CN102801926A - Image sensor assembly as well as configuration method and testing method thereof - Google Patents
Image sensor assembly as well as configuration method and testing method thereof Download PDFInfo
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- CN102801926A CN102801926A CN2012102237258A CN201210223725A CN102801926A CN 102801926 A CN102801926 A CN 102801926A CN 2012102237258 A CN2012102237258 A CN 2012102237258A CN 201210223725 A CN201210223725 A CN 201210223725A CN 102801926 A CN102801926 A CN 102801926A
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Abstract
The invention provides an image sensor assembly as well as a configuration method and a testing method of the image sensor assembly. According to the image sensor assembly and the configuration method of the image sensor assembly, an OTP (One Time Programmable) module for storing configuration information of the image sensor assembly is arranged, so that when a test of the image sensor assembly is carried out, namely an image sensor and a lens group assembling unit are tested, the configuration information can be accurately obtained from the OTP module; and the test depended information is accurate so that the reliability of carrying out the test is guaranteed. Meanwhile, the information can be obtained on the spot in a testing process and the expending of time cost for obtaining the information and some relative costs is avoided, so that the testing cost is reduced.
Description
Technical field
The present invention relates to the optics technical field, particularly a kind of image sensor module, its collocation method and method of testing thereof.
Background technology
In the prior art, imageing sensor (Sensor) and lens group (Lens) are all given production and selling as an independent product usually, promptly these two parts produce separately, (qualified, performance) debugging, the encapsulation, then, make up through the third party again.Idiographic flow can be with reference to figure 1, and it is existing imageing sensor and lens group assembling and testing process sketch map.
As shown in Figure 1, imageing sensor and lens group all are sent to third party's (being the module factory among Fig. 1) and assemble/dispose after producing and accomplishing, and the sub-assembly that assembling is accomplished is sent to the opposing party's (being the terminal production firm among Fig. 1) again and tests.At this moment, terminal production firm is a kind of man-to-man test for the test of sub-assembly, and promptly a test macro can only be used for the sub-assembly corresponding with this test macro.
At first; Because the otherness that technology certainly exists is in promptly same batch the imageing sensor and lens group, between each imageing sensor; And all have small difference between each lens group; And in the configuration and method of testing of this kind for imageing sensor and lens group, because of being difficult to obtain the parameter of those fine differences in the test process, can only ignore for this species diversity.
Secondly, when the change of bigger imageing sensor or lens group occurring, promptly imageing sensor in the various combination spare or lens group parameter difference are very big, and when consequently not carrying out the differentiation test, it is beyond all doubt that test will become.At this moment; Because measuring unit (being the terminal production firm among Fig. 1) is owing to be the concrete parameter that can't obtain each parts wherein from sub-assembly; It can only obtain these information from factory (being lens group factory and the imageing sensor factory among Fig. 1), promptly need carry out combined debugging/test.Thus, will cause the expenditure of great time cost and some correlative chargess, modernized totally unfavorable for industry.
At present; Publication number is that " CN102298247A ", denomination of invention disclose a kind of CCC (Camera Cub Chip) image sensor module for the Chinese publication application of " reinforced structure that is used for the wafer scale camera module "; It has been incorporated into imageing sensor with lens group; But this CCC image sensor module does not still solve the problem that testing reliability is low, testing cost is high.It is thus clear that this problem of relevant test is perplexing those skilled in the art always.
Summary of the invention
The object of the present invention is to provide a kind of image sensor module, its collocation method and method of testing thereof, to solve in the prior art the problem that testing reliability is low, testing cost is high for imageing sensor and lens group sub-assembly.
For solving the problems of the technologies described above, the present invention provides a kind of image sensor module, comprising: imageing sensor that is packaged together and set of lenses; Described imageing sensor comprises an One Time Programmable (One Time Programmable; Being called for short OTP, is a kind of type of memory of MCU, behind the burned IC of program; Can not change once more) module, said One Time Programmable module is in order to deposit the configuration information of said image sensor module.
Optional, in described image sensor module, said One Time Programmable module is deposited the configuration information of said imageing sensor.
Optional, in described image sensor module, said One Time Programmable module is also deposited the configuration information of said set of lenses.
The present invention also provides a kind of collocation method of image sensor module, comprising:
The imageing sensor and the set of lenses that will have the One Time Programmable module combine;
After integrating completion, carry out the picture quality debugging, obtain configuration information;
Configuration information is deposited in the One Time Programmable module;
Imageing sensor, set of lenses and One Time Programmable module are encapsulated.
Optional, in the collocation method of described image sensor module, said configuration information comprises the configuration information of imageing sensor.
Optional, in the collocation method of described image sensor module, said configuration information also comprises the configuration information of set of lenses.
The present invention also provides a kind of method of testing of image sensor module, comprising:
Image sensor module is connected with test platform;
The driver module of test platform obtains the configuration information in the One Time Programmable module;
Test platform is tested image sensor module according to the configuration information that obtains.
Optional, in the method for testing of described image sensor module, be reserved with the module of obtaining configuration information in the said driver module.
Optional, in the method for testing of described image sensor module, said configuration information comprises the configuration information of imageing sensor.
Optional, in the method for testing of described image sensor module, said configuration information also comprises the configuration information of set of lenses.
In image sensor module provided by the invention and collocation method thereof; The OTP module that comprises the configuration information of depositing image sensor module, thus, when carrying out the test of image sensor module; Promptly comprise when imageing sensor and lens group sub-assembly tested; Can from said OTP module, obtain configuration information accurately, because the accuracy of the information that test relies on, thus the reliability of the test that has guaranteed to carry out in view of the above.Simultaneously, because these information can obtain in test process then and there, avoided the time cost that information obtains and the expenditure of some correlative chargess accordingly, thereby reduced testing cost.
Description of drawings
Fig. 1 is existing imageing sensor and lens group assembling and testing process sketch map;
Fig. 2 is the image sensor module assembling and the testing process sketch map of the embodiment of the invention.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment image sensor module provided by the invention, its collocation method and method of testing thereof are done further explain.According to following explanation and claims, advantage of the present invention and characteristic will be clearer.What need explanation is, accompanying drawing all adopts the form of simplifying very much, only in order to convenient, the purpose of the aid illustration embodiment of the invention lucidly.
Please refer to Fig. 2, in the present embodiment, the collocation method of image sensor module comprises the steps:
Imageing sensor and set of lenses are combined;
After integrating completion, carry out the picture quality debugging, obtain configuration information;
Configuration information is deposited in OTP (One Time Programmable) module;
Imageing sensor, set of lenses and OTP module are encapsulated.
Thus, will obtain an image sensor module, it comprises: imageing sensor that is packaged together and set of lenses, described imageing sensor comprise an OTP module, and said OTP module is in order to deposit the configuration information of said image sensor module.
Wherein, present embodiment repeats no more for the relation of imageing sensor and set of lenses and with the technology that imageing sensor and set of lenses combine, and this concerns for existing technology/routine, is knowledge known in those skilled in the art.
Present embodiment is stressed that, in the layoutprocedure of image sensor module, after imageing sensor and set of lenses combined, carries out the picture quality debugging, obtains configuration information.Wherein, said configuration information comprises: the configuration information of said imageing sensor and/or the configuration information of said set of lenses.Concrete; Said configuration information can comprise: white balance (White Balance), lens correction value (Lens Correction), gamma value (Gamma), colour moment battle array (Color Matrix) etc.; Certainly; In other embodiments of the invention, said configuration information also can further comprise: definition (Sharpness), denoising (De-noise) etc.To this, can be according to concrete product requirement, all kinds of configuration informations of storage in said OTP module.
In the present embodiment, obtaining of said configuration information is after imageing sensor and set of lenses integration, when carrying out the picture quality debugging, obtains.Thus, the configuration information that is obtained will be more accurate, make that the reliability of follow-up test is higher.Reason is; Change slightly possibly take place in imageing sensor and set of lenses configuration information separately before integrating and after integrating; And test finally will be obtained is the quality after imageing sensor and set of lenses are integrated; Therefore, be some information more reliably for test at the configuration information that after imageing sensor and set of lenses integration, obtains, thereby can further improve the reliability of test.
In the present embodiment, said OTP module package is in said imageing sensor.Concrete; Said OTP module can be integrated even said configuration information is deposited in the existing module of said imageing sensor with more original modules in the said imageing sensor; Thus; Can make full use of existing parts, utilize the miniaturization of imageing sensor, image sensor module.
In the present embodiment, said imageing sensor can be ccd image sensor, also can be cmos image sensor, and promptly the application does not do qualification for the concrete implementation of imageing sensor, and it can be existing any imageing sensor.This shows that the image sensor module that the application provided, its collocation method and method of testing thereof have high versatility.
Subsequent, will further set forth for the method for testing of imageing sensor, specifically comprise:
Image sensor module is connected with test platform;
The driver module of test platform obtains the configuration information in the OTP module;
Test platform is tested image sensor module according to the configuration information that obtains.
Wherein, said test platform can have the parts of operation processing function for central processing unit, microprocessor etc., and the application does not do qualification to this.
The application is stressed that; With image sensor module with after test platform is connected; The driver module of test platform can obtain configuration information, thereby can test according to this configuration information at once, promptly is equivalent to carry out said test through the mode of plug and play; No longer need suspend and obtain the configuration information that some tests need, thereby improve the efficient of test greatly.
After obtaining configuration information, said test platform promptly by existing mode/requirement to said image sensor module, mainly refer to imageing sensor and set of lenses are tested, obtain test result.This point and not this Applicant's Abstract graph emphasis, simultaneously, after configuration information was provided, those skilled in the art were easy to test in view of the above, and therefore, the application repeats no more.
Further, in the present embodiment, be reserved with the module of obtaining configuration information in the said driver module, therefore, said driver module has versatility, all can use same driver module according to the pictures different sensor cluster, thereby has reduced testing cost.And simultaneously; Again can be through obtaining the configuration information of each image sensor module; Carry out the differentiation test to the different images sensor cluster, even, also can accurately test promptly to same batch imageing sensor and the fine difference in the lens group; And need not tolerate the existence of such fine difference, and then guaranteed the reliability of test.
In sum, in image sensor module, its collocation method and the method for testing thereof that present embodiment provides, have the following outstanding advantage:
Can realize plug and play, thereby improve efficient, reduce cost;
Need not to change the driver of test platform, the situation with respect to needing in the existing technology often to revise greatly reduces the human and material resources cost;
Can carry out the differentiation test to the fine difference in imageing sensor and the lens group, thereby improve the reliability of test, further guarantee the yield of product.
Foregoing description only is the description to preferred embodiment of the present invention, is not any qualification to the scope of the invention, and any change, modification that the those of ordinary skill in field of the present invention is done according to above-mentioned disclosure all belong to the protection range of claims.
Claims (10)
1. image sensor module; It is characterized in that; Comprise: imageing sensor that is packaged together and set of lenses, described imageing sensor comprise an One Time Programmable module, and said One Time Programmable module is in order to deposit the configuration information of said image sensor module.
2. image sensor module as claimed in claim 1 is characterized in that said One Time Programmable module is deposited the configuration information of said imageing sensor.
3. image sensor module as claimed in claim 2 is characterized in that said One Time Programmable module is also deposited the configuration information of said set of lenses.
4. the collocation method of an image sensor module is characterized in that, comprising:
The imageing sensor and the set of lenses that will have the One Time Programmable module combine;
After integrating completion, carry out the picture quality debugging, obtain configuration information;
Configuration information is deposited in the One Time Programmable module;
Imageing sensor, set of lenses and One Time Programmable module are encapsulated.
5. the collocation method of image sensor module as claimed in claim 4 is characterized in that, said configuration information comprises the configuration information of imageing sensor.
6. the collocation method of image sensor module as claimed in claim 5 is characterized in that, said configuration information also comprises the configuration information of set of lenses.
7. the method for testing of an image sensor module is characterized in that, comprising:
Image sensor module is connected with test platform;
The driver module of test platform obtains the configuration information in the One Time Programmable module;
Test platform is tested image sensor module according to the configuration information that obtains.
8. the method for testing of image sensor module as claimed in claim 7 is characterized in that, is reserved with the module of obtaining configuration information in the said driver module.
9. the method for testing of image sensor module as claimed in claim 7 is characterized in that, said configuration information comprises the configuration information of imageing sensor.
10. the method for testing of image sensor module as claimed in claim 7 is characterized in that, said configuration information also comprises the configuration information of set of lenses.
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| CN2012102237258A CN102801926A (en) | 2012-06-29 | 2012-06-29 | Image sensor assembly as well as configuration method and testing method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105677434A (en) * | 2016-03-18 | 2016-06-15 | 格科微电子（上海）有限公司 | OTP (One Time Programmable) memory burn method for image sensor |
| CN108769667A (en) * | 2018-05-30 | 2018-11-06 | 华勤通讯技术有限公司 | Camera module, electronic equipment and burning information call method |
| CN109655679A (en) * | 2017-10-11 | 2019-04-19 | 许继集团有限公司 | A kind of modularization high-tension apparatus plug & play sensor apparatus and system |
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| CN102158589A (en) * | 2011-01-19 | 2011-08-17 | 宁波舜宇光电信息有限公司 | High-pixel photographic module and burning method for chip |
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| CN1988680A (en) * | 2005-12-23 | 2007-06-27 | 鸿富锦精密工业（深圳）有限公司 | Assembling and testing system and method for digital camera module |
| CN102096306A (en) * | 2009-12-10 | 2011-06-15 | 深圳市金科威实业有限公司 | Device and method for carrying out multi-parameter testing on digital imaging lens |
| CN102158589A (en) * | 2011-01-19 | 2011-08-17 | 宁波舜宇光电信息有限公司 | High-pixel photographic module and burning method for chip |
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| CN105677434A (en) * | 2016-03-18 | 2016-06-15 | 格科微电子（上海）有限公司 | OTP (One Time Programmable) memory burn method for image sensor |
| CN109655679A (en) * | 2017-10-11 | 2019-04-19 | 许继集团有限公司 | A kind of modularization high-tension apparatus plug & play sensor apparatus and system |
| CN108769667A (en) * | 2018-05-30 | 2018-11-06 | 华勤通讯技术有限公司 | Camera module, electronic equipment and burning information call method |
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Inventor after: Chen Jiawang Inventor after: Wang Yongfeng Inventor before: Chen Jiawang |
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Application publication date: 20121128 |