CN102703865A - Vacuum film plating machine - Google Patents

Vacuum film plating machine Download PDF

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Publication number
CN102703865A
CN102703865A CN2012101961736A CN201210196173A CN102703865A CN 102703865 A CN102703865 A CN 102703865A CN 2012101961736 A CN2012101961736 A CN 2012101961736A CN 201210196173 A CN201210196173 A CN 201210196173A CN 102703865 A CN102703865 A CN 102703865A
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CN
China
Prior art keywords
drive unit
dividing plate
vacuum plating
control system
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012101961736A
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Chinese (zh)
Inventor
成军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KUNSHAN PULI METAL INDUSTRIAL Co Ltd
Original Assignee
KUNSHAN PULI METAL INDUSTRIAL Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KUNSHAN PULI METAL INDUSTRIAL Co Ltd filed Critical KUNSHAN PULI METAL INDUSTRIAL Co Ltd
Priority to CN2012101961736A priority Critical patent/CN102703865A/en
Publication of CN102703865A publication Critical patent/CN102703865A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a vacuum film plating machine, which comprises a vacuum film plating chamber, a temperature control system, a film thickness control system and an evaporation control system, wherein the vacuum film plating chamber comprises a partition device, the partition device comprises a separation plate and a driving device, the driving device is connected with the separation plate, and the opening and closing state of the separation plate is controlled. The vacuum film plating machine can realize the partition between an evaporation source and a product, and the influence on plated films caused by impurities and air is avoided, so high-precision optical films can be manufactured.

Description

A kind of vacuum plating unit
Technical field
The present invention relates to photoelectric component production unit field, particularly relate to a kind of vacuum plating unit.
Background technology
Optical thin film is made up of thin layered medium, propagates one type of optical medium material of light beam through the interface.Application of optical film starts from the thirties in 20th century.In the modern times, optical thin film has been widely used in optics and photoelectron technology field, makes various opticinstruments.
At present, it is main with physical vapor deposition usually that optical thin film is made, this method for thin-film material by solid-state gaseous state or the ionic state of being converted into, the material of gaseous state or ionic state passes through the space by evaporation source, arrives at substrate surface, deposition forms film gradually at last.Usually, in order to make highly purified film, the processing procedure of plated film needs to accomplish down in high vacuum environment.In the heat-processed before the plated film, when not reaching the vaporization temperature of evaporant, just have evaporation source impurity evaporation is fallen, other has some evaporants in the heating evaporation process, can discharge gas.These impurity and unsettled gaseous diffusion can cause that uneven film thickness, component are clean, performance is unstable, stress is big, adhere to shortcomings such as insecure, influence coating quality.
Existing vacuum plating unit can't completely cut off these impurity and gas, can't produce high-precision optical thin film.
Summary of the invention
The technical problem that the present invention mainly solves provides a kind of vacuum plating unit, can produce high-precision optical thin film.
For solving the problems of the technologies described above; The technical scheme that the present invention adopts is: a kind of vacuum plating unit is provided; Comprise vacuum film coating chamber, temperature controlling system, film thickness monitoring system and evaporation control system, said vacuum film coating chamber comprises partition apparatus, and said partition apparatus comprises dividing plate and drive unit; Said drive unit is connected with dividing plate, the opening and closing of control dividing plate.
In preferred embodiment of the present invention; Said drive unit is connected with evaporation control system, when said evaporation control system starts, sends out start signal and gives drive unit; Dividing plate is closed in said drive unit operation; When said evaporation control system is closed, send out shutdown signal and give drive unit, dividing plate is opened in said drive unit operation.
In preferred embodiment of the present invention; Said drive unit also is connected with temperature controlling system, when said temperature controlling system starts, sends out start signal and gives drive unit; Dividing plate is closed in said drive unit operation; When said temperature controlling system is closed, send out shutdown signal and give drive unit, dividing plate is opened in said drive unit operation.
In preferred embodiment of the present invention, said baffle surface is coated with inert material.
In preferred embodiment of the present invention, said vacuum plating chamber internal surface is coated with inert material
In preferred embodiment of the present invention, said inert material is aluminum oxide or zirconium white.
In preferred embodiment of the present invention, said partition apparatus also comprises guide rail, and said dividing plate is installed on the guide rail.
The invention has the beneficial effects as follows: vacuum plating unit of the present invention, can be to cutting off between evaporation source and the product, isolated impurity and gas are to the influence of plated film production, thus ability can produce high-precision optical thin film.
Description of drawings
Fig. 1 is the structural representation of vacuum plating unit one preferred embodiment of the present invention.
Embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present invention is set forth in detail, thereby protection scope of the present invention is made more explicit defining so that advantage of the present invention and characteristic can be easier to it will be appreciated by those skilled in the art that.
See also Fig. 1, the embodiment of the invention comprises:
A kind of vacuum plating unit; Comprise vacuum film coating chamber 1, temperature controlling system 2, film thickness monitoring system 3 and evaporation control system 4; Said vacuum film coating chamber 1 comprises partition apparatus (not mark), and said partition apparatus comprises dividing plate 11, guide rail 12 and drive unit 13, and said dividing plate 11 is installed on the said guide rail 12; Said drive unit 13 is connected with dividing plate 11, the opening and closing of control dividing plate 11.
Said drive unit 13 is connected with evaporation control system 4; When said evaporation control system 4 starts, send out start signal and give drive unit 13, said dividing plate 11 is closed in said drive unit 13 operations; Evaporation source and product are cut off; When said evaporation control system 4 is closed, send out shutdown signal and give drive unit 13, said dividing plate 11 is opened in said drive unit 13 operations.
Said drive unit 13 also is connected with temperature controlling system 2; When said temperature controlling system 2 starts, send out start signal and give drive unit 13, said dividing plate 11 is closed in said drive unit 13 operations; Evaporation source and product are cut off; When said temperature controlling system 2 is closed, send out shutdown signal and give drive unit 13, said dividing plate 11 is opened in said drive unit 13 operations.
Preferably, on said dividing plate 11 surfaces with the material generation chemical reaction of indoor the prevented impurity that plates inertia materials such as aluminum oxide or zirconium white of vacuum plating, the to be deposited or evaporating materials that gasifies and said dividing plate 11 self.
Vacuum plating unit of the present invention can be to cutting off the influence that isolated impurity and gas are produced plated film between evaporation source and the product; Guaranteed the clean state that vacuum plating is indoor, thereby ensured that rete to be deposited can not take place to pollute and go bad, made the substrate coating layer thickness more even; Composition is purer, and performance is more stable, and is more solid and reliable with being connected of substrate surface; Improve the quality of substrate coating layer and prolonged work-ing life of substrate, thereby can produce high-precision optical thin film.
The above is merely embodiments of the invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes specification sheets of the present invention and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.

Claims (6)

1. vacuum plating unit; Comprise vacuum film coating chamber, temperature controlling system, film thickness monitoring system and evaporation control system; It is characterized in that said vacuum film coating chamber comprises partition apparatus, said partition apparatus comprises dividing plate and drive unit; Said drive unit is connected with dividing plate, the opening and closing of control dividing plate.
2. vacuum plating unit according to claim 1 is characterized in that said drive unit is connected with evaporation control system; When said evaporation control system starts; Send out start signal and give drive unit, dividing plate is closed in said drive unit operation, when said evaporation control system is closed; Send out shutdown signal and give drive unit, dividing plate is opened in said drive unit operation.
3. vacuum plating unit according to claim 2 is characterized in that said drive unit also is connected with temperature controlling system; When said temperature controlling system starts; Send out start signal and give drive unit, dividing plate is closed in said drive unit operation, when said temperature controlling system is closed; Send out shutdown signal and give drive unit, dividing plate is opened in said drive unit operation.
4. vacuum plating unit according to claim 1 is characterized in that said baffle surface is coated with inert material.
5. vacuum plating unit according to claim 1 is characterized in that, said vacuum plating chamber internal surface is coated with inert material
According to claim 4 or 5 described vacuum plating units, it is characterized in that said inert material is alumina layer or zirconia layer.
6. vacuum plating unit according to claim 1 is characterized in that said partition apparatus also comprises guide rail, and said dividing plate is installed on the guide rail.
CN2012101961736A 2012-06-14 2012-06-14 Vacuum film plating machine Pending CN102703865A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012101961736A CN102703865A (en) 2012-06-14 2012-06-14 Vacuum film plating machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012101961736A CN102703865A (en) 2012-06-14 2012-06-14 Vacuum film plating machine

Publications (1)

Publication Number Publication Date
CN102703865A true CN102703865A (en) 2012-10-03

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012101961736A Pending CN102703865A (en) 2012-06-14 2012-06-14 Vacuum film plating machine

Country Status (1)

Country Link
CN (1) CN102703865A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020132047A1 (en) * 2001-03-12 2002-09-19 Shunpei Yamazaki Film forming apparatus and film forming method
CN101503795A (en) * 2008-02-01 2009-08-12 应用材料公司 Twin-type coating device with improved separating plate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020132047A1 (en) * 2001-03-12 2002-09-19 Shunpei Yamazaki Film forming apparatus and film forming method
CN101503795A (en) * 2008-02-01 2009-08-12 应用材料公司 Twin-type coating device with improved separating plate

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Application publication date: 20121003