CN102765261A - Method and device for controlling ink droplet drying process of inkjet printer - Google Patents
Method and device for controlling ink droplet drying process of inkjet printer Download PDFInfo
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- CN102765261A CN102765261A CN2012102715264A CN201210271526A CN102765261A CN 102765261 A CN102765261 A CN 102765261A CN 2012102715264 A CN2012102715264 A CN 2012102715264A CN 201210271526 A CN201210271526 A CN 201210271526A CN 102765261 A CN102765261 A CN 102765261A
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- ink
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
Abstract
The invention discloses a method for controlling an ink droplet drying process of an inkjet printer. The method is characterized in that a uniform electric field is formed between plate electrodes in pair, a printing substrate is positioned in the uniform electric field, the electric field direction is perpendicular to the surface of the printing substrate to enable surface charges to be generated on the surface of the printing substrate by means of induction or polarization, and spreading of ink droplets on the printing substrate, solvent evaporation and solute film forming process are controlled by coulomb force between the surface charges of the printing substrate and each of solvent molecules and solute molecules in ink. The surface of the printing substrate is modified, and shape and appearance of a printed film material is controlled without damaging device performances.
Description
Technical field
The present invention relates to a kind of method and device that is applied to the control ink droplet dry run of patterning function film preparation in the FPD manufacturing.
Background technology
The making of OTFT (OTFT) array relates to metallic film, the preparation of semiconductive thin film and insulating film material and Patternized technique in FPD is made.Adopt solwution method that these functional materials are accurately printed on the print substrate and can directly form patterned film.It is simple that this method has operation, and materials are economized, low cost and other advantages; But because multiple effect of factors such as the surface property of the component of ink, substrate, printing process conditions, the uniformity of film and microscopic appearance are wayward.Substrate surface can size and polarity then directly determine extravagant degree and the microscopic appearance of film of ink droplet on print substrate.Research shows, perhaps uses other process of surface treatment can improve the printability of ink ductor on print substrate through surperficial self assembled monolayer, effectively promotes the performance of the OTFT device of printing preparation.
Ink-jet printer comprises printhead, slipper bracket and the fixing moveable platform of print substrate; And there is the ink clip to be used for the storage ink material; The bottom fixing clamp silicon wafer of ink clip; Have the through hole of a plurality of micron-scales on the clip silicon wafer, ink forms required pattern through the upper surface that the through hole on the silicon wafer is sprayed on laminar print substrate.Conventional form is that the frequency inkjet drop of printhead to fix, the drop point of ink droplet are different along with moving of slipper bracket.The ink-jet time rhythm of printhead and the displacement of slipper bracket control are carried out through computer program synchronously.For printing a single-point that forms; It is positioned can to take place because of the difference of substrate surface performance after the print substrate sprawling in various degree; Ink droplet dry run subsequently comprises solvent evaporates; Solute diffusion, the behaviors such as curing with solute that circulate of solvent, can observe contact angle variation or contact wire phenomenon such as retreat.The dry run of ink droplet has determined final solute molecule to solidify the material pattern that the back forms.
The major influence factors that the single-point size is printed in decision is the wetability of print substrate surface and ink, characterizes with the contact angle of ink droplet at the surface of solids usually.Contact angle is more little, and wetability is high more.Contact angle can be determined by the surface ability of liquid phase ink droplet and the surface of solid phase print substrate jointly.The solute diffusion velocity is main relevant with the viscosity of solvent with the intensity that solvent circulates in the dry run.In addition, solute molecule is very sensitive to the Surface Physical Chemistry character of print substrate in solid liquid interface curing or crystallization speed.Through can the dry run of direct regulation and control ink droplet on print substrate, obtain size and the suitable print pattern of pattern to the modification of solid state surface physicochemistry character.
It is to remove the surface adsorption thing or pass through the composition structure that chemical reaction changes outermost layer atom and chemical group through physical action that the surface of solids is carried out the modification general process; Concrete process comprises self assembled monolayer, and the oxygen plasma bombardment is handled and the uv ozone surface treatment.Changes of chemical structures takes place in print substrate often that adopt these methods to handle on the surface, this modification can be used for controlling inkjet printing technology and drop on the size of the ink droplet on the print substrate and the pattern of cured film.But after technology was accomplished, the effect of this finishing was retained, and possibly produce adverse influence to the final devices performance.Many researchers is attempted on the insulative dielectric film, printing semi-conducting material and is prepared thin film transistor (TFT), and the insulation dielectric layer of film transistor device and the interface quality between the semiconductive thin film have determined important performance characteristic such as threshold voltage and the on-off ratio of device.Chemical surface treatment is when optimizing inkjet printing technology, and often the performance to device causes uncontrollable influence.
Summary of the invention
The present invention is for avoiding above-mentioned existing in prior technology weak point; A kind of method and device of ink-jet printer control ink droplet dry run are provided; It produces electric charge through electric field action on the print substrate surface; In the time of the thin-film material pattern printed with control, can not damage device performance.
The present invention adopts following technical scheme for the technical solution problem:
The characteristics of the method for a kind of ink-jet printer control of the present invention ink droplet dry run are that the pair of plates electrode is set; Between said plate electrode, form uniform electric field; Print substrate is in the middle of the said uniform electric field; And direction of an electric field is vertical each other with the surface of print substrate; Make to produce surface charge, with the sprawling on print substrate of the control ink droplet of the Coulomb force between solute molecule and the solvent molecule in print substrate surface charge and the ink, solvent evaporates and the film forming procedure of solute at the spatial induction of print substrate or polarization.
The characteristics of a kind of ink-jet printer ink droplet of the present invention dry run control device are to be provided with:
The pair of plates electrode is made up of electric pole plate and lower electrode plate, and said electric pole plate is fixedly installed on the bottom of ink clip, and moves with said ink clip; In said electric pole plate and the said ink clip on the clip silicon wafer each nozzle be provided with through hole correspondingly; Feasible ink droplet through the ejection of the nozzle on the clip silicon wafer can pass through the corresponding through hole that is provided with and be dropped on the said print substrate;
The characteristics of a kind of ink-jet printer ink droplet of the present invention dry run control device also are: said lower electrode plate is positioned at the below of print substrate.
The inventive method is through applying the uniform electric field of a field intensity controlled amount, make in the spatial induction or the polarization generation surface charge of print substrate, utilizing surface charge that the microscopic appearance of the thin-film material of print pattern and printing is controlled; After print procedure finishes, induce electric charge to eliminate along with adding the disappearance of inducing electric field, therefore this surface modifying method can not damage device performance when film morphology is printed in control.Compared with present technology, beneficial effect of the present invention is embodied in:
1, the present invention's surface charge of inducing through electric field is had an effect in print procedure, through electrostatic interaction the solute molecule in the liquid ink is produced easily to attract or the orientation effect, and the curing of solute molecule is produced favourable influence; After printing end, surface charge disappears along with the elimination of electric field, can not cause harmful effect to device performance.
2, the existence of surface charge among the present invention, and the density of surface charge all can be relevant with the print substrate surface, through the electric field modulomenter density of surface charge, is expected to through carrying out dynamic modulation to the surface, control ink droplet sprawling on the print substrate surface.
Description of drawings
Fig. 1 is the inventive method sketch map;
Fig. 2 is electric pole plate and clip silicon wafer contraposition sketch map among the present invention;
Fig. 3 covers print pattern region sketch map for electric pole plate among the present invention;
Label among the figure: 1 ink clip; 2 electric pole plates; 3 print substrate; 4 lower electrode plates; 5 ink droplets; 11 clip silicon wafers; 12 nozzles; 21 through holes.
The specific embodiment
Method for ink-jet printer control ink droplet dry run in the present embodiment is that the pair of plates electrode is set; Between plate electrode, form uniform electric field; Print substrate 3 is in the middle of the said uniform electric field; And direction of an electric field is vertical each other with the surface of print substrate 3; Make in the spatial induction or the polarization generation surface charge of print substrate 3, control ink droplet sprawling on print substrate with the Coulomb force between solute molecule and the solvent molecule in print substrate surface charge and the ink, the film forming procedure of solvent evaporation and solute.
Referring to Fig. 1 and Fig. 2, the structure of the dry process control equipment of present embodiment China and Mexico drip-dry is set to:
The pair of plates electrode is made up of electric pole plate 2 and lower electrode plate 4, and electric pole plate 2 is fixedly installed on the bottom of ink clip 1, and moves with ink clip 1; Each nozzle 12 is provided with through hole 21 correspondingly on electric pole plate 2 and the ink clip 1; The ink droplet that makes ink clip 1 spray through nozzle 12 can pass through the corresponding through hole 21 that is provided with and be dropped on the print substrate 3;
In the practical implementation, lower electrode plate 4 is positioned at the below of print substrate 3, is in the electric field action scope of parallel-plate electrode to guarantee print substrate 3.Clip silicon wafer 11 in electric pole plate 2 and the ink clip 1 is fixed together, and print substrate 3 is fixed on the lower electrode plate 4, according to the print pattern of appointment, relative motion takes place in nozzle ink jet between clip silicon wafer 11 and the print substrate 3; Lower electrode plate 4 is fixed and is covered whole XY mobile platform, and size is bigger than electric pole plate 2; Electric pole plate 2 is as dismountable parts, and its size is confirmed according to the unit size and the ink of print pattern the drying time on substrate.
Electric pole plate can adopt the high rigidity metal material, and the height of electric pole plate 2 is a little less than the height of clip silicon wafer 11, and mutually insulated; The distance of the upper surface of electric pole plate 2 and clip silicon wafer 11 generally is no more than 1000 microns.
In printing the technology of semiconductive thin film, can let ink on the print substrate is slowly dry under lower environment temperature to help forming the higher dense film of degree of crystallinity, thereby help making the high-performance OTFT.In order effectively to utilize the effect of electric field excited surface electric charge to the ink dried film forming procedure, about the size of electric pole plate 2, the general requirement printed one independently in the process of pattern unit, and area of the pattern is covered by electric pole plate 2 always, and is as shown in Figure 3.Print pattern is the rectangular area shown in the ABCD, at top of form A point, and the complete overlay pattern of electric pole plate 2 region covered zone ABCD; Printing end position C point, the still complete overlay pattern of electric pole plate 2 region covered zone ABCD; Requirement in overall print process, the complete capping unit area of the pattern of electric pole plate ABCD.
Existing research has proved surperficial can the pattern and the OTFT device performance of the film of solwution method preparation being exerted an influence, and its microcosmic mechanism of having an effect is the interaction of solute molecule and solvent molecule in print substrate surface atom and the solution.Wherein the Coulomb force between the electric charge is the important component part in this interaction, thereby can have an effect to film forming procedure through electric field excitating surface electric charge.
Claims (3)
1. the method for ink-jet printer control ink droplet dry run; It is characterized in that being provided with the pair of plates electrode; Between said plate electrode, form uniform electric field; Print substrate (3) is in the middle of the said uniform electric field; And the surface of direction of an electric field and print substrate (3) is vertical each other, makes that spatial induction or the polarization in print substrate (3) produces surface charge, with the Coulomb force between solute molecule and the solvent molecule in print substrate surface charge and the ink control ink droplet sprawling on print substrate, solvent evaporates and the film forming procedure of solute.
2. ink-jet printer ink droplet dry run control device is characterized in that being provided with:
The pair of plates electrode is made up of electric pole plate (2) and lower electrode plate (4), and said electric pole plate (2) is fixedly installed on the bottom of ink clip (1), and moves with said ink clip (1); Said electric pole plate (2) is gone up each nozzle (12) with the middle clip silicon wafer (11) of said ink clip (1) and is provided with through hole (21) correspondingly; Feasible ink droplet through the ejection of the nozzle (12) on the clip silicon wafer (11) can pass through the corresponding through hole (21) that is provided with and be dropped on the said print substrate (3).
3. ink-jet printer ink droplet dry run control device according to claim 2 is characterized in that said lower electrode plate (4) is positioned at the below of print substrate (3).
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Cited By (9)
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CN107962877A (en) * | 2017-04-17 | 2018-04-27 | 广东聚华印刷显示技术有限公司 | The preparation method of vacuum dryer and display panel |
CN108389965A (en) * | 2018-03-01 | 2018-08-10 | 京东方科技集团股份有限公司 | Film build method, display base plate and preparation method thereof, display device |
CN108511610A (en) * | 2018-03-21 | 2018-09-07 | 南京大学昆山创新研究院 | A kind of spraying perovskite preparation method of solar battery and device entirely |
WO2018176744A1 (en) * | 2017-03-29 | 2018-10-04 | 京东方科技集团股份有限公司 | Method for preparing thin film, preparation device and preparation method for display substrate |
CN111516391A (en) * | 2020-04-23 | 2020-08-11 | Tcl华星光电技术有限公司 | Ink jet printing apparatus and ink jet printing method |
CN113306141A (en) * | 2021-05-31 | 2021-08-27 | 苏州天峰动立合金科技有限公司 | Micro-nano printing raw materials feeding device of high accuracy |
CN113410419A (en) * | 2021-08-18 | 2021-09-17 | 深圳市华星光电半导体显示技术有限公司 | Manufacturing method of display panel and drying equipment |
CN113948666A (en) * | 2020-07-15 | 2022-01-18 | Tcl科技集团股份有限公司 | Display device, manufacturing method thereof and drying device |
CN114889333A (en) * | 2022-04-27 | 2022-08-12 | 华中科技大学 | Regulation and control method and device for eliminating bubble defects in jet printing process |
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CN107962877A (en) * | 2017-04-17 | 2018-04-27 | 广东聚华印刷显示技术有限公司 | The preparation method of vacuum dryer and display panel |
CN108389965B (en) * | 2018-03-01 | 2021-03-23 | 京东方科技集团股份有限公司 | Film forming method, display substrate and manufacturing method thereof, and display device |
CN108389965A (en) * | 2018-03-01 | 2018-08-10 | 京东方科技集团股份有限公司 | Film build method, display base plate and preparation method thereof, display device |
CN108511610A (en) * | 2018-03-21 | 2018-09-07 | 南京大学昆山创新研究院 | A kind of spraying perovskite preparation method of solar battery and device entirely |
CN108511610B (en) * | 2018-03-21 | 2021-11-30 | 南京大学昆山创新研究院 | Preparation method and device of full-spraying perovskite solar cell |
CN111516391A (en) * | 2020-04-23 | 2020-08-11 | Tcl华星光电技术有限公司 | Ink jet printing apparatus and ink jet printing method |
CN111516391B (en) * | 2020-04-23 | 2021-10-08 | Tcl华星光电技术有限公司 | Ink jet printing apparatus and ink jet printing method |
CN113948666A (en) * | 2020-07-15 | 2022-01-18 | Tcl科技集团股份有限公司 | Display device, manufacturing method thereof and drying device |
CN113306141A (en) * | 2021-05-31 | 2021-08-27 | 苏州天峰动立合金科技有限公司 | Micro-nano printing raw materials feeding device of high accuracy |
CN113410419A (en) * | 2021-08-18 | 2021-09-17 | 深圳市华星光电半导体显示技术有限公司 | Manufacturing method of display panel and drying equipment |
CN114889333A (en) * | 2022-04-27 | 2022-08-12 | 华中科技大学 | Regulation and control method and device for eliminating bubble defects in jet printing process |
CN114889333B (en) * | 2022-04-27 | 2023-02-10 | 华中科技大学 | Regulation and control method and device for eliminating bubble defects in jet printing process |
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Application publication date: 20121107 |