass-transition temperature is 284.36-336 DEG C.

Description

A kind of flexible transparent polyimide film material and preparation method thereof
Technical field:
The invention belongs to the technical field of macromolecular material, relate to a kind of flexible transparent polyimide film material and preparation method thereof, described polyimide film material contains the new diamine monomer.
Technical background:
Polyimide is a kind of high performance material, is used widely in high-tech sectors such as space flight and aviation, electric and electronic, photoelectrons.Last century the mid-1960s, E.I.Du Pont Company has applied for a series of patents, at first with Kapton (Kapton) and varnish (Pyre ML) commercialization, the epoch of a polyimide develop rapidly that Open from This Side.In flexible display technologies and field of thin film solar cells, adopt the clear polyimides film as flexible base, board, not only realize the flexibility of device own, and alleviated the weight of device largely.
Tradition Kapton band look, light transmission rate is not high, is owing to there is stronger intermolecular and intramolecular interaction in the molecular chain structure, between electron donor(ED) diamines and electron acceptor(EA) dianhydride, is prone to form charge transfer complex.The thinking that improves the transparency of Kapton mainly contains blocking-up polyimide molecule chain conjugation, reduces conjugated degree, reduces diamines electron donation and dianhydride electron-withdrawing power, increases the molecular chain torsion resistance, reduces intramolecularly and piles up degree or the like.The employing means have main even the introducing to contain fluoro substituents or side group, adopt to have the alicyclic ring substituted benzene ring, introduce non-coplanar structure, introduce bridged linkages such as sulfuryl.
In present research, the diamine monomer that extensively adopts is 2,2'-two (trifluoromethyl) benzidine (TFDB), and this diamine monomer contains biphenyl structural, contains the trifluoromethyl electron-withdrawing group.The biphenyl structural rigidity is big, can improve polyimide glass transition temperature, but can cause its decreased solubility.Can suppress generation intermolecular or intramolecularly transfer transport complex compound about the strong electrophilic of trifluoromethyl, reduce the polymerization activity of diamine monomer simultaneously.Therefore, in the diamines molecular structure, introduce the polymerization activity that the ehter bond bridging improves diamine monomer, improve the polyimide solvability.
Be in the document of " Highly Organosoluble and Flexible Polyimides with Color Lightness and Transparency Based on2; 2-Bis [4-(2-trifluoromethyl-4-aminophenoxy)-3; 5-dimeth-ylphenyl] propane " at exercise question; Author designed the novel ether diamine monomer 2 that contains, 2-two [4-(2-trifluoromethyl-4-amino-benzene oxygen-3,5-3,5-dimethylphenyl] propane.This kind diamines and 4, the cutoff wavelength of the Kapton that the polymerization of 4'-(the different propylene of hexafluoro) two anhydride phthalic acids (6FDA) obtains is 356nm, and second-order transition temperature is 264 ℃, and heat decomposition temperature is 462 ℃ in air.Owing to introduce the bis ether key, molecular chain is flexible to be increased, and second-order transition temperature descends.In two amine molecules, introduce four methyl structural, also reduced heat decomposition temperature.
Be in the document of " Synthesis and Properties of Fluorinated Polyimides. 1.Derived from Novel 4; 4-Bis (aminophenoxy)-3; 3-trifluoromethyl Terphenyl " at exercise question; The author has synthesized new diamine monomer 4, two (amino-benzene oxygen)-3, the 3-trifluoromethyl-biphenyls of 4-.The cutoff wavelength of the Kapton that this diamines and hexafluorodianhydride polymerization obtain is 372nm, and second-order transition temperature is 278 ℃, and heat decomposition temperature is 519 ℃ in air.The author obtains two amine molecules through the suziki linked reaction in document, and the synthetic route of being developed is comparatively expensive, is not suitable for industrial production.
So, in order to improve the solvability of molecular chain, improve the diamine monomer polymerization activity, guarantee high glass transition simultaneously, we have developed new diamine monomer 2,2'-two (trifluoromethyl) diamino-phenyl ether.This diamines introduces monoether key bridging and a position replaces the trifluoromethyl structure.In order to improve the transparency of Kapton, we have also adopted alicyclic ring dianhydride and new diamine polymerization, interrupt the conjugation of molecular chain, improve the molecule chain rigidity.
Summary of the invention
Main purpose of the present invention provides a kind of flexible transparent polyimide film material.
Another object of the present invention is to provide a kind of preparation method of flexible transparent polyimide film material.
The object of the invention is realized through following technical scheme:
A kind of flexible transparent polyimide film material; It is that described polyimide film material has following structural unit:
Figure BDA0000203001211
, R represents the dianhydride residue in the formula.
The weight-average molecular weight of above-mentioned polyimide film material is 2000 ~ 500000; Be preferably: 8000 ~ 200000.
The dianhydride residue of R representative is selected from:
(1) full aromatic dianhydride
Figure BDA0000203001212
(2) fatty dianhydride
Figure BDA0000203001213
(3) bridging aromatic dianhydride
Figure BDA0000203001214
Wherein one or more;
Be preferably:
Among
Figure BDA0000203001215
Figure BDA0000203001216
one or more.
Above-mentioned flexible transparent polyimide film material, it is to adopt any one preparation in following two kinds of methods:
Method one:
The first step: with strong polar non-proton organic solvent diamine monomer is dissolved in the polyreaction bottle fully, dianhydride monomer is added in batches, reaction is 1-48 hour under the mechanical stirring, obtains transparent, thick polyamic acid solution;
Second step: with the polyamic acid solution of gained leave standstill treated that wherein bubble was eliminated in 1-48 hour after; On clean base plate, filming, dried 1 ~ 3 hour down at 70 ~ 90 ℃ earlier, is a ladder with 20 ~ 50 ℃ again; Be warmed up to 200 ~ 300 ℃; Each ladder was kept 1-120 minute, naturally cooling then, and demoulding obtains Kapton;
Method two:
The first step: diamine monomer and dianhydride monomer are dissolved in the high boiling solvent, add catalyzer, under protection of inert gas heating reflux reaction 1-48 hour, to pour into after the cooling and separate out polyimide resin in the alcohol, pure washing and drying obtains polyimide resin;
Second step: polyimide resin is dissolved in the organic solvent, on substrate, films, dried 1 ~ 3 hour down at 70 ~ 90 ℃ earlier; Be a ladder with 20 ~ 50 ℃ again, be warmed up to 200-300 ℃, each ladder was kept 1-120 minute; Naturally cooling then, demoulding obtains Kapton.
The present invention provides two kinds of methods that prepare flexible transparent polyimide film material.
First kind of preparation method may further comprise the steps:
The first step: with strong polar non-proton organic solvent diamine monomer is dissolved in the polyreaction bottle fully, dianhydride monomer is added in batches, reaction is 1-48 hour under the mechanical stirring, obtains transparent, thick polyamic acid solution;
Second step: with the polyamic acid solution of gained leave standstill treated that wherein bubble was eliminated in 1-48 hour after; On clean base plate, filming, dried 1 ~ 3 hour down at 70 ~ 90 ℃ earlier, is a ladder with 20 ~ 50 ℃ again; Be warmed up to 200-300 ℃; Each ladder was kept 1-120 minute, naturally cooling then, and demoulding obtains Kapton.
Among first kind of preparation method: used strong polar non-proton organic solvent is N, dinethylformamide, DMAC N,N, DMSO 99.8MIN. or N-Methyl pyrrolidone.
Among first kind of preparation method: by the quality percentage composition, the solid content of controlling said polyamic acid solution is 10 ~ 70%.
Second kind of preparation method may further comprise the steps:
The first step: diamine monomer and dianhydride monomer are dissolved in the high boiling solvent, add catalyzer, under protection of inert gas heating reflux reaction 1-48 hour, to pour into after the cooling and separate out polyimide resin in the alcohol, pure washing and drying obtains polyimide resin;
Second step: polyimide resin is dissolved in the organic solvent, on substrate, films, dried 1 ~ 3 hour down at 70 ~ 90 ℃ earlier; Be a ladder with 20 ~ 50 ℃ again, be warmed up to 200-300 ℃, each ladder was kept 1-120 minute; Naturally cooling then, demoulding obtains Kapton.
Among second kind of preparation method: used high boiling solvent is N, dinethylformamide, DMAC N,N, DMSO 99.8MIN., N-Methyl pyrrolidone, meta-cresol, para-chlorophenol or phenylformic acid; The used organic solvent of filming is N, dinethylformamide, DMAC N,N, DMSO 99.8MIN., N-Methyl pyrrolidone, meta-cresol or THF; Used catalyzer is isoquinoline 99.9, quinoline, phenylformic acid, diacetyl oxide or pyridine; Described alcohol is ethanol or methyl alcohol.
Among first kind of preparation method and the second kind of preparation method: the molar ratio of said diamine monomer and dianhydride monomer is 0.9:1 ~ 1:1.1; The structural formula of said diamine monomer is:
Room temperature described in the application documents of the present invention is 20 ~ 30 ℃.
Beneficial effect of the present invention:
The diamine monomer of the monoether key bridging that the present invention adopts, reactive behavior is high, and polymerizing condition is gentle, and the alicyclic ring dianhydride of employing is break-in conjugated, and rigidity is big, and the Kapton transparency that obtains is high, and thermal property is excellent.It is 280nm-402nm that this type of Kapton UV-light sees through cutoff wavelength; Second-order transition temperature is between 284.36 ℃-336 ℃.
Description of drawings
Fig. 1 is the ir spectra of TFODA/CHDA-PI Kapton.
Fig. 2 is the ir spectra of TFODA/6FDA-PI Kapton.
Fig. 3 is the TGA curve of TFODA/PMDA-PI Kapton.
Fig. 4 is the TGA curve of TFODA/CHDA-PI Kapton.
Fig. 5 is the TGA curve of TFODA/6FDA-PI Kapton.
Fig. 6 is the DSC curve of TFODA/PMDA-PI Kapton.
Fig. 7 is the DSC curve of TFODA/CHDA-PI Kapton.
Fig. 8 is the DSC curve of TFODA/6FDA-PI Kapton.
Embodiment:
Embodiment 1
At room temperature, with 1.3450 gram (0.004 moles) 2,2 '-bis trifluoromethyl-4; 4 '-diaminodiphenyl oxide (TFODA) is dissolved in 8.87 gram N; In the N-N,N-DIMETHYLACETAMIDE, mechanical stirring adds 0.8725 gram (0.004 mole) pyromellitic acid dianhydride (PMDA) fully in batches after the dissolving; Continue stirring reaction 12 hours, and obtained solid content and be 20% transparent, thick polyamic acid solution.
Second step: with the polyamic acid solution of gained leave standstill treated that wherein bubble was eliminated in 24 hours after, on glass the filming of cleaning, put into high temperature oven.80 ℃ of down bakings 2 hours, ladder-elevating temperature to 110 ℃, 140 ℃, 170 ℃, 200 ℃, 240 ℃, 270 ℃ was respectively kept 30 minutes, to 300 ℃ of bakings 1 hour, naturally cooled to room temperature then again, and sheet glass is put into the water demoulding, obtained Kapton.
The molecular structure of clear polyimides film is following in the present embodiment:
Figure BDA0000203001218
The UV, visible light light transmission cutoff wavelength of measuring film is 402nm.Second-order transition temperature is 342.89 ℃.Polymkeric substance weight-average molecular weight M wBe 131,000.
Embodiment 2
At room temperature, with 1.3450 gram (0.004 moles) 2,2 '-bis trifluoromethyl-4; 4 '-diaminodiphenyl oxide (TFODA) is dissolved in 12.49 gram N; In the dinethylformamide, mechanical stirring adds 1.7770 gram (0.004 mole) hexafluorodianhydrides (6FDA) fully in batches after the dissolving; Continue stirring reaction 12 hours, and obtained solid content and be 30% transparent, thick polyamic acid solution.
Second step: with the polyamic acid solution of gained leave standstill treated that wherein bubble was eliminated in 24 hours after, on glass the filming of cleaning, put into high temperature oven.70 ℃ of down bakings 2 hours, ladder-elevating temperature to 100 ℃, 140 ℃, 180 ℃, 220 ℃, 260 ℃ was respectively kept 30 minutes, naturally cooled to room temperature then in 1 hour to 280 ℃ of bakings again, and sheet glass is put into the water demoulding, obtained Kapton.
The molecular structure of clear polyimides film is following in the present embodiment:
Figure BDA0000203001219
The UV, visible light light transmission cutoff wavelength of measuring film is 334nm, and transmitance is 81% at the 400nm place.Second-order transition temperature is 284.36 ℃.Polymkeric substance weight-average molecular weight M wBe 89,580.
Embodiment 3
At room temperature, with 1.3450 gram (0.004 moles) 2,2 '-bis trifluoromethyl-4; 4 '-diaminodiphenyl oxide (TFODA) is dissolved in the 8.97 gram N-Methyl pyrrolidone, and mechanical stirring adds 1.1769 gram (0.004 moles) 3 fully in batches after the dissolving; 3', 4,4'-biphenyl tetracarboxylic dianhydride (BPDA); Continue stirring reaction 12 hours, and obtained solid content and be 40% transparent, thick polyamic acid solution.
With the polyamic acid solution of gained leave standstill treated that wherein bubble was eliminated in 24 hours after, on glass the filming of cleaning, put into high temperature oven.80 ℃ of down bakings 2 hours, ladder-elevating temperature to 110 ℃, 140 ℃, 170 ℃, 200 ℃, 240 ℃, 270 ℃ was respectively kept 30 minutes, to 300 ℃ of bakings 1 hour, naturally cooled to room temperature then again, and sheet glass is put into the water demoulding, obtained Kapton.
The molecular structure of clear polyimides film is following in the present embodiment:
Figure BDA00002030012110
The UV, visible light light transmission cutoff wavelength of measuring film is 372nm, and transmitance is 68% at the 400nm place.Second-order transition temperature is 320 ℃.Polymkeric substance weight-average molecular weight M wBe 115,450.
Embodiment 4
At room temperature, take by weighing 1.3450 gram (0.004 moles) 2,2 '-bis trifluoromethyl-4; 4 '-diaminodiphenyl oxide (TFODA) and 0.8967 gram (0.004 mole) 1,2,4; 5-hexanaphthene tetracarboxylic dianhydride (CHDA) joins reaction flask, and nitrogen protection adds the 15g meta-cresol down, after stirring; Add 4 isoquinoline 99.9, be warming up to 190 ℃, reacted 12 hours.Pour reaction solution into ethanol after the cooling and separate out, ethanol boils to be washed, and filtering drying obtains polyimide powder.
Take by weighing the 1g polyimide powder, use 10gN, obtain polyimide solution after the dissolving of N-N,N-DIMETHYLACETAMIDE, on sheet glass, film, put into high temperature oven.80 ℃ of down bakings 2 hours, ladder-elevating temperature to 110 ℃, 140 ℃, 170 ℃ was respectively kept 30 minutes, to 200 ℃ of bakings 1 hour, put into the water demoulding again, obtained Kapton.
The molecular structure of clear polyimides film is following in the present embodiment:
The UV, visible light light transmission cutoff wavelength of measuring film is 298nm, and transmitance is 89% at the 400nm place.Second-order transition temperature is 308 ℃.Polymkeric substance weight-average molecular weight M wBe 26,200.
Embodiment 5
At room temperature; With 1.3450 gram (0.004 moles) 2,2 '-bis trifluoromethyl-4,4 '-diaminodiphenyl oxide (TFODA) are dissolved in the 8.52 gram methyl-sulphoxides; Mechanical stirring; Add 0.7844 gram (0.004 mole) tetramethylene tetracarboxylic dianhydride (CBDA) fully after the dissolving in batches, continued stirring reaction 12 hours, obtain solid content and be 20% transparent, thick polyamic acid solution.
With the polyamic acid solution of gained leave standstill treated that wherein bubble was eliminated in 24 hours after, on glass the filming of cleaning, put into high temperature oven.80 ℃ of down bakings 2 hours, ladder-elevating temperature to 110 ℃, 140 ℃, 170 ℃, 200 ℃, 240 ℃, 270 ℃ was respectively kept 30 minutes, naturally cooled to room temperature then in 1 hour to 300 ℃ of bakings again, and sheet glass is put into the water demoulding, obtained Kapton.
The molecular structure of clear polyimides film is following in the present embodiment:
Figure BDA00002030012112
The UV, visible light light transmission cutoff wavelength of measuring film is 280nm, and transmitance is 91% at the 400nm place.Second-order transition temperature is 317 ℃.Polymkeric substance weight-average molecular weight M wBe 14,600.
Embodiment 6
At room temperature, with 1.3450 gram (0.004 moles) 2,2 '-bis trifluoromethyl-4; 4 '-diaminodiphenyl oxide (TFODA) is dissolved in the 8.74 gram DMAC N,Ns, mechanical stirring; Add 0.8406 gram (0.004 mole) 1,2,3 fully after the dissolving in batches; 4-pentamethylene tetracarboxylic dianhydride (CPDA) continued stirring reaction 12 hours, obtained solid content and be 20% transparent, thick polyamic acid solution.
With the polyamic acid solution of gained leave standstill treated that wherein bubble was eliminated in 24 hours after, on glass the filming of cleaning, put into high temperature oven.80 ℃ of down bakings 2 hours, ladder-elevating temperature to 110 ℃, 140 ℃, 170 ℃, 200 ℃, 240 ℃, 270 ℃ was respectively kept 30 minutes, to 300 ℃ of bakings 1 hour, naturally cooled to room temperature then again, and sheet glass is put into the water demoulding, obtained Kapton.
The molecular structure of clear polyimides film is following in the present embodiment:
Figure BDA00002030012113
The UV, visible light light transmission cutoff wavelength of measuring film is 285nm, and transmitance is 86% at the 400nm place.Second-order transition temperature is 312 ℃.Polymkeric substance weight-average molecular weight M wBe 19,700.
Embodiment 7
At room temperature, take by weighing 1.3450 gram (0.004 moles) 2,2 '-bis trifluoromethyl-4; 4 '-diaminodiphenyl oxide (TFODA) and 09447 gram (0.004 mole) 4,5,6; 7-dicyclo [2.2.1] heptane tetracarboxylic dianhydride (BHDA) joins reaction flask, and nitrogen protection adds the 15g para-chlorophenol down, after stirring; Add the 1g phenylformic acid, be warming up to 205 ℃, reacted 12 hours.Pour reaction solution into ethanol after the cooling and separate out, ethanol boils to be washed, and filtering drying obtains polyimide powder.
Take by weighing the 1g polyimide powder, use 10gN, obtain polyimide solution after the dissolving of N-N,N-DIMETHYLACETAMIDE, on sheet glass, film, put into high temperature oven.80 ℃ of down bakings 2 hours, ladder-elevating temperature to 100 ℃, 120 ℃, 140 ℃, 180 ℃ was respectively kept 30 minutes, to 200 ℃ of bakings 1 hour, put into the water demoulding after the cooling again, obtained Kapton.
The molecular structure of clear polyimides film is following in the present embodiment:
Figure BDA00002030012114
The UV, visible light light transmission cutoff wavelength of measuring film is 294nm, and transmitance is 90% at the 400nm place.Second-order transition temperature is 320 ℃.Polymkeric substance weight-average molecular weight M wBe 38,500.
Embodiment 8
At room temperature, take by weighing 1.3450 gram (0.004 moles) 2,2 '-bis trifluoromethyl-4; 4 '-diaminodiphenyl oxide (TFODA) and 0.9928 gram (0.004 mole) 5,6,7; 8-dicyclo [2.2.2]-2-heptene tetracarboxylic dianhydride (BCDA) joins reaction flask, and nitrogen protection adds the 15g meta-cresol down, after stirring; Add 4 isoquinoline 99.9, be warming up to 190 ℃, reacted 12 hours.Pour reaction solution into ethanol after the cooling and separate out, ethanol boils to be washed, and filtering drying obtains polyimide powder.
Take by weighing the 1g polyimide powder, use 10gN, obtain polyimide solution after the dinethylformamide dissolving, on sheet glass, film, put into high temperature oven.80 ℃ of down bakings 2 hours, ladder-elevating temperature to 100 ℃, 120 ℃, 140 ℃, 160 ℃, 180 ℃ was respectively kept 30 minutes, and to 200 ℃ of bakings 1 hour, the water demoulding was put in cooling, obtains Kapton again.
The molecular structure of clear polyimides film is following in the present embodiment:
Figure BDA00002030012115
The UV, visible light light transmission cutoff wavelength of measuring film is 302nm, and transmitance is 85% at the 400nm place.Second-order transition temperature is 336 ℃.Polymkeric substance weight-average molecular weight M wBe 57,500.
Measure UV, visible light light transmission rate, thermal property and the mechanical property of embodiment 1-8 flexible transparent polyimide film.
Test result: it is 280nm-402nm that this type of Kapton UV-light sees through cutoff wavelength; Second-order transition temperature is between 284.36 ℃-342.89 ℃.

Claims (10)

1. flexible transparent polyimide film material is characterized in that described polyimide film material has following structural unit:
R represents the dianhydride residue in the formula.
2. flexible transparent polyimide film material according to claim 1, the weight-average molecular weight that it is characterized in that said polyimide film material is 2000 ~ 500000; Be preferably: 8000 ~ 200000.
3. flexible transparent polyimide film material according to claim 1 is characterized in that the dianhydride residue of R representative is selected from:
(1) full aromatic dianhydride
Figure FDA0000203001202
(2) fatty dianhydride
(3) bridging aromatic dianhydride
Figure FDA0000203001204
Wherein one or more;
Be preferably:
Figure FDA0000203001205
Figure FDA0000203001206
in one or more of.
4. flexible transparent polyimide film material according to claim 1 is characterized in that adopting any one preparation in following two kinds of methods:
Method one:
The first step: with strong polar non-proton organic solvent diamine monomer is dissolved in the polyreaction bottle fully, dianhydride monomer is added in batches, reaction is 1-48 hour under the mechanical stirring, obtains transparent, thick polyamic acid solution;
Second step: with the polyamic acid solution of gained leave standstill treated that wherein bubble was eliminated in 1-48 hour after; On clean base plate, filming, dried 1 ~ 3 hour down at 70 ~ 90 ℃ earlier, is a ladder with 20 ~ 50 ℃ again; Be warmed up to 200 ~ 300 ℃; Each ladder was kept 1-120 minute, naturally cooling then, and demoulding obtains Kapton;
Method two:
The first step: diamine monomer and dianhydride monomer are dissolved in the high boiling solvent, add catalyzer, under protection of inert gas heating reflux reaction 1-48 hour, to pour into after the cooling and separate out polyimide resin in the alcohol, pure washing and drying obtains polyimide resin;
Second step: polyimide resin is dissolved in the organic solvent, on substrate, films, dried 1 ~ 3 hour down at 70 ~ 90 ℃ earlier; Be a ladder with 20 ~ 50 ℃ again, be warmed up to 200-300 ℃, each ladder was kept 1-120 minute; Naturally cooling then, demoulding obtains Kapton.
5. the preparation method of the described flexible transparent polyimide film of claim 1 is characterized in that comprising the steps:
The first step: with strong polar non-proton organic solvent diamine monomer is dissolved in the polyreaction bottle fully, dianhydride monomer is added in batches, reaction is 1-48 hour under the mechanical stirring, obtains transparent, thick polyamic acid solution;
Second step: with the polyamic acid solution of gained leave standstill treated that wherein bubble was eliminated in 1-48 hour after; On clean base plate, filming, dried 1 ~ 3 hour down at 70 ~ 90 ℃ earlier, is a ladder with 20 ~ 50 ℃ again; Be warmed up to 200-300 ℃; Each ladder was kept 1-120 minute, naturally cooling then, and demoulding obtains Kapton.
6. the preparation method of flexible transparent polyimide film according to claim 3 is characterized in that: used strong polar non-proton organic solvent is N, dinethylformamide, DMAC N,N, DMSO 99.8MIN. or N-Methyl pyrrolidone.
7. the preparation method of flexible transparent polyimide film according to claim 3 is characterized in that: the solid content of controlling said polyamic acid solution is 10 ~ 70%.
8. the preparation method of the described flexible transparent polyimide film of claim 1 is characterized in that comprising the steps:
The first step: diamine monomer and dianhydride monomer are dissolved in the high boiling solvent, add catalyzer, under protection of inert gas heating reflux reaction 1-48 hour, to pour into after the cooling and separate out polyimide resin in the alcohol, pure washing and drying obtains polyimide resin;
Second step: polyimide resin is dissolved in the organic solvent, on substrate, films, dried 1 ~ 3 hour down at 70 ~ 90 ℃ earlier; Be a ladder with 20 ~ 50 ℃ again, be warmed up to 200-300 ℃, each ladder was kept 1-120 minute; Naturally cooling then, demoulding obtains Kapton.
9. the preparation method of flexible transparent polyimide film according to claim 6; It is characterized in that: used high boiling solvent is N; Dinethylformamide, DMAC N,N, DMSO 99.8MIN., N-Methyl pyrrolidone, meta-cresol, para-chlorophenol or phenylformic acid; The used organic solvent of filming is N, dinethylformamide, DMAC N,N, DMSO 99.8MIN., N-Methyl pyrrolidone, meta-cresol or THF; Used catalyzer is isoquinoline 99.9, quinoline, phenylformic acid, diacetyl oxide or pyridine; Described alcohol is ethanol or methyl alcohol.
10. according to the preparation method of claim 4 or 7 described flexible transparent polyimide film materials, it is characterized in that the molar ratio of said diamine monomer and dianhydride monomer is 0.9:1 ~ 1:1.1; The structural formula of said diamine monomer is:
Figure FDA0000203001207
CN2012102959343A 2012-08-19 2012-08-19 Flexible transparent polyimide film material and preparation method thereof Pending CN102807675A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012102959343A CN102807675A (en) 2012-08-19 2012-08-19 Flexible transparent polyimide film material and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012102959343A CN102807675A (en) 2012-08-19 2012-08-19 Flexible transparent polyimide film material and preparation method thereof

Publications (1)

Publication Number Publication Date
CN102807675A true CN102807675A (en) 2012-12-05

Family

ID=47231558

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012102959343A Pending CN102807675A (en) 2012-08-19 2012-08-19 Flexible transparent polyimide film material and preparation method thereof

Country Status (1)

Country Link
CN (1) CN102807675A (en)

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103044916A (en) * 2012-12-24 2013-04-17 南京依麦德光电材料科技有限公司 Flexible transparent polyimide thin film and preparation method thereof
CN103102489A (en) * 2013-02-27 2013-05-15 南京岳子化工有限公司 Thermoplastic polyimide resin and preparation method thereof
CN103756317A (en) * 2014-01-24 2014-04-30 江苏亚宝绝缘材料股份有限公司 Flexible conductive polyimide film
CN103755987A (en) * 2014-01-20 2014-04-30 江苏冰城电材股份有限公司 Preparation method for heat-resisting and high-transparence polyimide thin film
CN103755959A (en) * 2014-01-22 2014-04-30 江苏亚宝绝缘材料股份有限公司 Soft transparent polyimide film
CN103772983A (en) * 2014-01-24 2014-05-07 江苏亚宝绝缘材料股份有限公司 Transparent flexible conductive polyimide film
CN103772984A (en) * 2014-01-24 2014-05-07 江苏亚宝绝缘材料股份有限公司 Soluble polyimide film with high refractive index
CN103788650A (en) * 2013-12-31 2014-05-14 杭州福斯特光伏材料股份有限公司 Colorless and transparent polyimide film and preparation method thereof
CN104497309A (en) * 2014-12-12 2015-04-08 珠海亚泰电子科技有限公司 Polyamide film with high frequency and high binding force as well as preparation method of polyamide film
CN105024017A (en) * 2014-04-29 2015-11-04 Tcl集团股份有限公司 Flexible substrate, flexible display and manufacturing method thereof
CN105694035A (en) * 2016-03-17 2016-06-22 常州大学 High-transparency polyimide film material with tetramethyl diphenyl sulfone bis-ether structure and preparation method thereof
WO2018171000A1 (en) * 2017-03-23 2018-09-27 武汉华星光电技术有限公司 Modified polyimide film and preparation method thereof
CN108682616A (en) * 2018-05-09 2018-10-19 南京理工大学 A kind of preparation method of transparent conductive film for flexible display
US10316157B2 (en) 2017-03-23 2019-06-11 Wuhan China Star Optoelectronics Technology Co., Ltd Modified polyimide thin film and manufacturing method thereof
CN110540643A (en) * 2019-08-15 2019-12-06 武汉华星光电半导体显示技术有限公司 polyimide, preparation method thereof and flexible OLED panel
CN110577643A (en) * 2019-09-03 2019-12-17 武汉华星光电半导体显示技术有限公司 Polyimide, preparation method thereof and flexible OLED panel
CN110951077A (en) * 2019-11-14 2020-04-03 安徽国风塑业股份有限公司 Transparent polyimide precursor and preparation method thereof
CN112048063A (en) * 2020-09-04 2020-12-08 吉林奥来德光电材料股份有限公司 High-performance transparent polyimide film and preparation method thereof
WO2021140845A1 (en) 2020-01-08 2021-07-15 三菱瓦斯化学株式会社 Polyimide resin, photosensitive resin composition, resin film, and electronic device
CN113336940A (en) * 2021-05-21 2021-09-03 安徽国风塑业股份有限公司 Method for preparing polyamic acid solution by reacting dianhydride with low reactivity with diamine
CN114249893A (en) * 2021-12-22 2022-03-29 深圳市华科创智技术有限公司 Transparent polyimide film with electrochromic property and preparation method thereof
CN114874623A (en) * 2022-05-17 2022-08-09 中国科学院化学研究所 Polyimide resin slurry, polyimide conduit, and preparation method and application thereof
CN114989430A (en) * 2022-07-01 2022-09-02 桂林电子科技大学 Fluorine-free transparent polyimide film and preparation method thereof
CN115611753A (en) * 2022-05-12 2023-01-17 深圳先进电子材料国际创新研究院 Diamine compound, preparation method thereof, polyimide precursor, polyimide film and application thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1711308A (en) * 2003-01-10 2005-12-21 日东电工株式会社 Polyimide film and process for producing the same
CN102382303A (en) * 2011-08-16 2012-03-21 中国科学院宁波材料技术与工程研究所 Colorless and transparent polyimide resin material and preparation method thereof
CN102634022A (en) * 2012-04-10 2012-08-15 中国科学院化学研究所 Colorless highly-transparent polyimide film as well as preparation method and application thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1711308A (en) * 2003-01-10 2005-12-21 日东电工株式会社 Polyimide film and process for producing the same
CN102382303A (en) * 2011-08-16 2012-03-21 中国科学院宁波材料技术与工程研究所 Colorless and transparent polyimide resin material and preparation method thereof
CN102634022A (en) * 2012-04-10 2012-08-15 中国科学院化学研究所 Colorless highly-transparent polyimide film as well as preparation method and application thereof

Cited By (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103044916B (en) * 2012-12-24 2015-05-27 南京依麦德光电材料科技有限公司 Flexible transparent polyimide thin film and preparation method thereof
CN103044916A (en) * 2012-12-24 2013-04-17 南京依麦德光电材料科技有限公司 Flexible transparent polyimide thin film and preparation method thereof
CN103102489A (en) * 2013-02-27 2013-05-15 南京岳子化工有限公司 Thermoplastic polyimide resin and preparation method thereof
CN103102489B (en) * 2013-02-27 2015-05-27 南京岳子化工有限公司 Thermoplastic polyimide resin and preparation method thereof
CN103788650A (en) * 2013-12-31 2014-05-14 杭州福斯特光伏材料股份有限公司 Colorless and transparent polyimide film and preparation method thereof
CN103788650B (en) * 2013-12-31 2016-06-08 杭州福斯特光伏材料股份有限公司 A kind of transparent polyimide film and preparation method thereof
CN103755987A (en) * 2014-01-20 2014-04-30 江苏冰城电材股份有限公司 Preparation method for heat-resisting and high-transparence polyimide thin film
CN103755959A (en) * 2014-01-22 2014-04-30 江苏亚宝绝缘材料股份有限公司 Soft transparent polyimide film
CN103755959B (en) * 2014-01-22 2016-03-02 江苏亚宝绝缘材料股份有限公司 A kind of Flexible transparent polyimide thin film
CN103772984A (en) * 2014-01-24 2014-05-07 江苏亚宝绝缘材料股份有限公司 Soluble polyimide film with high refractive index
CN103772983A (en) * 2014-01-24 2014-05-07 江苏亚宝绝缘材料股份有限公司 Transparent flexible conductive polyimide film
CN103772984B (en) * 2014-01-24 2016-03-30 江苏亚宝绝缘材料股份有限公司 A kind of solubility high refractive index Kapton
CN103756317A (en) * 2014-01-24 2014-04-30 江苏亚宝绝缘材料股份有限公司 Flexible conductive polyimide film
CN103772983B (en) * 2014-01-24 2016-01-20 江苏亚宝绝缘材料股份有限公司 A kind of transparent flexible electric-conduction polyimide film
CN105024017B (en) * 2014-04-29 2018-06-19 Tcl集团股份有限公司 A kind of flexible base board, flexible display and preparation method thereof
CN105024017A (en) * 2014-04-29 2015-11-04 Tcl集团股份有限公司 Flexible substrate, flexible display and manufacturing method thereof
CN104497309A (en) * 2014-12-12 2015-04-08 珠海亚泰电子科技有限公司 Polyamide film with high frequency and high binding force as well as preparation method of polyamide film
CN105694035A (en) * 2016-03-17 2016-06-22 常州大学 High-transparency polyimide film material with tetramethyl diphenyl sulfone bis-ether structure and preparation method thereof
CN105694035B (en) * 2016-03-17 2018-06-12 常州大学 A kind of structure high transparency polyimide film material of bis ether containing tetramethyl diphenyl sulfone and preparation method thereof
US10316157B2 (en) 2017-03-23 2019-06-11 Wuhan China Star Optoelectronics Technology Co., Ltd Modified polyimide thin film and manufacturing method thereof
WO2018171000A1 (en) * 2017-03-23 2018-09-27 武汉华星光电技术有限公司 Modified polyimide film and preparation method thereof
CN108682616B (en) * 2018-05-09 2020-10-02 南京理工大学 Preparation method of transparent conductive film for flexible display
CN108682616A (en) * 2018-05-09 2018-10-19 南京理工大学 A kind of preparation method of transparent conductive film for flexible display
CN110540643B (en) * 2019-08-15 2021-02-23 武汉华星光电半导体显示技术有限公司 Polyimide, preparation method thereof and flexible OLED panel
CN110540643A (en) * 2019-08-15 2019-12-06 武汉华星光电半导体显示技术有限公司 polyimide, preparation method thereof and flexible OLED panel
CN110577643A (en) * 2019-09-03 2019-12-17 武汉华星光电半导体显示技术有限公司 Polyimide, preparation method thereof and flexible OLED panel
CN110951077A (en) * 2019-11-14 2020-04-03 安徽国风塑业股份有限公司 Transparent polyimide precursor and preparation method thereof
WO2021140845A1 (en) 2020-01-08 2021-07-15 三菱瓦斯化学株式会社 Polyimide resin, photosensitive resin composition, resin film, and electronic device
CN114945621A (en) * 2020-01-08 2022-08-26 三菱瓦斯化学株式会社 Polyimide resin, photosensitive resin composition, resin film, and electronic device
CN112048063A (en) * 2020-09-04 2020-12-08 吉林奥来德光电材料股份有限公司 High-performance transparent polyimide film and preparation method thereof
CN113336940A (en) * 2021-05-21 2021-09-03 安徽国风塑业股份有限公司 Method for preparing polyamic acid solution by reacting dianhydride with low reactivity with diamine
CN113336940B (en) * 2021-05-21 2023-09-19 安徽国风新材料股份有限公司 Method for preparing polyamic acid solution by reacting dianhydride with low reactivity and diamine
CN114249893A (en) * 2021-12-22 2022-03-29 深圳市华科创智技术有限公司 Transparent polyimide film with electrochromic property and preparation method thereof
CN114249893B (en) * 2021-12-22 2024-02-27 深圳市华科创智技术有限公司 Transparent polyimide film with electrochromic property and preparation method thereof
CN115611753A (en) * 2022-05-12 2023-01-17 深圳先进电子材料国际创新研究院 Diamine compound, preparation method thereof, polyimide precursor, polyimide film and application thereof
CN114874623A (en) * 2022-05-17 2022-08-09 中国科学院化学研究所 Polyimide resin slurry, polyimide conduit, and preparation method and application thereof
CN114989430A (en) * 2022-07-01 2022-09-02 桂林电子科技大学 Fluorine-free transparent polyimide film and preparation method thereof

Similar Documents

Publication Publication Date Title
CN102807675A (en) Flexible transparent polyimide film material and preparation method thereof
CN103044916B (en) Flexible transparent polyimide thin film and preparation method thereof
Hsiao et al. Synthesis and properties of poly (ether imide) s having ortho-linked aromatic units in the main chain
CN102634022B (en) Colorless highly-transparent polyimide film as well as preparation method and application thereof
CN102604091B (en) Polyimide containing benzimidazole unit and preparation method thereof
CN105566633A (en) Novel hyperbranched polyimide containing carbazole structure, and preparation method and application thereof
Wen et al. Syntheses and characterizations of high refractive index and low birefringence polyimides containing spirobifluorene in the side chain
Liaw et al. Synthesis and Characterization of New Highly Organosoluble Poly (ether imide) s Bearing a Noncoplanar 2, 2 ‘-Dimethyl-4, 4 ‘-biphenyl Unit and Kink Diphenylmethylene Linkage
CN102352039B (en) Soluble functional polyimide based on fluorene structure as well as preparation method and application thereof
Hu et al. Preparation and characterization of organic soluble polyimides with low dielectric constant containing trifluoromethyl for optoelectronic application
Sulub-Sulub et al. Highly permeable polyimide membranes with a structural pyrene containing tert-butyl groups: synthesis, characterization and gas transport
CN105085281A (en) Diamine monomer containing diphenylamine-fluorene, preparation method and application of same in polyimide preparation
CN104017214A (en) Light-colored transparent polyimide based on m-terphenyl diamine as well as preparation method and application thereof
CN102321244B (en) Soluble functional polyimide containing rigid non-planar conjugated structure, and preparation method and application thereof
CN102816327A (en) Polyimides containing ditrifluoromethyl group and unsymmetrical structure and preparation method thereof
Chung et al. Highly soluble fluorinated polyimides based on an asymmetric bis (ether amine): 1, 7‐bis (4‐amino‐2‐trifluoromethylphenoxy) naphthalene
Grubb et al. Highly soluble polyimides from sterically hindered diamines
Yang et al. Synthesis and characterization of novel fluorinated polyimides derived from 4, 4′‐[2, 2, 2‐trifluoro‐1‐(3‐trifluoromethylphenyl) ethylidene] diphthalic anhydride and aromatic diamines
CN103524738A (en) Method for preparing soluble polyimide by use of aromatic diamine monomer containing naphthaline and tertiary-butyl structure
CN103755987A (en) Preparation method for heat-resisting and high-transparence polyimide thin film
CN106832278A (en) One class high transparency copoly type fluorine-containing polyimide film material and preparation method thereof
CN105504281A (en) High-barrier function polyimide containing naphthaline structure and preparation method and application thereof
WO2022133722A1 (en) Polyimide material and preparation method therefor and application thereof
Sheng et al. Synthesis and characterization of new cardo poly (ether imide) s derived from 9, 9‐bis [4‐(4‐aminophenoxy) phenyl] xanthene
TW201815891A (en) Method for preparing adamantane-containing polyimide having properties such as low dielectric constant, high glass transition temperature (Tg) and good processability

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C12 Rejection of a patent application after its publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20121205