CN102796369A - Heat conduction polyimide composite material, preparation method and application thereof - Google Patents
Heat conduction polyimide composite material, preparation method and application thereof Download PDFInfo
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- CN102796369A CN102796369A CN2012102609195A CN201210260919A CN102796369A CN 102796369 A CN102796369 A CN 102796369A CN 2012102609195 A CN2012102609195 A CN 2012102609195A CN 201210260919 A CN201210260919 A CN 201210260919A CN 102796369 A CN102796369 A CN 102796369A
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Abstract
The invention provides a heat conduction polyimide composite material and a preparation method thereof. The heat conduction polyimide composite material comprises the following components in percentage by weight: 18.2-58.6 percent of polyimide, 0.1-1.0 percent of lubricating agent, 0.1-0.5 percent of antioxidant, 1.0-1.5 percent of surface modifier and 40-81 percent of heat conduction enhanced modifying agent, wherein the heat conduction enhanced modifying agent can be one, two or three of carbon fiber, carbon powder, silicon carbide, aluminum oxide, silicon carbide and aluminum nitride. The heat conduction polyimide composite material provided by the invention has excellent heat conduction, can be used for preparing a radiator part of a light emitting diode illuminating device, is low in cost, easy to process and form, and light in weight, can be recycled, and accords with the environment protection requirement. The preparation method provided by the invention is simple in process and is suitable for massive industrial production.
Description
Technical field
The present invention relates to the polymer composite field and relate in particular to a kind of heat conduction polyamide compoiste material.
Background technology
The heat energy scatterer that produces for light emitting diode lighting equipment traditionally at present is main with the metal external member still mainly, like the heat radiation aluminium fin.And that metal material elder generation the sky just has matter is heavy, the characteristic that processing is difficult for, and it must come die cast via extruding, and subsequent machining cost is expensive, and face shaping fixes, not as plastics come to such an extent that make different shape goods attractive in appearance easily.
Plastics have light weight and penetrate the good characteristic of machine-shaping property, yet the heat-conducting effect of plastics itself also is not so good as the good of metal.Is that master's scatterer finished product is difficult for penetrating that to process the back segment procedure of processing numerous and diverse in order to overcome existing with metal (like aluminium etc.); Cost is expensive; And final product quality heavily waits existing issue, and therefore, the good macromolecule engineering plastics of heat-conductive characteristic of exploitation modification are trend of the times.
Summary of the invention
Technical problem to be solved by this invention has been to overcome the not good defective of heat conductivity of existing polyamide material, and a kind of heat conduction polyamide compoiste material is provided.The heat-conductive characteristic of heat conduction polyamide compoiste material of the present invention is good, be applicable to the heat sink assembly of preparation led lighting device, and its cost is low; Machine-shaping is easy; Lighter in weight, the also recyclable utilization of this heat conduction polyamide compoiste material, compliance with environmental protection requirements.Preparing method's technology of the present invention is simple, but large-scale commercial prodn.
The present invention solves the problems of the technologies described above through following technical scheme.
The invention provides a kind of heat conduction polyamide compoiste material, its raw material comprises the component of following weight per-cent: polymeric amide 18.2%-58.6%, lubricant 0.1%-1.0%, inhibitor 0.1%-0.5%, surface-modifying agent 1.0%-1.5% and heat conduction reinforced modifier 40%-81%; Described heat conduction reinforced modifier be in thomel, carbon dust, silit, aluminum oxide, SP 1 and the aluminium nitride AlN a kind of, two or three.
Wherein, described polymeric amide can be the polymeric amide of the various routines in this area, preferably is nylon 66 and/or nylon 6.The relative viscosity of said polymeric amide preferably is 2.2-2.7.
Wherein, described lubricant can be the conventional various lubricants that are used for polyamide compoiste material that use in this area, preferably is in ethylene bis stearic acid amide (being called for short EBS), modification EBS, polyethylene wax and the stearate one or more.Described modification EBS preferably is EBA-200.
Wherein, described inhibitor can be the conventional various inhibitors that are used for polyamide compoiste material that use in this area, preferably is in antioxidant 1010, inhibitor 1098 and the inhibitor 168 one or more.
Wherein, described surface-modifying agent can be the conventional various surface-modifying agents that can be used for polyamide compoiste material that use in this area, preferably is ethylene-vinyl acetate copolymer and/or silicone master batch.In the said ethylene-vinyl acetate copolymer-vinyl acetate segmental content preferably is 58-68wt%
Wherein, the particle diameter of said heat conduction reinforced modifier can be the particle diameter that this area routine is chosen, and preferably is 1 μ m-100 μ m.
The present invention also provides the preparation method of above-mentioned heat conduction polyamide compoiste material; It comprises the steps: to add said polymeric amide at the main spout of twin screw extruder, in the first side spout, adds the mixture of following component: said lubricant, said inhibitor and said surface-modifying agent add said heat conduction reinforced modifier in the second side spout; Melt extrude; Cooling, pelletizing gets final product.
Wherein, described mixture preferably obtains through the high-speed mixer mixing.
Wherein, the described conventional extrusion condition that melt extrudes employing this area polyamide compoiste material carries out.The said temperature that melt extrudes preferably is 230 ℃-290 ℃.Described melt extrude generally in twin screw extruder, carry out.The temperature of said twin screw extruder preferably is respectively to die head by main spout: 230 ℃ of 260 ℃, 290 ℃, 280 ℃, 280 ℃, 280 ℃, 260 ℃, 260 ℃, 260 ℃, 240 ℃, die head temperature.
The present invention also provides the application of described heat conduction polyamide compoiste material at the heat sink assembly that is used for making light emitting diode (LED) set lights.
The specification of equipment of described led lighting device can be conventional specification of equipment.The power of described led lighting device preferably is 5W-8W.
But above-mentioned each optimum condition arbitrary combination promptly gets each preferred embodiments of the present invention on the basis that meets this area general knowledge.
Agents useful for same of the present invention and raw material are all commercially available to be got.
Positive progressive effect of the present invention is:
The heat-conductive characteristic of heat conduction polyamide compoiste material of the present invention is good, and heat-conduction coefficient can reach 2.7W/km, and alternative common metal material is used for the LED set lights, and lighter in weight.Heat conduction polyamide compoiste material cost of the present invention is low, can be made into the different shape specification.Preparing method's technology of the present invention is simple, and existing equipment capable of using carries out scale operation.
Embodiment
Mode through embodiment further specifies the present invention but does not therefore limit the present invention among the described scope of embodiments below.The experimental technique of unreceipted actual conditions is selected according to catalogue according to ordinary method and conditioned disjunction in the following example.
Among the following embodiment, the relative viscosity of PA6 is 2.2-2.7, and modification EBS is EBA200; In the ethylene-vinyl acetate copolymer-vinyl acetate segmental content is 58-68wt%; The particle diameter of silit is 20-100 μ m, and the particle diameter of carbon dust is 1-5 μ m, and the particle diameter of aluminum oxide is 60-100 μ m; The particle diameter of aluminium nitride AlN is 5-20 μ m, and the particle diameter of SP 1 is 1-10 μ m.
The composition of raw materials of table 1 embodiment 1-4
Embodiment 1
The composition of raw materials of the heat conduction polyamide compoiste material of embodiment 1 is seen table 1.The preparation method of this heat conduction polyamide compoiste material is: with mixing in other all components adding high-speed mixer except that polymeric amide and heat conduction reinforced modifier in the composition of raw materials, take out.Add polymeric amide from the main spout of twin screw extruder; Add through high-speed mixer blended material at the first side spout, add the heat conduction reinforced modifier at the second side spout again, all materials in the technical scheme are mixed in twin screw extruder; Melt extrude; Cooling, pelletizing promptly gets the heat conduction polyamide compoiste material; Extruder temperature is respectively to die head by main spout: 230 ℃ of 260 ℃, 290 ℃, 280 ℃, 280 ℃, 280 ℃, 260 ℃, 260 ℃, 260 ℃, 240 ℃, die head temperature.
Embodiment 2
The composition of raw materials of the heat conduction polyamide compoiste material of embodiment 2 is seen table 1.The preparation method of this heat conduction polyamide compoiste material is: with mixing in other all components adding high-speed mixer except that polymeric amide and heat conduction reinforced modifier in the composition of raw materials, take out.Add polymeric amide from the main spout of twin screw extruder; Add through high-speed mixer blended material at the first side spout, add the heat conduction reinforced modifier at the second side spout again, all materials in the technical scheme are mixed in twin screw extruder; Melt extrude; Cooling, pelletizing promptly gets the heat conduction polyamide compoiste material; Extruder temperature is respectively to die head by main spout: 230 ℃ of 260 ℃, 290 ℃, 280 ℃, 280 ℃, 280 ℃, 260 ℃, 260 ℃, 260 ℃, 240 ℃, die head temperature.
Embodiment 3
The composition of raw materials of the heat conduction polyamide compoiste material of embodiment 3 is seen table 1.The preparation method of this heat conduction polyamide compoiste material is: with mixing in other all components adding high-speed mixer except that polymeric amide and heat conduction reinforced modifier in the composition of raw materials, take out.Add polymeric amide from the main spout of twin screw extruder; Add through high-speed mixer blended material at the first side spout, add the heat conduction reinforced modifier at the second side spout again, all materials in the technical scheme are mixed in twin screw extruder; Melt extrude; Cooling, pelletizing promptly gets the heat conduction polyamide compoiste material; Extruder temperature is respectively to die head by main spout: 230 ℃ of 260 ℃, 290 ℃, 280 ℃, 280 ℃, 280 ℃, 260 ℃, 260 ℃, 260 ℃, 240 ℃, die head temperature.
Embodiment 4
The composition of raw materials of the heat conduction polyamide compoiste material of embodiment 4 is seen table 1.The preparation method of this heat conduction polyamide compoiste material is: with mixing in other all components adding high-speed mixer except that polymeric amide and heat conduction reinforced modifier in the composition of raw materials, take out.Add polymeric amide from the main spout of twin screw extruder; Add through high-speed mixer blended material at the first side spout, add the heat conduction reinforced modifier at the second side spout again, all materials in the technical scheme are mixed in twin screw extruder; Melt extrude; Cooling, pelletizing promptly gets the heat conduction polyamide compoiste material; Extruder temperature is respectively to die head by main spout: 230 ℃ of 260 ℃, 290 ℃, 280 ℃, 280 ℃, 280 ℃, 260 ℃, 260 ℃, 260 ℃, 240 ℃, die head temperature.
Comparative example 1-2
The polyamide material composition of raw materials of comparative example 1-2 is seen table 1.Adopt this area ordinary method to prepare polymeric amide (comparative example 1).Adopt and prepare glass fiber-reinforced polyamide composite material (comparative example 2) with embodiment 1 identical processing condition.
Effect embodiment:
Heat conduction polyamide compoiste material to embodiment 1-4 gained carries out Performance Detection as shown in table 2, and concrete outcome is seen table 2.
The performance perameter of table 2 embodiment 1-5 and comparative example 1-2
Can find out from table 2; The heat-conduction coefficient of heat conduction polyamide compoiste material of the present invention can reach more than the 2.5W/km; Far above comparative example 1 polymeric amide and comparative example 2 glass fiber-reinforced polyamide composite material; Can be good at satisfying the heat conductivility requirement of heat sink assembly in the LED set lights, and the over-all properties of this heat conduction polyamide compoiste material is good.
Claims (10)
1. heat conduction polyamide compoiste material, its raw material comprises the component of following weight per-cent: polymeric amide 18.2%-58.6%, lubricant 0.1%-1.0%, inhibitor 0.1%-0.5%, surface-modifying agent 1.0%-1.5% and heat conduction reinforced modifier 40%-81%; Described heat conduction reinforced modifier be in thomel, carbon dust, silit, aluminum oxide, SP 1 and the aluminium nitride AlN a kind of, two or three.
2. heat conduction polyamide compoiste material as claimed in claim 1 is characterized in that, described polymeric amide is nylon 66 and/or nylon 6; The relative viscosity of said polymeric amide is 2.2-2.7; And/or described lubricant is one or more in ethylene bis stearic acid amide, modification ethylene bis stearic acid amide, polyethylene wax and the stearate.
3. heat conduction polyamide compoiste material as claimed in claim 2 is characterized in that, and/or described modification ethylene bis stearic acid amide is EBA-200.
4. heat conduction polyamide compoiste material as claimed in claim 1 is characterized in that, described inhibitor is one or more in antioxidant 1010, inhibitor 1098 and the inhibitor 168.
5. heat conduction polyamide compoiste material as claimed in claim 1 is characterized in that, described surface-modifying agent is ethylene-vinyl acetate copolymer and/or silicone master batch; And/or the particle diameter of said heat conduction reinforced modifier is 1 μ m-100 μ m.
6. heat conduction polyamide compoiste material as claimed in claim 5 is characterized in that, in the said ethylene-vinyl acetate copolymer-vinyl acetate segmental content is 58-68wt%.
7. like the preparation method of each described heat conduction polyamide compoiste material of claim 1-6; It comprises the steps: to add said polymeric amide at the main spout of twin screw extruder, in the first side spout, adds the mixture of following component: said lubricant, said inhibitor and said surface-modifying agent add said heat conduction reinforced modifier in the second side spout; Melt extrude; Cooling, pelletizing gets final product.
8. preparation method as claimed in claim 9 is characterized in that, described mixture obtains through the high-speed mixer mixing; And/or the described temperature that melt extrudes is 230 ℃-290 ℃.
9. preparation method as claimed in claim 8 is characterized in that, described melt extrude in twin screw extruder carry out; The temperature of said twin screw extruder is respectively to die head by main spout: 230 ℃ of 260 ℃, 290 ℃, 280 ℃, 280 ℃, 280 ℃, 260 ℃, 260 ℃, 260 ℃, 240 ℃, die head temperature.
10. like of the application of each described heat conduction polyamide compoiste material of claim 1-6 at the heat sink assembly that is used for making led lighting device.
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| CN201210260919.5A CN102796369B (en) | 2012-07-25 | 2012-07-25 | Heat conduction polyimide composite material, preparation method and application thereof |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103146187A (en) * | 2013-03-29 | 2013-06-12 | 大河宝利材料科技(苏州)有限公司 | Polyamide composite material as well as preparation method and use thereof |
| CN103304995A (en) * | 2013-06-21 | 2013-09-18 | 苏州新区佳合塑胶有限公司 | Heat-conducting reinforced nylon 66 composite material |
| CN104231604A (en) * | 2014-09-25 | 2014-12-24 | 丹阳丹金航空材料科技有限公司 | Modified carbon fiber-reinforced composite material and preparation method thereof |
| CN104592746A (en) * | 2015-01-02 | 2015-05-06 | 中南大学 | Novel heat-conducting polyamide-based composite material and preparation method thereof |
| CN105098046A (en) * | 2014-05-19 | 2015-11-25 | 四川新力光源股份有限公司 | LED light source substrate, method for manufacturing LED light source substrate and LED light source |
| CN106046769A (en) * | 2016-07-11 | 2016-10-26 | 铜陵日兴电子有限公司 | Carbon nanosphere particle-nylon heat-conductive composite material for LED lamp and preparation method of material |
| CN106751807A (en) * | 2017-01-09 | 2017-05-31 | 广东中塑新材料有限公司 | High heat conductive insulating copolyamide 6T composites and preparation method thereof |
| CN110684343A (en) * | 2019-09-25 | 2020-01-14 | 广东格瑞新材料股份有限公司 | Heat-conducting nylon replacing aluminum product and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1789337A (en) * | 2005-12-20 | 2006-06-21 | 孙兰英 | High-performance reinforced nylon |
| CN102304284A (en) * | 2011-08-22 | 2012-01-04 | 金发科技股份有限公司 | Heat-conductive resin composition and preparation method thereof |
| CN102558609A (en) * | 2011-12-13 | 2012-07-11 | 金发科技股份有限公司 | Method for improving thermal conductivity of thermal conductive polymer |
-
2012
- 2012-07-25 CN CN201210260919.5A patent/CN102796369B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1789337A (en) * | 2005-12-20 | 2006-06-21 | 孙兰英 | High-performance reinforced nylon |
| CN102304284A (en) * | 2011-08-22 | 2012-01-04 | 金发科技股份有限公司 | Heat-conductive resin composition and preparation method thereof |
| CN102558609A (en) * | 2011-12-13 | 2012-07-11 | 金发科技股份有限公司 | Method for improving thermal conductivity of thermal conductive polymer |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103146187A (en) * | 2013-03-29 | 2013-06-12 | 大河宝利材料科技(苏州)有限公司 | Polyamide composite material as well as preparation method and use thereof |
| CN103304995A (en) * | 2013-06-21 | 2013-09-18 | 苏州新区佳合塑胶有限公司 | Heat-conducting reinforced nylon 66 composite material |
| CN105098046A (en) * | 2014-05-19 | 2015-11-25 | 四川新力光源股份有限公司 | LED light source substrate, method for manufacturing LED light source substrate and LED light source |
| CN104231604A (en) * | 2014-09-25 | 2014-12-24 | 丹阳丹金航空材料科技有限公司 | Modified carbon fiber-reinforced composite material and preparation method thereof |
| CN104592746A (en) * | 2015-01-02 | 2015-05-06 | 中南大学 | Novel heat-conducting polyamide-based composite material and preparation method thereof |
| CN106046769A (en) * | 2016-07-11 | 2016-10-26 | 铜陵日兴电子有限公司 | Carbon nanosphere particle-nylon heat-conductive composite material for LED lamp and preparation method of material |
| CN106751807A (en) * | 2017-01-09 | 2017-05-31 | 广东中塑新材料有限公司 | High heat conductive insulating copolyamide 6T composites and preparation method thereof |
| CN106751807B (en) * | 2017-01-09 | 2019-02-26 | 广东中塑新材料有限公司 | High heat conductive insulating copolyamide 6T composite material and preparation method |
| CN110684343A (en) * | 2019-09-25 | 2020-01-14 | 广东格瑞新材料股份有限公司 | Heat-conducting nylon replacing aluminum product and preparation method thereof |
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| CN102796369B (en) | 2014-12-31 |
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