CN102686039A - Vacuum distributed supply system of chip mounters - Google Patents
Vacuum distributed supply system of chip mounters Download PDFInfo
- Publication number
- CN102686039A CN102686039A CN2012101218885A CN201210121888A CN102686039A CN 102686039 A CN102686039 A CN 102686039A CN 2012101218885 A CN2012101218885 A CN 2012101218885A CN 201210121888 A CN201210121888 A CN 201210121888A CN 102686039 A CN102686039 A CN 102686039A
- Authority
- CN
- China
- Prior art keywords
- vacuum
- pipeline
- placement head
- compressed gas
- tracheae
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention discloses a vacuum distributed supply system of chip mounters. The vacuum distributed supply system of the chip mounters comprises a plurality of the chip mounters, a vacuum pump and an air compressor, wherein any chip mounter comprises a vacuum pick-up pipeline, a vacuum keeping pipeline and a compressed gas pipeline, a cantilever and a placement head, each placement head comprises a suction nozzle of the placement head, each placement head is arranged on the cantilever, the vacuum pick-up pipelines, the vacuum keeping pipelines and the compressed gas pipelines are selectively communicated with the suction nozzles of the placement heads, the air compressors are communicated with the compressed gas pipelines through compressed gas pipelines, and the vacuum pumps are communicated with the vacuum keeping pipelines and/or the vacuum pick-up pipelines through vacuum pipelines. The vacuum distributed supply system of the chip mounters can realize energy conservation and consumption reduction, improve production quality and prevent polluting produced products.
Description
Technical field
The present invention relates to the chip mounter technical field, relate in particular to the collecting and distributing supply system of a kind of chip mounter vacuum.
Background technology
Venturi effect is also claimed venturi effect.This phenomenon is with its finder, and Italian physicist's venturi (Giovanni Battista Venturi) is named.As shown in Figure 2; This effect is meant near swiftly flowing gas can produce low pressure, thereby produces suction-operated, in view of the above; People develop vacuum generator; Be to utilize the malleation source of the gas to produce a kind of novel, efficient, the cleaning of negative pressure, economic vacuum components and parts, this makes is having compressed-air actuated place, or in a pneumatic system, needs the place of positive negative pressure to obtain that negative pressure becomes very easily simultaneously and convenient.The conventional use of vacuum generator is that sucker cooperates, and carries out the absorption of various materials, carrying, be particularly suitable for adsorbing frangible, softness, thin non-iron, nonmetallic materials or ball-type object.
Vacuum generator utilizes above principle to produce vacuum exactly.Currently marketed chip mounter uses air compressor to produce Compressed Gas, uses Compressed Gas to be blown into vacuum generator and produces vacuum, carries out picking up of material and paster through the switching of positive negative-pressure gas.
In picking machine system, for improving paster efficient, placement head is provided with a plurality of material suction nozzles, realizes a plurality of materials of disposable absorption, carrying and paster.But when placement head was drawn material, the suction nozzle of the material of drawing was connected moment with the external world, and gas entering placement head can cause other suction nozzle vacuum reductions on the placement head, the material slippage occurred or fell, and influenced the paster quality.For preventing this phenomenon, in chip mounter, designed two and overlapped independently vacuum pipe.One of which, the vacuum pick pipeline is used for drawing material; Its two, vacuum keeps pipeline, is used for ensureing the not slippage of material on other suction nozzles or falling.Current generation vacuum is to keep on the pipeline vacuum generator being set respectively picking up pipeline and vacuum, produces vacuum.This method prepares vacuum, and is very big to power consumption.Also there is at present water ring vacuum pump of independent usefulness to keep the loop that vacuum is provided for separate unit chip mounter vacuum, but because not energy-conservation, and forms aqueous reflux in the vacuum pump head of replying to the topic easily and cause accident, so can't promote.
Through material is drawn and carrying, chip mounter is checked material, when material is audited and found correct, material is carried out the rectification of position, and carries out paster; When improper phenomenon appears in material, carry out material casting.When paster or material casting; Through air blowing electromagnetically operated valve and the action of piston switching valve, the placement head suction nozzle is connected with the compressed air piping of air compressor, realizes the conversion of vacuum and Compressed Gas; And apply with strength to material; Make material be fitted on the circuit board, accomplish paster, or material is blown in the material casting box.
Yet current chip mounter has the problem of following two aspects to need to solve: one of which, and current chip mounter prepares vacuum through air compressor machine and vacuum generator, and its vacuum producing method air consumption is big, thereby the big shortcoming of power consumption is arranged; And owing in the compressed air You Heshui is arranged, make placement head inside dirty easily, influence the paster quality, also be easy to generate mechanical disorder.Its two, like direct use water ring vacuum pump the separate unit chip mounter is prepared vacuum, because vacuum degree is not high enough; Can only prepare vacuum and keep the required vacuum of pipeline; Can't prepare the required vacuum of vacuum pick pipeline, under the situation that vacuum pump does not start, produce vacuum owing to the vacuum generator on the chip mounter vacuum pick pipeline is first in the chip mounter startup; Can the water in the vacuum pump be sucked chip mounter, chip mounter is caused damage.
In view of this, provide that a kind of energy consumption is low, production process is safer, the collecting and distributing supply system of chip mounter vacuum that can not produce greasy dirt necessitates.
Summary of the invention
The purpose of this invention is to provide the collecting and distributing supply system of a kind of chip mounter vacuum,, realize saving energy and reduce the cost, do not produce greasy dirt, improve the production quality through the transformation of system.
To achieve these goals; The collecting and distributing supply system of a kind of chip mounter vacuum; Comprise many chip mounters, vacuum pump and air compressor, any said chip mounter has included the vacuum pick pipeline, vacuum keeps pipeline and Compressed Gas pipeline, cantilever and placement head, and said placement head includes the placement head suction nozzle; Said placement head is arranged on the cantilever; Said vacuum pick pipeline, vacuum keep pipeline and Compressed Gas pipeline selectivity to be communicated with the placement head suction nozzle, and said air compressor is connected with said Compressed Gas pipeline through the Compressed Gas pipeline, and said vacuum pump keeps pipeline and/or vacuum pick pipeline to be connected through vacuum line and said vacuum.
The collecting and distributing supply system of said chip mounter vacuum also includes and is used for dividing the gas flow distribution plate into pipeline with gas.
Said placement head also includes air blowing electromagnetically operated valve and piston switching valve; Said vacuum pick pipeline comprises pickup loops vacuum tube and pickup loops vacuum detecting pipe; Said vacuum keeps pipeline to comprise and keeps loop vacuum tube and maintenance loop vacuum detecting pipe, and said Compressed Gas pipeline comprises paster tracheae and material casting tracheae.
Said maintenance loop vacuum detecting pipe, maintenance loop vacuum tube, pickup loops vacuum tube, pickup loops vacuum detecting pipe and said vacuum pump pipeline connection; Said paster tracheae and material casting tracheae and said air compressor pipeline connection; Said paster tracheae and pickup loops vacuum tube optionally are communicated with said placement head suction nozzle through air blowing electromagnetically operated valve and piston switching valve; Said material casting tracheae optionally is communicated with said placement head suction nozzle through air blowing electromagnetically operated valve and piston switching valve with maintenance loop vacuum tube.
Said pickup loops also includes the pickup loops blast pipe, and said paster tracheae and material casting tracheae are communicated with said air compressor pipeline; Said maintenance loop vacuum detecting pipe is communicated with said vacuum pump with maintenance loop vacuum tube; The vacuum of said pickup loops vacuum tube, pickup loops vacuum detecting pipe prepares the high speed Compressed Gas by air compressor, and the high speed Compressed Gas is made through vacuum generator; Said paster tracheae and pickup loops vacuum tube optionally are communicated with said placement head suction nozzle through air blowing electromagnetically operated valve and piston switching valve; Said material casting tracheae optionally is communicated with said placement head suction nozzle through air blowing electromagnetically operated valve and piston switching valve with maintenance loop vacuum tube.
With present compared with techniques; The collecting and distributing supply system of a kind of chip mounter vacuum provided by the invention; It is realized many chip mounter supply vacuum and Compressed Gas through vacuum pump and air compressor; Through reducing a large amount of losses that prepare vacuum with Compressed Gas, reduced the consumption of electric power, avoid the greasy dirt or the water stain paster quality that influences chip mounter that cause by air compressor.Through increasing surge tank, prevent fluid reflux at the vacuum pump end.The present invention has practiced thrift energy consumption, has reduced production cost, has avoided the pollution of the product that current chip mounter causes, and the present invention is significant.
Description of drawings
Accompanying drawing is used for further understanding of the present invention, and constitutes the part of specification, is used to explain the present invention with embodiments of the invention, is not construed as limiting the invention.In the accompanying drawings:
Fig. 1 is existing chip mounter pipeline sketch map;
Fig. 2 is the vacuum generator principle schematic;
Fig. 3 is the vacuum generator structural representation;
Fig. 4 is existing chip mounter pipeline module map;
Fig. 5 is the collecting and distributing supply system pipeline of an a kind of chip mounter vacuum provided by the invention sketch map;
The structural representation of the vacuum generator of Fig. 6 after for the repacking that provides of the collecting and distributing supply system of a kind of chip mounter vacuum shown in Figure 5;
Fig. 7 is the collecting and distributing supply system pipeline of an another kind of chip mounter vacuum provided by the invention sketch map;
Fig. 8 is the placement head structural representation;
Fig. 9 is that placement head shown in Figure 8 splits structural representation;
Figure 10 is the collecting and distributing supply system vacuum of a kind of chip mounter vacuum supply module figure shown in Figure 7;
Figure 11 is the interior pipeline module map of the collecting and distributing supply system chip mounter of a kind of chip mounter vacuum shown in Figure 7;
Figure 12 is a kind of air distributor structural representation provided by the invention;
Figure 13 is a piston switching valve structural representation shown in Figure 9;
Figure 14 is a piston structure sketch map shown in Figure 13;
Figure 15 is the user mode sketch map that piston switching valve shown in Figure 13 is communicated with vacuum;
Figure 16 is the user mode sketch map that piston switching valve shown in Figure 13 is communicated with Compressed Gas.
Embodiment
Specify the present invention below in conjunction with accompanying drawing, it explains principle of the present invention as the part of this specification through embodiment, other aspects of the present invention, and characteristic and advantage thereof will become very clear through this detailed description.
Shown in Fig. 5～12; The present invention provides a kind of chip mounter vacuum collecting and distributing supply system; Comprise many chip mounters, vacuum pump 6 and air compressor 1; Any said chip mounter has included the vacuum pick pipeline, vacuum keeps pipeline and Compressed Gas pipeline, cantilever and placement head 7; Said placement head 7 includes placement head suction nozzle, air blowing electromagnetically operated valve 53 and piston switching valve 701, and said placement head 7 is arranged on the cantilever, and said vacuum pick pipeline, vacuum keep pipeline and Compressed Gas pipeline selectivity to be communicated with the placement head suction nozzle; Said air compressor 1 is connected with said Compressed Gas pipeline through the Compressed Gas pipeline, and said vacuum pump keeps pipeline and/or vacuum pick pipeline to be connected through vacuum line and said vacuum.
Like Fig. 1,4～5,7, shown in 10～11, the present invention has reduced energy resource consumption through 1 pair of many chip mounters supply vacuum of vacuum pump 6 and air compressor and Compressed Gas, has practiced thrift production cost.Compare prior art; The collecting and distributing supply system of a kind of chip mounter vacuum provided by the invention, it is concentrated through vacuum pump 6 vacuum is provided, and is distributed to each chip mounter of workshop through vacuum line; Changed the chip mounter gas circuit structure simultaneously, made chip mounter can directly use the vacuum of vacuum pump supply.Prepare the air supply of vacuum loss through saving chip mounter, the use amount of saving air compressor machine, thus save electric power.For example, be example with 10 Siemens's chip mounter production lines (2 D4 model high speed placement system+1 D1 model multifunctional patch machines), normally need to use 2 75KW air compressor machines; After using new departure; Increase by 1 5KW vacuum machine, only, be equivalent to per hour save 70KW electric power with using 1 75KW air compressor machine.
Like Fig. 1,5,7, shown in 12, said chip mounter gas circuit includes and is used for dividing the gas flow distribution plate 11 into pipeline with Compressed Gas.Cantilever of the present invention, it comprises the anterior flow distribution plate 2 of cantilever, cantilever middle part flow distribution plate 3, and cantilever rear portion flow distribution plate 4.Compressed Gas is through gas flow distribution plate 11; Tell two Compressed Gas pipelines to each cantilever; Wherein a pipeline is communicated with pipeline a, b, c through the anterior flow distribution plate 2 of cantilever, and another pipeline is communicated with pipeline d, e, f through the anterior flow distribution plate 2 of cantilever, and pipeline g is a backup line.Seven pipelines of a～f are behind the flow distribution plate 3 of cantilever middle part, and flow distribution plate 4 converges respectively through the cantilever rear portion again.Wherein to converge be a pipeline to five pipelines of a～e, and Compressed Gas is blown into vacuum generator 51, produces vacuum, gets into to keep loop vacuum tube 72 and keep loop vacuum detecting pipe 71; E, two pipelines of f converge is a pipeline, and Compressed Gas is blown into vacuum generator 52, produce vacuum, get into pickup loops vacuum tube 75 and pickup loops vacuum detecting pipe 76; Converging at e, two pipelines of f is a pipeline, when Compressed Gas is blown into vacuum generator 52, tells a Compressed Gas pipeline and gets into air blowing electromagnetically operated valve 53, gets into paster tracheae 77 and material casting tracheae 78.
Like Fig. 5, shown in 7; Said placement head also includes air blowing electromagnetically operated valve 53 and piston switching valve 701; Said vacuum pick pipeline comprises pickup loops vacuum tube 75 and pickup loops vacuum detecting pipe 76; Said vacuum keeps pipeline to comprise and keeps loop vacuum tube 72 and maintenance loop vacuum detecting pipe 71, and said Compressed Gas pipeline comprises paster tracheae 77 and material casting tracheae 78.
As a kind of preferred version, like Fig. 5, shown in 6, said maintenance loop vacuum detecting pipe 71, maintenance loop vacuum tube 72, pickup loops vacuum tube 75, pickup loops vacuum detecting pipe 76 and said vacuum pump 6 pipeline connections; Said paster tracheae 77 and material casting tracheae 78 and said air compressor pipeline connection; Said paster tracheae 77 optionally is communicated with said placement head suction nozzle through air blowing electromagnetically operated valve 53 and piston switching valve 701 with pickup loops vacuum tube 75; Said material casting tracheae 78 optionally is communicated with said placement head suction nozzle through air blowing electromagnetically operated valve 53 and piston switching valve 701 with maintenance loop vacuum tube 72.
As a kind of preferred version, like Fig. 7,10, shown in 11, said pickup loops also includes pickup loops blast pipe 74, and said paster tracheae 77 is communicated with said air compressor pipeline with material casting tracheae 78; Said maintenance loop vacuum detecting pipe 71 is communicated with said vacuum pump 6 with maintenance loop vacuum tube 72; The vacuum of said pickup loops vacuum tube 75, pickup loops vacuum detecting pipe 76 prepares the high speed Compressed Gas by air compressor, and the high speed Compressed Gas is made through vacuum generator 52; Said paster tracheae 77 optionally is communicated with said placement head suction nozzle through air blowing electromagnetically operated valve 53 and piston switching valve 701 with pickup loops vacuum tube 75; Said material casting tracheae 78 optionally is communicated with said placement head suction nozzle through air blowing electromagnetically operated valve 53 and piston switching valve 701 with maintenance loop vacuum tube 72.
Shown in Fig. 1～4, a kind of gas method of supplying that existing Siemens chip mounter uses.Every Siemens's chip mounter has one or more cantilevers, and the structure of each cantilever is identical with function, and the Siemens's high speed placement system in this example has four cantilevers.It provides Compressed Gas through air compressor 1; Via gas flow distribution plate 11; Tell two Compressed Gas pipelines to each cantilever; Wherein a pipeline is communicated with pipeline a, b, c through the anterior flow distribution plate 2 of cantilever, and another pipeline is communicated with pipeline d, e, f through the anterior flow distribution plate 2 of cantilever, and pipeline g is a backup line.Seven pipelines of a～f are behind the flow distribution plate 3 of cantilever middle part, and flow distribution plate 4 converges through the cantilever rear portion again.Wherein to converge be a pipeline to five pipelines of a～e, and Compressed Gas is blown into vacuum generator 51, produces vacuum, gets into to keep loop vacuum tube 72 and keep loop vacuum detecting pipe 71, supplies vacuum to keep the loop to use; E, two pipelines of f converge is a pipeline, and Compressed Gas is blown into vacuum generator 52, produce vacuum, get into pickup loops vacuum tube 75 and pickup loops vacuum detecting pipe 76, supply the vacuum pick loop to use; Converging at e, two pipelines of f is a pipeline, when Compressed Gas is blown into vacuum generator 52, tells a Compressed Gas pipeline and gets into air blowing electromagnetically operated valve 53, feeds paster tracheae 77 and material casting tracheae 78, supplies paster and material casting use.Keep loop vacuum detecting pipe 71 and pickup loops vacuum detecting pipe 76 to interlink respectively with the vacuum detecting circuit board, the key-course that it detects vacuum degree and feeds back to chip mounter.Keep loop vacuum tube 72,, be connected with the suction nozzle that is in the holding position on the placement head 7 via piston switching valve 701; Pickup loops vacuum tube 75 via piston switching valve 701, is connected with the suction nozzle that is in take-off location on the placement head 7.
Like Fig. 5, shown in 6, the collecting and distributing supply system of a kind of chip mounter vacuum provided by the invention, it passes through to increase vacuum pump 6, and the chip mounter internal duct is transformed, and reduces air compressor 1 consumption.Its transformation comprises through flow distribution plate 11 to be introduced the vacuum that vacuum pump 6 produces through vacuum line; And tell two vacuum lines to each cantilever; Wherein a pipeline is communicated with pipeline a, b, c through the anterior flow distribution plate 2 of cantilever, and another pipeline is communicated with pipeline d, e through the anterior flow distribution plate 2 of cantilever.Five vacuum pipes of a～e are through cantilever middle part flow distribution plate 3, and behind cantilever rear portion flow distribution plate 4, converging is a vacuum pipe, keep return to be communicated with vacuum.Vacuum keeps the needed vacuum in loop just directly to be provided by vacuum pump 6 like this.Remove the Venturi nozzle 54 in the vacuum generator 51 this moment, and sealing vacuum generator 51 exhaust outlets, vacuum generator 51 is used as common connecting tube.The compressed air that air compressor 1 provides via air distributor 11, is told a Compressed Gas pipeline to each cantilever, is communicated with pipeline f, g through the anterior flow distribution plate 2 of cantilever.F, two compressed air pipings of g are through cantilever middle part flow distribution plate 3, and behind cantilever rear portion flow distribution plate 4, converging is a Compressed Gas pipeline, are blown into vacuum generator 52 and produce vacuum, provide pickup loops needed vacuum; This pipeline is drawn a Compressed Gas pipeline to the electromagnetically operated valve 53 of blowing when being blown into vacuum generator 52, through electromagnetically operated valve 53 actions, material casting is provided and pastes the needed barotropic gas of material.
This kind modification scheme provided by the present invention; It is only revised a～e pipeline and directly by vacuum pump vacuum is provided; Can realize saving the air compressor machine electric energy loss and be about 58%, and the vacuum of the barotropic gas of pipeline f～g and generation thereof is connected with the Compressed Gas pipeline and the pickup loops pipeline of chip mounter respectively.This technical scheme provided by the invention, structure of modification is few, and high efficiency has very important significance.
Like Fig. 7,10, shown in 11, another kind of embodiment provided by the invention, it has done improvement basically further technique scheme, and saves a double-venturi nozzle vacuum generator 5.Pipeline improves and is specially, and only provides placement head 7 desired compression gases through pipeline g, is communicated with air compressor machine 1; Pipeline a～f all is connected with vacuum pump 6, and a～e pipeline directly is communicated with keeping return, and f is connected with pickup loops.Save a vacuum generator 5 through this programme chip mounter, more can use the air compressor machine power-saving to reach more than 70%, practiced thrift production cost greatly and simplified production technology.
Like Fig. 9, shown in 13～16, gas piping of the present invention is that placement head 7 provides vacuum and Compressed Gas, and wherein the Compressed Gas pipeline comprises paster tracheae 77 and material casting tracheae 78, and vacuum pipe comprises that vacuum keeps return and vacuum pick return.Placement head 7 comprises placement head body 70, and placement head body 70 is provided with piston switching valve 701.Piston switching valve 701 comprises piston 7012 and switches chamber 7011.Include 3 pore pore one 7011a, pore two 7011b and pore three 7011c on the said switching chamber 7011, wherein pore one 7011a is communicated with vacuum pipe, and pore two 7011b are communicated with the Compressed Gas pipeline, and pore three 7011c are connected with the placement head suction nozzle.Piston 7012 through switching in the chamber 7011 moves, and pore three 7011c optionally are communicated with pore one 7011a and pore two 7011b.Shown in figure 15, when piston 7012 was moved to pore one 7011a and pore three 7011c connection, the 7011b hole was closed, and realized picking up or keeping material; Shown in figure 16, when pore two 7011b and pore three 7011c connection, the 7011a hole is closed, and realizes paster or material casting.
Above disclose be merely preferred embodiment of the present invention, can not limit the present invention's interest field certainly with this, the equivalent variations of therefore doing according to claim of the present invention still belongs to the scope that the present invention is contained.
Claims (5)
1. collecting and distributing supply system of chip mounter vacuum; Comprise many chip mounters, vacuum pump and air compressor; Any said chip mounter has included the vacuum pick pipeline, vacuum keeps pipeline and Compressed Gas pipeline, cantilever and placement head, and said placement head includes the placement head suction nozzle
Said placement head is arranged on the cantilever,
Said vacuum pick pipeline, vacuum keep pipeline and Compressed Gas pipeline selectivity to be communicated with the placement head suction nozzle, it is characterized in that:
Said air compressor is connected with said Compressed Gas pipeline through the Compressed Gas pipeline, and said vacuum pump keeps pipeline and/or vacuum pick pipeline to be connected through vacuum line and said vacuum.
2. the collecting and distributing supply system of a kind of chip mounter vacuum according to claim 1 is characterized in that: the collecting and distributing supply system of said chip mounter vacuum also includes and is used for dividing the gas flow distribution plate into pipeline with gas.
3. the collecting and distributing supply system of a kind of chip mounter vacuum according to claim 1 and 2 is characterized in that:
Said placement head also includes air blowing electromagnetically operated valve and piston switching valve,
Said vacuum pick pipeline comprises pickup loops vacuum tube and pickup loops vacuum detecting pipe,
Said vacuum keeps pipeline to comprise maintenance loop vacuum tube and keeps loop vacuum detecting pipe,
Said Compressed Gas pipeline comprises paster tracheae and material casting tracheae.
4. the collecting and distributing supply system of a kind of chip mounter vacuum according to claim 3 is characterized in that:
Said maintenance loop vacuum detecting pipe, maintenance loop vacuum tube, pickup loops vacuum tube, pickup loops vacuum detecting pipe and said vacuum pump pipeline connection;
Said paster tracheae and material casting tracheae and said air compressor pipeline connection;
Said paster tracheae and pickup loops vacuum tube optionally are communicated with said placement head suction nozzle through air blowing electromagnetically operated valve and piston switching valve;
Said material casting tracheae optionally is communicated with said placement head suction nozzle through air blowing electromagnetically operated valve and piston switching valve with maintenance loop vacuum tube.
5. the collecting and distributing supply system of a kind of chip mounter vacuum according to claim 3 is characterized in that:
Said pickup loops also includes the pickup loops blast pipe,
Said paster tracheae and material casting tracheae are communicated with said air compressor pipeline;
Said maintenance loop vacuum detecting pipe is communicated with said vacuum pump with maintenance loop vacuum tube,
The vacuum of said pickup loops vacuum tube, pickup loops vacuum detecting pipe prepares the high speed Compressed Gas by air compressor, and the high speed Compressed Gas is made through vacuum generator;
Said paster tracheae and pickup loops vacuum tube optionally are communicated with said placement head suction nozzle through air blowing electromagnetically operated valve and piston switching valve;
Said material casting tracheae optionally is communicated with said placement head suction nozzle through air blowing electromagnetically operated valve and piston switching valve with maintenance loop vacuum tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101218885A CN102686039A (en) | 2012-04-23 | 2012-04-23 | Vacuum distributed supply system of chip mounters |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101218885A CN102686039A (en) | 2012-04-23 | 2012-04-23 | Vacuum distributed supply system of chip mounters |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102686039A true CN102686039A (en) | 2012-09-19 |
Family
ID=46817196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101218885A Pending CN102686039A (en) | 2012-04-23 | 2012-04-23 | Vacuum distributed supply system of chip mounters |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102686039A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105323976A (en) * | 2014-07-30 | 2016-02-10 | 上海儒竞电子科技有限公司 | Pneumatic system device |
| CN107592750A (en) * | 2016-07-09 | 2018-01-16 | 重庆霖萌电子科技有限公司 | A kind of compressed air manual pasting machine system |
| CN111050490A (en) * | 2020-01-02 | 2020-04-21 | 四川恒立泰科技有限公司 | Smt chip mounter suction nozzle station with detection function and detection method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4971554A (en) * | 1988-08-30 | 1990-11-20 | Semiconductor Equipment Corporation | Multi-nozzle surface mount rework system |
| CN101098618A (en) * | 2006-06-29 | 2008-01-02 | 北京航空航天大学 | High speed full-automatic paster machine array type mounting head |
| CN202663663U (en) * | 2012-04-23 | 2013-01-09 | 孙元 | Chip-mounter vacuum collection-distribution supply system |
-
2012
- 2012-04-23 CN CN2012101218885A patent/CN102686039A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4971554A (en) * | 1988-08-30 | 1990-11-20 | Semiconductor Equipment Corporation | Multi-nozzle surface mount rework system |
| CN101098618A (en) * | 2006-06-29 | 2008-01-02 | 北京航空航天大学 | High speed full-automatic paster machine array type mounting head |
| CN202663663U (en) * | 2012-04-23 | 2013-01-09 | 孙元 | Chip-mounter vacuum collection-distribution supply system |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105323976A (en) * | 2014-07-30 | 2016-02-10 | 上海儒竞电子科技有限公司 | Pneumatic system device |
| CN105323976B (en) * | 2014-07-30 | 2018-02-16 | 上海儒竞电子科技有限公司 | A kind of pneumatic system device |
| CN107592750A (en) * | 2016-07-09 | 2018-01-16 | 重庆霖萌电子科技有限公司 | A kind of compressed air manual pasting machine system |
| CN111050490A (en) * | 2020-01-02 | 2020-04-21 | 四川恒立泰科技有限公司 | Smt chip mounter suction nozzle station with detection function and detection method thereof |
| CN111050490B (en) * | 2020-01-02 | 2020-12-04 | 四川恒立泰科技有限公司 | Smt chip mounter suction nozzle station with detection function and detection method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102686039A (en) | Vacuum distributed supply system of chip mounters | |
| CN202663663U (en) | Chip-mounter vacuum collection-distribution supply system | |
| CN201963526U (en) | Air compressor system capable of improving air supply effect | |
| CN203442476U (en) | Air-supply circulating system of air engine | |
| CN201921977U (en) | Vacuum suction system for vacuum molding | |
| CN111828839A (en) | Gas supply system with temperature control and humidification device for supplying compressed gas to pressure space | |
| CN202037092U (en) | Energy-saving coating machine | |
| CN202576589U (en) | Electrolytic vacuum ladle low-voltage ejector | |
| CN202655311U (en) | Glass surface cleaning device for production line of liquid crystal glass substrate | |
| CN104690036A (en) | Shell dust remover | |
| CN202901833U (en) | Compressed air system used for producing chemical fibers | |
| CN203624474U (en) | Steering, conveying and water-removing device for coated glass | |
| CN201428926Y (en) | Compression air and nitrogen integrating supply device of titanium sponge plant | |
| CN207483939U (en) | Blowing carding supplies cotton system | |
| CN202250106U (en) | Split pumping type wet concrete spraying machine | |
| CN204674897U (en) | A kind of gas circuit switching mechanism of rotatory vacuum case | |
| CN201202963Y (en) | Multi-head compressed air storing tank | |
| CN204892211U (en) | Special flush coater of plastic course | |
| CN204120945U (en) | explosion-proof industrial dust collector | |
| CN201014890Y (en) | Compressed air liquid removing device | |
| CN205836067U (en) | A kind of tablet machine negative-pressure vacuum system | |
| CN214626913U (en) | Energy-concerving and environment-protective type photovoltaic board washs dolly | |
| CN201065381Y (en) | High-pressure exhaust gas reclaiming device for bottle blowing machine | |
| CN202829015U (en) | Paper separation suction nozzle | |
| CN209423219U (en) | A kind of construction site depositing dust environmental protecting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| DD01 | Delivery of document by public notice |
Addressee: Sun Yuan Document name: Notification that Application Deemed to be Withdrawn |
|
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120919 |