CN102676985B - Preparation method of copper cemented layer on titanium alloy surface - Google Patents
Preparation method of copper cemented layer on titanium alloy surface Download PDFInfo
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- CN102676985B CN102676985B CN201210134157.4A CN201210134157A CN102676985B CN 102676985 B CN102676985 B CN 102676985B CN 201210134157 A CN201210134157 A CN 201210134157A CN 102676985 B CN102676985 B CN 102676985B
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Abstract
The invention discloses a preparation method of a copper cemented layer on a titanium alloy surface, and belongs to the technical field of surface modification of a metal material. The preparation method comprises the following steps of: holding a pretreated titanium alloy workpiece on a workpiece table of a glow ion metal cementation furnace; suspending a pure copper plate serving as a source electrode above the titanium alloy workpiece through a source electrode bracket; grounding a furnace shell serving as an anode; vacuuming the furnace chamber to ultimate vacuum, then introducing argon gas and sputtering and cleaning the workpiece in the furnace chamber; applying bias voltage to a workpiece electrode and the source electrode respectively to heat the workpiece electrode and the source electrode; and enabling copper atoms (groups) or ions obtained by argon ion bombardment to acceleratedly move to the titanium alloy surface under the action of an electric field, and preserving heat for certain time to obtain the copper cemented layer. According to the copper cemented layer prepared by the method, the antibacterial performance of the titanium alloy can be obviously improved.
Description
Technical field
The invention belongs to metal surface properties modification technical field, the preparation method who is specifically related to a kind of titanium alloy surface and oozes copper layer material.
Background technology
Environmental microorganism such as bacterium, fungi and virus etc. can cause the spread and epidemic of various diseases, and therefore research and the application of people to various anti-biotic materials paid close attention to widely.Antibacterialization of metallic substance is the brand-new problem that developed recently gets up.At present the research of antibacterial metallic materials is mainly concentrated on to anti-bacteria stainless steel aspect both at home and abroad, about the research of antibacterial titanium or titanium alloy material is seen in the also less of report.
Titanium alloy has excellent solidity to corrosion, mechanical property, and its range of application is extended to stationery sports goods from traditional aerospace field, as spectacle frame, wrist-watch, racket and artwork etc.Titanium alloy itself, without anti-microbial property, if can give its anti-microbial property, can further be expanded its application at civil area.Take into account the needs to titanium alloy body mechanical property and biocompatibility and anti-bacterial attachment performance, it is carried out to surface treatment is very necessary to adapt to apply widely.
Summary of the invention
The object of this invention is to provide a kind of preparation method of oozing copper layer that forms at titanium alloy surface, the copper layer that oozes obtaining has excellent anti-microbial property.
The present invention is achieved in that and it is characterized in that, the preparation method of oozing copper layer at titanium alloy surface is:
(1) titanium alloy workpiece pre-treatment: will use SiC waterproof abrasive paper that minute surface is polished, is polished to titanium alloy workpiece step by step after titanium alloy workpiece surface degreasing, then clean, be dried;
(2) titanium alloy workpiece 4 good pre-treatment is put in the work stage 8 of metallic glow ion cementation stove, and be connected with the negative electrode of workpiece utmost point power supply 12 by work stage 8, become the workpiece utmost point, by source electrode support 11, fine copper plate 3 is hung on again to the top of the titanium alloy workpiece 4 in furnace chamber 1, if itself and titanium alloy workpiece 4 are at a distance of 15mm～20mm, and by source electrode support 11, fine copper plate 3 is connected with the negative electrode of source electrode power supply 13, become source electrode, the anodic bonding of furnace shell 2 and workpiece utmost point power supply 12 and source electrode power supply 13, and ground connection;
(3) be 1 × 10 metallic glow ion cementation stove furnace chamber 1 inside degree of being evacuated
– 1pa, pass into flow and be the argon gas of 30sccm～35sccm to furnace chamber 1, make furnace chamber 1 internal gas pressure maintain 35Pa～45Pa, connect the cathode power of workpiece utmost point power supply 12, between anode and negative electrode, apply volts DS, in the time that workpiece utmost point temperature rises to 400 DEG C～600 DEG C, titanium alloy workpiece 4 is carried out to icon bombardment cleaning 20min～40min;
(4) by workpiece pole tension Tiao Zhi – 450V～– 500V, connect source electrode power supply 13, and by source voltage Tiao Zhi – 950V～– 1000V, source electrode temperature maintains 950 DEG C～1000 DEG C, workpiece utmost point temperature is controlled at 800 DEG C～850 DEG C, after insulation 2h～6h, disconnect source electrode power supply 13 and workpiece utmost point power supply 12, make titanium alloy workpiece 4 slow cooling to room temperature.
Advantage of the present invention and positively effect are that the copper layer that oozes of titanium alloy surface has good anti-bacterial attachment performance.
Brief description of the drawings
Fig. 1 is metallic glow ion cementation furnace structure schematic diagram;
Fig. 2 is the fluorescence micrograph that polishing titanium alloy workpiece surface bacteria adheres to;
Fig. 3 oozes the fluorescence micrograph that copper layer surface bacteria adheres to;
In figure: the furnace chamber of 1-metallic glow ion cementation stove; The furnace shell of 2-metallic glow ion cementation stove; 3-fine copper plate; 4-titanium alloy workpiece; 5-view port; 6-photoelectric thermometer; 7-be connected with pumped vacuum systems; 8-work stage; The furnace bottom of 9-metallic glow ion cementation stove; 10-be connected with inflation system; 11-source electrode support; 12-workpiece utmost point power supply; 13-source electrode power supply; 14-adhere to the single bacterium on titanium alloy workpiece surface.
Embodiment:
(1) workpiece that titanium alloy ti6al4v bar is cut into Φ 15mm × 3mm, as matrix, by using SiC waterproof abrasive paper that titanium alloy workpiece is polished step by step after the surface degreasing of titanium alloy workpiece 4, is polished to minute surface, then cleans, is dried;
(2) titanium alloy workpiece 4 good pre-treatment is put in the work stage 8 of metallic glow ion cementation stove, and be connected with the negative electrode of workpiece utmost point power supply 12 by work stage 8, become the workpiece utmost point, by source electrode support 11, fine copper plate 3 is hung on again to the top of the titanium alloy workpiece 4 in furnace chamber 1, make itself and titanium alloy workpiece 4 at a distance of 15mm, and by source electrode support 11, fine copper plate 3 is connected with the negative electrode of source electrode power supply 13, become source electrode, the anodic bonding of furnace shell 2 and workpiece utmost point power supply 12 and source electrode power supply 13, and ground connection;
(3) be 1 × 10 metallic glow ion cementation stove furnace chamber 1 inside degree of being evacuated
– 1pa, passes into flow and is the argon gas of 35sccm to furnace chamber 1, makes furnace chamber 1 internal gas pressure maintain 40Pa, connect the cathode power of workpiece utmost point power supply 12, between anode and negative electrode, apply volts DS, in the time that workpiece utmost point temperature rises to 500 DEG C, titanium alloy workpiece 4 is carried out to icon bombardment cleaning 30min;
(4) by workpiece pole tension Tiao Zhi – 475V, connect source electrode power supply 13, and by source voltage Tiao Zhi – 975V.Source electrode temperature maintains 975 DEG C, and workpiece utmost point temperature is controlled at 825 DEG C, after insulation 4h, disconnects source electrode power supply 13 and workpiece utmost point power supply 12, makes titanium alloy workpiece 4 slow cooling to room temperature.
Under above-mentioned processing condition, can titanium alloy surface prepare there is excellent anti-bacterial attachment performance ooze copper layer.As shown in Figure 2, polishing titanium alloy surface is stained with a large amount of bacteriums, and Fig. 3 shows there is no bacterial adhesion through the titanium alloy surface that oozes copper.
Claims (2)
1. titanium alloy surface oozes a preparation method for copper layer, it is characterized in that: comprise the following steps:
(1) titanium alloy workpiece pre-treatment: will use SiC waterproof abrasive paper that minute surface is polished, is polished to titanium alloy workpiece step by step after titanium alloy workpiece surface degreasing, then clean, be dried;
(2) titanium alloy workpiece (4) good pre-treatment is put in the work stage (8) of metallic glow ion cementation stove, and be connected with the negative electrode of workpiece utmost point power supply (12) by work stage (8), become the workpiece utmost point, by source electrode support (11), fine copper plate (3) is hung on again to the top of the titanium alloy workpiece (4) in furnace chamber (1), if itself and titanium alloy workpiece (4) are at a distance of 15 mm～20 mm, and by source electrode support (11), fine copper plate (3) is connected with the negative electrode of source electrode power supply (13), become source electrode, the anodic bonding of furnace shell (2) and workpiece utmost point power supply (12) and source electrode power supply (13), and ground connection,
(3) be 1 × 10 metallic glow ion cementation stove furnace chamber (1) inside degree of being evacuated
– 1pa, pass into flow and be the argon gas of 30 sccm～35 sccm to furnace chamber (1), make furnace chamber (1) internal gas pressure maintain 35 Pa～45 Pa, connect the cathode power of workpiece utmost point power supply (12), between anode and negative electrode, apply volts DS, in the time that workpiece utmost point temperature rises to 400 DEG C～600 DEG C, titanium alloy workpiece (4) is carried out to icon bombardment cleaning 20 min～40 min;
(4) by workpiece pole tension Tiao Zhi – 450 V～– 500 V, connect source electrode power supply (13), and by source voltage Tiao Zhi – 950 V～– 1000 V, source electrode temperature maintains 950 DEG C～1000 DEG C, workpiece utmost point temperature is controlled at 800 DEG C～850 DEG C, after being incubated 2 h～6 h, disconnect source electrode power supply (13) and workpiece utmost point power supply (12), make titanium alloy workpiece (4) slow cooling to room temperature.
2. the preparation method that a kind of titanium alloy surface according to claim 1 oozes copper layer, is characterized in that: described titanium alloy workpiece is Ti6Al4V.
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| CN201210134157.4A CN102676985B (en) | 2012-05-03 | 2012-05-03 | Preparation method of copper cemented layer on titanium alloy surface |
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| CN201210134157.4A CN102676985B (en) | 2012-05-03 | 2012-05-03 | Preparation method of copper cemented layer on titanium alloy surface |
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| CN102676985A CN102676985A (en) | 2012-09-19 |
| CN102676985B true CN102676985B (en) | 2014-07-30 |
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| CN103243306B (en) * | 2013-05-10 | 2015-01-14 | 太原理工大学 | Method for preparing Cu doped TiN alloy layer on surface of titanium alloy |
| CN104630720B (en) * | 2015-01-22 | 2017-08-11 | 中联西北工程设计研究院有限公司 | A kind of processing method of anti-corrosion P110 steel bushings pipe joint |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101880860A (en) * | 2010-05-29 | 2010-11-10 | 太原理工大学 | Preparation method of stainless steel surface copper-silver diffusion coating layer |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101880860A (en) * | 2010-05-29 | 2010-11-10 | 太原理工大学 | Preparation method of stainless steel surface copper-silver diffusion coating layer |
Non-Patent Citations (2)
| Title |
|---|
| 双辉等离子表面冶金Ti-Cu阻燃合金的制备工艺;张平则等;《中国有色金属学报》;20050131;第15卷(第1期);第110-115页 * |
| 张平则等.双辉等离子表面冶金Ti-Cu阻燃合金的制备工艺.《中国有色金属学报》.2005,第15卷(第1期),第110-115页. |
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Inventor after: Lin Naiming Inventor after: Zou Jiaojuan Inventor after: Chu Zhibing Inventor after: Zhang Xiangyu Inventor after: Tang Bin Inventor after: Fan Ailan Inventor after: Qin Lin Inventor before: Lin Naiming Inventor before: Chu Zhibing Inventor before: Zou Jiaojuan Inventor before: Zhang Xiangyu Inventor before: Tang Bin Inventor before: Fan Ailan Inventor before: Qin Lin |
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