CN102756332B - A kind of burnishing device - Google Patents
A kind of burnishing device Download PDFInfo
- Publication number
- CN102756332B CN102756332B CN201210256021.0A CN201210256021A CN102756332B CN 102756332 B CN102756332 B CN 102756332B CN 201210256021 A CN201210256021 A CN 201210256021A CN 102756332 B CN102756332 B CN 102756332B
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- China
- Prior art keywords
- assembling fixture
- automatic assembling
- polishing
- burnishing device
- polishing jig
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Abstract
The invention discloses a kind of burnishing device, including polishing jig and the automatic assembling fixture being installed on polishing jig top, described automatic assembling fixture top is provided with electrode, and the down either side of described automatic assembling fixture is provided with spacer.The present invention be more beneficial for change polished silicon wafer, make in polishing process, active force the most all with, improve the quality of polishing.
Description
Technical field
The present invention relates to a kind of burnishing device, belong to mould manufacturing field.
Background technology
In mold pressing process, often mould can be polished, thus reach the surface gloss requirement of product, common buffing machine is when polishing, die surface can be close in the surface of buffing machine, produce bigger frictional force therewith, operability during polishing is the strongest, mobile slower, because bigger frictional force, the most easily damage mould die surface, the skill water product of workman are had higher requirement by this, sometimes for having reached required surface quality, often polish repeatedly, which increase the labor intensity of workman, and the polished silicon wafer of buffing machine is changed the most relatively difficult.
Summary of the invention
For the deficiencies in the prior art, it is an object of the invention to, it is provided that a kind of burnishing device, to improve quality of finish, save polishing time, make polished silicon wafer be more prone to change.
For solving above-mentioned technical problem, the technical solution used in the present invention is: a kind of burnishing device, including polishing jig and the automatic assembling fixture being installed on polishing jig top, described automatic assembling fixture top is provided with electrode, it is characterised in that: the down either side of described automatic assembling fixture is provided with spacer.
Aforesaid a kind of burnishing device, it is characterised in that: it is provided with a connecting rod between described polishing jig and automatically assembling fixture.
Aforesaid a kind of burnishing device, it is characterised in that: described connecting rod one end is fixedly connected on automatic assembling fixture by screw.
The invention has the beneficial effects as follows: be more beneficial for change polished silicon wafer, make in polishing process, active force the most all with, improve the quality of polishing.
Accompanying drawing explanation
Fig. 1 is the structural representation of the present invention.
Detailed description of the invention
For disclosing technical scheme further, describe embodiments of the present invention below in conjunction with the accompanying drawings in detail: as shown in Figure 1, a kind of burnishing device, including polishing jig 1 and the automatic assembling fixture 2 being installed on polishing jig 1 top, between polishing jig 1 and automatically assembling fixture 2, it is provided with a connecting rod 3.Connecting rod 3 one end is fixedly connected on automatic assembling fixture 2 by screw 4.Automatically assembling fixture 2 top is provided with electrode 5, and the down either side of automatic assembling fixture 2 is provided with spacer 6.Polishing jig 1 only connects the screwed hole of automatic assembling fixture 2, on the premise of not contacting spacer 6, electrode 5 can carry out height, the change of the anglec of rotation, simple, convenient, safety.
Operation principle: install automatic assembling fixture on polished silicon wafer top, be connected on buffing machine by automatic assembling fixture by screw, when buffing machine rotates, automatic assembling fixture drives polished silicon wafer to be rotated by screw.Owing to the interconnection function of screw makes it when changing polished silicon wafer, as long as just can be installed by screw hole alignment, it is not necessary to centering again, save the set-up time.
There is certain working place between polished silicon wafer and automatically assembling fixture, when polishing, this section of space can effectively dispersive pressure, make pressure to act in polished silicon wafer uniformly, the ratio that makes to exert oneself during polishing is more uniform, improves the quality of polishing.
Above by description of listed embodiment, elaborate the basic ideas and basic principles of the present invention.But the present invention is not limited to above-mentioned listed embodiment, every equivalent variations, improvement made based on technical scheme and the behavior such as deliberately deteriorate, protection scope of the present invention all should be belonged to.
Claims (1)
1. a burnishing device, including polishing jig and the automatic assembling fixture being installed on polishing jig top, described automatic assembling fixture top is provided with electrode, it is characterized in that: the down either side of described automatic assembling fixture is provided with spacer, being provided with a connecting rod between described polishing jig and automatically assembling fixture, described connecting rod one end is fixedly connected on automatic assembling fixture by screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210256021.0A CN102756332B (en) | 2012-07-24 | 2012-07-24 | A kind of burnishing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210256021.0A CN102756332B (en) | 2012-07-24 | 2012-07-24 | A kind of burnishing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102756332A CN102756332A (en) | 2012-10-31 |
| CN102756332B true CN102756332B (en) | 2016-10-26 |
Family
ID=47051100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210256021.0A Active CN102756332B (en) | 2012-07-24 | 2012-07-24 | A kind of burnishing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102756332B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101745866A (en) * | 2010-02-04 | 2010-06-23 | 北京理工大学 | Electro-rheological pendulum shaft cylindrical polishing device |
| CN201889709U (en) * | 2010-11-12 | 2011-07-06 | 台湾顺力发有限公司 | Processing system rotary plate mechanism with changeable fixture actions |
| CN202702015U (en) * | 2012-07-24 | 2013-01-30 | 泰德兴精密电子（昆山）有限公司 | Polishing device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001277088A (en) * | 2000-03-31 | 2001-10-09 | Seiko Instruments Inc | Jig board |
| KR100349216B1 (en) * | 2000-04-19 | 2002-08-14 | 삼성전자 주식회사 | Polishing head of chemical and mechanical apparatus for polishing wafer |
-
2012
- 2012-07-24 CN CN201210256021.0A patent/CN102756332B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101745866A (en) * | 2010-02-04 | 2010-06-23 | 北京理工大学 | Electro-rheological pendulum shaft cylindrical polishing device |
| CN201889709U (en) * | 2010-11-12 | 2011-07-06 | 台湾顺力发有限公司 | Processing system rotary plate mechanism with changeable fixture actions |
| CN202702015U (en) * | 2012-07-24 | 2013-01-30 | 泰德兴精密电子（昆山）有限公司 | Polishing device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102756332A (en) | 2012-10-31 |
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| C14 | Grant of patent or utility model | ||
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