CN102745984A - High-curie-point lead-free PTC (Positive Temperature Coefficient) ceramic material and preparation method thereof - Google Patents

High-curie-point lead-free PTC (Positive Temperature Coefficient) ceramic material and preparation method thereof Download PDF

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CN102745984A
CN102745984A CN2012102613843A CN201210261384A CN102745984A CN 102745984 A CN102745984 A CN 102745984A CN 2012102613843 A CN2012102613843 A CN 2012102613843A CN 201210261384 A CN201210261384 A CN 201210261384A CN 102745984 A CN102745984 A CN 102745984A
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CN102745984B (en
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蒲永平
袁启斌
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Shenzhen Pengbo Information Technology Co ltd
Yancheng Qinglong Jinbang Water Co ltd
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Shaanxi University of Science and Technology
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Abstract

The invention provides a high-curie-point lead-free PTC (Positive Temperature Coefficient) ceramic material and a preparation method of the ceramic material. The ceramic material mainly comprises Ba1-x(K0.5Bi0.5)xTiO3, wherein x is more than or equal to 0.05 and smaller than or equal to 0.3. The high-curie-point PTC ceramic material provided by the invention does not contain lead, so damages of resistor devices to the human bodies and the environment in manufacturing and using processes are avoided; the processes of oxidation and then reduction are adopted, so semi-conduction of the material is achieved without donor doping; and PTC heat-sensitive materials with different curie points can be prepared through controlling the doping quantities of KBT (KBiTiO).

Description

A kind of high curie point lead-free PTC stupalith and preparation method thereof
Technical field
The present invention relates to a kind of semiconductor material, particularly a kind ofly meet K unleaded, low-resistance 0.5Bi 0.5TiO 3(KBT) high-concentration dopant BaTiO 3(BT) high curie point lead-free PTC thermistor ceramic material and preparation method thereof.
Background technology
BaTiO 3Base positive temperature coefficient resistance (positive temperature coefficient resistance is called for short PTCR) stupalith is a kind of Ferro-Electric Semiconductor material, is development in recent years one of novel electron material rapidly.Because the PTCR stupalith has " switch " function automatically such as temperature sensitive, current limliting, time-delay, has been widely used in every field such as telecommunications, aerospace, automotive industry, household electrical appliance.
Yet, but the piezoelectricity of current practicability and ferroelectric material mainly are with the mobile agent of Pb as Curie temperature, realize with the crystallographic site of Pb displacement Ba.This series products is because its satisfactory stability property, repeatability and higher Curie temperature have obtained application widely.But contain the Pb oxide compound inevitably because a variety of causes flows into living environment and physical environment, thereby human body and physical environment are worked the mischief.Because current various countries are to the improving constantly of environmental requirement, PTCR material unleaded become a kind of inexorable trend.Environmentally friendly PTCR thermal sensitive ceramic material has far-reaching social effect and economic implications.
It is BT-KBT that present various countries researchist studies one of maximum system, but focuses mostly in KBT (K 0.5Bi 0.5TiO 3) to BT (BaTiO 3) low concentration doping (generally being no more than 5%).
Summary of the invention
The object of the present invention is to provide a kind of high curie point lead-free PTC stupalith and preparation method thereof.
For achieving the above object, the present invention has adopted following technical scheme.
A kind of high curie point lead-free PTC stupalith, this stupalith comprises following component:
Ba 1-x(K 0.5Bi 0.5) xTiO 3
, 0.05≤x≤0.3 wherein.
The preparation method of above-mentioned high curie point lead-free PTC stupalith may further comprise the steps:
1) at first with K 2CO 3, Bi 2O 3And TiO 2According to K 2CO 3: Bi 2O 3: TiO 2The mixed in molar ratio of=1:1:4 gets mixture A, then with BaCO 3And TiO 2Mixed in molar ratio according to 1:1 gets mixture B, in mixture A and mixture B, adds behind the deionized water respectively ball milling 4h under the rotating speed at 350-500r/min, behind the ball milling 80-100 ℃ of oven dry down;
2), mixture A is incubated the synthetic K of 2-3h down at 900-950 ℃ through after the step 1) 0.5Bi 0.5TiO 3Powder is incubated the synthetic BaTiO of 2-3h with mixture B down at 1100-1150 ℃ 3Powder;
3) with K 0.5Bi 0.5TiO 3Powder, BaTiO 3Powder and M according to following prescription prepare burden mixture C:
Ba 1-x(K 0.5Bi 0.5) xTiO 3+yM
, 0.05≤x≤0.3,0≤y≤0.05 wherein; Y got 0 o'clock; Sintering temperature can be higher, and M be the minor compound additive as sintering agent, glassy phase and strongthener temperature factor, in mixture C behind the adding deionized water under the rotating speed of 350-500r/min ball milling 4h; 80-100 ℃ of oven dry down, granulation then, moulding get idiosome behind the ball milling;
4) with idiosome in feeding the atmosphere furnace of argon gas in 1300 ℃ of insulation 2h, obtain the ceramics sample of semiconductor;
5) with the ceramics sample of semiconductor in being mixed with the argon gas of trace oxygen, ℃ following insulation 1-2h of 800-1100, obtain high curie point lead-free PTC stupalith.
Said M is one or several the mixture that contains in the oxide compound of Si, Al, Ti or Mn.
The volume(tric)fraction of oxygen is 0.5-4% in the said argon gas that is mixed with trace oxygen.
The high curie point lead-free PTC stupalith that the present invention prepares can reach following parameter request: Tc=150-230 ℃ through the resistive material Characteristics Detection; R 25≤3.5k Ω; Lg (R Max/ R Min)>=3.0.Characteristics Detection adopts the In-Ga alloy as electrode, records the room temperature resistance and the resistance-temperature curve of components and parts.Can select other electrode materialss (like aluminium electrode, nickel electrode etc.) in the actual production for use.
The preparation method of high curie point lead-free PTC stupalith according to the invention has the following advantages: 1. adopt conventional solid-state method to prepare powder, particle does not have reunion, fillibility is good, cost is low, output is big, preparation technology is simple, easy control of reaction conditions.2. through KBT the high density (5% ~ 30%) of BT is mixed to realize the raising of Curie temperature.3. sample carries out sintering in argon gas atmosphere, under the situation of not carrying out donor doping, realizes resistance lowering, the semiconductor of sample.4. the sample after the reduction is at Ar and O 2Mixed gas in, reoxidize.Through the ratio of each component in the control mixed gas, execute the oxygen temperature, execute conditions such as oxygen time, with the liftdrag of control material.5. the high curie point PTC stupalith of the present invention's preparation is not leaded, has avoided resistance element in manufacturing and use, human body and environment to be produced harm.The technology that adopts reduction to reoxidize has realized the semiconductor of material under the situation of not carrying out donor doping.And can be through to the control of KBT doping, with the preparation of the PTC thermo-sensitive material of realizing different Curie temperatures.The preparation method of high curie point lead-free PTC stupalith 6. according to the invention can obtain high-purity phase composite, stable performance, high curie point PTC thermistor that safety is high; The doping scope of KBT is wide in the prescription of principal constituent; Can adjust accordingly according to production technique in the actual application, handiness is big.
Embodiment
Below in conjunction with embodiment the present invention is described further.
Embodiment 1
1) at first with K 2CO 3, Bi 2O 3And TiO 2According to K 2CO 3: Bi 2O 3: TiO 2The mixed in molar ratio of=1:1:4 gets mixture A, then with BaCO 3And TiO 2Mixed in molar ratio according to 1:1 gets mixture B, in mixture A and mixture B, adds behind the deionized water respectively ball milling 4h under the rotating speed at 400r/min, and the ball milling after-filtration is removed ballstone, then 80 ℃ of oven dry down;
2), mixture A is incubated the synthetic K of 2h down at 925 ℃ through after the step 1) 0.5Bi 0.5TiO 3Powder is incubated the synthetic BaTiO of 3h with mixture B down at 1100 ℃ 3Powder;
3) with K 0.5Bi 0.5TiO 3Powder, BaTiO 3Powder and SiO 2According to prescription Ba 1-x(K 0.5Bi 0.5) xTiO 3+ ySiO 2Preparing burden obtains mixture C, x=0.05 wherein, y=0.05; In mixture C, add behind a certain amount of deionized water ball milling 4h under the rotating speed of 400r/min, the ball milling after-filtration is removed ballstone, then under 80 ℃ through oven dry in 6 hours; The oven dry back adds a certain amount of PVA granulation, moulding gets idiosome; Idiosome is the disk type, and the diameter of disk is 12mm, and thickness is 3.5-4.0mm;
4) with idiosome in feeding the atmosphere furnace of argon gas in 1300 ℃ of insulation 2h, obtain the ceramics sample of semiconductor;
5) with the ceramics sample of semiconductor in being mixed with the argon gas of trace oxygen (volume(tric)fraction of oxygen is 2%), 900 ℃ down insulation 1h reoxidize so that grain boundary oxidation and form the crystal boundary potential barrier and obtain high curie point lead-free PTC stupalith;
6) two sides with the lead-free PTC stupalith polishes, and is coated with the In-Ga alloy as electrode;
7) the PTC stupalith be will obtain after the step 6) and resistance temperature curve measurement, the performance of resulting stupalith: Tc (Curie temperature)=150 ℃ carried out; R 25=3.5k Ω; Lg (R Max/ R Min)=3.25.
Embodiment 2
1) at first with K 2CO 3, Bi 2O 3And TiO 2According to K 2CO 3: Bi 2O 3: TiO 2The mixed in molar ratio of=1:1:4 gets mixture A, then with BaCO 3And TiO 2Mixed in molar ratio according to 1:1 gets mixture B, in mixture A and mixture B, adds behind the deionized water respectively ball milling 4h under the rotating speed at 350r/min, and the ball milling after-filtration is removed ballstone, then 90 ℃ of oven dry down;
2), mixture A is incubated the synthetic K of 3h down at 930 ℃ through after the step 1) 0.5Bi 0.5TiO 3Powder is incubated the synthetic BaTiO of 2h with mixture B down at 1130 ℃ 3Powder;
3) with K 0.5Bi 0.5TiO 3Powder, BaTiO 3Powder and SiO 2According to prescription Ba 1-x(K 0.5Bi 0.5) xTiO 3+ ySiO 2Preparing burden obtains mixture C, x=0.07 wherein, y=0.05; In mixture C, add behind a certain amount of deionized water ball milling 4h under the rotating speed of 350r/min, the ball milling after-filtration is removed ballstone, then under 100 ℃ through oven dry in 4 hours; The oven dry back adds a certain amount of PVA granulation, moulding gets idiosome; Idiosome is the disk type, and the diameter of disk is 12mm, and thickness is 3.5-4.0mm;
4) with idiosome in feeding the atmosphere furnace of argon gas in 1300 ℃ of insulation 2h, obtain the ceramics sample of semiconductor;
5) with the ceramics sample of semiconductor in being mixed with the argon gas of trace oxygen (volume(tric)fraction of oxygen is 3%), 1000 ℃ down insulation 1h reoxidize so that grain boundary oxidation and form the crystal boundary potential barrier and obtain high curie point lead-free PTC stupalith;
6) two sides with the lead-free PTC stupalith polishes, and is coated with the In-Ga alloy as electrode;
7) the PTC stupalith be will obtain after the step 6) and resistance temperature curve measurement, the performance of resulting stupalith: Tc=170 ℃ carried out; R 25=2.5k Ω; Lg (R Max/ R Min)=3.10.
Embodiment 3
1) at first with K 2CO 3, Bi 2O 3And TiO 2According to K 2CO 3: Bi 2O 3: TiO 2The mixed in molar ratio of=1:1:4 gets mixture A, then with BaCO 3And TiO 2Mixed in molar ratio according to 1:1 gets mixture B, in mixture A and mixture B, adds behind the deionized water respectively ball milling 4h under the rotating speed at 500r/min, and the ball milling after-filtration is removed ballstone, then 100 ℃ of oven dry down;
2), mixture A is incubated the synthetic K of 2h down at 950 ℃ through after the step 1) 0.5Bi 0.5TiO 3Powder is incubated the synthetic BaTiO of 3h with mixture B down at 1150 ℃ 3Powder;
3) with K 0.5Bi 0.5TiO 3Powder, BaTiO 3Powder and SiO 2According to prescription Ba 1-x(K 0.5Bi 0.5) xTiO 3+ ySiO 2Preparing burden obtains mixture C, x=0.10 wherein, y=0.05; In mixture C, add behind a certain amount of deionized water ball milling 4h under the rotating speed of 500r/min, the ball milling after-filtration is removed ballstone, then under 90 ℃ through oven dry in 5 hours; The oven dry back adds a certain amount of PVA granulation, moulding gets idiosome; Idiosome is the disk type, and the diameter of disk is 12mm, and thickness is 3.5-4.0mm;
4) with idiosome in feeding the atmosphere furnace of argon gas in 1300 ℃ of insulation 2h, obtain the ceramics sample of semiconductor;
5) with the ceramics sample of semiconductor in being mixed with the argon gas of trace oxygen (volume(tric)fraction of oxygen is 4%), 1100 ℃ down insulation 1h reoxidize so that grain boundary oxidation and form the crystal boundary potential barrier and obtain high curie point lead-free PTC stupalith;
6) two sides with the lead-free PTC stupalith polishes, and is coated with the In-Ga alloy as electrode;
7) the PTC stupalith be will obtain after the step 6) and resistance temperature curve measurement, the performance of resulting stupalith: Tc=178 ℃ carried out; R 25=2.9k Ω; Lg (R Max/ R Min)=3.15.
Embodiment 4
1) at first with K 2CO 3, Bi 2O 3And TiO 2According to K 2CO 3: Bi 2O 3: TiO 2The mixed in molar ratio of=1:1:4 gets mixture A, then with BaCO 3And TiO 2Mixed in molar ratio according to 1:1 gets mixture B, in mixture A and mixture B, adds behind the deionized water respectively ball milling 4h under the rotating speed at 450r/min, and the ball milling after-filtration is removed ballstone, then 90 ℃ of oven dry down;
2), mixture A is incubated the synthetic K of 3h down at 900 ℃ through after the step 1) 0.5Bi 0.5TiO 3Powder is incubated the synthetic BaTiO of 2h with mixture B down at 1120 ℃ 3Powder;
3) with K 0.5Bi 0.5TiO 3Powder, BaTiO 3Powder and SiO 2According to prescription Ba 1-x(K 0.5Bi 0.5) xTiO 3+ ySiO 2Preparing burden obtains mixture C, x=0.13 wherein, y=0.05; In mixture C, add behind a certain amount of deionized water ball milling 4h under the rotating speed of 450r/min, the ball milling after-filtration is removed ballstone, then under 90 ℃ through oven dry in 5 hours; The oven dry back adds a certain amount of PVA granulation, moulding gets idiosome; Idiosome is the disk type, and the diameter of disk is 12mm, and thickness is 3.5-4.0mm;
4) with idiosome in feeding the atmosphere furnace of argon gas in 1300 ℃ of insulation 2h, obtain the ceramics sample of semiconductor;
5) with the ceramics sample of semiconductor in being mixed with the argon gas of trace oxygen (volume(tric)fraction of oxygen is 0.5%), 800 ℃ down insulation 2h reoxidize so that grain boundary oxidation and form the crystal boundary potential barrier and obtain high curie point lead-free PTC stupalith;
6) two sides with the lead-free PTC stupalith polishes, and is coated with the In-Ga alloy as electrode;
7) the PTC stupalith be will obtain after the step 6) and resistance temperature curve measurement, the performance of resulting stupalith: Tc=201 ℃ carried out; R 25=2.8k Ω; Lg (R Max/ R Min)=3.30.
Embodiment 5
1) at first with K 2CO 3, Bi 2O 3And TiO 2According to K 2CO 3: Bi 2O 3: TiO 2The mixed in molar ratio of=1:1:4 gets mixture A, then with BaCO 3And TiO 2Mixed in molar ratio according to 1:1 gets mixture B, in mixture A and mixture B, adds behind the deionized water respectively ball milling 4h under the rotating speed at 450r/min, and the ball milling after-filtration is removed ballstone, then 90 ℃ of oven dry down;
2), mixture A is incubated the synthetic K of 3h down at 900 ℃ through after the step 1) 0.5Bi 0.5TiO 3Powder is incubated the synthetic BaTiO of 2h with mixture B down at 1140 ℃ 3Powder;
3) with K 0.5Bi 0.5TiO 3Powder, BaTiO 3Powder and SiO 2According to prescription Ba 1-x(K 0.5Bi 0.5) xTiO 3+ ySiO 2Preparing burden obtains mixture C, x=0.25 wherein, y=0.02; In mixture C, add behind a certain amount of deionized water ball milling 4h under the rotating speed of 450r/min, the ball milling after-filtration is removed ballstone, then under 90 ℃ through oven dry in 5 hours; The oven dry back adds a certain amount of PVA granulation, moulding gets idiosome; Idiosome is the disk type, and the diameter of disk is 12mm, and thickness is 3.5-4.0mm;
4) with idiosome in feeding the atmosphere furnace of argon gas in 1300 ℃ of insulation 2h, obtain the ceramics sample of semiconductor;
5) with the ceramics sample of semiconductor in being mixed with the argon gas of trace oxygen (volume(tric)fraction of oxygen is 0.5%), 800 ℃ down insulation 2h reoxidize so that grain boundary oxidation and form the crystal boundary potential barrier and obtain high curie point lead-free PTC stupalith;
6) two sides with the lead-free PTC stupalith polishes, and is coated with the In-Ga alloy as electrode;
7) the PTC stupalith be will obtain after the step 6) and resistance temperature curve measurement, the performance of resulting stupalith: Tc=211 ℃ carried out; R 25=2.9k Ω; Lg (R Max/ R Min)=3.20.
Among the embodiment 1-5, the usage ratio of deionized water, ballstone is in the ball milling:
Material: ball: water=1: (1 ~ 1.4): (0.8 ~ 1.2) this ratio can change as one sees fit, and is very faint to final result's influence.

Claims (4)

1. high curie point lead-free PTC stupalith, it is characterized in that: this stupalith comprises following component:
Ba 1-x(K 0.5Bi 0.5) xTiO 3
, 0.05≤x≤0.3 wherein.
2. one kind prepares high curie point lead-free PTC method of ceramic material according to claim 1, it is characterized in that: may further comprise the steps:
1) at first with K 2CO 3, Bi 2O 3And TiO 2According to K 2CO 3: Bi 2O 3: TiO 2The mixed in molar ratio of=1:1:4 gets mixture A, then with BaCO 3And TiO 2Mixed in molar ratio according to 1:1 gets mixture B, in mixture A and mixture B, adds behind the deionized water respectively ball milling 4h under the rotating speed at 350-500r/min, behind the ball milling 80-100 ℃ of oven dry down;
2), mixture A is incubated the synthetic K of 2-3h down at 900-950 ℃ through after the step 1) 0.5Bi 0.5TiO 3Powder is incubated the synthetic BaTiO of 2-3h with mixture B down at 1100-1150 ℃ 3Powder;
3) with K 0.5Bi 0.5TiO 3Powder, BaTiO 3Powder and M according to following prescription prepare burden mixture C:
Ba 1-x(K 0.5Bi 0.5) xTiO 3+yM
0.05≤x≤0.3 wherein; 0≤y≤0.05, M is the minor compound additive as sintering agent, glassy phase and strongthener temperature factor, in mixture C, adds behind the deionized water ball milling 4h under the rotating speed of 350-500r/min; 80-100 ℃ of oven dry down, granulation then, moulding get idiosome behind the ball milling;
4) with idiosome in feeding the atmosphere furnace of argon gas in 1300 ℃ of insulation 2h, obtain the ceramics sample of semiconductor;
5) with the ceramics sample of semiconductor in being mixed with the argon gas of trace oxygen, ℃ following insulation 1-2h of 800-1100, obtain high curie point lead-free PTC stupalith.
3. according to the said a kind of preparation high curie point lead-free PTC method of ceramic material of claim 2, it is characterized in that: said M is one or several the mixture that contains in the oxide compound of Si, Al, Ti or Mn.
4. according to the said a kind of preparation high curie point lead-free PTC method of ceramic material of claim 2, it is characterized in that: the volume(tric)fraction of oxygen is 0.5-4% in the said argon gas that is mixed with trace oxygen.
CN201210261384.3A 2012-07-26 2012-07-26 High-curie-point lead-free PTC (Positive Temperature Coefficient) ceramic material and preparation method thereof Expired - Fee Related CN102745984B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104030679A (en) * 2014-06-27 2014-09-10 陕西科技大学 BaTiO3-based lead-free PTC (positive temperature coefficient) thermistor ceramic material sintered in reducing atmosphere and preparation method thereof

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CN101276659A (en) * 2007-03-26 2008-10-01 太阳诱电株式会社 Dielectric ceramics and multi-layer ceramic capacitor
CN102177105A (en) * 2008-10-16 2011-09-07 韩国Ceramic技术院 Lead free ceramic composition for PTC thermistor and PTC ceramic thermistor thereby

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CN104030679A (en) * 2014-06-27 2014-09-10 陕西科技大学 BaTiO3-based lead-free PTC (positive temperature coefficient) thermistor ceramic material sintered in reducing atmosphere and preparation method thereof
CN104030679B (en) * 2014-06-27 2015-10-28 陕西科技大学 A kind of BaTiO of reducing atmosphere sintering 3base lead-free PTC thermistor ceramic material and preparation method thereof

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Patentee after: Yancheng Qinglong Jinbang water Co.,Ltd.

Address before: 518000 No.6 Qinglong Road, Qinglong Road, Qinghua community, Longhua street, Longhua District, Shenzhen City, Guangdong Province

Patentee before: Shenzhen Pengbo Information Technology Co.,Ltd.

CI03 Correction of invention patent
CI03 Correction of invention patent

Correction item: Patentee|Address

Correct: Yancheng Qingdun Jinbang water Co.,Ltd.|224000 Qingyang Road, Nanyang Town, Tinghu District, Yancheng City, Jiangsu Province (in Qingdun Office) (8)

False: Yancheng Qinglong Jinbang water Co.,Ltd.|224000 Qingyang Road, Nanyang Town, Tinghu District, Yancheng City, Jiangsu Province (in Qingdun Office) (8)

Number: 02-02

Volume: 37

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140827