CN102642355B - A kind of preparation method of the flexible membrane based on man-made microstructure - Google Patents
A kind of preparation method of the flexible membrane based on man-made microstructure Download PDFInfo
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- CN102642355B CN102642355B CN201210107169.8A CN201210107169A CN102642355B CN 102642355 B CN102642355 B CN 102642355B CN 201210107169 A CN201210107169 A CN 201210107169A CN 102642355 B CN102642355 B CN 102642355B
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Abstract
The invention provides a kind of preparation method of the flexible membrane based on man-made microstructure, this flexible membrane comprises man-made microstructure prepared by membrane body and multiple conductive materials of array arrangement on membrane body, and the method comprises the following steps: prepare membrane body; Membrane body adheres to conductive material layer, removes unnecessary conductive material according to the man-made microstructure of described array arrangement, the man-made microstructure of remaining array arrangement, namely obtains flexible membrane.The present invention be directed to the flexible membrane based on man-made microstructure and the preparation method proposed, be particularly suitable for adding multiple man-made microstructure on the flexible film, the method can realize on existing equipment basis, and without the need to making larger change to existing equipment, the method is suitable for industrial production.
Description
Technical field
The invention belongs to Material Field, be specifically related to a kind of preparation method of the flexible membrane based on man-made microstructure.
Background technology
Along with the rise of plastic material industry, because its plastics are in the powerful plasticity of manufacture view, and easily process, and there is certain intensity, the advantage such as acidproof, the demand of multiple environment can be met, make increasing part, article use plastic material manufacture.But part, the article of plastics manufacture need to carry out spraying paint etc. following process because of the problem of appearance on its surface after shaping usually, and people have developed the preparation technology of a kind of new plastic part, article, i.e. IMD technology.IMD is the surface decoration technique that the world is in fashion at present, Surface hardened layer transparent membrane, and back side injection molded layers, can make product rub resistance, prevents surface from being scratched, and the distinctness of color can be kept for a long time not easily to fade.
Usually can with certain pattern on the flexible membrane being used as IMD, and mostly these patterns are the effect playing decoration, more common is make the LOGO of company or the appearance of trade mark with those patterns or word, can play the effect to product identification.And utilize this flexible membrane to go to realize more function to yet there are no and disclosed, therefore, be badly in need of the preparation that a kind of preparation method preparing this flexible membrane removes to realize this flexible membrane.
Summary of the invention
In order to solve problems of the prior art; the invention provides a kind of preparation method of the flexible membrane based on man-made microstructure; be can be implemented on this flexible membrane by the method and design man-made microstructure; flexible membrane is made to have protection and decorative effect; but also the effect had electromagnetic wave modulation; in order to achieve the above object, the present invention is by the following technical solutions:
Based on a preparation method for the flexible membrane of man-made microstructure, described flexible membrane comprises man-made microstructure prepared by membrane body and multiple conductive materials of array arrangement on described membrane body, comprises the following steps:
S1, prepare membrane body;
S2, on membrane body, adhere to conductive material layer, remove unnecessary conductive material according to the man-made microstructure of described array arrangement, the man-made microstructure of remaining array arrangement, namely obtain described flexible membrane.
Further, on membrane body, adhere to conductive material layer described in described step S2 adopts plating, deposition or Vacuum Deposition mode to realize.
Further, removing unnecessary conductive material described in described step S2 adopts etching or strip mode to realize.
Further, described step S2 is following steps:
S21, on described membrane body, adhere to protective layer, described protective layer has and identical with man-made microstructure shape engraves hole;
S22, on described protective layer, adhere to conductive material layer, the part of engraving hole described in described conductive material layer correspondence is attached directly on described membrane body;
S23, the conductive material layer removed on described protective layer and described protective layer, namely the remaining described conductive material layer segment be attached directly on described membrane body forms described man-made microstructure.
Further, described protective layer is photoresist or photolithography thin film.
Further, described step S22 adopts plating, deposition or Vacuum Deposition mode to realize.
Further, described step S2 is: directly printed to by conductive material powder and described membrane body forms geometrical pattern form described man-made microstructure.
Further, described step S1 adopt extrude, blowing, curtain coating mode prepare membrane body.
Further, described membrane body is that one or more in PE, PC, PET and PMMA are made.
Further, the thickness of described membrane body is 0.1 ~ 2mm.
The present invention be directed to the flexible membrane based on man-made microstructure and the preparation method proposed, be particularly suitable for adding multiple man-made microstructure on the flexible film, the method can realize on existing equipment basis, and without the need to making larger change to existing equipment, the method is suitable for industrial production.
Accompanying drawing explanation
Fig. 1 is the structural representation of flexible membrane in the present invention;
Fig. 2 is the flow chart of flexible membrane preparation method embodiment 1 of the present invention;
Fig. 3 is the flow chart of flexible membrane preparation method embodiment 2 of the present invention;
Fig. 4 is the flow chart of flexible membrane preparation method embodiment 3 of the present invention.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the present invention is further described.
Man-made microstructure of the present invention is prepared by conductive material, and this conductive material at least comprises metal and electrically conductive ink, and wherein, metal can be copper, silver, gold etc., can select according to the demand of electric conductivity.
Structural representation for flexible membrane of the present invention shown in Figure 1, this flexible membrane comprises membrane body 10 and multiple man-made microstructure 20, membrane body 10 can be that one or more in PE, PC, PET and PMMA are made, add some pigment in the raw material that can also prepare at membrane body as required, make membrane body 10 have certain color.Man-made microstructure 20 has multiple, be arranged in one of membrane body 10 on the surface, membrane body 10 this on the surface the virtual of array be divided into multiple equal grid 11, man-made microstructure 20 correspondence be arranged in above-mentioned grid 11, multiple man-made microstructure 20 is of similar shape, but it varies in size, with left and right directions in scheming be row, above-below direction is for row, the size of the man-made microstructure 20 of every a line is equal, man-made microstructure 20 on each row from top to bottom size diminishes successively, presents rule change; During man-made microstructure 20 that membrane body 10 is arranged, also size can increase successively from top to bottom on each row, the size that also can be the man-made microstructure 20 of each row is equal, in every a line, from left to right size becomes large successively or diminishes, and can certainly be that shape, the size of each man-made microstructure 20 is all equal.
The flow chart of the preparation method's embodiment 1 for flexible membrane of the present invention shown in Figure 2, this flow process comprises step: S1, prepare membrane body; S2, on membrane body, adhere to conductive material layer, remove unnecessary conductive material according to man-made microstructure, the man-made microstructure of remaining array arrangement, obtains flexible membrane.Preparation for membrane body can adopt extrude, blowing, the mode such as curtain coating, existing kinds of schemes realizes in the prior art, and the thickness of membrane body is 0.1 ~ 2mm, as required the thickness of selective membrane body, and then uses the mode preparing membrane body accordingly.Conductive material can use metal or electrically conductive ink etc., the mode that membrane body adheres to conductive material has multiple, such as electroplate, deposit or Vacuum Deposition etc., the mode removing conductive material can be etching or strip, and the mode of attachment conductive material and removal conductive material can select corresponding method according to the conductive material of concrete attachment; When using metal as conductive material, the mode of plating and strip can be selected to obtain man-made microstructure, when using electrically conductive ink as conductive material, the mode of printing and etching can be selected to obtain man-made microstructure.
The flow chart of the preparation method's embodiment 2 for flexible membrane of the present invention shown in Figure 3, first be still in this preparation flow and prepare membrane body by step S1, step S2 comprises: S21, on membrane body, adhere to protective layer, this protective layer has identical with man-made microstructure shape engrave hole; S22, adhere to conductive material layer on the protection layer, wherein, the part that this conductive material layer correspondence engraves hole is attached directly on membrane body; S23, the conductive material layer removed on protective layer and protective layer, namely the remaining conductive material layer segment be attached directly on this membrane body forms man-made microstructure, and then to flexible membrane.In this embodiment; in step S21, protective layer can make with photoresist or photolithography thin film etc.; when photoresist is liquid; the regions shield that will adhere to man-made microstructure; liquid photoresist is by being paved with the region of non-crested after flowing; form protective layer after solidification, protective layer has on the position of aforementioned crested identical with man-made microstructure shape engraves hole, removes veil.Also directly just can use photolithography thin film, and carve on film in man-made microstructure shape identical engrave hole, and film overlayed on substrate form protective layer.Step S22 adopts can adopt plating, deposit or the mode of Vacuum Deposition realizes, which can remove easily beyond the man-made microstructure of adhering on membrane body conductive material.
The flow chart of the preparation method's embodiment 3 for flexible membrane of the present invention shown in Figure 4, first be still in this preparation flow and prepare membrane body by step S1, step S2 adopts the mode of similar printing, direct for metal powder pointwise is printed on membrane body and is combined into certain geometrical pattern, by default print track, the geometrical pattern that metal powder forms can be realized and jointly form man-made microstructure.Metal powder wherein also can use electrically conductive ink to replace, and prepares man-made microstructure to realize electrically conductive ink as raw material.
By reference to the accompanying drawings embodiments of the present invention are described above; but the present invention is not limited to above-mentioned detailed description of the invention; above-mentioned detailed description of the invention is only schematic; instead of it is restrictive; those of ordinary skill in the art is under enlightenment of the present invention; do not departing under the ambit that present inventive concept and claim protect, also can make a lot of form, these all belong within protection of the present invention.
Claims (9)
1., based on a preparation method for the flexible membrane of man-made microstructure, described flexible membrane comprises man-made microstructure prepared by membrane body and multiple conductive materials of array arrangement on described membrane body, it is characterized in that, comprises the following steps:
S1, prepare membrane body;
S2, on membrane body, adhere to conductive material layer, remove unnecessary conductive material according to the man-made microstructure of described array arrangement, the man-made microstructure of remaining array arrangement, namely obtain described flexible membrane electromagnetic wave to modulating action;
Wherein, multiple man-made microstructure is of similar shape, the size of the man-made microstructure of every a line is equal, man-made microstructure on each row from top to bottom size diminishes successively or increases, or the size of the man-made microstructure of each row is equal, and in every a line, from left to right size becomes large successively or diminishes;
Removing unnecessary conductive material described in described step S2 adopts etching or strip mode to realize.
2. preparation method according to claim 1, is characterized in that, adheres to conductive material layer and adopt plating, deposition or Vacuum Deposition mode to realize described in described step S2 on membrane body.
3. preparation method according to claim 1, is characterized in that, described step S2 is following steps:
S21, on described membrane body, adhere to protective layer, described protective layer has and identical with man-made microstructure shape engraves hole;
S22, on described protective layer, adhere to conductive material layer, the part of engraving hole described in described conductive material layer correspondence is attached directly on described membrane body;
S23, the conductive material layer removed on described protective layer and described protective layer, namely the remaining described conductive material layer segment be attached directly on described membrane body forms described man-made microstructure.
4. preparation method according to claim 3, is characterized in that, described protective layer is photoresist or photolithography thin film.
5. preparation method according to claim 3, is characterized in that, described step S22 adopts plating, deposition or Vacuum Deposition mode to realize.
6. preparation method according to claim 1, is characterized in that, described step S2 is: directly printed to by conductive material powder and described membrane body forms geometrical pattern form described man-made microstructure.
7. preparation method according to claim 1, is characterized in that, described step S1 adopt extrude, blowing, curtain coating mode prepare membrane body.
8. the preparation method according to any one of claim 1-7, is characterized in that, described membrane body is that one or more in PE, PC, PET and PMMA are made.
9. the preparation method according to any one of claim 1-7, is characterized in that, the thickness of described membrane body is 0.1 ~ 2mm.
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| CN201210107169.8A CN102642355B (en) | 2012-04-13 | 2012-04-13 | A kind of preparation method of the flexible membrane based on man-made microstructure |
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| CN201210107169.8A CN102642355B (en) | 2012-04-13 | 2012-04-13 | A kind of preparation method of the flexible membrane based on man-made microstructure |
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| CN106644189B (en) * | 2016-12-13 | 2018-12-07 | 中国科学院深圳先进技术研究院 | Pliable pressure sensor and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TW200821400A (en) * | 2006-11-10 | 2008-05-16 | Wen Wang | A method to process a vacuum metallization pattern on plastic substrate |
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| JP2004269932A (en) * | 2003-03-06 | 2004-09-30 | Hitachi Zosen Corp | Method and apparatus for depositing metal thin film |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TW200821400A (en) * | 2006-11-10 | 2008-05-16 | Wen Wang | A method to process a vacuum metallization pattern on plastic substrate |
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