CN102800464A - Inductance element and manufacturing method thereof - Google Patents
Inductance element and manufacturing method thereof Download PDFInfo
- Publication number
- CN102800464A CN102800464A CN2011101371113A CN201110137111A CN102800464A CN 102800464 A CN102800464 A CN 102800464A CN 2011101371113 A CN2011101371113 A CN 2011101371113A CN 201110137111 A CN201110137111 A CN 201110137111A CN 102800464 A CN102800464 A CN 102800464A
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- Prior art keywords
- conducting strip
- inductance element
- welding foot
- conducting
- magnetic core
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Abstract
The invention discloses an inductance element and a manufacturing method thereof. The inductance element comprises a magnetic core, conducting strips surrounding the magnetic core, wherein the conducting strips are flat and are surface-mounted on the magnetic core; welding feet are respectively formed at the two ends of each conducting strip. The inductance element is easy to manufacture; and a large inductance value can be obtained by a small number of conducting strips.
Description
[technical field]
The invention relates to a kind of inductance element and manufacturing approach thereof.
[background technology]
In the prior art; The structure of normally used inductor or device for transformer is: a ring seal magnetic core, the enamelled wire of winding on magnetic core; Enamelled wire is reserved part as the connecting portion that is soldered to external equipment at its two end, existing Wound-rotor type structure, and the coiling processing procedure is complicated; And number of turns is more, when taking a lot of work very much during production.In addition, in a single day inductance element is processed, and just can not change inductance value and satisfy different demands, has increased production cost to a certain extent.Therefore, necessary existing inductance element structure is improved to solve above-mentioned defective of the prior art.
So, be necessary to design a kind of inductance element to overcome aforementioned deficiency.
[summary of the invention]
Technical problem to be solved by this invention provides a kind of inductance element and manufacturing approach thereof, and it is easily manufactured simple.
For solving the problems of the technologies described above a kind of technical scheme provided by the invention: inductance element, it comprises the conducting strip of magnetic core, wounded core, and said conducting strip is a flat, and its surface mount is in magnetic core, and the two ends of each conducting strip form welding foot respectively.
Second kind of technical scheme: inductance element; The circuit board that it comprises at least two conducting strips of magnetic core, wounded core and is provided with at least three conducting wires; Said conducting strip is a flat, and its surface mount is in magnetic core, and the two ends of each conducting strip form welding foot respectively; The conducting wire is provided with the bonding pad that connects with welding foot and is used to the bonding pad importing, export.
The third technical scheme: the manufacturing approach of inductance element, it comprises following step: (1) strikes out copper coin the conducting strip of even flat earlier; (2) conducting strip is placed on the magnetic core, and product is put into mould; (3) the plastic cement powder is expelled to in the mold, and is full of the die cavity of entire die; (4) cure and demold, folding pin, peeling; (5) the conducting strip welding foot is soldered to the conducting wire of circuit board.
Compared with prior art, the present invention's inductance element has following effect: this inductance element manufacturing of the present invention is simple, and can obtain big inductance value through a small amount of conducting strip.
[description of drawings]
Fig. 1 is the stereogram of inductance element of the present invention.
Fig. 2 is the three-dimensional exploded view of inductance element of the present invention.
Fig. 3 is another angle three-dimensional exploded view of inductance element of the present invention.
Fig. 4 is the cutaway view of Fig. 1 along the A-A line.
[embodiment]
Fig. 1 to Fig. 4 is an inductance element according to the invention.Please referring to Fig. 1, Fig. 2, inductance element 100 comprises the plurality of conducting strips 2 of magnetic core 3, wounded core and is sheathed on the plastic cement body 4 in the magnetic core outside and is embedded with the circuit board 1 of some conducting wires 11 that conducting strip 2 is welded in the conducting wire of circuit board, forms loop.
In conjunction with Fig. 2,3, said conducting wire 11 comprises first, second circuit 111,112 of two almost parallels and vertical two parallel the 3rd, the 4th circuits 113,114 between first, second circuit.Above-mentioned four connection lines are provided with for series connection; The two ends of every circuit all have size and become big bonding pad 13,14 a little; Certainly, bonding pad need be exposed to the surface of circuit board, and the connection line between the bonding pad then can be embedded in circuit board or be exposed to circuit board all can.Cause the 3rd, the 4th circuit 113,114 is perpendicular to first, second circuit 111,112; The bonding pad 13,14 of all circuits forms two rows just, and wherein a row is equivalent to input, and another row is equivalent to output; In the present embodiment; The bonding pad 13a, the 14a that are positioned at an end then connect with outside line, and electric current is imported, and the circuit that promptly this two bonding pad is corresponding forms input, outlet line.
Plurality of conducting strips 2 all is flat, and it is different from the enamel-cover river valley, has certain width.This conducting strip adopts surface mounting technology to be attached at magnetic core 3 outsides, and the electric current of conducting strip 2 makes magnetic core 3 formation magnetic fields.This conducting strip 2 have with core shapes cooperate around portion 21 and from two welding foots 22,23 that bend inwards respectively and form around the portion two ends, it is used for input and output signal.These welding foots connect the bonding pad 13,14 of each circuit just respectively.It should be noted that; Second circuit 112 is shorter; Three, an end bonding pad 14 of the 4th circuit is positioned at a side of second circuit, and aligns with it and to form a straight line, and 13 of the other end bonding pads of the 3rd, the 4th circuit tilt and are positioned at the same sides of two bonding pads of first circuit; And align with it and to form a straight line, that is the bonding pad 13,14 that is used to import, export lays respectively at the homonymy of first, second conducting wire.So, another bonding pad of the relative bonding pad 14a of second circuit 112 aligns with the other end bonding pad 13 of tertiary circuit in a lateral direction, successively, tertiary circuit is with the 4th circuit, and the 4th circuit is similar with first circuit, and alignment forms cascaded structure.Be positioned at bonding pad 13,14 alignment one by one respectively of both sides, with the welding foot connection of same conducting strip.Bonding pad 13,14 aligns in a lateral direction, makes that the structure of conducting strip 2 is more simple.
With reference to Fig. 1 and Fig. 4, said around portion 21 and welding foot 22 formation receiving spaces 210, magnetic core 3 is positioned at this receiving space 210 especially.Plastic cement body 4 is covered in the magnetic core outside, and its bilateral symmetry is provided with the through hole 41 that supplies conducting strip to wear.Comprise the horizontal part 211 that is parallel to circuit board 1 and connect and perpendicular to the vertical portion 212 of horizontal part around portion 21 by horizontal part.Welding foot 22,23 bends inwards from vertical portion 212, and horizontal part 211 is positioned at plastic cement body 4, vertically 212 outsides that are attached at plastic cement body 4 of portion.Plastic cement body 4 is provided with the container cavity 42 that runs through the bottom surface, and the part-structure of conducting strip 2 and magnetic core 3 is positioned at this container cavity, and the welding foot 22,23 of conducting strip is exposed to outside the plastic cement body 4.Plastic cement body 4 not only can be followed conducting strip 2 by fixed magnetic core 3, the more important thing is that protection magnetic core 3 is with conducting strip 2.
Certainly, according to the different demands of inductance value, can increase or reduce the number of conducting strip 2 and connection line.Simultaneously, because conducting strip 2 has certain width, conductive path only needs less conducting strip (being less coil turn) just can obtain bigger inductance value.
Introduce the preparation method of above-mentioned inductance element 100 below, it comprises following step: (1) strikes out copper coin the conducting strip 2 of even flat earlier; (2) conducting strip is placed on the magnetic core, magnetic core is processed by nickel-zinc-ferrite material, and product is put into mould; (3) plastics powder is expelled to in the mold, and is full of the die cavity of entire die; (4) solidify, heating makes the plastics powder polymerization; (5) demoulding takes apart a die; (6) folding pin, unnecessary protruding pin on the cracking-off product; (7) peeling, the crust of removal plastic cement; (8) welding foot 22 of conducting strip is soldered to the conducting wire 11 of circuit board.
Claims (9)
1. inductance element, the conducting strip that it comprises magnetic core, wounded core is characterized in that: said conducting strip is a flat, and its surface mount is in magnetic core, and the two ends of each conducting strip form welding foot respectively.
2. inductance element as claimed in claim 1 is characterized in that: inductance element comprises the plastic cement body, and the part-structure of said magnetic core and conducting strip is positioned at the plastic cement body, and the welding foot of conducting strip is exposed to plastic cement, and this is external.
3. inductance element; The circuit board that it comprises at least two conducting strips of magnetic core, wounded core and is provided with at least three conducting wires; It is characterized in that: said conducting strip is a flat; Its surface mount is in magnetic core, and the two ends of each conducting strip form welding foot respectively, and the conducting wire is provided with the bonding pad that connects with welding foot and is used to the bonding pad importing, export.
4. inductance element as claimed in claim 3 is characterized in that: said inductance element comprises the plastic cement body, and the part-structure of said magnetic core and conducting strip is positioned at the plastic cement body, and the welding foot of conducting strip is exposed to plastic cement, and this is external.
5. inductance element as claimed in claim 4; It is characterized in that: said conducting strip comprises the horizontal part that is parallel to circuit board and is connected and perpendicular to the vertical portion of horizontal part by horizontal part; Welding foot bends inwards from vertical portion; Horizontal position is in host cavity, and vertically portion then is attached at the plastic cement body outside.
6. inductance element as claimed in claim 5; It is characterized in that: said at least three conducting wires comprise two parallel first, second circuit and tertiary circuits; The above-mentioned bonding pad that is used to import, export lays respectively at an end that is positioned at homonymy of first, second circuit; And the welding foot of the 3rd conducting wire one end follows the welding foot of first conducting wire to be positioned at the same side, and the welding foot of the 3rd conducting wire other end then is positioned at the same side with the welding foot of second conducting wire.
7. inductance element as claimed in claim 6 is characterized in that: be positioned at the bonding pad alignment one by one respectively of both sides, with the welding foot connection of same conducting strip.
8. the manufacturing approach of an inductance element, it comprises following step:
(1) elder generation strikes out copper coin the conducting strip of even flat;
(2) conducting strip is placed on the magnetic core, and product is put into mould;
(3) the plastic cement powder is expelled to in the mold, and is full of the die cavity of entire die;
(4) curing, the demoulding, folding pin, peeling;
(5) the conducting strip welding foot is soldered to the conducting wire of circuit board.
9. the manufacturing approach of inductance element as claimed in claim 8, it is characterized in that: said magnetic core is processed by nickel-zinc-ferrite material.
Priority Applications (1)
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CN2011101371113A CN102800464A (en) | 2011-05-25 | 2011-05-25 | Inductance element and manufacturing method thereof |
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CN2011101371113A CN102800464A (en) | 2011-05-25 | 2011-05-25 | Inductance element and manufacturing method thereof |
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CN102800464A true CN102800464A (en) | 2012-11-28 |
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CN2011101371113A Pending CN102800464A (en) | 2011-05-25 | 2011-05-25 | Inductance element and manufacturing method thereof |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103515074A (en) * | 2013-09-12 | 2014-01-15 | 上海查尔斯电子有限公司 | Non-coil type electronic transformer |
CN103515075A (en) * | 2013-09-12 | 2014-01-15 | 上海查尔斯电子有限公司 | Non-coil vertical type transformer |
CN104681250A (en) * | 2015-02-13 | 2015-06-03 | 张家港市华洋电子有限公司 | High-frequency and high-power inductor for large-scale adjustable power supply |
CN107452465A (en) * | 2016-05-31 | 2017-12-08 | 库珀技术公司 | Low section power inductor |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN2092803U (en) * | 1991-06-08 | 1992-01-08 | 千如电机工业股份有限公司 | Improved coil construction of crystal plate |
US20020067234A1 (en) * | 2000-12-01 | 2002-06-06 | Samuel Kung | Compact surface-mountable inductors |
CN101048830A (en) * | 2004-12-27 | 2007-10-03 | 胜美达集团株式会社 | Magnetic device |
TW200939260A (en) * | 2008-03-06 | 2009-09-16 | Crown Ferrite Entpr Co | Inductor and manufacturing method thereof |
-
2011
- 2011-05-25 CN CN2011101371113A patent/CN102800464A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2092803U (en) * | 1991-06-08 | 1992-01-08 | 千如电机工业股份有限公司 | Improved coil construction of crystal plate |
US20020067234A1 (en) * | 2000-12-01 | 2002-06-06 | Samuel Kung | Compact surface-mountable inductors |
CN101048830A (en) * | 2004-12-27 | 2007-10-03 | 胜美达集团株式会社 | Magnetic device |
TW200939260A (en) * | 2008-03-06 | 2009-09-16 | Crown Ferrite Entpr Co | Inductor and manufacturing method thereof |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103515074A (en) * | 2013-09-12 | 2014-01-15 | 上海查尔斯电子有限公司 | Non-coil type electronic transformer |
CN103515075A (en) * | 2013-09-12 | 2014-01-15 | 上海查尔斯电子有限公司 | Non-coil vertical type transformer |
CN104681250A (en) * | 2015-02-13 | 2015-06-03 | 张家港市华洋电子有限公司 | High-frequency and high-power inductor for large-scale adjustable power supply |
CN107452465A (en) * | 2016-05-31 | 2017-12-08 | 库珀技术公司 | Low section power inductor |
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Application publication date: 20121128 |