CN102701739A - Piezoelectric material and preparation method thereof - Google Patents
Piezoelectric material and preparation method thereof Download PDFInfo
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- CN102701739A CN102701739A CN2012101727349A CN201210172734A CN102701739A CN 102701739 A CN102701739 A CN 102701739A CN 2012101727349 A CN2012101727349 A CN 2012101727349A CN 201210172734 A CN201210172734 A CN 201210172734A CN 102701739 A CN102701739 A CN 102701739A
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Abstract
The invention relates to a piezoelectric material and a preparation method thereof. The chemical constitution of the piezoelectric material is shown as follows: Pb1-x-yMe1xMe2y[(Ni1/3Nb2/3a.Zrb.Tic)O3, wherein Me1 and Me2 are independently selected from one of or combination of at least two of Ba, Ca, Sr, Mg and La; x and y are equal to 0.02 to 0.1; a is 0.1 to 0.7; b is 0.1 to 0.6; c is 0.1 to 0.8; and a, b and c are equal to 1. The piezoelectric material has the advantages of high piezoelectric coefficient and low mechanical quality factor, has other excellent performance and can be widely applied in the fields of high-sensitivity flowmeter sensors, piezoelectric loudspeakers, brakes, micro-positioning systems, hydroacoustic engineering, passive sonar and the like.
Description
Technical field
The present invention relates to a kind of piezoelectric, particularly, the present invention relates to a kind of high tension electricity coefficient d33, low Qm Qm piezoelectric and preparation method thereof.
Background technology
Material can be divided into structured material and functional materials two big classes on use properties; Wherein structured material serves as to use foundation with mechanical characteristics such as its intensity, toughness, hardness, elasticity; Functional materials is the basis with physicalies such as its electricity, magnetic, light, sound, heat, in order to be manufactured with the device of specific function.Piezoelectric is a functional materials of realizing that mechanical energy and electric energy are changed each other, be one type to mechanical, electrical, sound, light, heat sensitive electronic material, be widely used in industrial sector and high-tech area.
Piezoelectric is divided into piezoelectric ceramics, piezoquartz and piezo-electricity composite material.
BaTiO
3Be the piezoelectric ceramics of finding the earliest, with regard to its piezoelectricity design fish finder of research and utilization, its maximum shortcoming was that the harmonics temperature profile is poor as far back as Japan in 1949.But partly replace BaTiO with elements such as Pb and Ca
3In Ba, can improve BaTiO
3The temperature profile of pottery is so in the today that is widely used the PZT piezoelectric ceramics, still have the part PZT to adopt the BaTiO3 piezoelectric ceramics of modification.Picture BaTiO
3Such unitary system piezoelectric ceramics also has PbTiO
3And PbZrO
3Deng.PbTiO
3Pottery is a kind of material of calcium titanium ore structure, and it has the little characteristics such as (ε=200) of Tc height (490 ℃), anisotropy (c/a=1.064) and specific inductivity.In addition, its harmonics temperature profile is also relatively good, and frequency constant is higher than PZT, so be a kind of up-and-coming high temperature high frequency piezoelectric.But be difficult to obtain fine and close pure PbTiO with ordinary method
3Piezoelectric ceramics is so people often adopt the method for introducing additive that it is carried out modification.Present PbTiO with Mn, W, Ca, Bi, La and Nb modification
3Pottery all has good piezoelectric property, is the excellent material of producing the high frequency piezoelectric filter.Lead titanate piezoelectric ceramics is called for short the PZT pottery, is with the most use the widest a kind of in the piezoceramic material.The electromechanical coupling factor of PZT is high, and temperature stability is good, and high Curie temperature (～300 ℃) is arranged.Partly replace the Pb among the PZT with elements such as Sr, Ca, Mg, or, can process the PZT type piezoelectric ceramics of many different purposes, like PZT-4, PZT-5, PZT-6, PZT-7 and PZT-8 etc. through adding unit's modifications usually such as Nb, La, Sb, Cr, Mn.The appearance of PZT pottery is a milestone new on the piezoelectric ceramics development history, and it has improved performance of piezoelectric ceramics greatly and has enlarged its range of application.
Piezoelectric device and application and development thereof depend on the renewal of piezoelectric kind and the raising of performance.In order to develop the new application of piezoelectric, after quartz crystal, people have developed multiple piezoquartzs such as sieve breath that salt, KDP, ADP, EDT, DKT and LH again.But because their performance often exists certain or some defective, your salt facile hydrolysis of sieve breath etc. for example is so along with the mass production of synthetic quartz and the raising of piezoelectric ceramics performance, these crystal are out of use now mostly basically.Present quartz crystal is still most important, also is the piezoelectric of maximum vibrator, resonator and narrow band filter equifrequency control elements of consumption.
In different use occasions, the performance of piezoelectric there is different requirement.From present material property, though piezoelectric has higher sensitivity, piezoelectric coefficient d 33 and Qm Qm are still than higher.
CN85100710B discloses a kind of lithium Naples yellow of the 0.05g of including molecule, the lead zirconates of the lead titanate of 0.46g molecule and 0.49g molecule, and the stupalith that forms with 0.01 to 0.15 Sr displacement Pb.This stupalith has extremely low mechanical q-value, high sensitivity, and high resonance impedance and suitable percentage coupling, specific inductivity, and cost is low, but this stupalith does not relate to piezoelectric coefficient d 33 aspects.
Summary of the invention
One of the object of the invention is to provide a kind of piezoelectric, and said piezoelectric has the advantage of high tension electricity coefficient d33 and low Qm Qm concurrently.
In order to achieve the above object, the present invention has adopted following technical scheme:
Piezoelectric according to the invention, its chemical constitution is as follows:
Pb
1-x-yMe1
xMe2
y[(Ni
1/3Nb
2/3)
a·Zr
b·Ti
c]O
3 （Ⅰ）
Wherein:
Me1 and Me2 independently are selected from the combination of a kind of among Ba, Ca, Sr, Mg, La, the Sb or at least two kinds;
x+y=0.02~0.1；
A is 0.1 ~ 0.7; B is 0.1 ~ 0.6; C is 0.1 ~ 0.8, and a+b+c=1.
Said combination is the combination of Ba and Ca for example, the combination of Sr and Mg, the combination of La and Sb, the combination of Ca and Sr, the combination of Mg and La, the combination of Sb and Ba, the combination of Ca, Ba, Sr.
As preferred version, x+y=0.05 ~ 0.08, for example 0.052,0.054,0.056,0.06,0.065,0.068,0.07,0.072,0.074, preferred x+y=0.03 ~ 0.07.Said x and y can equate, also can be unequal, and the present invention does not limit this.
As optimal technical scheme, a is 0.15 ~ 0.65, for example 0.18,0.21,0.24,0.27,0.30,0.33,0.36,0.39,0.42,0.62,0.59,0.56,0.53,0.50, and preferred 0.15 ~ 0.6, further preferred 0.2 ~ 0.5.
As optimal technical scheme, b is 0.15 ~ 0.5, for example 0.18,0.21,0.24,0.27,0.30,0.33,0.37,0.40,0.43,0.46,0.49, and preferred 0.15 ~ 0.4, further preferred 0.2 ~ 0.4.
As optimal technical scheme, c is 0.1 ~ 0.7, for example 0.13,0.16,0.19,0.22,0.25,0.28,0.31,0.34,0.37,0.69,0.66,0.63,0.60,0.57,0.54, and preferred 0.15 ~ 0.65, further preferred 0.2 ~ 0.6.
Two of the object of the invention is to provide a kind of preparation method of aforesaid piezoelectric, and said method comprises the steps:
(1) select the compound that contains required element for use, press the said chemical constitution batching of formula I, precompressed piece behind the ball milling, pre-burning, ball milling obtains material a once more;
(2) in material a, add sticker and carry out granulation, plastic removal after the moulding, sintering obtains material b then;
(3) with the material b processing that polarizes, obtain piezoelectric.
The compound that contains required element comprises the carbonate cpds that contains required element, nitrate compound, oxide compound, prussiate, sulfide, carbide, nitride etc.; Only need guarantee in the follow-up sintering process, can not introduce new element gets final product; Those skilled in the art can select the classes of compounds of being added voluntarily, and the present invention does not limit this.Said compound is barium carbonate, lime carbonate, Strontium carbonate powder, magnesiumcarbonate, Phosbloc, nitrate of baryta, nitrocalcite, magnesium nitrate, strontium nitrate, Lanthanum trinitrate, barium oxide, quicklime, strontium oxide, lanthanum trioxide, magnesium carbide, barium carbide, carbide of calcium, strontium carbide, lanthanum carbide, strontium cyanide, barium cyanide, calcyanide, magnesium cyanide, lead carbonate, plumbous oxide, lead nitrate, carbonization lead, nickelous carbonate, nickelous nitrate, nickel oxide, nickel cyanide, nickel oxide, niobium oxides, carbonic acid niobium, nitric acid niobium, niobium nitride, zirconium white, zirconium carbonate, zirconium nitrate, titanium oxide, titanium nitride for example, and the quality of required compound can calculate according to the described chemical constitution of formula I.
After the chemical constitution batching, raw material is carried out ball milling precompressed piece then, the ball mill arbitrarily that those skilled in the art can be known all can be realized the present invention, as optimal technical scheme, ball milling according to the invention adopts planetary ball mill to carry out ball milling.
Preferably, the temperature of said pre-burning is 600 ~ 1200 ℃, for example 620 ℃, 650 ℃, 680 ℃, 710 ℃, 740 ℃, 770 ℃, 800 ℃, 1150 ℃, 1100 ℃, 1080 ℃, and preferred 700 ~ 1100 ℃, further preferred 800 ~ 900 ℃.
Preferably, the time of said pre-burning is more than the 1h, for example 2h, 3h, 4h, 5h, 6h, 7h, 8h, 9h, 10h, 11h, 12h, 13h, 14,15h, preferred 1 ~ 10h, further preferred 1.5 ~ 5h, more preferably 2h.
Pure PZT piezoelectric ceramics is owing to the plumbous vacant cavity type conduction that demonstrates; And positive low valence metal ion additive rises in vivo and receives main effect; Therefore, the adding of positive low valence metal ion greatly increases interior negative electricity center of ceramic body and current carrier hole, promptly produces a large amount of space charges.In order to eliminate the electric field that the discontinuous variation of domain wall is produced; Electronegative space charge concentrates at the anode on farmland; And the space charge of positively charged concentrates at the negative terminal of domain wall, has formed the space charge field (Eq) identical with the original spontaneous polarization direction of electricdomain, when applying external electric field electricdomain is turned to; Not only to overcome the spontaneous polarization on original farmland, but also will overcome space charge field Eq.That is to say it is that the effect of space charge has suppressed the motion of electricdomain, thereby reduced internal friction, increased the Qm value.For positive low price metallic additions (rigid additive), along with the increase of doping, the space charge amount increases.Therefore, the piezoelectric ceramics of high Qm value, the variation of Qm value is relevant with space charge.Temperature raises, and space charge moves in ceramic body, has reduced gathering of space charge, promotes the motion of domain wall, and the Qm value is descended.
The present invention is through being employed in 600 ~ 1200 ℃, and the pre-burning time is more than the 1h, and the material behind the precompressed piece is carried out pre-burning, has eliminated space charge, has reduced the Qm value of final piezoelectric.
Ball milling is carried out in the sinter pulverizing that forms after the pre-burning, preferably carry out rolling ball milling.
For the intensity that improves pressed compact after the moulding or prevent the powder segregation, therefore in powdery substance a, add sticker, it can be removed before sintering or in the sintering process.Sticker according to the invention is selected from the mixture of a kind of in epoxy adhesive, polyurethane adhesive, aminoresin sticker, the curable hot-melt adhesive of vinyl resin or at least two kinds; Said mixture is the mixture of epoxy adhesive, polyurethane adhesive for example; The mixture of aminoresin sticker and the curable hot-melt adhesive of vinyl resin; The mixture of epoxy adhesive, polyurethane adhesive and aminoresin sticker, optimization polyurethane acrylate adhesives (PUA).
Preferably; The mass percent that the quality of said urethane acrylate sticker accounts for the total mass of material a is 5 ~ 15wt%; For example 5.5wt%, 6wt%, 6.5wt%, 7wt%, 7.5wt%, 8wt%, 8.5wt%, 9wt%, 9.5wt%, 10wt%, 10.5wt%, 11wt%, 11.5wt%, 12wt%, 12.5wt%, 13wt%; Preferred 5 ~ 10wt%, further preferred 8wt%.
Moulding: powder behind the ball milling adds sticker, can be mist projection granulating, can be manual granulation also, leave standstill 24h after, charge into mould with certain pressure and speed, pass through pressurize, put opening mold behind the oxygen, just can obtain the ceramic of definite shape and size.The isostatic pressing that is shaped to according to the invention.
Isostatic pressing is that sample to be pressed is placed high pressure vessel; Utilize incompressible character of liquid medium and the character of evenly transmitting pressure sample evenly to be pressurizeed from all directions; When liquid medium passes through pressure pump injection pressure container; According to fluid mechanics principle, its pressure size is constant and be delivered to all directions equably.The pressure that this moment, the powder in the high pressure vessel received on all directions is uniformly with of the same size.Make the method for lean property powder moulding dense green be called isostatic pressing method through aforesaid method.
Preferably, the pressure of said isostatic pressing is 150 ~ 300MPa, for example 155MPa, 160MPa, 165MPa, 170MPa, 180MPa, 190MPa, 290MPa, 280MPa, 270MPa, 260MPa, preferred 160 ~ 250MPa, further preferred 180MPa.
Also need carry out plastic removal after the moulding, if do not carry out plastic removal, directly carry out sintering, sticker can be influenced the performance of final material by the calcining carbonization so.
Preferably, the temperature of said plastic removal is 600 ~ 900 ℃, for example 610 ℃, 620 ℃, 630 ℃, 640 ℃, 650 ℃, 660 ℃, 890 ℃, 880 ℃, 870 ℃, 860 ℃, 850 ℃, and preferred 650 ~ 800 ℃, further preferred 690 ~ 750 ℃.
Preferably, the time of said plastic removal is 1 ~ 5h, for example 1.2h, 1.4h, 1.6h, 1.8h, 2h, 2.2h, 2.4h, 2.6h, 4.8h, 4.6h, 4.4h, 4.2h, preferred 1.5 ~ 4h, further preferred 2h.
Preferably, said sintering temperature is 1000 ~ 1400 ℃, for example 1050 ℃, 1100 ℃, 1150 ℃, 1200 ℃, 1250 ℃, 1300 ℃, 1350 ℃, 1380 ℃, and preferred 1100 ~ 1350 ℃, further preferred 1200 ~ 1300 ℃.
It is lack of alignment that piezoelectric does not have the preceding unbound electron of polarization, and after polarization was handled, producing residual polarization along direction of polarization became anisotropic polycrystal, unbound electron trend unanimity, and piezoelectricity strengthens greatly.Said polarization treatment temperature is 120～180 ℃, for example 122 ℃, 124 ℃, 126 ℃, 128 ℃, 130 ℃, 132 ℃, 140 ℃, 178 ℃, 176 ℃, 174 ℃, 172 ℃, 170 ℃, and preferred 130 ~ 170 ℃, further preferred 140 ~ 160 ℃.
Preferably; The strength of electric field that said polarization is handled is 1600 ~ 2800V/mm; For example 1650V/mm, 1700V/mm, 1750V/mm, 1800V/mm, 1850V/mm, 1900V/mm, 1950V/mm, 2700V/mm, 2600V/mm, 2500V/mm, 2400V/mm, 2300V/mm; Preferred 1800 ~ 2600V/mm, further preferred 2000 ~ 2500V/mm.
Preferably, the time that said polarization is handled is 5 ~ 30min, for example 7min, 9min, 11min, 13min, 15min, 17min, 19min, 29min, 27min, 25min, 23min, 21min, preferred 10 ~ 20min, further preferred 15min.
Three of the object of the invention is to provide the purposes of a kind of aforesaid piezoelectric in HSF transmitter, piezoelectric speaker, stopper, microposition system, Underwater Acoustics Engineering, passive sonar etc.
Compared with prior art, the present invention has and is described below:
(1) the present invention carries out doping vario-property through doped metallic elements to existing PZT stupalith, and obtaining chemical constitution is Pb
1-x-yMe1
xMe2
y[(Ni
1/3Nb
2/3)
aZr
bTi
c] O
3Piezoelectric, improved its piezoelectric property;
(2) piezoelectric preparation method according to the invention is employed in 600 ~ 1200 ℃, and the pre-burning time is more than the 1h, and the material behind the precompressed piece is carried out pre-burning, has eliminated space charge, has reduced the Qm value of final piezoelectric, and has improved its piezoelectric coefficient d 33.Compare with the existing standard C B1125-98P52 of China State Shipbuilding Corporation, the performance of piezoelectric according to the invention is superior to existing standard, and piezoelectric property significantly improves.
Embodiment
For the present invention is described better, be convenient to understand technical scheme of the present invention, typical case of the present invention but non-restrictive example is following:
Embodiment 1
(1) selects compound (PbO, BaO, MgO, NiO, the TiO that contains required element for use
2, ZrO
2, Nb
2O
5), the chemical constitution batching of pressing the compound of required preparation, precompressed piece behind the ball milling, pre-burning, rolling ball milling obtains material a once more;
(2) in material a, add sticker and carry out granulation, plastic removal after the moulding, sintering obtains material b then;
(3) material b is polarized obtain chemical constitution piezoelectric as follows: Pb after handling
0.98Ba
0.01Mg
0.01[(Ni
1/3Nb
2/3)
0.1Zr
0.6Ti
0.3] O
3
The quality that contains the compound of required element can calculate according to the chemical constitution of final piezoelectric.
Embodiment 2
(1) selects compound (lead carbonate, Strontium carbonate powder, magnesiumcarbonate, NiO, the Nb that contains required element for use
2O
5, zirconium carbonate, titanium nitride), by the chemical constitution batching of the compound of required preparation, precompressed piece behind the ball milling, pre-burning, rolling ball milling obtains material a once more;
(2) in material a, add sticker and carry out granulation, plastic removal after the moulding, sintering obtains material b then;
(3) material b is polarized obtain chemical constitution piezoelectric as follows: Pb after handling
0.9Sr
0.05Mg
0.05[(Ni
1/3Nb
2/3)
0.7Zr
0.2Ti
0.1] O
3
The quality that contains the compound of required element can calculate according to the chemical constitution of final piezoelectric.
Embodiment 3
(1) selects compound (lead carbonate, Phosbloc, barium carbonate, NiO, the Nb that contains required element for use
2O
5, Titanium Nitrate, zirconium nitrate), by the chemical constitution batching of the compound of required preparation, precompressed piece behind the ball milling, pre-burning, rolling ball milling obtains material a once more;
(2) in material a, add sticker and carry out granulation, plastic removal after the moulding, sintering obtains material b then;
(3) material b is polarized obtain chemical constitution piezoelectric as follows: Pb after handling
0.95La
0.02Ba
0.03[(Ni
1/3Nb
2/3)
0.2Zr
0.1Ti
0.7] O
3
The quality that contains the compound of required element can calculate according to the chemical constitution of final piezoelectric.
Embodiment 4
(1) selects compound (lead carbonate, strontium nitride, magnesiumcarbonate, NiO, the Nb that contains required element for use
2O
5, Titanium Nitrate, zirconium nitrate), by the chemical constitution batching of the compound of required preparation, precompressed piece behind the planetary ball mill, in pre-burning, rolling ball milling obtains material a once more;
(2) in material a, add sticker and carry out granulation, plastic removal after the moulding, sintering obtains material b then;
(3) material b is polarized obtain chemical constitution piezoelectric as follows: Pb after handling
0.94Sr
0.05Mg
0.01[(Ni
1/3Nb
2/3)
0.1Zr
0.1Ti
0.8] O
3
The quality that contains the compound of required element can calculate according to the chemical constitution of final piezoelectric.
The processing parameter that the said piezoelectric of embodiment 1-4 prepares in the process is as shown in table 1.
Table 1 embodiment 1-4 piezoelectric prepares processing parameter
Piezoelectric according to the invention is carried out performance test, and compare with the ministerial standard CB1125-98P52 of China State Shipbuilding Corporation, as shown in table 2:
Table 2 piezoelectric performance according to the invention is compared with CB1125-98P52
| CB1125-98?P52 | Piezoelectric according to the invention | |
| DIELECTRIC CONSTANTS r3 T | 3250 | 4300 |
| Piezoelectric strain constant d33 | 575×10 -12C/N | 680×10 -12C/N |
| Piezoelectric strain constant d31 | -260×10 -12C/N | -270×10 -12C/N |
| Elastic compliance constant S E 11 | 15.5×10 12m 2/N | 17×10 12m 2/N |
| Dielectric loss tg δ | ≤0.02 | ≤0.02 |
| Electromechanical coupling factor Kp | 0.64 | 0.68 |
| Electromechanical coupling factor K31 | 0.38 | 0.38 |
| Tc Tc | ≥180℃ | ≥210℃ |
| Qm Qm | ≥65 | ≤60 |
| Volume density ρ | 7.4×10 3kg/m 3 | 7.5×10 3kg/m 3 |
Piezoelectric of the present invention has the advantage of high tension electricity coefficient and low Qm; And have other good performance concurrently, can be applied in fields such as HSF transmitter, piezoelectric speaker, stopper, microposition system, Underwater Acoustics Engineering, passive sonar widely.
Should be noted that and understand, under the situation that does not break away from the desired the spirit and scope of the present invention of accompanying Claim, can make various modifications and improvement the present invention of above-mentioned detailed description.Therefore, the scope of the technical scheme of requirement protection does not receive the restriction of given any specific exemplary teachings.
Applicant's statement, the present invention explains detailed method of the present invention through the foregoing description, but the present invention is not limited to above-mentioned detailed method, does not mean that promptly the present invention must rely on above-mentioned detailed method and could implement.The person of ordinary skill in the field should understand, and to any improvement of the present invention, to the interpolation of the equivalence replacement of each raw material of product of the present invention and ancillary component, the selection of concrete mode etc., all drops within protection scope of the present invention and the open scope.
Claims (10)
1. a piezoelectric is characterized in that, its chemical constitution is as follows:
Pb
1-x-yMe1
xMe2
y[(Ni
1/3Nb
2/3)
a·Zr
b·Ti
c]O
3 （Ⅰ）
Wherein:
Me1 and Me2 independently are selected from the combination of a kind of among Ba, Ca, Sr, Mg, La, the Sb or at least two kinds;
x+y=0.02~0.1；
A is 0.1 ~ 0.7; B is 0.1 ~ 0.6; C is 0.1 ~ 0.8, and a+b+c=1.
2. piezoelectric as claimed in claim 1 is characterized in that, x+y=0.02 ~ 0.08, preferred x+y=0.03 ~ 0.07.
3. according to claim 1 or claim 2 piezoelectric is characterized in that a is 0.15 ~ 0.65, and is preferred 0.15 ~ 0.6, further preferred 0.2 ~ 0.5.
4. like the described piezoelectric of one of claim 1-3, it is characterized in that b is 0.15 ~ 0.5, preferred 0.15 ~ 0.4, further preferred 0.2 ~ 0.4.
5. like the described piezoelectric of one of claim 1-4, it is characterized in that c is 0.1 ~ 0.7, preferred 0.15 ~ 0.65, further preferred 0.2 ~ 0.6.
6. the preparation method like one of claim 1-5 described piezoelectric is characterized in that, said method comprises the steps:
(1) select the compound that contains required element for use, press the said chemical constitution batching of formula I, precompressed piece behind the ball milling, pre-burning, ball milling obtains material a once more;
(2) in material a, add sticker and carry out granulation, plastic removal after the moulding, sintering obtains material b then;
(3) with the material b processing that polarizes, obtain piezoelectric.
7. method as claimed in claim 6 is characterized in that, said batching back ball milling adopts planetary ball mill to carry out ball milling;
Preferably, the temperature of said pre-burning is 600 ~ 1200 ℃, preferred 700 ~ 1100 ℃, and further preferred 800 ~ 900 ℃;
Preferably, the time of said pre-burning is more than the 1h, preferred 1 ~ 10h, further preferred 1.5 ~ 5h, more preferably 2h;
Preferably, ball milling is carried out in the sinter pulverizing that forms after the pre-burning, preferably carry out rolling ball milling.
8. method as claimed in claim 6; It is characterized in that; Said sticker is selected from the mixture of a kind of in epoxy adhesive, polyurethane adhesive, aminoresin sticker, the curable hot-melt adhesive of vinyl resin or at least two kinds, optimization polyurethane acrylate adhesives;
Preferably, the mass percent that the quality of said urethane acrylate sticker accounts for the total mass of material a is 5 ~ 15wt%, preferred 5 ~ 10wt%, further preferred 8wt%;
Preferably, the said isostatic pressing that is shaped to;
Preferably, the pressure of said isostatic pressing is 150 ~ 300MPa, preferred 160 ~ 250MPa, further preferred 180MPa;
Preferably, the temperature of said plastic removal is 600 ~ 900 ℃, preferred 650 ~ 800 ℃, and further preferred 690 ~ 750 ℃;
Preferably, the time of said plastic removal is 1 ~ 5h, preferred 1.5 ~ 4h, further preferred 2h;
Preferably, said sintering temperature is 1000 ~ 1400 ℃, preferred 1100 ~ 1350 ℃, and further preferred 1200 ~ 1300 ℃.
9. method as claimed in claim 6 is characterized in that, said polarization treatment temperature is 120 ~ 180 ℃, preferred 130 ~ 170 ℃, and further preferred 140 ~ 160 ℃;
Preferably, the strength of electric field that said polarization is handled is 1600 ~ 2800V/mm, preferred 1800 ~ 2600V/mm, further preferred 2000 ~ 2500V/mm;
Preferably, the time that said polarization is handled is 5 ~ 30min, preferred 10 ~ 20min, further preferred 15min.
10. one kind like the purposes of the described piezoelectric of one of claim 1-5 in HSF transmitter, piezoelectric speaker, stopper, microposition system, Underwater Acoustics Engineering, passive sonar etc.
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| CN103724013A (en) * | 2013-12-26 | 2014-04-16 | 重庆胜普昂凯科技有限公司 | A-position co-substituted piezoelectric ceramic material with high piezoelectric constant and preparation method |
| CN105645957A (en) * | 2016-01-14 | 2016-06-08 | 广东捷成科创电子股份有限公司 | Lead zirconate titanate fine-grain piezoelectric ceramic with high electromechanical coupling performance and preparing method thereof |
| CN109060160A (en) * | 2018-06-25 | 2018-12-21 | 泗阳君子兰激光科技发展有限公司 | High voltage bearing temperature sensor |
| CN109293354A (en) * | 2018-10-17 | 2019-02-01 | 佛山市高明欧电子制造有限公司 | A kind of PTC-ceramic material and preparation method thereof |
| CN111875374A (en) * | 2020-08-06 | 2020-11-03 | 湖北大学 | Low-temperature sintered niobium-nickel-lead zirconate titanate piezoelectric ceramic material and preparation method thereof |
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| CN101189743A (en) * | 2005-06-03 | 2008-05-28 | 株式会社村田制作所 | Piezoelectric element |
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