CN102802339B - Printed circuit board (PCB) - Google Patents

Printed circuit board (PCB) Download PDF

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Publication number
CN102802339B
CN102802339B CN201110133141.7A CN201110133141A CN102802339B CN 102802339 B CN102802339 B CN 102802339B CN 201110133141 A CN201110133141 A CN 201110133141A CN 102802339 B CN102802339 B CN 102802339B
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China
Prior art keywords
connecting element
current
pcb
circuit board
printed circuit
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CN201110133141.7A
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Chinese (zh)
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CN102802339A (en
Inventor
辛国胜
吴涛
谢厚斌
徐万新
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Yong Jie Electronics (Shixing) Co., Ltd.
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Yong Jie Electronics (shixing) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Yong Jie Electronics (shixing) Co Ltd filed Critical Yong Jie Electronics (shixing) Co Ltd
Priority to CN201110133141.7A priority Critical patent/CN102802339B/en
Publication of CN102802339A publication Critical patent/CN102802339A/en
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Publication of CN102802339B publication Critical patent/CN102802339B/en
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Abstract

The invention provides a printed circuit board (PCB). The PCB comprises a first current region, a second current region and a plurality of connection elements, wherein the first current region is electrically connected with the second current region by the connection elements; a plurality of connection terminals connected with external loads are arranged on the first current region; the connection elements are arranged between the first current region and the second current region; and the current path from each connection element to the corresponding connection terminal is the shortest. The PCB can avoid local overtemperature of the PCB caused by excessive current flowing through one connection element.

Description

Printed circuit board (PCB)
Technical field
The present invention relates to a kind of printed circuit board (PCB).
Background technology
Fig. 1 is refer to, the first Current Zone 11 and the second Current Zone 12, the first Current Zone 11 are provided with printed circuit board (PCB) 1 On be provided with connection end 13-15 for being connected with external loading, the electric current in the second Current Zone 12 passes through connecting element 16-19 Flow into the first Current Zone 11, and connection end 14 further flowed to by current path 141, is flowed to by current path 151 and is connected Hold 15 and connection end 13 is flowed to by current path 131.First Current Zone 11 has different operation electricity from the second Current Zone 12 Stream, but its operating voltage can for example be 12V voltages with identical.In view of the driving current of external loading is higher, generally require logical Connecting element 16-19 is crossed to couple together the first Current Zone 11 with the second Current Zone 12.But, flow through the plurality of connecting element The current unevenness of 16-19 is even, and the local temperature for being easily caused printed circuit board (PCB) 1 is too high, shortens the life-span of printed circuit board (PCB) 1 and drops Low its reliability.
The content of the invention
In view of the foregoing, it is necessary to a kind of electric current that can flow through multiple connecting elements is provided and more uniformly prints electricity Road plate, the printed circuit board (PCB) can avoid the electric current for flowing through a wherein connecting element excessive.
A kind of printed circuit board (PCB), including the first Current Zone, the second Current Zone and multiple connecting element, first Current Zone with Formed by the plurality of connecting element between second Current Zone and electrically connected, be provided with first Current Zone for negative with outside Connected some connection ends are carried, the plurality of connecting element is arranged between described first and second Current Zone, and each connecting element is extremely The current path of correspondence connection end is most short.
Compare prior art, the printed circuit board (PCB) by by the connecting element alloing each connecting element equal Shunting is through the electric current to the connection end, it is to avoid the electric current that a certain connecting element is flowed through is excessive.
Brief description of the drawings
Fig. 1 is the schematic diagram of existing printed circuit board (PCB).
Fig. 2 is the schematic diagram of the printed circuit board (PCB) that first embodiment of the invention is provided.
Fig. 3 is the schematic diagram of the printed circuit board (PCB) that second embodiment of the invention is provided.
Main element symbol description
Printed circuit board (PCB) 1、2、3
First Current Zone 11、21、31
Second Current Zone 12、22、32
Connection end 13-15、23-25、33-35
Connecting element 16-19、26-29、36-39
Current path 131、141、151、231、241、251、242、341、331、351
Side 40、41、50、51
Following specific embodiment will further illustrate the present invention with reference to above-mentioned accompanying drawing.
Specific embodiment
Fig. 2 is refer to, printed circuit board (PCB) of the present invention 2 includes one first Current Zone 21, one second Current Zone 22, connecting element 26-29 and connection end 23-25.According to actual needs, two or more connection units can also be included in the printed circuit board (PCB) 2 Part.
The connection end 23 is arranged on a side 50 of first Current Zone 21 and is used to (scheme not with external loading Show) it is connected, the connection end 24 is arranged on the side 51 of first Current Zone 21 nearby and near second Current Zone 22, For being connected with external loading (not shown), the side 51 that the connection end 25 is arranged on first Current Zone 21 is nearby and remote From second Current Zone 22, for being connected with external loading (not shown).The printed circuit board (PCB) 2 passes through connection end 23-25 Driving current is input into external loading, so connection end 23-25 is construed as load end.The connection end 23 can be symbol The golden finger of the specifications such as USB, PCI is closed, the connection end 24 and 25 can be connector.
Multiple voltage zones are usually provided with the printed circuit board (PCB) 2 to drive multiple loads simultaneously, but, at each Difference that can be further according to load in voltage zone is divided into multiple Current Zones with different operation electric currents.Set in the present embodiment It is equipped with the operation electric current of the operation electric current less than second Current Zone 22 of first Current Zone 21 of connection end 23-25.Described Formed by the connecting element 26-29 between one Current Zone 21 and the second Current Zone 22 and electrically connected, that is to say, that the second electric current Electric current in area 22 flows into the first Current Zone 21 by connecting element 26-29, and described in further being flowed to by current path 241 Connection end 24, the connection end 25 is flowed to by current path 251 and the connection end 23 is flowed to by current path 231. In present embodiment, it is described by being flowed to after the connecting element 26-29 that the current path 241,251 and 231 is electric current The most short current path of connection end 24,25 and 23.
The connecting element 26-29 can be the impedors such as resistance, metal-oxide-semiconductor.The connecting element 26-29 is according to certain Mode is arranged.In order to describe to understand the arrangement mode of connecting element 26-29, set the connection end 23 there is one and be located at On the printed circuit board (PCB) 2 and perpendicular to the center line OO ' of side 50 and 51, and set each connecting element 26-29 and center line The vertical range of OO ' is respectively x1, x2, x3 and x4(Be illustrate only in Fig. 2 connecting element 28 it is vertical with center line OO ' away from From x3), the vertical range of each connecting element 26-29 and side 51 is respectively y1, y2, y3 and y4(The company of illustrate only in Fig. 2 Meet the vertical range y3 of element 28 and side 51).It can be seen that ought a wherein connecting element and center line OO ' hang down Straight distance more hour, the connecting element is then bigger with the vertical range of side 51.It is also understood that in connecting element 26-29 Vertical range between the connecting element smaller with the vertical range of center line OO ' and side 51 is bigger, closer to center line Vertical range between the connecting element of OO ' and side 51 is bigger.From the point of view of connecting element 26-29 arrangement shapes, the present embodiment In the stepped arrangements of connecting element 26-29.
From figure 2 it can be seen that the stairstepping arrangement of the connecting element 26-29 will cause the connecting element 27- 29 distance apart from the connection end 23 and 25 becomes near, therefore the current path 251 and 231 shortens, so that the connection unit Electric current on part 26 is distributed to other and is relatively distant from the connecting element 27-29 of the connection end 24 by drainage so that flow through each The electric current of individual connecting element 26-29 is more uniform, so as to avoid the upstream of the connecting element 26 through excessive electric current.
Further, also by the current path by flowing to the connection end 24 after the connecting element 26 in present embodiment Copper Foil on 241 is hollowed out, to increase the equivalent resistance that electric current flows to the connection end 24 by the current path 241, from And by electric current by the current path that the connection end 24 is flowed to beeline after the connecting element 26 change into it is larger away from From current path 242, so as to reduce the electric current flowed through in the connecting element 26, also pass through each connecting element 26- 29 electric current is more uniformly distributed, so as to further avoid the upstream of the connecting element 26 through excessive electric current.
The printed circuit board (PCB) 1 is carried out to emulate the current value for obtaining flowing through each connecting element, as shown in table 1:
Table 1
Connecting element 16 17 18 19
Electric current(A) 14.982 13.465 11.276 12.479
Emulation is carried out to the printed circuit board (PCB) 2 can obtain flowing through the current value of each connecting element, as shown in table 2:
Table 2
Connecting element 26 27 28 29
Electric current(A) 12.213 13.173 11.759 13.906
From table 1 it is known that second Current Zone 12 electric current flow into first Current Zone 11 when, wherein most Electric current flows through the electric current maximum flowed through in the connecting element 16, therefore the connecting element 16, in this way, the connecting element 16 Pin temperature it is too high, then from table 2 it is known that the electric current of second Current Zone 22 flows into first Current Zone 21 When, it is only 2.147 amperes to flow through the maximum of the connecting element 26-29 and the difference of minimum current, therefore flows through the connection unit The electric current of part 26-29 is more uniform, in this way, avoiding a certain connecting element upstream causes its pin temperature through excessive electric current It is too high.
Refer to Fig. 3, the printing that the printed circuit board (PCB) 3 that second embodiment of the invention is provided is provided with above-mentioned first embodiment Circuit board 2 is essentially identical, and difference is:Connecting element 37 is near side 40, and connecting element 38 is close to side 41, so that Connecting element 36-39 is set to be arranged in bending, to cause the connecting element 37-39 apart from the distance of the connection end 33 and 35 Become near, therefore the current path 351 and 331 shortens, so that the electric current in the connecting element 36 is distributed to other by drainage It is relatively distant from the connecting element 37-39 of the connection end 34 so that the electric current for flowing through each connecting element 36-39 is more equal Even, so as to avoid the upstream of the connecting element 36 through excessive electric current, the reliability of printed circuit board (PCB) 3 and life-span are improved.
The printed circuit board (PCB) is by arranging the connecting element into a ladder or bending and will flow to the company The mode that the Copper Foil on the current path at end hollows out is connect to be flowed through to the connection end to allow that each connecting element is divided equally Electric current, it is to avoid a certain connecting element because the electric current for flowing through is excessive causes its pin temperature too high, and then cause printing electricity Road the plate lost of life and reliability reduction because local temperature is too high.

Claims (1)

1. a kind of printed circuit board (PCB), including the first Current Zone, the second Current Zone and multiple connecting element, first Current Zone with should Formed by the plurality of connecting element between second Current Zone and electrically connected, multiple connection ends are additionally provided with first Current Zone, The multiple connection end is used to be connected with external loading, and the plurality of connecting element is arranged in first Current Zone and the second electric current Between area, it is characterised in that:The printed circuit board (PCB) includes mutually opposing first side and second side, the multiple connection Between element and the first side and second side parallel sequential arrangement, and adjacent the multiple connecting element each other Stagger and arranged in bending, and it is uniform to flow through the electric current of the multiple connecting element.
CN201110133141.7A 2011-05-23 2011-05-23 Printed circuit board (PCB) Active CN102802339B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201110133141.7A CN102802339B (en) 2011-05-23 2011-05-23 Printed circuit board (PCB)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201110133141.7A CN102802339B (en) 2011-05-23 2011-05-23 Printed circuit board (PCB)

Publications (2)

Publication Number Publication Date
CN102802339A CN102802339A (en) 2012-11-28
CN102802339B true CN102802339B (en) 2017-05-24

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Application Number Title Priority Date Filing Date
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1742470A (en) * 2003-01-29 2006-03-01 皇家飞利浦电子股份有限公司 Transmission line conductor arrangement
CN101557675A (en) * 2008-04-11 2009-10-14 鸿富锦精密工业(深圳)有限公司 Printed circuit board and wiring method thereof
CN101646300A (en) * 2008-08-07 2010-02-10 佳能株式会社 Printed wiring board
US7746660B1 (en) * 2006-10-10 2010-06-29 Xilinx, Inc. Reduced mounting inductance and increased self-resonant frequency range
CN102034823A (en) * 2009-09-30 2011-04-27 意法半导体研发(深圳)有限公司 Layout and bonding pad floor planning for power transistor with favorable SPU (Short-to-Plus Unpowered) and STOG (Short-to-Open circuit Grounded) performance
CN102740588A (en) * 2011-04-15 2012-10-17 鸿富锦精密工业(深圳)有限公司 Printed circuit board

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW434821B (en) * 2000-02-03 2001-05-16 United Microelectronics Corp Allocation structure of via plug to connect different metal layers
CN101005730A (en) * 2006-01-20 2007-07-25 佛山市顺德区顺达电脑厂有限公司 Circuit board for reducing electromagnetic interference of electronic product

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1742470A (en) * 2003-01-29 2006-03-01 皇家飞利浦电子股份有限公司 Transmission line conductor arrangement
US7746660B1 (en) * 2006-10-10 2010-06-29 Xilinx, Inc. Reduced mounting inductance and increased self-resonant frequency range
CN101557675A (en) * 2008-04-11 2009-10-14 鸿富锦精密工业(深圳)有限公司 Printed circuit board and wiring method thereof
CN101646300A (en) * 2008-08-07 2010-02-10 佳能株式会社 Printed wiring board
CN102034823A (en) * 2009-09-30 2011-04-27 意法半导体研发(深圳)有限公司 Layout and bonding pad floor planning for power transistor with favorable SPU (Short-to-Plus Unpowered) and STOG (Short-to-Open circuit Grounded) performance
CN102740588A (en) * 2011-04-15 2012-10-17 鸿富锦精密工业(深圳)有限公司 Printed circuit board

Also Published As

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Effective date of registration: 20160617

Address after: 518000 Guangdong Province, Shenzhen New District of Longhua City, Dalang street, Hua Sheng Lu Yong Jingxuan commercial building 1608

Applicant after: Jinyang Shenzhen sea Network Intelligent Technology Co., Ltd.

Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two

Applicant before: Hongfujin Precise Industry (Shenzhen) Co., Ltd.

Applicant before: Hon Hai Precision Industry Co., Ltd.

CB03 Change of inventor or designer information
CB03 Change of inventor or designer information

Inventor after: Xin Guosheng

Inventor after: Wu Tao

Inventor after: Xie Houbin

Inventor after: Xu Wanxin

Inventor before: Huang Zongsheng

Inventor before: Chen Junren

Inventor before: He Dunyi

Inventor before: Zhou Weijie

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Effective date of registration: 20170425

Address after: 510000 Shixing Industrial Park West (Jiangkou area), Guangdong

Applicant after: Yong Jie Electronics (Shixing) Co., Ltd.

Address before: 518000 Guangdong Province, Shenzhen New District of Longhua City, Dalang street, Hua Sheng Lu Yong Jingxuan commercial building 1608

Applicant before: Jinyang Shenzhen sea Network Intelligent Technology Co., Ltd.

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