CN102753001B - Method for manufacturing electronic equipment - Google Patents
Method for manufacturing electronic equipment Download PDFInfo
- Publication number
- CN102753001B CN102753001B CN201210222317.0A CN201210222317A CN102753001B CN 102753001 B CN102753001 B CN 102753001B CN 201210222317 A CN201210222317 A CN 201210222317A CN 102753001 B CN102753001 B CN 102753001B
- Authority
- CN
- China
- Prior art keywords
- assembly
- spraying
- components
- shell
- electronic equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 44
- 238000000034 method Methods 0.000 title claims abstract description 39
- 238000005507 spraying Methods 0.000 claims abstract description 80
- 239000003973 paint Substances 0.000 claims description 42
- 238000009434 installation Methods 0.000 claims description 8
- 238000003032 molecular docking Methods 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 abstract description 9
- 238000000576 coating method Methods 0.000 abstract description 9
- 239000000428 dust Substances 0.000 abstract description 5
- 239000007921 spray Substances 0.000 description 11
- 230000000712 assembly Effects 0.000 description 9
- 238000000429 assembly Methods 0.000 description 9
- 230000001681 protective effect Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009776 industrial production Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000001195 anabolic effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000004043 dyeing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a method for manufacturing electronic equipment. The method comprises the following steps of: providing parts to be assembled into the electronic equipment, wherein the parts comprise components and a shell; assembling the components into a plurality of modules; performing conformal coating spraying on each module; assembling the sprayed modules in the shell; and performing conformal coating spraying on the modules in the shell. The method for manufacturing the electronic equipment has the advantages that the components are modularized and then individually sprayed, the components are sprayed repeatedly in the overall assembly process, and the components of the electronic equipment can be comprehensively protected by multilayer spraying which comprises individual spraying and overall spraying, so the whole protection performance of the electronic equipment is effectively improved; and on the premise that the international protection (IP) grade is not improved, the operation reliability of the electronic equipment in service environment such as high dust content, high humidity and high corrosive pollution can be improved.
Description
Technical field
The present invention relates to technical field of electronic equipment, refer in particular to a kind of electric equipment manufacturing method.
Background technology
Along with the development of information technology, the electronic equipment of such as frequency converter and so on is applied in industry-by-industry more and more widely.When electronic apparatus application is in the industry that pottery manufacture, the printing and dyeing environmental pollution such as water pump and chemical industry are serious, there is due to its operational environment the features such as dust is many, high humidity, highly corrosive pollution, if the protective capacities of electronic equipment is not enough, then rugged environment will the stability of heavy damage electronic equipment and reliability, therefore, in industry, the protective capacities of electronic equipment is had higher requirement.
At present, in order to improve the protective capacities of electronic equipment to adapt to adverse circumstances, the mode generally adopted in the industry carrys out the IP grade of complete upgrading electronic equipment by architecture advances or carries out the anti-paint spraying of single three to electronic equipment complete machine, but all there is certain defect in above-mentioned two kinds of modes, the former can increase production cost greatly, and the latter is due to the structural limitations of electronic equipment, when carrying out the anti-paint of complete machine three and spraying, due to various copper bar, structural member, the barrier effect of device etc. makes three anti-paints cannot spray to inner space uniformly and effectively, mainly all can effectively not process for protected parts.And easily there is slight crack in the three anti-paint overcoats that the anti-paint operation of single spin three produces, the components and parts of electronic equipment internal can not get effective protection, therefore, dust is many, high humidity and the adverse circumstances such as highly corrosive pollution are to the permanent protective property requirement of electronic equipment to adopt the electronic equipment of which manufacture not meet.
Given this, be necessary design a kind of new electric equipment manufacturing method with produce low cost and the electronic equipment of permanent protective property to meet the requirement of high pollution industrial production environment.
Summary of the invention
The object of this invention is to provide a kind of electric equipment manufacturing method with produce low cost and the electronic equipment of permanent protective property to meet the requirement of high pollution industrial production environment.
To achieve these goals, the technical solution used in the present invention is: provide a kind of electric equipment manufacturing method, it comprises the following steps: (a) provides the parts of the described electronic equipment of one-tenth to be assembled, and described parts comprise components and parts and shell; B components and parts are assembled into multiple module by (); C () carries out three anti-paint sprayings to each module; (d) by spraying after module group assembling in shell; E () carries out three anti-paint sprayings to the module in shell.
Its further technical scheme is: described step (b) comprising: all components and parts are assembled into multiple device level assembly by (b1); (b2) three anti-paint sprayings are carried out to each described device level assembly; (b3) the part of devices level assembly after spraying is assembled at least one module level assembly, described module comprises device level assembly and module level assembly.In another embodiment, described step (b) comprising: all components and parts are assembled into multiple device level assembly by (b1); (b2) three anti-paint sprayings are carried out to each described device level assembly; (b3) all device level assembling components after spraying are become at least one module level assembly, described module is module level assembly.
Its further technical scheme is: described parts also comprise movement, described movement is formed with the installation position for installing module and the spraying opening corresponding with installation position; Described step (d) comprising: the module after spraying is assembled in movement on corresponding installation position according to predefined procedure by (d1) in batches, carries out three anti-paint sprayings after every a collection of module group assembling by the spraying opening of movement to this batch of module; (d2) movement assembling all modules is installed in described shell.
Its further technical scheme is: in described step (d1), and from inside to outside and/or from low to high multi-level in movement that the mode of in batches assembling according to predefined procedure comprises the structure according to described movement and arranges is assembled in batches.
Its further technical scheme is: described shell is the stacked housing comprising drain pan and mesochite, is being carry out the module group assembling after spraying up and down according to the structure of described shell to the mode of operation of shell in batches.
Its further technical scheme is: before each module being carried out to three anti-paint sprayings, first carry out anti-spraying conservation treatment to the conducting terminal in module.
Its further technical scheme is: described anti-spraying conservation treatment comprises and covers described conducting terminal with high tempreture tape or working of plastics.
Its further technical scheme is: before each module being carried out to three anti-paint sprayings, carry out playing glue process to the docking terminal in module.
Its further technical scheme is: after carrying out three anti-paint sprayings, dry by application element at every turn.
Electric equipment manufacturing method of the present invention first carries out modularity design to components and parts and implements spraying operation separately to each modular assembly, then again spraying operation is implemented to the assembly sprayed in final assembly link, wherein spray owing to possessing good operability separately, effectively can eliminate the dead angle existed in the anti-paint spraying process of complete machine three, the phenomenon such as in uneven thickness, and the spraying again in final assembly, components and parts can be made to obtain further sprayed protection, the thickness that repeatedly spraying to increase by three anti-paint overcoats also can make up the issuable slight crack of single spin to meet requirement of shelter simultaneously, thus can provide comprehensive to the components and parts in electronic equipment, effective protective action.As can be seen here, electric equipment manufacturing method of the present invention can under the prerequisite not improving IP degree of protection, improves that electronic equipment is many for dust, high humidity and operational reliability in the environments for use such as highly corrosive pollution.
By following description also by reference to the accompanying drawings, the present invention will become more clear, and these accompanying drawings are for explaining embodiments of the invention.
Accompanying drawing explanation
Fig. 1 is the method flow diagram of electric equipment manufacturing method first embodiment of the present invention.
Fig. 2 is the structure chart of the electronic equipment according to Fig. 1 manufactured by electric equipment manufacturing method.
Fig. 3 is the method flow diagram of electric equipment manufacturing method second embodiment of the present invention.
Fig. 4 is the structure chart of the electronic equipment according to Fig. 2 manufactured by electric equipment manufacturing method.
Fig. 5 is the different conditions figure of the assembling process of electronic equipment shown in Fig. 4.
Fig. 6 is the method flow diagram of electric equipment manufacturing method of the present invention 3rd embodiment.
Fig. 7 is the structure chart of the electronic equipment according to Fig. 6 manufactured by electric equipment manufacturing method.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in embodiment, reference numerals similar in accompanying drawing represents similar assembly.Obviously, be only the present invention's part embodiment below by the embodiment of description, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Electric equipment manufacturing method of the present invention can be used for the electronic equipment manufacturing multiple different type of machines, describes electric equipment manufacturing method of the present invention in detail below for the electronic equipment of three kinds of different type of machines.
Fig. 1 and Fig. 2 illustrates the first embodiment of electric equipment manufacturing method of the present invention.
With reference to Fig. 1, the manufacture method of the present embodiment comprises the following steps: first, provides shell and the components and parts (step S101) of one-tenth electronic equipment to be assembled; Then, all components and parts are assembled into multiple device level assembly (step S102); And then, three anti-paints spraying (step S103) are carried out to each device level assembly; Then will the device level assembling components of same batch of assembling be needed in shell again, after every a collection of device level assembling components, carry out three anti-paints spraying (step S104); Finally, step S104 is repeated until all device level assemblies all load in shell complete complete machine assembling (step S105).
The manufacture method of the present embodiment can be used for the little type frequency converter 10 shown in shop drawings 2.With reference to Fig. 2, the shell 11 of the present embodiment is stacked housing, it comprises drain pan 111 and mesochite 112, and the assembly formed in the present embodiment is device level assembly, described device level assembly comprises control board assembly 12, circuit board assemblies 13, heat sink assembly 14 and fan component 15, before by device level assembling components to shell 11 such as above-mentioned control board assembly 12, circuit board assemblies 13, first carry out three anti-paint sprayings to each device level assembly, this operation realizes spraying each assembly by automatic spraying equipment comprehensively.In the present embodiment, according to the structure of shell and the feature of each assembly, its complete machine assembling process is by being divided into three batches to carry out by assembly: the below first heat sink assembly 14 being loaded on mesochite 112, then will load in drain pan 111 with the mesochite 112 of heat sink assembly 14 and fan component 15 again, finally again circuit board assemblies 13 and control board assembly 12 are loaded in mesochite 112, in this complete machine assembling process, three anti-paint sprayings are then carried out after every a collection of device level assembling components, the spraying operation repeatedly of this assembling process not only can add thick coating, can spray the joint between assembly but also can spray the junction of assembly and shell, make the protection of coating more comprehensive and effective.The manual link position place supplementary three anti-paints further smearing to two parts are adopted after above-mentioned spraying operation repeatedly carries out automatic coating by automatic spraying equipment.In the present embodiment, adopt the method for designing of stacked shell structure, effectively support the operation of comprehensive, all even effective three anti-paint sprayings carried out at complete machine assembling process further, make main protected parts all can implement multilayer and entirely spray.
Fig. 3 to Fig. 5 illustrates the second embodiment of electric equipment manufacturing method of the present invention.
With reference to Fig. 3, the manufacture method of the present embodiment comprises the following steps: first, provides shell, components and parts and movement (step S201); Then, components and parts are assembled into multiple device level assembly (step S202); And then, three anti-paints spraying (step S203) are carried out to each device level assembly; Again then, each device level assembly is assembled into corresponding position in movement according to predefined procedure in batches, after often assembling a collection of assembly, carries out three anti-paints spraying (step S204); Finally, the movement assembling all device level assemblies is installed in shell complete complete machine assembling (step S205).
The manufacture method of the present embodiment can be used for the medium type frequency converter 20 shown in shop drawings 4 and Fig. 5.With reference to Fig. 4 and Fig. 5, the shell 21 of the present embodiment comprises base 211, face-piece 212 and front and back end plate 213 and 214, a stepped dividing plate 221 is formed in movement 22, movement 22 inside is divided into two-layer up and down by this dividing plate 221, be formed with multiple installation position in it, and four sides of movement 22 are formed with the multiple spraying openings 222 corresponding with installation position.In the present embodiment, the assembly formed through above-mentioned steps S202 is device level assembly, it comprises heat sink assembly 23, capacitance component 24, control board assembly 25, IGBT assembly 26, terminal assemblies 27 and fan component 28 etc., according to the feature of said modules and the architectural feature of movement 22, above-mentioned steps S204 specifically assembles by order from inside to outside and from low to high: first the heat sink assembly 23 being positioned at the bottom is assembled into movement 22 as first batch, then capacitance component 24 is assembled into the hierarchic structure lower floor of movement 22 internal partition 221 as second batch, then IGBT assembly 26 and terminal assemblies 27 are installed to the hierarchic structure upper strata of movement 22 internal partition 221 as the 3rd sets of batches again, finally will be in outer field control board assembly 25 and other assembly is assembled, often assemble a collection of assembly and then carry out once comprehensive three anti-paint sprayings, the spraying operation repeatedly of this assembling process not only can add thick coating, can spray the joint between assembly but also can spray the junction of assembly and movement, make the protection of coating more comprehensive and effective.In addition; based on the above-mentioned Open architecture design of movement 22; in above-mentioned spraying process repeatedly; three anti-paints by multiple spraying opening 222 enter into movement 22 inner and to needing spray assembly to carry out comprehensively, all even effective spraying, make main protected parts still can implement full spraying after being loaded on movement 22.In the present embodiment, also need to be electrically connected accordingly after each assembling components to movement 22, such as, IGBT assembly 26 is mounted on the surface of heat sink assembly 23, control board assembly 25 is connected with IGBT assembly 26 by cable, and control board assembly 25 is connected with terminal assemblies 27 by wiring.
Fig. 6 to Fig. 7 illustrates the 3rd embodiment of electric equipment manufacturing method of the present invention.
With reference to Fig. 6, the manufacture method of the present embodiment comprises the following steps: first provide components and parts and shell (step S301); Then components and parts are assembled into multiple device level assembly (step S302); Three anti-paints spraying (step S303) are carried out to each device level assembly; Device level assembling components after all sprayings is become multiple module level assembly (step S304); Three anti-paints spraying (step S305) are carried out to each module level assembly; To the module level assembly of same batch of assembling be needed to be assembled in shell, after every a collection of module level assembly assembling, carry out three anti-paints spraying (step S306); Finally, step S306 is repeated until all module level assemblies all load in shell complete complete machine assembling (step S307).
The manufacture method of the present embodiment can be used for the electronic equipment of the large type shown in shop drawings 7.With reference to Fig. 7, the shell 31 of the electronic equipment 30 of the present embodiment be set shell and movement function in frame structure integrally, the surrounding of this shell 31 is formed with multiple spraying opening 311 to facilitate the carrying out of three anti-paint spray coating operations.For such large type electronic equipment, because its components and parts are more, before the device level assembly will be assembled into by components and parts carries out final assembly, module level assembly can be combined to form further according to the design feature of each assembly and function, in the present embodiment, the assembly of final assembly process is module level assembly, it comprises power modules 32, distribution module 33, input module 34 and control module 35 etc., these modules can be assembled in shell according to sequenced batch from inside to outside or from bottom to up, often assemble a collection of assembly and then carry out once comprehensive three anti-paint sprayings, the spraying operation repeatedly of this assembling process not only can add thick coating, can spray the joint between module level assembly but also can spray the junction of module level assembly and shell, make the protection of coating more comprehensive and effective.
Understandably, in the anabolic process of above-mentioned module level assembly, a part device level assembly also can be only selected to be combined into module level assembly and also to remain with part of devices level assembly making the assembly in final assembly not only comprise module level assembly.In addition, according to specific needs, each module level assembly can also again combine and form larger assembly.
Preferably; in the manufacture process of electric equipment manufacturing method of the present invention; before three anti-paint sprayings are carried out to each device level assembly; first can carry out anti-spraying conservation treatment to the conducting terminal in device level assembly, described anti-spraying conservation treatment realizes to adopt the mode of high tempreture tape or working of plastics covering conducting terminal.Equally preferably, in complete machine assembling process, before carrying out three anti-paint sprayings, first carry out playing glue process to protect the conductivity of docking terminal to the docking terminal in interconnective assembly at every turn.In addition, in above-mentioned manufacture process, after carrying out three anti-paint sprayings, also can accelerate to manufacture efficiency to being dried by application element at every turn.
As mentioned above, electric equipment manufacturing method of the present invention first carries out modularity design to components and parts and implements spraying operation separately to each modular assembly, then repeatedly spraying operation is implemented again to the assembly sprayed in final assembly link, wherein spray owing to possessing good operability separately, effectively can eliminate the dead angle existed in the anti-paint spraying process of complete machine three, the phenomenon such as in uneven thickness, and the spraying again in final assembly, components and parts can be made to obtain further sprayed protection, the thickness that repeatedly spraying to increase by three anti-paint overcoats also can make up the issuable slight crack of single spin to meet requirement of shelter simultaneously, thus can provide comprehensive to the components and parts in electronic equipment, effective protective action.As can be seen here, electric equipment manufacturing method of the present invention can not increase infrastructure cost and improve IP degree of protection prerequisite under, improve that electronic equipment is many for dust, high humidity and operational reliability in the environments for use such as highly corrosive pollution.
More than in conjunction with preferred embodiment, invention has been described, but the present invention is not limited to the embodiment of above announcement, and should contain various carry out according to essence of the present invention amendment, equivalent combinations.
Claims (7)
1. an electric equipment manufacturing method, is characterized in that, comprises the following steps:
A () provides the parts of the described electronic equipment of one-tenth to be assembled, described parts comprise components and parts, movement and shell, described movement is formed with installation position and the spraying opening corresponding with installation position;
(b1) all components and parts are assembled into multiple device level assembly;
(b2) three anti-paint sprayings are carried out to each described device level assembly;
(b3) the part of devices level assembly after spraying or all device level assembling components are become at least one module level assembly;
C () carries out three anti-paint sprayings to each module level assembly;
(d1) the device level assembly after spraying, module level assembly are assembled in movement on corresponding installation position according to predefined procedure in batches, after every a collection of assembling components, carry out three anti-paint sprayings by the spraying opening of movement to this batch of assembly;
(d2) movement assembling all component is installed in described shell;
E () carries out three anti-paint sprayings to the assembly in shell.
2. electric equipment manufacturing method as claimed in claim 1, it is characterized in that, in described step (d1), from inside to outside and/or from low to high multi-level in movement that the mode of in batches assembling according to predefined procedure comprises the structure according to described movement and arranges is assembled in batches.
3. electric equipment manufacturing method as claimed in claim 1, it is characterized in that, described shell is the stacked housing comprising drain pan and mesochite, is being carry out the assembling components after spraying up and down according to the structure of described shell to the mode of operation of shell in batches.
4. electric equipment manufacturing method as claimed in claim 1, is characterized in that, before each assembly being carried out to three anti-paint sprayings, first carries out anti-spraying conservation treatment to the components and parts conducting terminal in assembly.
5. electric equipment manufacturing method as claimed in claim 4, is characterized in that, described anti-spraying conservation treatment comprises and covers described conducting terminal with high tempreture tape or working of plastics.
6. electric equipment manufacturing method as claimed in claim 1, is characterized in that, before each assembly being carried out to three anti-paint sprayings, carries out playing glue process to the docking terminal in assembly between each components and parts.
7. the electric equipment manufacturing method as described in any one of claim 1-6, is characterized in that, after carrying out three anti-paint sprayings, dries by application element at every turn.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210222317.0A CN102753001B (en) | 2012-03-22 | 2012-06-29 | Method for manufacturing electronic equipment |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220113185 | 2012-03-22 | ||
| CN2012201131853 | 2012-03-22 | ||
| CN201220113185.3 | 2012-03-22 | ||
| CN201210222317.0A CN102753001B (en) | 2012-03-22 | 2012-06-29 | Method for manufacturing electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102753001A CN102753001A (en) | 2012-10-24 |
| CN102753001B true CN102753001B (en) | 2015-05-27 |
Family
ID=47032785
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210222284.XA Active CN102752973B (en) | 2012-03-22 | 2012-06-29 | Electronic equipment |
| CN201210222317.0A Expired - Fee Related CN102753001B (en) | 2012-03-22 | 2012-06-29 | Method for manufacturing electronic equipment |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210222284.XA Active CN102752973B (en) | 2012-03-22 | 2012-06-29 | Electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN102752973B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104064968B (en) * | 2014-06-03 | 2016-10-05 | 江苏华冠电器集团有限公司 | A kind of static reacance generator (PCC) power |
| CN104538317A (en) * | 2014-12-23 | 2015-04-22 | 成都九洲迪飞科技有限责任公司 | Heat-humidity prevention, mould prevention and salt mist prevention method for microwave substrate of bare tube core micro-package |
| CN105869803A (en) * | 2016-05-25 | 2016-08-17 | 常州市武进凯利达电子有限公司 | Mould-proof moisture absorption potentiometer |
| CN108054930B (en) * | 2017-12-19 | 2019-11-12 | 深圳市英威腾电气股份有限公司 | A kind of inverter |
| CN113738705B (en) * | 2021-08-23 | 2024-04-12 | 奇鋐科技股份有限公司 | Method for combining fan and system main board |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2509803Y (en) * | 2001-09-14 | 2002-09-04 | 湖南湘计信息软件股份有限公司 | Passageway exchange board |
| CN101072473A (en) * | 2007-06-17 | 2007-11-14 | 成都市宇中梅科技有限责任公司 | Moisture-proof circuit board processing method and product |
| CN102062908A (en) * | 2010-11-12 | 2011-05-18 | 武汉华工正源光子技术有限公司 | Light transceiving module with special assembly structure and assembly method thereof |
| CN102123564A (en) * | 2010-11-26 | 2011-07-13 | 中国北方车辆研究所 | Conformal coating shielding method of circuit board |
| CN102223055A (en) * | 2011-06-20 | 2011-10-19 | 深圳市英威腾电气股份有限公司 | Frequency converter with master device installed in modularized way |
| CN102313570A (en) * | 2010-06-30 | 2012-01-11 | 金理拌 | Electric power instrument with protection function and machining process thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2689656Y (en) * | 2004-03-06 | 2005-03-30 | 鸿富锦精密工业（深圳）有限公司 | Fixer of data memory |
| CN100580612C (en) * | 2006-05-20 | 2010-01-13 | 技嘉科技股份有限公司 | Computer casing |
| CN101219419A (en) * | 2008-01-29 | 2008-07-16 | 钟晓辉 | Method and spray gun for executing electrostatic plastic-blasting for internal surface of container |
-
2012
- 2012-06-29 CN CN201210222284.XA patent/CN102752973B/en active Active
- 2012-06-29 CN CN201210222317.0A patent/CN102753001B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2509803Y (en) * | 2001-09-14 | 2002-09-04 | 湖南湘计信息软件股份有限公司 | Passageway exchange board |
| CN101072473A (en) * | 2007-06-17 | 2007-11-14 | 成都市宇中梅科技有限责任公司 | Moisture-proof circuit board processing method and product |
| CN102313570A (en) * | 2010-06-30 | 2012-01-11 | 金理拌 | Electric power instrument with protection function and machining process thereof |
| CN102062908A (en) * | 2010-11-12 | 2011-05-18 | 武汉华工正源光子技术有限公司 | Light transceiving module with special assembly structure and assembly method thereof |
| CN102123564A (en) * | 2010-11-26 | 2011-07-13 | 中国北方车辆研究所 | Conformal coating shielding method of circuit board |
| CN102223055A (en) * | 2011-06-20 | 2011-10-19 | 深圳市英威腾电气股份有限公司 | Frequency converter with master device installed in modularized way |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102752973A (en) | 2012-10-24 |
| CN102753001A (en) | 2012-10-24 |
| CN102752973B (en) | 2016-01-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102753001B (en) | Method for manufacturing electronic equipment | |
| US6219240B1 (en) | Three-dimensional electronic module and a method of its fabrication and repair | |
| US20120147558A1 (en) | Scalable electronics, computer, router, process control and other module/enclosures employing approximated tesselation(s)/tiling(s) or electronics and other modules from tow modules to columns, rows and arrays with optional deployment utilizing palletization for build out of existing industrial space and/or new construction with nestable wiring applicable from module and assembly level to molecular and atomic levels | |
| RS54934B1 (en) | Method and system for construction of a building | |
| DE50206698D1 (en) | ARRANGEMENT CONSISTING OF A PANEL-BASED MODULE AND A CONNECTION UNIT, METHOD OF MANUFACTURING AND DEVICE | |
| CN102650173A (en) | Modular data center and configuration method thereof | |
| CN204680910U (en) | A kind of cable fast joint structure for modularization secondary unit equipment | |
| CN103546018B (en) | A kind of power cell and manufacture method thereof | |
| KR200415388Y1 (en) | Distribution Switchboard using a Clip-typed Busbar Connector | |
| CN202767578U (en) | Modular data center | |
| CN205860366U (en) | Antistatic structure, controller and air conditioner | |
| US20070017180A1 (en) | Network floor structure | |
| CN109750872B (en) | Data center based on prefabrication | |
| CN211349699U (en) | Open type four-axis aircraft platform for teaching | |
| CN209299288U (en) | Industry internet intelligent gateway device | |
| CN205986764U (en) | Wiring base and use its photovoltaic assembly junction box | |
| CN103135020B (en) | A kind of consider the flexible configurations experiment porch that multiple distributed power source accesses | |
| US20140268576A1 (en) | Line replaceable unit with universal heat sink receptacle | |
| CN205000395U (en) | Loader commonality operation panel assembly | |
| CN204481542U (en) | Large-scale intelligent charging device | |
| CN204721340U (en) | A kind of radio frequency power amplification modules and radio frequency communication devices | |
| CN216590695U (en) | Mounting platform for monitored control system | |
| CN207977702U (en) | A kind of bus duct for power transmission and transformation | |
| CN218125188U (en) | Component mounting structure, vehicle console and vehicle | |
| CN215656109U (en) | PCB adhesive deposite device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150527 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |