CN102691089B - Electrochemical method for preparing superhydrophobic surface on copper substrates by using aqueous electrolyte - Google Patents
Electrochemical method for preparing superhydrophobic surface on copper substrates by using aqueous electrolyte Download PDFInfo
- Publication number
- CN102691089B CN102691089B CN201210203153.7A CN201210203153A CN102691089B CN 102691089 B CN102691089 B CN 102691089B CN 201210203153 A CN201210203153 A CN 201210203153A CN 102691089 B CN102691089 B CN 102691089B
- Authority
- CN
- China
- Prior art keywords
- copper
- solution
- copper matrix
- distilled water
- matrixes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Electrolytic Production Of Metals (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
The invention discloses an electrochemical method for preparing a superhydrophobic surface on copper substrates by using an aqueous electrolyte. The method comprises the steps of: I, dissolving potassium hydroxide and potassium peroxydisulfate into distilled water to obtain a solution A; II, dissolving tetradecanoic acid into anhydrous ethanol to obtain a solution B; III, polishing the two copper substrates by using waterproof abrasive paper, then cleanly washing the two copper substrates by sequentially using the distilled water and the anhydrous ethanol, and drying for later use; IV, placing the solution A, as an electrolyte, into an electrolytic cell, and utilizing the two dried copper substrates as an anode and a cathode respectively to electrolyze; and V, cleanly washing the electrolyzed anode copper substrate by sequentially using the distilled water and the anhydrous ethanol, then uniformly smearing the solution B to a surface of the cleanly washed anode copper substrate, and airing to obtain the copper substrates with the super-hydrophobic surface. A contact angle of the super-hydrophobic surface prepared on the copper substrates by using the method can reach more than 152 degrees, and the super-hydrophobic performance keeps stable after the copper substrates are placed in a normal condition for one year.
Description
Technical field
The invention belongs to material technology field, be specifically related to a kind of water electrolysis liquid that adopts and on copper matrix, prepare the electrochemical method of super hydrophobic surface.
Background technology
Natural a lot of plant for example lotus leaf has all been shown extraordinary ultra-hydrophobicity, its contact angle up to 150 ° above and roll angle lower than 3 °.Excited by this, researcher has carried out the research of superhydrophobic characteristic, and this direction has developed into a study hotspot problem of Surface Science at present.Found that superhydrophobic characteristic depends primarily on chemical constitution and microtexture, generally adopt and on uneven surface, modify low surface energy material or build ultraphobic surface at super hydrophobic material surface construction coarse structure.At present, the preparation method who forms has mainly contained galvanic deposit, chemical vapour deposition, plasma etching, anodic oxidation, chemical corrosion, laser treatment, Electrospun, collosol and gel etc., yet, also there are some shortcomings in these methods, for example expensive material, complicated technology controlling and process and need to use template, these have all seriously hindered its large-scale application in engineering.Therefore, adopt a kind of efficient, inexpensive, method is constructed suitable coarse surface tissue simply and easily, has obvious application prospect in the application of industrial big scale.
Summary of the invention
Technical problem to be solved by this invention is for above-mentioned the deficiencies in the prior art, provide a kind of method simple, preparation time is short, and cost is low, and the employing water electrolysis liquid that is easy to realize the industrialization production requirements of big scale is prepared the electrochemical method of super hydrophobic surface on copper matrix.The copper sulfate that employing the method is prepared on copper matrix and the super hydrophobic surface of TETRADECONIC ACID copper micro/nano structure, contact angle can reach more than 152 °.
For solving the problems of the technologies described above, the technical solution used in the present invention is: a kind of water electrolysis liquid that adopts is prepared the electrochemical method of super hydrophobic surface on copper matrix, it is characterized in that, the method comprises the following steps:
Step 1, potassium hydroxide and Potassium Persulphate are dissolved in distilled water, after stirring, obtain solution A; In described solution A, the concentration of potassium hydroxide is 0.03mol/L～0.2mol/L, and the concentration of Potassium Persulphate is 0.035mol/L～0.1mol/L;
Step 2, TETRADECONIC ACID is dissolved in dehydrated alcohol, after stirring, obtains solution B; In described solution B, the concentration of TETRADECONIC ACID is 0.01mol/L～0.4mol/L;
Step 3, by two copper matrix liquid honings, to remove the zone of oxidation of copper matrix surface, then by polishing after two copper matrixes with distilled water and dehydrated alcohol, rinse well successively, dry up stand-by;
Step 4, solution A described in step 1 is placed in to electrolyzer as electrolytic solution, two copper matrixes after drying up in step 3 are connected with the positive and negative electrode of direct supply with negative electrode as anode respectively, and to regulate two copper matrixes be 25mm～35mm over against the distance between parallel placement and two copper matrixes, open direct supply, electrolysis 5s～120s under the condition that is 5V～15V at voltage;
Step 5, the anode copper matrix after electrolysis in step 4 is rinsed well with distilled water and dehydrated alcohol successively, then solution B described in step 2 is evenly applied in to the anode copper matrix surface after rinsing well, dry, obtain thering is the copper matrix that surface contact angle reaches 152 ° of above super hydrophobic surfaces.
Above-mentioned employing water electrolysis liquid is prepared the electrochemical method of super hydrophobic surface on copper matrix, and described in step 1, in solution A, the concentration of potassium hydroxide is 0.1mol/L.
Above-mentioned employing water electrolysis liquid is prepared the electrochemical method of super hydrophobic surface on copper matrix, and described in step 1, in solution A, the concentration of Potassium Persulphate is 0.05mol/L.
Above-mentioned employing water electrolysis liquid is prepared the electrochemical method of super hydrophobic surface on copper matrix, and described in step 2, in solution B, the concentration of TETRADECONIC ACID is 0.1mol/L.
Above-mentioned employing water electrolysis liquid is prepared the electrochemical method of super hydrophobic surface on copper matrix, and the distance described in step 4 between two copper matrixes is 30mm.
The present invention compared with prior art has the following advantages:
1, method of the present invention is simple, and preparation time is short, and cost is low, and efficiency is high, and the present invention adopts distilled water as the solvent of electrolytic solution, than adopting other reagent (as dehydrated alcohol) more economically, convenient; In addition, adopt distilled water as the solvent of electrolytic solution, in electrolytic process, required voltage is low, operates safer.
2, the present invention has broken through the restriction that in the past needs acid electrolyte, constructs first the super hydrophobic surface of copper sulfate and TETRADECONIC ACID copper micro/nano structure in basic solution, is easy to realize the industrialization production requirements cheaply of big scale.
3, method of the present invention is quicker than the electrochemical method based on dehydrated alcohol electrolytic solution, electrolysis 5s～120s.
4, adopt copper sulfate that method of the present invention prepared on copper matrix and the super hydrophobic surface of TETRADECONIC ACID copper micro/nano structure, contact angle can reach more than 152 °, and under normal condition, places ultra-hydrophobicity after a year and keep stable.
Below in conjunction with drawings and Examples, technical scheme of the present invention is described in further detail.Figure of description
Fig. 1 is the scanning electron microscope (SEM) photograph of the super hydrophobic surface of the embodiment of the present invention 2 preparations.
Fig. 2 is the scanning electron microscope (SEM) photograph of the super hydrophobic surface of the embodiment of the present invention 5 preparations.
Embodiment
Embodiment 1
Step 1, by 0.56g potassium hydroxide and 1.35g Potassium Persulphate powder dissolution in distilled water, be settled to 100mL, after stirring, obtaining concentration of potassium hydroxide is 0.1mol/L, the solution A that Potassium Persulphate concentration is 0.05mol/L;
Step 2, the TETRADECONIC ACID of 2.28g is dissolved in dehydrated alcohol, is settled to 100mL, after stirring, obtain the solution B that TETRADECONIC ACID concentration is 0.1mol/L;
Step 3, the copper matrix liquid honing that is 50mm * 25mm * 1.5mm by two piece sizes, to remove the zone of oxidation of copper matrix surface, then rinse two copper matrixes after polishing well successively with distilled water and dehydrated alcohol, dry up stand-by;
Step 4, solution A described in step 1 is placed in to electrolyzer as electrolytic solution, two copper matrixes after drying up in step 3 are inserted in electrolytic solution, and as anode, be connected with the positive and negative electrode of direct supply with negative electrode respectively, regulating two copper matrixes is 30mm over against the distance between parallel placement and two copper matrixes, open direct supply, electrolysis 20s under the condition that is 5V at voltage;
Step 5, the anode copper matrix after electrolysis in step 4 is rinsed well with distilled water and dehydrated alcohol successively, then solution B described in step 2 is evenly applied in to the anode copper matrix surface after rinsing well, dry, obtain having the copper matrix of super hydrophobic surface.
Embodiment 2
Step 1, by 0.56g potassium hydroxide and 1.35g Potassium Persulphate powder dissolution in distilled water, be settled to 100mL, after stirring, obtaining concentration of potassium hydroxide is 0.1mol/L, the solution A that Potassium Persulphate concentration is 0.05mol/L;
Step 2, the TETRADECONIC ACID of 2.28g is dissolved in dehydrated alcohol, is settled to 100mL, after stirring, obtain the solution B that TETRADECONIC ACID concentration is 0.1mol/L;
Step 3, the copper matrix liquid honing that is 50mm * 25mm * 1.5mm by two piece sizes, to remove the zone of oxidation of copper matrix surface, then rinse two copper matrixes after polishing well successively with distilled water and dehydrated alcohol, dry up stand-by;
Step 4, solution A described in step 1 is placed in to electrolyzer as electrolytic solution, two copper matrixes after drying up in step 3 are inserted in electrolytic solution, and as anode, be connected with the positive and negative electrode of direct supply with negative electrode respectively, regulating two copper matrixes is 30mm over against the distance between parallel placement and two copper matrixes, open direct supply, electrolysis 50s under the condition that is 5V at voltage;
Step 5, the anode copper matrix after electrolysis in step 4 is rinsed well with distilled water and dehydrated alcohol successively, then solution B described in step 2 is evenly applied in to the anode copper matrix surface after rinsing well, dry, obtain having the copper matrix of super hydrophobic surface.
Fig. 1 is the scanning electron microscope (SEM) photograph of the super hydrophobic surface prepared of the present embodiment, as can be seen from the figure, on substrate surface, stochastic distribution sparse tiny flocculent structure, and these cotton-shaped clusters form a complicated coarse structure, and this has greatly increased the ability of stored air.This structure is combined with the TETRADECONIC ACID of low surface energy, thereby has realized the ultra-hydrophobicity of copper matrix surface.
Embodiment 3
Step 1, by 0.168g potassium hydroxide and 2.7g Potassium Persulphate powder dissolution in distilled water, be settled to 100mL, after stirring, obtaining concentration of potassium hydroxide is 0.03mol/L, the solution A that Potassium Persulphate concentration is 0.1mol/L;
Step 2, the TETRADECONIC ACID of 0.228g is added in dehydrated alcohol, be settled to 100mL, after stirring, obtain the solution B that TETRADECONIC ACID concentration is 0.01mol/L;
Step 3, the copper matrix liquid honing that is 50mm * 25mm * 1.5mm by two piece sizes, to remove the zone of oxidation of copper matrix surface, then rinse two copper matrixes after polishing well successively with distilled water and dehydrated alcohol, dry up stand-by;
Step 4, solution A described in step 1 is placed in to electrolyzer as electrolytic solution, two copper matrixes after drying up in step 3 are inserted in electrolytic solution, and as anode, be connected with the positive and negative electrode of direct supply with negative electrode respectively, regulating two copper matrixes is 25mm over against the distance between parallel placement and two copper matrixes, open direct supply, electrolysis 90s under the condition that is 5V at voltage;
Step 5, the anode copper matrix after electrolysis in step 4 is rinsed well with distilled water and dehydrated alcohol successively, then solution B described in step 2 is evenly applied in to the anode copper matrix surface after rinsing well, dry, obtain having the copper matrix of super hydrophobic surface.
Embodiment 4
Step 1, by 1.12g potassium hydroxide and 0.945g Potassium Persulphate powder dissolution in distilled water, be settled to 100mL, after stirring, obtaining concentration of potassium hydroxide is 0.2mol/L, the solution A that Potassium Persulphate concentration is 0.035mol/L;
Step 2, the TETRADECONIC ACID of 9.12g is added in dehydrated alcohol, be settled to 100mL, after stirring, obtain the solution B that TETRADECONIC ACID concentration is 0.4mol/L;
Step 3, the copper matrix liquid honing that is 50mm * 25mm * 1.5mm by two piece sizes, to remove the zone of oxidation of copper matrix surface, then rinse two copper matrixes after polishing well successively with distilled water and dehydrated alcohol, dry up stand-by;
Step 4, solution A described in step 1 is placed in to electrolyzer as electrolytic solution, two copper matrixes after drying up in step 3 are inserted in electrolytic solution, and as anode, be connected with the positive and negative electrode of direct supply with negative electrode respectively, regulating two copper matrixes is 35mm over against the distance between parallel placement and two copper matrixes, open direct supply, electrolysis 120s under the condition that is 5V at voltage;
Step 5, the anode copper matrix after electrolysis in step 4 is rinsed well with distilled water and dehydrated alcohol successively, then solution B described in step 2 is evenly applied in to the anode copper matrix surface after rinsing well, dry, obtain having the copper matrix of super hydrophobic surface.
Embodiment 5
Step 1, by 0.56g potassium hydroxide and 1.35g Potassium Persulphate powder dissolution in distilled water, be settled to 100mL, after stirring, obtaining concentration of potassium hydroxide is 0.1mol/L, the solution A that Potassium Persulphate concentration is 0.05mol/L;
Step 2, the TETRADECONIC ACID of 2.28g is dissolved in dehydrated alcohol, is settled to 100mL, after stirring, obtain the solution B that TETRADECONIC ACID concentration is 0.1mol/L;
Step 3, the copper matrix liquid honing that is 50mm * 25mm * 1.5mm by two piece sizes, to remove the zone of oxidation of copper matrix surface, then rinse two copper matrixes after polishing well successively with distilled water and dehydrated alcohol, dry up stand-by;
Step 4, solution A described in step 1 is placed in to electrolyzer as electrolytic solution, two copper matrixes after drying up in step 3 are inserted in electrolytic solution, and as anode, be connected with the positive and negative electrode of direct supply with negative electrode respectively, regulating two copper matrixes is 30mm over against the distance between parallel placement and two copper matrixes, open direct supply, electrolysis 5s under the condition that is 10V at voltage;
Step 5, the anode copper matrix after electrolysis in step 4 is rinsed well with distilled water and dehydrated alcohol successively, then solution B described in step 2 is evenly applied in to the anode copper matrix surface after rinsing well, dry, obtain having the copper matrix of super hydrophobic surface.
Fig. 2 is the scanning electron microscope (SEM) photograph of the super hydrophobic surface prepared of the present embodiment, and as can be seen from the figure, its microtexture is too smooth, and this structure has increased the contact area on water droplet and copper coin surface, also makes its hydrophobic performance decline greatly.Yet this structure is further combined with the TETRADECONIC ACID of low surface energy, also realized the ultra-hydrophobicity of copper matrix surface.
Embodiment 6
Step 1, by 0.28g potassium hydroxide and 2.16g Potassium Persulphate powder dissolution in distilled water, be settled to 100mL, after stirring, obtaining concentration of potassium hydroxide is 0.05mol/L, the solution A that Potassium Persulphate concentration is 0.08mol/L;
Step 2, the TETRADECONIC ACID of 4.56g is added in dehydrated alcohol, be settled to 100mL, after stirring, obtain the solution B that TETRADECONIC ACID concentration is 0.2mol/L;
Step 3, the copper matrix liquid honing that is 50mm * 25mm * 1.5mm by two piece sizes, to remove the zone of oxidation of copper matrix surface, then rinse two copper matrixes after polishing well successively with distilled water and dehydrated alcohol, dry up stand-by;
Step 4, solution A described in step 1 is placed in to electrolyzer as electrolytic solution, two copper matrixes after drying up in step 3 are inserted in electrolytic solution, and as anode, be connected with the positive and negative electrode of direct supply with negative electrode respectively, regulating two copper matrixes is 35mm over against the distance between parallel placement and two copper matrixes, open direct supply, electrolysis 15s under the condition that is 10V at voltage;
Step 5, the anode copper matrix after electrolysis in step 4 is rinsed well with distilled water and dehydrated alcohol successively, then solution B described in step 2 is evenly applied in to the anode copper matrix surface after rinsing well, dry, obtain having the copper matrix of super hydrophobic surface.
Embodiment 7
Step 1, by 0.84g potassium hydroxide and 1.89g Potassium Persulphate powder dissolution in distilled water, be settled to 100mL, after stirring, obtaining concentration of potassium hydroxide is 0.15mol/L, the solution A that Potassium Persulphate concentration is 0.07mol/L;
Step 2, the TETRADECONIC ACID of 3.42g is added in dehydrated alcohol, be settled to 100mL, after stirring, obtain the solution B that TETRADECONIC ACID concentration is 0.15mol/L;
Step 3, the copper matrix liquid honing that is 50mm * 25mm * 1.5mm by two piece sizes, to remove the zone of oxidation of copper matrix surface, then rinse two copper matrixes after polishing well successively with distilled water and dehydrated alcohol, dry up stand-by;
Step 4, solution A described in step 1 is placed in to electrolyzer as electrolytic solution, two copper matrixes after drying up in step 3 are inserted in electrolytic solution, and as anode, be connected with the positive and negative electrode of direct supply with negative electrode respectively, regulating two copper matrixes is 28mm over against the distance between parallel placement and two copper matrixes, open direct supply, electrolysis 5s under the condition that is 15V at voltage;
Step 5, the anode copper matrix after electrolysis in step 4 is rinsed well with distilled water and dehydrated alcohol successively, then solution B described in step 2 is evenly applied in to the anode copper matrix surface after rinsing well, dry, obtain having the copper matrix of super hydrophobic surface.
The copper matrix with super hydrophobic surface to the embodiment of the present invention 1 to embodiment 7 preparation carries out contact angle detection, the results are shown in following table:
The contact angle of the copper matrix with super hydrophobic surface of table 1 embodiment 1 to embodiment 7 preparation
| Sample | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Embodiment 6 | Embodiment 7 |
| Contact angle (°) | 158 | 165 | 161 | 159 | 152 | 158 | 158 |
As can be seen from Table 1, adopt method of the present invention to prepare super hydrophobic surface on copper matrix, the contact angle on surface reaches more than 152 °, has greatly reduced the contact area of drop and matrix surface, thereby has further improved the performance such as not sticky, antifouling and anticorrosion of super hydrophobic surface.
The above; it is only preferred embodiment of the present invention; not the present invention is imposed any restrictions, every any simple modification of above embodiment being done according to the technology of the present invention essence, change and equivalent structure change, and all still belong in the protection domain of technical solution of the present invention.
Claims (3)
1. adopt water electrolysis liquid on copper matrix, to prepare an electrochemical method for super hydrophobic surface, it is characterized in that, the method comprises the following steps:
Step 1, potassium hydroxide and Potassium Persulphate are dissolved in distilled water, after stirring, obtain solution A; In described solution A, the concentration of potassium hydroxide is 0.1mol/L, and the concentration of Potassium Persulphate is 0.05mol/L;
Step 2, TETRADECONIC ACID is dissolved in dehydrated alcohol, after stirring, obtains solution B; In described solution B, the concentration of TETRADECONIC ACID is 0.01mol/L～0.4mol/L;
Step 3, by two copper matrix liquid honings, to remove the zone of oxidation of copper matrix surface, then by polishing after two copper matrixes with distilled water and dehydrated alcohol, rinse well successively, dry up stand-by;
Step 4, solution A described in step 1 is placed in to electrolyzer as electrolytic solution, two copper matrixes after drying up in step 3 are connected with the positive and negative electrode of direct supply with negative electrode as anode respectively, and to regulate two copper matrixes be 25mm～35mm over against the distance between parallel placement and two copper matrixes, open direct supply, electrolysis 5s～120s under the condition that is 5V～15V at voltage;
Step 5, the anode copper matrix after electrolysis in step 4 is rinsed well with distilled water and dehydrated alcohol successively, then solution B described in step 2 is evenly applied in to the anode copper matrix surface after rinsing well, dry, obtain having the copper matrix of super hydrophobic surface.
2. employing water electrolysis liquid according to claim 1 is prepared the electrochemical method of super hydrophobic surface on copper matrix, it is characterized in that, described in step 2, in solution B, the concentration of TETRADECONIC ACID is 0.1mol/L.
3. employing water electrolysis liquid according to claim 1 is prepared the electrochemical method of super hydrophobic surface on copper matrix, it is characterized in that, the distance described in step 4 between two copper matrixes is 30mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210203153.7A CN102691089B (en) | 2012-06-19 | 2012-06-19 | Electrochemical method for preparing superhydrophobic surface on copper substrates by using aqueous electrolyte |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210203153.7A CN102691089B (en) | 2012-06-19 | 2012-06-19 | Electrochemical method for preparing superhydrophobic surface on copper substrates by using aqueous electrolyte |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102691089A CN102691089A (en) | 2012-09-26 |
| CN102691089B true CN102691089B (en) | 2014-11-26 |
Family
ID=46856819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210203153.7A Expired - Fee Related CN102691089B (en) | 2012-06-19 | 2012-06-19 | Electrochemical method for preparing superhydrophobic surface on copper substrates by using aqueous electrolyte |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102691089B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102943246B (en) * | 2012-11-26 | 2014-10-29 | 四川材料与工艺研究所 | Method for preparing metal surface super-hydrophobicity aluminum coating |
| CN104345085A (en) * | 2013-08-01 | 2015-02-11 | 中国石油化工股份有限公司 | An electrolytic solution and uses thereof |
| CN103406248B (en) * | 2013-08-26 | 2016-01-06 | 武汉理工大学 | The preparation method of copper substrate superhydrophobic surface structure |
| CN105568327B (en) * | 2015-12-18 | 2018-06-29 | 西安科技大学 | A kind of electrochemical method for preparing copper dendrite super hydrophobic surface |
| CN107779848A (en) * | 2017-09-22 | 2018-03-09 | 浙江海洋大学 | It is a kind of to prepare super-hydrophobic and oleophobic surface method by replacing reaction on steel matrix surface |
| CN111218712B (en) * | 2020-01-09 | 2021-05-18 | 大连理工大学 | Preparation method of super-hydrophobic surface of electrolytic copper matrix |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101967663A (en) * | 2010-08-27 | 2011-02-09 | 中国科学院海洋研究所 | Method for preparing super-hydrophobic alloy film on surface of metal matrix |
| CN102140657A (en) * | 2011-02-24 | 2011-08-03 | 西北工业大学 | Method for preparing compressible micron/ nano-structured ultra-sparse coating |
| CN102140659A (en) * | 2011-02-24 | 2011-08-03 | 西北工业大学 | Method for preparing superhydrophobic film |
-
2012
- 2012-06-19 CN CN201210203153.7A patent/CN102691089B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101967663A (en) * | 2010-08-27 | 2011-02-09 | 中国科学院海洋研究所 | Method for preparing super-hydrophobic alloy film on surface of metal matrix |
| CN102140657A (en) * | 2011-02-24 | 2011-08-03 | 西北工业大学 | Method for preparing compressible micron/ nano-structured ultra-sparse coating |
| CN102140659A (en) * | 2011-02-24 | 2011-08-03 | 西北工业大学 | Method for preparing superhydrophobic film |
Non-Patent Citations (4)
| Title |
|---|
| A facile method for the fabrication of super-hydrophobic surface.A facile method for the fabrication of super-hydrophobic surfaces and their resulting wettability.《Scripta Materialia》.2008,第59卷第776页右栏最后1段至第778页左栏第1段. * |
| A facile method for the fabrication of super-hydrophobic surfaces and their resulting wettability;A facile method for the fabrication of super-hydrophobic surface;《Scripta Materialia》;20080620;第59卷;第776页右栏最后1段至第778页左栏第1段 * |
| A non-aqueous electrodeposition process for fabrication of superhydrophobic surface with hierarchical micro/nano structure;Limei Hao等;《Applied Surface Science》;20120601;第258卷;第8970页右栏最后1段至第8971页右栏最后1段 * |
| Limei Hao等.A non-aqueous electrodeposition process for fabrication of superhydrophobic surface with hierarchical micro/nano structure.《Applied Surface Science》.2012,第258卷第8970页右栏最后1段至第8971页右栏最后1段. * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102691089A (en) | 2012-09-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102691089B (en) | Electrochemical method for preparing superhydrophobic surface on copper substrates by using aqueous electrolyte | |
| CN104925791B (en) | A kind of graphene, its colloidal sol, powder and preparation method and preparation facilities | |
| CN106277228B (en) | A kind of method of high catalytic activity electrode preparation and its Electrocatalysis Degradation methyl blue | |
| CN105603492B (en) | A method of the electrochemical deposition silver nano-grain in Nano tube array of titanium dioxide | |
| CN103007965B (en) | Titanium-based carbon nanotube supported copper/palladium bimetallic catalyst and preparation method thereof | |
| CN105780087B (en) | The preparation method of Electric oxidative synthesis 1-dimention nano oxide structure | |
| CN104404566B (en) | A kind of to modify TiO 2nano-tube array is the ti-lead dioxide anode in middle layer and preparation method thereof and application | |
| CN108793339A (en) | A kind of novel high catalytic activity electrode prepares and its method of Electrocatalysis Degradation o-chlorphenol | |
| CN105986292B (en) | Preparation method of cobalt-nickel double-layer hydroxide modified titanium dioxide nanotube array and application of photoelectrochemical hydrolysis hydrogen production | |
| CN109082697B (en) | Preparation method of columnar copper particle film | |
| CN104313663B (en) | A kind of N, Ti3+The visible light catalytic TiO of codope2The preparation method of nano-tube array | |
| CN102703953B (en) | Method for preparing nanometer platinum/titanium dioxide nanotube electrode through cyclic voltammetry electrodeposition | |
| CN102041534B (en) | Method for simultaneously preparing two types of super-hydrophobic films by utilizing copper chloride | |
| CN104198560B (en) | A kind of preparation method of the porous silica titanium compound film of graphene modified | |
| CN108054390A (en) | A kind of method of modifying of efficiently and effectively graphite felt for vanadium cell | |
| CN105568327B (en) | A kind of electrochemical method for preparing copper dendrite super hydrophobic surface | |
| CN101974776A (en) | Method for preparing quantum dot film in a water phase through electrophoretic deposition | |
| CN105671523B (en) | A kind of displacement reaction method for preparing silver tree branch super hydrophobic surface | |
| CN106981650A (en) | A kind of preparation method of nanoscale bismuth with elementary | |
| CN108277520A (en) | The preparation method of hollow cube stannous chloride film | |
| CN108772054A (en) | A kind of titanium dioxide-pucherite composite photocatalyst material and preparation method thereof | |
| CN105112980A (en) | High-activity TiO2-NTs/PbO2-Y-Co3O4 modified electrode and method for electrocatalytic oxidation treatment of pharmaceutical wastewater with same | |
| CN102534719B (en) | Electrochemical method for preparing super-hydrophobic surface on copper substrate | |
| CN101570872B (en) | Method for growing upright three-dimensional netlike noble metal nano-plate on boron-doped diamond substrate | |
| CN106920971A (en) | A kind of cluster polyaniline nano fiber composite carbon electrode and preparation method and purposes |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141126 Termination date: 20150619 |
|
| EXPY | Termination of patent right or utility model |