CN102779721A - Peeling shovel cutter applied to semiconductor silicon chip production - Google Patents
Peeling shovel cutter applied to semiconductor silicon chip production Download PDFInfo
- Publication number
- CN102779721A CN102779721A CN2011101210944A CN201110121094A CN102779721A CN 102779721 A CN102779721 A CN 102779721A CN 2011101210944 A CN2011101210944 A CN 2011101210944A CN 201110121094 A CN201110121094 A CN 201110121094A CN 102779721 A CN102779721 A CN 102779721A
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- blade
- cutter
- handle
- perching knife
- peeling
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Abstract
The invention provides a peeling shovel cutter applied to semiconductor silicon chip production. The peeling shovel cutter comprises a cutter handle and a cutter body, wherein the cutter handle is connected with the cutter body, the cutter body is made of polyether-ether-ketone resin, the lower side of the cutter body is a web surface, the web surface of the cutter body is in an arc surface structure, the upper side is the back side, and the back side of the cuter body is made into an inclined plane. The cutter handle is still made of PVC (polyvinyl chloride) materials, and installing holes are arranged in the cutter handle. The cutter body is made of the polyether-ether-ketone resin materials, the wear resistance is greatly improved, and the service life of the shovel cutter is prolonged. The web surface adopts the arc surface, the operation convenience is effectively enhanced, and in addition, the high-precision design of the sharp end is sufficiently realized.
Description
Technical field
The present invention relates to a kind of perching knife, be specifically related to a kind of perching knife of peeling off that is applied to semi-conductor silicon chip production, be used for the production of semi-conducting material.
Background technology
Along with making rapid progress of electronic information technology, to substrate require increasingly highly, such as the flatness level, must impel the wax polishing broad application is arranged and improve the flatness level.In the wax polishing process is arranged, peel off the link that is absolutely necessary, the quality of perching knife directly has influence on the yield level of product in the stripping process.
At present, be widely applied to the perching knife of peeling off in the wax polishing process, shown in Fig. 1-2, peel off perching knife, comprise handle of a knife 120 and blade 110, said handle of a knife 120 is connected with blade 110.Installing hole 130 is set on the blade.
The following of blade 110 is the outside of belly 114, and the top of blade 110 is the back side 113.The outside of belly 114 is a horizontally disposed plane, and the back side 113 is a tapered plane.The front end of blade 110 can be processed into thickness 0.5mm.
Because the outside of belly 113 general employing planar designs of blade 110 in use receive the influence of artificial application of force direction, blade 110 is decurvation often, makes the higher design of most advanced and sophisticated precision not play a role.
Peel off perching knife and adopt the Teflon material made more, although its elasticity is better, resistance to wear is relatively poor, and perching knife front end rate of depreciation is very fast, need repeat processing, could guarantee normal the use.
Summary of the invention
The objective of the invention is to; A kind of perching knife of peeling off that is applied to semi-conductor silicon chip production is provided, to overcome shortcoming and defect such as the existing outside of belly of peeling off the existing blade of perching knife is planar design, most advanced and sophisticated low precision, blade employing Teflon material is made, resistance to wear is relatively poor.The present invention has increased the degree easy to use of peeling off perching knife.
A kind of perching knife of peeling off that is applied to semi-conductor silicon chip production comprises handle of a knife and blade, and said handle of a knife is connected with blade, it is characterized in that:
Said blade adopts polyether-ether-ketone resin to process, and the following of said blade is the outside of belly, and the outside of belly is set to globoidal structure; Be the back side above, the back side is set to tapered plane.
Wherein, the radius of curvature R 4 of the cambered surface of the said blade outside of belly is 1300～1800mm.
Wherein, the nose thickness of said blade is less than the rear end thickness of blade.
Further, said nose thickness is 0.2mm.
Wherein, on the said handle of a knife installing hole is set.
Further, the radius R 3 of said installing hole is 2～5mm.
The said handle of a knife of peeling off perching knife still adopts the PVC material to process list structure.
Beneficial effect of the present invention:
1, the outside of belly of originally peeling off perching knife is a globoidal structure, and in use blade 210 has effectively increased the simple operation degree originally with regard to decurvation.
2, adopt the polyether-ether-ketone resin material owing to originally peel off the blade of perching knife, the resistance to wear of peeling off perching knife than Teflon improves a lot, and can use for a long time after the time processing moulding, need not to process once more, has increased the useful life of perching knife greatly.
3, most advanced and sophisticated precision of the present invention is good, and the thickness of the front end of blade is 0.2mm.
Description of drawings
Fig. 1 is the front view of prior art.
Fig. 2 is the upward view of prior art.
Fig. 3 is a front view of the present invention.
Fig. 4 is a upward view of the present invention.
Reference numeral:
Embodiment
Below in conjunction with specific embodiment, the present invention is described further.Should be understood that following examples only are used to the present invention is described but not are used to limit scope of the present invention.
Embodiment
A kind of perching knife of peeling off that is applied to semi-conductor silicon chip production shown in Fig. 3-4, comprising: blade 210 is connected with blade 210 with handle of a knife 220, handle of a knife 220, and installing hole 230 is set on the handle of a knife 220.
The following of blade 210 is the outside of belly 214, and the outside of belly 214 is set to globoidal structure; The top of blade 210 is the back side 213, and the back side 213 is set to tapered plane.
The radius of curvature R 4 of the cambered surface of the outside of belly 214 is 1300～1800mm, is preferably 1500mm.
Blade 210 is connected the handle of a knife 220 of PVC, be fixed on the machine and can use through installing hole 230 with screw.The radius R 3 of installing hole 230 is 2～5mm, is preferably 2.2mm.
In addition, the outside of belly 214 of originally peeling off perching knife is set to globoidal structure, when using perching knife to carry out overburden operation; Front end is owing to stopped by silicon chip, and the outside of belly will bend, and outside of belly radian is increased; And then generation nature elastic restoring force forward; Under the elastic restoring force effect, front end high accuracy part will slip into the silicon chip below easily presses close in the chamfering slit of ceramic wafer, and silicon chip is peeled off.The perching knife that this compares no radian design has increased the simple operation degree greatly and has given full play to most advanced and sophisticated high precision design.
Blade 210 adopts polyether-ether-ketone resins (Polyetheretherketone is called for short PEEK) to be made into through compression molding process, mills with high precision numerical control again, and the tip is worked into required precision, is 0.2mm like the thickness of front end.
Polyether-ether-ketone resin is a kind of high-end special engineering plastics.It has high elastic modulus, characteristics such as high-wear resistance.Compare with the Teflon material.The high 1J order of magnitude of its interlayer faults toughness, intensity is high by 25%, and fatigue life is high 1 times.This composite material impact damage is insensitive, and damage tolerance is bigger in structural design, can use for a long time after the time processing moulding, need not process once more, and increased more than 2 years the useful life of perching knife.
Handle of a knife 220 still adopts polyvinyl chloride (Polyvinylchloride, PVC) material.
More than show and described basic principle of the present invention, principal character and advantage of the present invention.The technical staff of the industry should understand; The present invention is not restricted to the described embodiments; That describes in the foregoing description and the specification just explains principle of the present invention; The present invention also has various changes and modifications under the prerequisite that does not break away from spirit and scope of the invention, and these variations and improvement all fall in the scope of the invention that requires protection.The present invention requires protection range to be defined by appending claims and equivalent thereof.
Claims (6)
1. the perching knife of peeling off that is applied to semi-conductor silicon chip production comprises handle of a knife and blade, and said handle of a knife is connected with blade, it is characterized in that:
Said blade adopts polyether-ether-ketone resin to process, and the following of said blade is the outside of belly, and the outside of belly is set to globoidal structure; Be the back side above, the back side is set to tapered plane.
2. perching knife according to claim 1 is characterized in that, the cambered surface radius of curvature R 4 of the said blade outside of belly is 1300～1800mm.
3. perching knife according to claim 1 is characterized in that the thickness of the front end of said blade is less than the thickness of the rear end of blade.
4. perching knife according to claim 3 is characterized in that, the thickness of said front end is 0.2mm.
5. perching knife according to claim 1 is characterized in that, on the said handle of a knife installing hole is set.
6. perching knife according to claim 5 is characterized in that, the radius R 3 of said installing hole is 2～5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101210944A CN102779721A (en) | 2011-05-11 | 2011-05-11 | Peeling shovel cutter applied to semiconductor silicon chip production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101210944A CN102779721A (en) | 2011-05-11 | 2011-05-11 | Peeling shovel cutter applied to semiconductor silicon chip production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102779721A true CN102779721A (en) | 2012-11-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101210944A Pending CN102779721A (en) | 2011-05-11 | 2011-05-11 | Peeling shovel cutter applied to semiconductor silicon chip production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102779721A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104037110A (en) * | 2014-05-20 | 2014-09-10 | 上海申和热磁电子有限公司 | Semiconductor silicon wafer stripping scraper knife |
| CN109483396A (en) * | 2018-11-21 | 2019-03-19 | 青岛嘉星晶电科技股份有限公司 | The automatic bottom sheet machine of sapphire wafer |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62296580A (en) * | 1986-06-17 | 1987-12-23 | Matsushita Electric Ind Co Ltd | Cleavage of semiconductor laser |
| CN101789472A (en) * | 2009-01-22 | 2010-07-28 | 艾笛森光电股份有限公司 | Manufacture method of thin light emitting diode (LED) assembly |
-
2011
- 2011-05-11 CN CN2011101210944A patent/CN102779721A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62296580A (en) * | 1986-06-17 | 1987-12-23 | Matsushita Electric Ind Co Ltd | Cleavage of semiconductor laser |
| CN101789472A (en) * | 2009-01-22 | 2010-07-28 | 艾笛森光电股份有限公司 | Manufacture method of thin light emitting diode (LED) assembly |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104037110A (en) * | 2014-05-20 | 2014-09-10 | 上海申和热磁电子有限公司 | Semiconductor silicon wafer stripping scraper knife |
| CN104037110B (en) * | 2014-05-20 | 2019-12-06 | 上海申和热磁电子有限公司 | Semiconductor silicon wafer stripping shovel |
| CN109483396A (en) * | 2018-11-21 | 2019-03-19 | 青岛嘉星晶电科技股份有限公司 | The automatic bottom sheet machine of sapphire wafer |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20121114 |