CN102632312B - Method for rapidly filling impregnated cathode alloy solder - Google Patents

Method for rapidly filling impregnated cathode alloy solder Download PDF

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Publication number
CN102632312B
CN102632312B CN201210090590.2A CN201210090590A CN102632312B CN 102632312 B CN102632312 B CN 102632312B CN 201210090590 A CN201210090590 A CN 201210090590A CN 102632312 B CN102632312 B CN 102632312B
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China
Prior art keywords
solder
alloy solder
cathode
filling
fill
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CN201210090590.2A
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Chinese (zh)
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CN102632312A (en
Inventor
吴华夏
邓清东
宋田英
贺兆昌
张丽
陈爱民
卞磊
于晨晨
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Anhui East China Institute of Optoelectronic Technology
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Anhui Huadong Polytechnic Institute
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Priority to CN201210090590.2A priority Critical patent/CN102632312B/en
Publication of CN102632312A publication Critical patent/CN102632312A/en
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Abstract

The invention discloses a method for quickly filling and dipping cathode alloy solder, which comprises the following steps that 1) the alloy solder is sent to a cathode cylinder (7) by using a first filling tool; 2) filling the alloy solder into the solder groove (5) by using a second filling tool; 3) and the third filling tool is used for sucking away the redundant alloy solder and the scattered alloy solder, and the sharp needle part (3) can be sucked up and cleaned when being close to the redundant alloy solder. The method for rapidly filling the cathode-impregnated alloy solder can rapidly fill the cathode-impregnated alloy solder, is simple, convenient and accurate to operate, can easily clean redundant and scattered powdered alloy solder in the cathode, improves the filling qualification rate of the cathode-impregnated alloy solder, and simultaneously, the tool used in the method is designed according to actual needs, so that the operation is simple and easy to implement, and the production efficiency is greatly improved.

Description

A kind of method of Fast Filling impregnated cathode solder
Technical field
The present invention relates to the method for Fast Filling impregnated cathode solder in microwave device.
Background technology
Impregnated cathode is widely used in microwave device as electron source.In the process preparing impregnated cathode, often use negative electrode soldering tech, namely with solder, tungsten cake and cathode tube are welded.The solder of dip brazing negative electrode is generally Powdered, and composition is containing cobalt powder, when filler alloys solder, require that the amount of solder is suitable, fill and want evenly, the local filler alloys solder that can only specify at drawing, if other places have solder to trickle down, needs are cleaned out, and not so can have influence on the size in other places.Existing filling mode, special instrument frock is not had at the solder of powder filler powder, operating personnel just operate with common little spoon and small brushes, operate very inconvenient, the amount of solder is wayward, and the place also inaccuracy of filling, solder is easily trickled down in the place not having solder, Powdered solder cleaning after unrestrained is unclean, and filling effect is poor, then affects the quality of negative electrode.
Summary of the invention
Technical problem to be solved by this invention is a kind of method providing Fast Filling impregnated cathode solder for problems of the prior art, its objective is quick, easy, accurate filling impregnated cathode solder, improve qualification rate and the efficiency of the filling of impregnated cathode solder, improve the quality of negative electrode.
Technical scheme of the present invention is that the method for this kind of Fast Filling impregnated cathode solder comprises:
1) use a fill tool to be delivered in cathode tube by solder, and described fill tool comprise the flat spoon part and handle portion that link together;
2) use No. two fill tools to be filled in solder bath by solder, and described No. two fill tools comprise the flat hook portion and handle portion that link together;
3) No. three fill tools are used unnecessary solder and unrestrained solder to be siphoned away, and described No. three fill tools comprise the prong part and handle portion that link together, prong part is the magnetic ferrous material of band, can be picked up and remove clean when prong part when unnecessary solder.
The described peaceful hook portion of flat spoon part is not magnetic steel.
The crotch angle of described flat hook portion can be according to actual conditions make arbitrarily angled.
The method of above-mentioned Fast Filling impregnated cathode solder has the following advantages:
1. the method for this kind of Fast Filling impregnated cathode solder can the solder of Fast Filling impregnated cathode, easy and simple to handle, accurate, and easily by unnecessary cleaning out with unrestrained Powdered solder in negative electrode, the qualification rate that impregnated cathode solder is filled can be improve.
2. the instrument utilized in the method for this kind of Fast Filling impregnated cathode solder designs according to actual needs, makes easy to operation, has increased substantially production efficiency.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the invention will be further described:
Fig. 1 is the structural representation of a fill tool in the present invention.
Fig. 2 is the top view of structure shown in Fig. 1.
Fig. 3 is the structural representation of No. two fill tools in the present invention.
Fig. 4 is the top view of structure shown in Fig. 3.
Fig. 5 is the structural representation of No. three fill tools in the present invention.
Fig. 6 is cathode construction schematic diagram to be brazed in the present invention.
In figs. 1-6,1: flat spoon part; 2: flat hook portion; 3: prong part; 4: handle portion; 5: solder bath; 6: tungsten cake; 7: cathode tube.
Detailed description of the invention
Combined from structure shown in Fig. 1-6, the method for this kind of Fast Filling impregnated cathode solder comprises:
1) use a fill tool to be delivered in cathode tube 7 by solder, and a fill tool comprise the flat spoon part 1 and handle portion 4 that link together;
2) use No. two fill tools to be filled in solder bath 5 by solder, and No. two fill tools comprise the flat hook portion 2 and handle portion 4 that link together;
3) No. three fill tools are used unnecessary solder and unrestrained solder to be siphoned away, and No. three fill tools comprise the prong part 3 and handle portion 4 that link together, prong part 3 is the magnetic ferrous materials of band, can be picked up and remove clean when prong part 3 when unnecessary solder.
Through filling solder accurately, can weld reliably tungsten cake 6 and cathode tube 7.The peaceful hook portion of flat spoon part 12 is not magnetic steel, and the crotch angle of flat hook portion 2 can be according to actual conditions make arbitrarily angled.
The method of this kind of Fast Filling impregnated cathode solder can the solder of Fast Filling impregnated cathode, easy and simple to handle, accurate, and can easily by unnecessary cleaning out with unrestrained Powdered solder in negative electrode, improve the qualification rate that impregnated cathode solder is filled, the instrument utilized in while method designs according to actual needs, make easy to operation, increased substantially production efficiency.

Claims (2)

1. a method for Fast Filling impregnated cathode solder, is characterized in that: described fill method comprises,
1) use a fill tool to be delivered to by solder in cathode tube (7), and described fill tool comprise the flat spoon part (1) and handle portion (4) that link together;
2) use No. two fill tools to be filled to by solder in solder bath (5), and described No. two fill tools comprise the flat hook portion (2) and handle portion (4) that link together;
3) No. three fill tools are used unnecessary solder and unrestrained solder to be siphoned away; and described No. three fill tools comprise the prong part (3) and handle portion (4) that link together; prong part (3) is the magnetic ferrous material of band, can be picked up and remove clean when prong part (3) when unnecessary solder;
The described peaceful hook portion of flat spoon part (1) (2) is not magnetic steel.
2. the method for a kind of Fast Filling impregnated cathode solder according to claim 1, is characterized in that: the crotch angle of described flat hook portion (2) can be according to actual conditions make arbitrarily angled.
CN201210090590.2A 2012-03-30 2012-03-30 Method for rapidly filling impregnated cathode alloy solder Active CN102632312B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210090590.2A CN102632312B (en) 2012-03-30 2012-03-30 Method for rapidly filling impregnated cathode alloy solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210090590.2A CN102632312B (en) 2012-03-30 2012-03-30 Method for rapidly filling impregnated cathode alloy solder

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CN102632312A CN102632312A (en) 2012-08-15
CN102632312B true CN102632312B (en) 2015-04-22

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103921012B (en) * 2014-04-04 2016-11-09 安徽华东光电技术研究所 Preparation method of tungsten-cobalt solder for cathode and preparation method of brazed assembly

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54123866A (en) * 1978-03-20 1979-09-26 Toshiba Corp Indirect type cathode for electron tubes and its manufacture
JPS62217525A (en) * 1986-03-19 1987-09-25 Hitachi Ltd Impregnated cathode
JPH04199550A (en) * 1990-11-26 1992-07-20 Yamaha Corp Solder plating device for lead
JPH05211028A (en) * 1992-01-30 1993-08-20 New Japan Radio Co Ltd Cathode structure body
JP3015437B2 (en) * 1990-09-26 2000-03-06 株式会社東芝 Method for producing impregnated cathode assembly
CN1727107A (en) * 2004-07-30 2006-02-01 中国科学院电子学研究所 The solder that is used for impregnated cathode
US7046343B2 (en) * 1999-12-08 2006-05-16 Fuji Photo Film Co., Ltd. Method and apparatus for recognizing regions corresponding to image storage sheets

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101791700B (en) * 2010-01-26 2012-05-30 厦门虹鹭钨钼工业有限公司 Manufacturing method of solder ring component for magnetron cathode assembly

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54123866A (en) * 1978-03-20 1979-09-26 Toshiba Corp Indirect type cathode for electron tubes and its manufacture
JPS62217525A (en) * 1986-03-19 1987-09-25 Hitachi Ltd Impregnated cathode
JP3015437B2 (en) * 1990-09-26 2000-03-06 株式会社東芝 Method for producing impregnated cathode assembly
JPH04199550A (en) * 1990-11-26 1992-07-20 Yamaha Corp Solder plating device for lead
JPH05211028A (en) * 1992-01-30 1993-08-20 New Japan Radio Co Ltd Cathode structure body
US7046343B2 (en) * 1999-12-08 2006-05-16 Fuji Photo Film Co., Ltd. Method and apparatus for recognizing regions corresponding to image storage sheets
CN1727107A (en) * 2004-07-30 2006-02-01 中国科学院电子学研究所 The solder that is used for impregnated cathode

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Address after: 241000 No.01 Eshan Road, high tech Development Zone, Yijiang District, Wuhu City, Anhui Province

Patentee after: ANHUI HUADONG PHOTOELECTRIC TECHNOLOGY INSTITUTE Co.,Ltd.

Address before: 241000 Anhui Province, Wuhu city Yijiang District South high tech Development Zone Technology Park mansion

Patentee before: Anhui Huadong Polytechnic Institute