CN102646605A - Method for reforming solder ball - Google Patents
Method for reforming solder ball Download PDFInfo
- Publication number
- CN102646605A CN102646605A CN2012100095680A CN201210009568A CN102646605A CN 102646605 A CN102646605 A CN 102646605A CN 2012100095680 A CN2012100095680 A CN 2012100095680A CN 201210009568 A CN201210009568 A CN 201210009568A CN 102646605 A CN102646605 A CN 102646605A
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- China
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- tin ball
- shaping
- solder ball
- ball
- tin
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Abstract
The invention discloses a method for reforming a solder ball. The method comprises the following steps of: S1, selecting the solder ball needing to be reformed on a basal body; S2, blowing out hot air of which the temperature is preset by aligning a hot air gun to the solder ball needing to be reformed; S3, judging whether the solder ball is melted or not, carrying out step S4 if so, and carrying out step S2 if not; and S4, stopping blowing out the hot air, and cooling the melted solder ball. By implementing the method for reforming the solder ball, irregular solder balls can be reformed, the situation of insufficient packaging caused by the irregular shape of the solder ball is reduced, and the yield of a product is increased.
Description
Technical field
The present invention relates to tin ball application, be specifically related to the method for a kind of tin ball shaping.
Background technology
Tin ball (BGA, Ball Gird Array, BGA Package) is to be used for replacing the pin in the IC component packaging structure, thereby satisfies a kind of connector of electrical interconnects and mechanical connection requirement.Its end product is digital camera/MP3/MP4/ notebook computer/mobile communication equipment (mobile phone, HF communication equipment)/LED/LCD/DVD/ computer motherboard/PDA/ on-board liquid crystal television/home theater (AC3 system)/consumption electronic products such as global position system.The development of BGA/CSP packaging part complied with the trend of technical development and satisfied people short, little, light to electronic product, thin to require this be a kind of high density surface assembling encapsulation technology, it is all very high that bga is reprocessed that platform, bga encapsulation, bga are reprocessed, BGA plants the ball requirement.In the bottom of encapsulation, pin is glomeration and be arranged in the pattern of a similar what grid all, thus called after BGA; Products characteristics: the purity and the sphericity of (tin ball) (unleaded tin sweat(ing)) are all very high; Be suitable for what BGA, most advanced and sophisticated encapsulation technology such as CSP and fine welding are used, and tin ball minimum diameter can be 0.14mm; Can customize according to requirement of client off-standard size. the relatively large storing error of automatic calibration capability of tool and tolerable, surface evenness problem for no reason during use.
Owing to extruding and defective products reprocess, repeat reason such as reparations, cause the distortion of part tin ball shape, can not fully encapsulate, therefore, be necessary the tin ball that is out of shape is carried out shaping.
Summary of the invention
In order to solve above technical problem, the present invention provides a kind of tin ball shaping methods.
The invention discloses the method for a kind of tin ball shaping, comprising:
S1. need on the matrix to select the tin ball of shaping;
S2. heat gun is aimed at the tin ball of described shaping, blown out the hot blast of preset temperature;
S3. judge whether the tin ball melts, or, get into step S4, if not, step S2 returned;
S4. stop blowing hot-air, and the tin ball of described thawing is cooled off.
In the method for tin ball of the present invention shaping, before step S1, also comprise step S0, utilizing Optical devices to search needs the tin ball and the processed of shaping.
In the method for tin ball of the present invention shaping, described optical system device comprises magnifying glass, microscope.
In the method for tin ball of the present invention shaping, described preset temperature is 350 ℃～450 ℃.
In the method for tin ball of the present invention shaping, described to need the tin ball of shaping be the tin ball with concave surface.
A kind of tin ball shaping methods and the device of embodiment of the present invention have following beneficial technical effects:
Irregular tin ball is carried out shaping, reduce the inadequate phenomenon of the irregularly shaped encapsulation that causes, improve the yield of product because of the tin ball.
Description of drawings
Fig. 1 is a kind of tin ball of embodiment of the invention shaping methods flow chart;
Fig. 2 is the irregular tin ball shape of embodiment of the invention figure;
Fig. 3 passes through the tin ball shape figure after heat gun is handled for the embodiment of the invention.
Embodiment
By specifying technology contents of the present invention, structural feature, realized purpose and effect, give explanation below in conjunction with execution mode and conjunction with figs. are detailed.
See also Fig. 1, a kind of tin ball shaping methods comprises:
S0, utilizing Optical devices to search needs the tin ball and the processed of shaping;
Because the tin ball of portioned product (like the circuit board of mobile phone) is very small, needs the tin ball of shaping so be necessary to utilize Optical devices to search, optical system device comprises magnifying glass, microscope.
S1. need on the matrix to select the tin ball of shaping;
Matrix is that printed substrate or electronic devices and components surface have contact electrode need go up the product of tin cream or tin ball, like IC, and BGA...; Preferably, the present invention has good effect to the tin ball shaping with concave surface, in Fig. 2 and Fig. 3; Tin ball 10 places on the substrate 20; After the heat gun processing, irregular tin ball has become regular tin ball among Fig. 2, and is as shown in Figure 3.
S2. heat gun is aimed at the tin ball of described shaping, blown out the hot blast of preset temperature;
When the preset temperature of heat gun is 350 ℃～450 ℃, the best results of tin ball remodelled shape.
S3. judge whether the tin ball melts, or, get into step S4, if not, step S2 returned;
S4. stop blowing hot-air, and the tin ball of described thawing is cooled off.
The tin ball can be put into the air natural cooling, and cost is minimum, and principle is: because room temperature is lower than the fusing point of tin ball, under the effect of gravity and tension force of itself, the tin ball of high temperature is shrunk to spherical gradually.
Especially, the present invention comprises that for the whole bag of tricks laser scanning sweeps off part tin ball, and the irregular tin ball shape that stays has correcting action, can be used as the subsequent handling of laser ablation tin ball.
A kind of tin ball shaping methods and the device of embodiment of the present invention have following beneficial technical effects:
Irregular tin ball is carried out shaping, reduce the inadequate phenomenon of the irregularly shaped encapsulation that causes, improve the yield of tight article because of the tin ball.
Combine accompanying drawing that embodiments of the invention are described above, but the present invention is not limited to above-mentioned embodiment, above-mentioned embodiment only is schematic; Rather than it is restrictive; Those of ordinary skill in the art not breaking away under the scope situation that aim of the present invention and claim protect, also can make a lot of forms under enlightenment of the present invention; These all belong to, within protection scope of the present invention.
Claims (5)
1. the method for tin ball shaping is characterized in that, comprising:
S1. need on the matrix to select the tin ball of shaping;
S2. heat gun is aimed at the tin ball of described shaping, blown out the hot blast of preset temperature;
S3. judge whether the tin ball melts, or, get into step S4, if not, step S2 returned;
S4. stop blowing hot-air, and the tin ball of described thawing is cooled off.
2. the method for tin ball according to claim 1 shaping is characterized in that, before step S1, also comprises step S0, and utilizing Optical devices to search needs the tin ball and the processed of shaping.
3. the method for tin ball according to claim 2 shaping is characterized in that described optical system device comprises magnifying glass, microscope.
4. according to the method for claim 1 or 2 each described tin ball shapings, it is characterized in that described preset temperature is 350 ℃～450 ℃.
5. according to the method for claim 1 or 2 each described tin ball shapings, it is characterized in that described to need the tin ball of shaping be the tin ball with concave surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100095680A CN102646605A (en) | 2012-01-12 | 2012-01-12 | Method for reforming solder ball |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100095680A CN102646605A (en) | 2012-01-12 | 2012-01-12 | Method for reforming solder ball |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102646605A true CN102646605A (en) | 2012-08-22 |
Family
ID=46659363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100095680A Pending CN102646605A (en) | 2012-01-12 | 2012-01-12 | Method for reforming solder ball |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102646605A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103231138A (en) * | 2013-05-08 | 2013-08-07 | 无锡江南计算技术研究所 | Ball grid array (BGA) balling single-point repair method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5921462A (en) * | 1997-02-21 | 1999-07-13 | Gordon; Thomas A. | Ball grid array ball placement method and apparatus |
| US6358834B1 (en) * | 2000-10-16 | 2002-03-19 | Orient Semiconductor Electronics Limited | Method of forming bumps on wafers or substrates |
| CN1500263A (en) * | 2002-01-26 | 2004-05-26 | 新科实业有限公司 | Reprocessing procedure for SBB HGA |
| CN101424645A (en) * | 2008-11-20 | 2009-05-06 | 上海交通大学 | Soldered ball surface defect detection device and method based on machine vision |
-
2012
- 2012-01-12 CN CN2012100095680A patent/CN102646605A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5921462A (en) * | 1997-02-21 | 1999-07-13 | Gordon; Thomas A. | Ball grid array ball placement method and apparatus |
| US6358834B1 (en) * | 2000-10-16 | 2002-03-19 | Orient Semiconductor Electronics Limited | Method of forming bumps on wafers or substrates |
| CN1500263A (en) * | 2002-01-26 | 2004-05-26 | 新科实业有限公司 | Reprocessing procedure for SBB HGA |
| CN101424645A (en) * | 2008-11-20 | 2009-05-06 | 上海交通大学 | Soldered ball surface defect detection device and method based on machine vision |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103231138A (en) * | 2013-05-08 | 2013-08-07 | 无锡江南计算技术研究所 | Ball grid array (BGA) balling single-point repair method |
| CN103231138B (en) * | 2013-05-08 | 2015-10-07 | 无锡江南计算技术研究所 | BGA plants ball single-point repair method |
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| PB01 | Publication | ||
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| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120822 |