CN102790345A - Ultralow temperature semiconductor refrigeration device for optical fiber laser - Google Patents
Ultralow temperature semiconductor refrigeration device for optical fiber laser Download PDFInfo
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- CN102790345A CN102790345A CN2012102229783A CN201210222978A CN102790345A CN 102790345 A CN102790345 A CN 102790345A CN 2012102229783 A CN2012102229783 A CN 2012102229783A CN 201210222978 A CN201210222978 A CN 201210222978A CN 102790345 A CN102790345 A CN 102790345A
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Abstract
The invention discloses an ultralow temperature semiconductor refrigeration device for an optical fiber laser. The ultralow temperature semiconductor refrigeration device comprises a semiconductor refrigeration pile, an optical fiber coiling column, a vacuum housing and a water-cooling radiator, wherein the optical fiber coiling column is arranged on the upper surface of the semiconductor refrigeration pile; the semiconductor refrigeration pile is arranged on the upper surface of the water-cooling radiator; the upper surface of the semiconductor refrigeration pile is a heat absorbing end; the lower surface of the semiconductor refrigeration pile is a heat release end; the vacuum housing is a hollow column body of which the lower end is opened; the vacuum housing is buckled above the water-cooling heat radiator; the optical fiber coiling column and the semiconductor refrigeration pile are enabled to be arranged inside the vacuum housing; and a cavity formed in the vacuum housing is a vacuum chamber. The ultralow temperature semiconductor refrigeration device disclosed by the invention is used for the optical fiber laser rotating at the required low temperature or ultralow temperature as well as cooling and radiating of the optical fiber laser with heavy power. An active optical fiber of the optical fiber laser is coiled on the optical fiber coiling column in the ultralow temperature semiconductor refrigeration device and the heat radiating function of the semiconductor refrigeration pile and the water-cooling radiator is utilized, and thus the low-temperature or ultralow temperature cooling of the optical fiber laser is realized.
Description
Technical field
The present invention relates to a kind of ultralow temperature semiconductor cooling device, this device need to be applied to the fiber laser of low temperature or ultralow temperature running, and high power fiber laser cooling and heat radiation.
Background technology
Fiber laser is little with its volume, advantages such as efficient is high, good stability, good beam quality, and development very rapidly.But the fiber laser of some special wave band need just can run well under low temperature or ultralow temperature; Like neodymium-doped fiber laser because stronger self-absorption phenomenon arranged near 940nm; Want to realize near the laser generation output the 940nm; Can only make the self-absorption spectral line to the migration of shortwave direction through reducing temperature, still not have the relevant apparatus and the relevant report of this respect at present, can be seen in document only has method (the Jay W.Dawson that adopts cooled with liquid nitrogen; Alex Drobshoff; Zhi Liao etc.High Power 938nm Cladding Pumped Fiber Laser, Proc.of SPIE Vol.4974), but this method operability not high, with high costs, can't be used for commercial use.
In addition on the one hand, for high-capacity optical fiber laser, the low more lifting that helps laser output power more of optical fiber surface temperature; And modes such as the main employing that can see at present is air-cooled, water-cooled or air cooling are cooled off optical fiber or are lowered the temperature, as: integral refrigerating device for barrel-type optical fiber (CN200810201549.1, CN200820155749.3); The optical fiber cooling water pipe (CN201020581142.9, CN201010524741.1, CN03109167.9); Infrared optical fiber cooling device (CN201020201751.7); Optical fiber cooling apparatus (CN200920157162.0), it all is water-cooled or air cooling mode that cap assembly and optical fiber cooling means (CN02154324.0), these patents of invention adopt; Water-cooling pattern cooling degree is limited; Can only the optical fiber surface temperature be dropped to room temperature or water temperature, air cooling mode use cost is high, operation easier is big and have certain danger, is difficult to commercial use.
Therefore, study a kind of fiber laser and use the ultralow temperature semiconductor cooling device, under low temperature or ultralow temperature, work, and the aspects such as power output of raising high power fiber laser there is important practical sense for the realization fiber laser.
Summary of the invention
To defective that exists in the above-mentioned prior art or deficiency; The objective of the invention is to; Provide a kind of fiber laser to use the ultralow temperature semiconductor cooling device; Through with the Active Optical Fiber of fiber laser coiling fiber reel in the present invention on post, utilize the thermolysis of semiconductor refrigerating heap and water-filled radiator, realize the low temperature or the ultralow temperature of fiber laser are cooled off.
In order to achieve the above object, the present invention adopts following technical solution:
A kind of fiber laser is used the ultralow temperature semiconductor cooling device; It is characterized in that, comprise that semiconductor refrigerating heap, fiber reel are around post, vacuum (-tight) housing and water-filled radiator, wherein; Fiber reel places semiconductor refrigerating heap upper surface around post; Semiconductor refrigerating is stacked in the upper surface of water-filled radiator, and the upper surface of semiconductor refrigerating heap is a heat absorbing end, and lower surface is a release end of heat; Vacuum (-tight) housing is the hollow cylinder of lower ending opening, and vacuum (-tight) housing is buckled in the water-filled radiator top and fiber reel is stacked in inside around post and semiconductor refrigerating, and the inner cavity that forms of vacuum (-tight) housing is a vacuum chamber.
The heat preserving and insulating material that said semiconductor refrigerating heap comprises the refrigeration inner core and is coated on refrigeration inner core side; The refrigeration inner core is made up of one or more identical refrigeration bodies; Described refrigeration body is formed by a plurality of semiconductor chilling plates and a plurality of enthusiasm alternated; And the upper and lower surfaces of refrigeration body is semiconductor chilling plate, between semiconductor chilling plate and enthusiasm, is coated with heat conduction auxiliary agent or Heat Conduction Material; Each semiconductor chilling plate all is connected with DC power supply; The upper surface heat absorption lower surface heat release of semiconductor chilling plate.
Said semiconductor chilling plate can be selected market semiconductor chilling plate on sale, as long as refrigerating capacity can satisfy the demands.
Said enthusiasm adopts the sheet metal with good thermal conductivity characteristic.
Said refrigeration inner core only comprises a refrigeration during body, and the regular prism or big down of being shaped as of this refrigeration body is gone up little terrace with edge, and the shape of its corresponding semiconductor refrigerating heap can be cylinder or greatly last little round platform down.
When said refrigeration inner core comprises a plurality of refrigeration body; Each refrigeration body is regular prism; All refrigeration body is arranged the back and is formed new regular prism or cuboid, corresponding semiconductor refrigerating heap be shaped as cylinder, cuboid, terrace with edge, cylindroid, elliptical table, two semicircle rectangular column or two semicircle rectangle platform.
Said fiber reel is cylinder or two semicircle rectangular column around post, is carved with groove along fiber reel around the circumferencial direction of post, groove be shaped as rectangle half slot, square groove, rectangular channel and V-shaped groove, the size of groove is submerging optical fiber wherein.
Said vacuum (-tight) housing adopts double-deck outer wall, and should be vacuum between the bilayer outer wall;
Said vacuum (-tight) housing is a column.
Said water-filled radiator comprises shell and water inlet pipe that is connected with enclosure and outlet pipe; This enclosure is provided with the dividing plate of many vertical directions; Dividing plate makes shell inner cavity form a circuitous cooling water channel that advances; Water inlet pipe connects the inlet of cooling water channel, and outlet pipe connects the outlet of this cooling water channel.
Technical characterictic of the present invention and advantage are following:
(1) through the semiconductor refrigerating heap and the water-filled radiator of multi-lager semiconductor cooling piece and enthusiasm alternated are taken away fiber reel around the heat of post, low temperature and super low temperature refrigeration have been realized to the applied fiber laser of the present invention.
(2) adopt the vacuum tightness cavity, and combine the refrigeration of vacuum chamber bottom surface, make the present invention not only have the cold energy of pressure power, also reached good adiabatic heat insulating effect simultaneously.
(3) fiber reel has three around the effect of post: fixed fiber, cooling optical fibers and improve beam quality; Super low temperature refrigeration base in conjunction with its below; Make the present invention realize fiber laser low temperature and ultralow temperature running, thus and the effect of the high-power cooling of fiber laser down raising fiber laser limited output power.
(4) compact overall structure, esy to use, safe and reliable, refrigerating efficiency is high, cryogenic temperature is low.
Description of drawings
Fig. 1 is a structural representation of the present invention.
Fig. 2 is cylindrical semiconductor refrigerating pile structure sketch map.Wherein, (a) being vertical view, (b) is front view.
Fig. 3 is a truncated cone-shaped semiconductor refrigerating pile structure sketch map.Wherein, (a) being vertical view, (b) is front view.
Fig. 4 is the plane structure chart of difform semiconductor refrigerating heap.Wherein, (a) be cylindroid, adopt two refrigeration bodies to form the refrigeration inner core; (b) be two semicircle rectangular column, adopt three refrigeration bodies to form the refrigeration inner core; (c) be cylinder, adopt four refrigeration bodies to form the refrigeration inner core; (d) be cuboid, adopt six refrigeration bodies to form the refrigeration inner core.
Fig. 5 is that difform fiber reel is around the rod structure sketch map.Wherein, (a) be cylinder; (b) be two semicircle rectangular column.
Fig. 6 is the structural representation of vacuum (-tight) housing.
Fig. 7 is the internal structure sketch map of water-filled radiator, and the direction of arrow is water (flow) direction among the figure.
Fig. 8 is an installation diagram of the present invention.Wherein, (a) be front view; (b) be left view.
Fig. 9 is " L " shape metal tie rod structural representation.Wherein, (a) be front view; (b) be left view; (c) be upward view.
Figure 10 is the structural representation of embodiment 1 applied fiber laser.
Figure 11 is applied to the structural representation of fiber laser for embodiment 1.
Below in conjunction with accompanying drawing and embodiment the present invention is further explained.
Embodiment
As shown in Figure 1; Fiber laser of the present invention is used the ultralow temperature semiconductor cooling device, comprises that semiconductor refrigerating heap 1, fiber reel are around post 2, vacuum (-tight) housing 3 and water-filled radiator 4, wherein; Fiber reel places semiconductor refrigerating to pile 1 upper surface around post 2; Semiconductor refrigerating heap 1 places the upper surface of water-filled radiator 4, and the upper surface of semiconductor refrigerating heap 1 is a heat absorbing end, and lower surface is a release end of heat; Vacuum (-tight) housing 3 is the hollow cylinder of lower ending opening, and vacuum (-tight) housing 3 is buckled in water-filled radiator 4 tops and fiber reel is placed inside around post 2 and semiconductor refrigerating heap 1, and the vacuum (-tight) housing 3 inner cavitys that form are vacuum chamber; Semiconductor refrigerating heap 1 is used for the heat in the vacuum chamber is passed continually with water-filled radiator 4, to keep continuing ultralow temperature in the vacuum chamber.
Like Fig. 2-shown in Figure 4; The heat preserving and insulating material 7 that semiconductor refrigerating heap 1 comprises the refrigeration inner core and is coated on refrigeration inner core side; Heat preserving and insulating material 7 adopts polyurethane foam or heat insulation foam, and the refrigeration inner core is made up of one or more identical refrigeration bodies, and described refrigeration body is formed with a plurality of enthusiasm 6 alternated by a plurality of semiconductor chilling plates 5; And the upper and lower surface of refrigeration body is semiconductor chilling plate 5, between semiconductor chilling plate 5 and enthusiasm 6, is coated with heat conduction auxiliary agent or Heat Conduction Material.Each semiconductor chilling plate 5 all is connected with DC power supply; The upper surface heat absorption lower surface heat release of semiconductor chilling plate 5.Heat conduction auxiliary agent or Heat Conduction Material adopt ductile glue, paste or the softer metals with good thermal conductivity characteristic, like heat-conducting silicone grease, thermal paste, thermal grease or indium foil; Enthusiasm 6 adopts the sheet metal with good thermal conductivity characteristic, like copper, aluminium; The number of plies of semiconductor chilling plate 5 and enthusiasm 6 alternated depends on the temperature requirement in the vacuum chamber; The temperature required low more then number of plies is many more; Wherein, Semiconductor chilling plate 5 is semiconductor chilling plates of selecting different size according to the needs routine of refrigerating capacity for use, and semiconductor chilling plate is selected TEC1-12712 in this instance.
The quantity of the refrigeration body that the refrigeration inner core comprises is confirmed around the situation of post 2 required coolings according to fiber reel.When the refrigeration inner core only comprises a refrigeration body; The regular prism (as shown in Figure 2) or down big of being shaped as of this refrigeration body is gone up little terrace with edge (as shown in Figure 3), and the shape of corresponding semiconductor refrigerating heap 1 can be cylinder (as shown in Figure 2) or big down and little round platform (as shown in Figure 3); When the refrigeration inner core comprises a plurality of refrigeration body; Each refrigeration body is regular prism; All refrigeration bodies are close to each other arranges new regular prism or the cuboid of back formation, and the shape of corresponding semiconductor refrigerating heap 1 can be cylinder (shown in Fig. 4 (c)), cuboid (shown in Fig. 4 (d)), terrace with edge, cylindroid (shown in Fig. 4 (a)), elliptical table, two semicircle rectangular column (shown in Fig. 4 (b)) or two semicircle rectangle platform.
As shown in Figure 5; Fiber reel is cylinder (seeing Fig. 5 (a)) or two semicircle rectangular column (seeing Fig. 5 (b)) around post 2; Be carved with groove along fiber reel around the circumferencial direction of post 2; Groove be shaped as rectangle half slot, square groove, rectangular channel and V-shaped groove, but be not limited thereto, the size of groove is submerging optical fiber wherein.
As shown in Figure 6, vacuum (-tight) housing 3 adopts double-deck outer wall, and should be vacuum between the bilayer outer wall; The profile of vacuum (-tight) housing 3 is confirmed according to the shape of semiconductor refrigerating heap 1, can be column (as shown in Figure 6), column neck or platform shape neck, no matter selects which kind of shape, all need guarantee vacuum (-tight) housing 3 can with semiconductor refrigerating pile 1 and fiber reel in post 2 is enclosed in.The material of vacuum (-tight) housing 3 adopts metal, alloy or glass.
As shown in Figure 7; Water inlet pipe 8 and outlet pipe 9 that water-filled radiator 4 comprises shell and is connected with this enclosure; This enclosure is provided with the dividing plate 20 of many vertical directions, and dividing plate 20 makes shell inner cavity form a circuitous cooling water channel 10 that advances, and water inlet pipe 8 connects the inlet of cooling water channel 10; Outlet pipe 9 connects the outlet of this cooling water channel 10, and water inlet pipe 8 is also discharged in order to the cooling water channel of water being introduced in the shell 10 with outlet pipe 9; Water-filled radiator 4 should have certain counterweight simultaneously also as the chassis.The upper and lower end face of said shell is the plane; Heat conductivility good metal material is adopted in the upper surface, like copper, aluminium.Water-filled radiator 4 also can be selected common water cooling equipment.
As shown in Figure 8, assembling process of the present invention is following:
1, the end face of water-filled radiator 4 or the bottom surface coated with thermally conductive auxiliary agent of semiconductor refrigerating heap 1 are perhaps increased flexible Heat Conduction Material between the two; Like heat-conducting silicone grease, thermal paste, thermal grease, indium foil etc.; Semiconductor refrigerating heap 1 is placed on the water-filled radiator 4, make the two close contact.
2, end face or the fiber reel with semiconductor refrigerating heap 1 applies one deck heat conduction auxiliary agent around the bottom surface of post 2 or between the two, increases flexible Heat Conduction Material, fiber reel is positioned on the end face of semiconductor refrigerating heap 1 around post 2 again, makes the two close contact.
3, use 2 or a plurality of " L " shape metal tie rod, chassis fixed screw 13 and coiling post fixed screw 11, will freeze inner core and fiber reel are fixed on the water-filled radiator 4 around post 2, make the three become one structure.All there is installing hole (as shown in Figure 9) at the two ends of " L " shape metal tie rod.
4, use heat preserving and insulating material 7 inner core that will freeze to coat and form semiconductor refrigerating heap 1, and add a cover vacuum (-tight) housing 3,, accomplish and assemble vacuumizing and seal in the vacuum (-tight) housing 3.
Embodiment 1:
Present embodiment adopts column structure as shown in Figure 1, and semiconductor refrigerating heap 1, fiber reel are cylindric around post 2, vacuum (-tight) housing 3 and water-filled radiator 4.
Semiconductor refrigerating heap 1 adopts shown in Figure 2 cylindric, and semiconductor chilling plate 5 adopts TEC1-12712 cooling pieces, maximum voltage 15.4V; Maximum current 12A, outside dimension 62*62*4mm, enthusiasm 6 adopts the red copper piece of 62*62*6mm; Shared 9 TEC1-12712 of this instance; 8 enthusiasm 6, heat preserving and insulating material 7 adopts polyurethane foam, smears heat-conducting silicone grease between semiconductor chilling plate 5 and the enthusiasm 6.
Fiber reel becomes cylindric shown in Fig. 5 (a) around post 2 usefulness aluminum profile extrusion, bottom surface diameter 8cm, and high 13cm along the circumferential direction mills 0.5*0.5mm, square spiral groove 70 circles of spacing 1.5mm, 10.5cm is high altogether, but coiled fiber is more than 17 meters.
Vacuum (-tight) housing 3 adopts double walled stainless steel cask as shown in Figure 6, and external diameter is 16cm, and internal diameter is 13cm, height 30cm, in high 28cm, stainless steel thickness of slab 1.5mm vacuumizes between double-walled with thermal insulation, all seamed edges are all made fillet and are handled.
Water-filled radiator 4 is the cylinder of 20cm, high 1.8cm for the bottom surface diameter; Its internal structure is as shown in Figure 7, and in order to save cost, water-filled radiator 4 removes end face and adopts the thick copper plate of 5mm; Its lap and dividing plate 20 all adopt the thick steel plate of 1.5mm, with the gateway sealing of rubber blanket with cooling water channel 10.
The steel plate of " L " shape metal tie rod 12 employing 120*10*1mm is converted into " L " shape of 11cm+1cm, and bores installing hole at two ends.
The assembling of embodiment is as shown in Figure 8; The upper surface of water-filled radiator 4 is coated heat-conducting silicone grease; With semiconductor chilling plate 5 and the enthusiasm 6 alternate refrigeration bodies that are stacked as; The disposing way of semiconductor chilling plate 5 is upper surface heat absorption lower surface heat release (also being the upper surface refrigeration, the lower surface heating), and contact-making surface is smeared heat-conducting silicone grease between semiconductor chilling plate 5 and the enthusiasm 6.Fiber reel is placed on the semiconductor chilling plate 5 of top layer around post 2 bottom surfaces, and contact-making surface is smeared heat-conducting silicone grease, fiber reel is fixed around post 2 and water-filled radiator 4 tractives with coiling post fixed screw 11 with 2 " L " shape metal tie rods 12 and chassis fixed screw 13.Coating heat preserving and insulating material 7 in refrigeration inner core side becomes columned semiconductor refrigerating heap 1, and it is bigger slightly than vacuum (-tight) housing internal diameter that semiconductor refrigerating is piled 1 bottom surface diameter, to guarantee and can cover vacuum (-tight) housing 3 tight.
The refrigeration that embodiment 1 is used for the 940nm fiber laser of all optical fibre structure.Shown in figure 10, this optical fiber laser structure is that 5% fiber grating 17, output tail optical fiber 18 are connected in turn by the 808nm semiconductor laser 14 of the fine output of magnetic tape trailer, 940nm total reflection optical fiber grating 15, double clad neodymium-doped fiber 16, at the 940nm reflectivity.Double clad neodymium-doped fiber 16 is coiled in fiber reel on post 2, and all the other devices all place outside the refrigerating plant, in order to protect optical fiber, are enclosed within outside the optical fiber with flexible pipe 19 in the device exit.
After present embodiment energising operation 20 minutes, fiber laser does not obtain cavity temperature under the condition of work and is-155 ℃, under the condition of fiber laser with 15W pumping work, measures cavity temperature when cavity temperature is stablized and is-125 ℃.
If go for other temperature, can increase then temperature reduction of the number of plies through changing the number of plies of semiconductor chilling plate 5, the minimizing number of plies then temperature raises; When in the fruit caving thermal source being arranged, excessive temperature differentials does not explain that refrigerator refrigerating capacity of the present invention is not enough when not opening with thermal source when thermal source is opened, and can comprise the mode of a plurality of refrigeration bodies in the inner core that yet promptly freezes through increasing the quantity solution of individual layer semiconductor chilling plate 5.
Claims (10)
1. a fiber laser is used the ultralow temperature semiconductor cooling device; It is characterized in that, comprise that semiconductor refrigerating heap (1), fiber reel are around post (2), vacuum (-tight) housing (3) and water-filled radiator (4), wherein; Fiber reel places semiconductor refrigerating heap (1) upper surface around post (2); Semiconductor refrigerating heap (1) places the upper surface of water-filled radiator (4), and the upper surface of semiconductor refrigerating heap (1) is a heat absorbing end, and lower surface is a release end of heat; Vacuum (-tight) housing (3) is the hollow cylinder of lower ending opening, and vacuum (-tight) housing (3) is buckled in water-filled radiator (4) top and fiber reel is placed inside around post (2) and semiconductor refrigerating heap (1), and the inner cavity that forms of vacuum (-tight) housing (3) is a vacuum chamber.
2. fiber laser as claimed in claim 1 is used the ultralow temperature semiconductor cooling device; It is characterized in that; The heat preserving and insulating material (7) that said semiconductor refrigerating heap (1) comprises the refrigeration inner core and is coated on refrigeration inner core side; The refrigeration inner core is made up of one or more identical refrigeration bodies; Described refrigeration body is formed by a plurality of semiconductor chilling plates (5) and a plurality of enthusiasm (6) alternated, and the refrigeration body upper and lower surfaces be semiconductor chilling plate (5), between semiconductor chilling plate (5) and enthusiasm (6), be coated with heat conduction auxiliary agent or Heat Conduction Material; Each semiconductor chilling plate 5 all is connected with DC power supply; The upper surface heat absorption lower surface heat release of semiconductor chilling plate 5.
3. fiber laser as claimed in claim 2 is used the ultralow temperature semiconductor cooling device, it is characterized in that, said semiconductor chilling plate (5) is selected the TEC1-12712 semiconductor chilling plate.
4. fiber laser as claimed in claim 2 is used the ultralow temperature semiconductor cooling device, it is characterized in that, said enthusiasm (6) adopts the sheet metal with good thermal conductivity characteristic.
5. fiber laser as claimed in claim 2 is used the ultralow temperature semiconductor cooling device; It is characterized in that; When said refrigeration inner core only comprises a refrigeration body; The regular prism or down big of being shaped as of this refrigeration body is gone up little terrace with edge, and the shape of its corresponding semiconductor refrigerating heap can be cylinder or big down and little round platform.
6. fiber laser as claimed in claim 2 is used the ultralow temperature semiconductor cooling device; It is characterized in that; When said refrigeration inner core comprises a plurality of refrigeration body; Each refrigeration body is regular prism, and all refrigeration body is arranged the back and formed new regular prism or cuboid, corresponding semiconductor refrigerating heap (1) be shaped as cylinder, cuboid, terrace with edge, cylindroid, elliptical table, two semicircle rectangular column or two semicircle rectangle platform.
7. fiber laser as claimed in claim 1 is used the ultralow temperature semiconductor cooling device; It is characterized in that; Said fiber reel is cylinder or two semicircle rectangular column around post (2); Be carved with groove along fiber reel around the circumferencial direction of post (2), groove be shaped as rectangle half slot, square groove, rectangular channel and V-shaped groove, the size of groove is submerging optical fiber wherein.
8. fiber laser as claimed in claim 1 is used the ultralow temperature semiconductor cooling device, it is characterized in that, said vacuum (-tight) housing (3) adopts double-deck outer wall, and should be vacuum between the bilayer outer wall.
9. fiber laser as claimed in claim 1 is used the ultralow temperature semiconductor cooling device, it is characterized in that, said vacuum (-tight) housing (3) is a column.
10. fiber laser as claimed in claim 1 is used the ultralow temperature semiconductor cooling device; It is characterized in that; Water inlet pipe (8) and outlet pipe (9) that said water-filled radiator (4) comprises shell and is connected with this enclosure; This enclosure is provided with the dividing plate (20) of many vertical directions; Dividing plate (20) makes shell inner cavity form a circuitous cooling water channel (10) that advances, and water inlet pipe (8) connects the inlet of cooling water channel (10), and outlet pipe (9) connects the outlet of this cooling water channel (10).
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| CN2012102229783A CN102790345A (en) | 2012-06-29 | 2012-06-29 | Ultralow temperature semiconductor refrigeration device for optical fiber laser |
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| CN2012102229783A CN102790345A (en) | 2012-06-29 | 2012-06-29 | Ultralow temperature semiconductor refrigeration device for optical fiber laser |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103279147A (en) * | 2013-05-15 | 2013-09-04 | 浙江大学 | Temperature control system for controlling optical fiber temperature excursion and application method of temperature control system |
| CN105742955A (en) * | 2016-05-12 | 2016-07-06 | 核工业理化工程研究院 | Semiconductor laser diode fin-type heat dissipation device |
| CN106053215A (en) * | 2016-08-08 | 2016-10-26 | 浙江工业大学 | Cooling platform for nano-indenter |
| CN107453192A (en) * | 2017-08-09 | 2017-12-08 | 西南技术物理研究所 | A kind of high-capacity optical fiber laser liquid cooling heat radiation system |
| WO2022110136A1 (en) * | 2020-11-27 | 2022-06-02 | 中国科学院深圳先进技术研究院 | Cooling system for radio frequency coil, and magnetic resonance imaging device |
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| US6215941B1 (en) * | 1998-02-12 | 2001-04-10 | Oki Electric Industry Co., Ltd. | Optical delay time adjuster and optical time-division multiplexer |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103279147A (en) * | 2013-05-15 | 2013-09-04 | 浙江大学 | Temperature control system for controlling optical fiber temperature excursion and application method of temperature control system |
| CN103279147B (en) * | 2013-05-15 | 2015-05-06 | 浙江大学 | Temperature control system for controlling optical fiber temperature excursion and application method of temperature control system |
| CN105742955A (en) * | 2016-05-12 | 2016-07-06 | 核工业理化工程研究院 | Semiconductor laser diode fin-type heat dissipation device |
| CN106053215A (en) * | 2016-08-08 | 2016-10-26 | 浙江工业大学 | Cooling platform for nano-indenter |
| CN107453192A (en) * | 2017-08-09 | 2017-12-08 | 西南技术物理研究所 | A kind of high-capacity optical fiber laser liquid cooling heat radiation system |
| CN107453192B (en) * | 2017-08-09 | 2019-09-27 | 西南技术物理研究所 | A kind of high-capacity optical fiber laser liquid cooling heat radiation system |
| WO2022110136A1 (en) * | 2020-11-27 | 2022-06-02 | 中国科学院深圳先进技术研究院 | Cooling system for radio frequency coil, and magnetic resonance imaging device |
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Application publication date: 20121121 |