CN102629668A - OLED device packaging method, OLED device and display device - Google Patents
OLED device packaging method, OLED device and display device Download PDFInfo
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- CN102629668A CN102629668A CN2011103051872A CN201110305187A CN102629668A CN 102629668 A CN102629668 A CN 102629668A CN 2011103051872 A CN2011103051872 A CN 2011103051872A CN 201110305187 A CN201110305187 A CN 201110305187A CN 102629668 A CN102629668 A CN 102629668A
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Abstract
The invention, which relates to the organic light-emitting diode (OLED) manufacturing field, provides an OLED device packaging method, an OLED device and a display device, so that efficiency of OLED packaging can be improved. The OLED packaging method comprises the following steps that: a moisture proofing layer is formed on an OLED substrate in the way of spraying; a glue film is formed at the upper layer of the moisture proofing layer or is formed on a packaging cover plate; and box pairing is carried out on the OLED substrate and the packaging cover plate so as to complete the packaging. According to the embodiment of the invention, the provided technical scheme is suitable for manufacturing an OLED device and a display device.
Description
Technical field
The present invention relates to OLED and make the field, relate in particular to a kind of OLED device package method, OLED device and display unit.
Background technology
Encapsulation is a vital link in OLED (Organic Light-Emitting Diode, the Organic Light Emitting Diode) device manufacturing processes.Because compositions such as airborne steam and oxygen are very big to the effect on service life of the luminous organic material in the OLED structure of OLED display; So the good and bad degree of encapsulation will directly influence the sealing of display floater, and then cause product useful life and quality to have greatly changed.Therefore, encapsulation technology is the important technology of left and right sides OLED device quality.
At present; The OLED device generally adopts the mode of glue packaging film to encapsulate, and this packaged type requires forming elder generation's making damp-proof layer on OLED structure TFT (Thin Film Transistor, the TFT) array base palte; Form glued membrane again, cover base plate for packaging at last and accomplish encapsulation.
Wherein, this damp-proof layer is generally inorganic passivation layer in the prior art.In the process of making inorganic passivation layer, in order to avoid influence as far as possible, available technology adopting CVD (Chemical Vapor Deposition, chemical vapour deposition (CVD)) technology to the luminous organic material in the OLED structure; And when carrying out CVD technology, be the further plasma damage that reduces luminous organic material, and need to adopt the low-power consumption evaporation coating method, adopt this method then can cause deposition velocity low, promptly production efficiency is low.
Summary of the invention
Embodiments of the invention provide a kind of OLED device package method, OLED device and display unit, in order to improve the efficient of OLED device package.
For achieving the above object, embodiments of the invention adopt following technical scheme:
On the one hand, a kind of OLED device package method is provided, comprises:
Mode through spraying on oled substrate forms damp-proof layer;
Upper strata at said damp-proof layer forms glued membrane, perhaps on encapsulation cover plate, forms glued membrane;
Oled substrate and encapsulation cover plate to box, are accomplished encapsulation.
On the one hand, a kind of OLED device is provided, comprises: oled substrate; With the encapsulation cover plate of said oled substrate to box; And the glued membrane between said oled substrate and encapsulation cover plate, also comprise: the damp-proof layer that between oled substrate and glued membrane, is provided with, said damp-proof layer covers the OLED structure fully.
On the one hand, a kind of display unit is provided also again, comprises above-mentioned OLED device.
A kind of OLED device package method, OLED device and display unit that the embodiment of the invention provides, this OLED device package method comprises: the mode through spraying on oled substrate forms damp-proof layer; Upper strata at said damp-proof layer forms glued membrane, perhaps on encapsulation cover plate, forms glued membrane; Oled substrate and encapsulation cover plate to box, are accomplished encapsulation.Adopt a kind of like this method for packing, form damp-proof layer through the mode that sprays, the mode of employing CVD technology of the prior art relatively makes the formation of damp-proof layer become fast simple more, thereby has improved the efficient of OLED device package.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art; To do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below; Obviously, the accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills; Under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
The schematic flow sheet of a kind of OLED device package method that Fig. 1 provides for the embodiment of the invention;
Fig. 2 is for dripping the sketch map that falls formula nozzle spraying drier;
The structural representation of a kind of OLED device that Fig. 3 provides for the embodiment of the invention.
Reference numeral:
The 11-OLED substrate, the 12-OLED structure, 13-damp-proof layer, 14-glued membrane, 15-encapsulation cover plate, 2-drip and fall the formula nozzle.
Embodiment
To combine the accompanying drawing in the embodiment of the invention below, the technical scheme in the embodiment of the invention is carried out clear, intactly description, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the present invention's protection.
The embodiment of the invention provides a kind of OLED device package method, and is as shown in Figure 1, comprising:
S101, the mode through spraying on oled substrate forms damp-proof layer.
Wherein, oled substrate is the substrate that is formed with the OLED structure, the regional corresponding viewing area of OLED structure, and concrete structure is not superfluous here.Wherein, Mode through spraying on oled substrate is when forming damp-proof layer; Can make said damp-proof layer cover whole oled substrate fully, also can make damp-proof layer only cover the OLED structure on the oled substrate fully, promptly on oled substrate, leave the zone that does not cover damp-proof layer at the OLED structure periphery.At this moment, the uncovered area of reservation can make things convenient for the glued membrane of the formation in the follow-up S102 step better to adhere to oled substrate and encapsulation cover plate.
Wherein, damp-proof layer can be preferably the drier film for any suitable film that forms with spraying method.Can utilize spraying equipment to accomplish S101; And spraying equipment comprises all spraying equipments that can the drier spraying be formed homogeneous film, is not limited to a certain specific equipment.In addition, above-mentioned drier can be chemisorbed drier or physical absorption drier, specifically can comprise: a kind of in liquid drier, black drier, transparent desiccant, the opaque drier.
S102 forms glued membrane on the upper strata of said damp-proof layer, perhaps on encapsulation cover plate, forms glued membrane.
Need to prove that the detailed process that forms glued membrane in this step can adopt existing adhesive film technique.This glued membrane can be formed on the upper strata (on the oled substrate) of damp-proof layer, also can be formed on the encapsulation cover plate.Preferably, said glued membrane is formed on the damp-proof layer; At this moment, be more conducive to realize moisture effect.
S103 to box, accomplishes encapsulation with oled substrate and encapsulation cover plate.
Concrete, the oled substrate and the base plate for packaging that form glued membrane can be encapsulated box through the mutual gluing completion of glued membrane, perhaps, the encapsulation cover plate that forms glued membrane and the oled substrate that forms damp-proof layer to box, are accomplished encapsulating.Certainly, also can around oled substrate that forms damp-proof layer and encapsulation cover plate, use envelope frame glue that the two is encapsulated box.
The OLED method for packing that the embodiment of the invention provides comprises: the mode through spraying on oled substrate forms damp-proof layer; Upper strata at said damp-proof layer forms glued membrane, perhaps on encapsulation cover plate, forms glued membrane; Oled substrate and encapsulation cover plate to box, are accomplished encapsulation.Adopt a kind of like this method for packing, form damp-proof layer through spraying method, the mode of employing CVD technology of the prior art relatively makes the formation of damp-proof layer become fast simple more, thereby has improved the efficient of OLED device package.
Preferably, step S101, on oled substrate through the spraying mode form damp-proof layer specifically can for:
With reference to figure 2, utilize to drip and to fall formula nozzle 2 and on the oled substrate 11 that forms OLED structure 12, spray drier, to form the drier film.
Adopt to drip and fall formula nozzle 2 spraying drier, can be so that drier forms damp-proof layer more quickly and evenly on the oled substrate 11 that forms OLED structure 12.So, make the formation of damp-proof layer become fast simple more, damp-proof layer is more even, thereby has improved the quality and the efficient of OLED device package.
The embodiment of the invention provides a kind of OLED device, and is as shown in Figure 3, comprising: be formed with the oled substrate 11 of OLED structure 12, and with the encapsulation cover plate 15 of 11 pairs of boxes of said oled substrate, and the glued membrane 14 between oled substrate 11 and encapsulation cover plate 15; Also be included in the damp-proof layer 13 that is provided with between oled substrate 11 and the glued membrane 14, said damp-proof layer 13 covers OLED structure 12 fully.
Concrete, damp-proof layer 13 can be preferably the drier film for any suitable film that forms with spraying method.Above-mentioned drier can be chemisorbed drier or physical absorption drier, specifically can comprise: a kind of in liquid drier, black drier, transparent desiccant, the opaque drier.
The OLED device that the embodiment of the invention provides adopts foregoing method for packing,, so, makes the formation of damp-proof layer become fast simple more, thereby has improved the efficient of OLED device package to form damp-proof layer through the spraying drier.
Further, the edge exclusion amount of said OLED structure 12 is preferably below the 5mm.(cover area) is preferably more than the 10mm in the overlay area of said glued membrane.
Wherein, the edge exclusion amount of said OLED structure be meant the OLED structure the border of border and array base palte in the distance of the same side.The overlay area of said glued membrane (cover area) refers to the cover width of glued membrane; Such as; The above-mentioned envelope frame glue that around oled substrate that forms damp-proof layer and encapsulation cover plate, uses is with in the two mode to the box encapsulation, and the cover width of glued membrane is the width (referring to one-sided) of envelope frame glue; And in other modes, then refer to the integral width of glued membrane.
Like this, the OLED display that the embodiment of the invention provides can adapt to the display requirement of each size display floater, and can significantly improve the efficient of small size OLED device package.
The embodiment of the invention provides a kind of display unit, has used above-mentioned OLED device.Said display unit can be mobile phone, navigator, panel computer, TV, notebook computer, monitor etc.Owing to used above-mentioned OLED device, improved the quality and the efficient of OLED device package, thereby improved the quality and the efficient of display unit.
The above; Be merely embodiment of the present invention, but protection scope of the present invention is not limited thereto, any technical staff who is familiar with the present technique field is in the technical scope that the present invention discloses; Can expect easily changing or replacement, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of said claim.
Claims (12)
1. an OLED device package method is characterized in that, comprising:
Mode through spraying on oled substrate forms damp-proof layer;
Upper strata at said damp-proof layer forms glued membrane, perhaps on encapsulation cover plate, forms glued membrane;
Oled substrate and encapsulation cover plate to box, are accomplished encapsulation.
2. OLED device package method according to claim 1 is characterized in that, said on oled substrate the mode through spraying form damp-proof layer and be specially:
Mode through spraying on oled substrate forms damp-proof layer, and said damp-proof layer covers the OLED structure on the oled substrate fully.
3. OLED device package method according to claim 1 is characterized in that, said on oled substrate, to form damp-proof layer be the drier film.
4. OLED device package method according to claim 3 is characterized in that said spraying process comprises: utilize to drip and to fall the formula nozzle and on oled substrate, spray drier, to form the drier film.
5. according to the arbitrary described OLED device package method of claim 2～4, it is characterized in that said drier comprises: chemisorbed drier or physical absorption drier.
6. OLED device; Comprise: oled substrate; With the encapsulation cover plate of said oled substrate to box, and the glued membrane between said oled substrate and encapsulation cover plate, it is characterized in that; Also comprise: the damp-proof layer that between oled substrate and glued membrane, is provided with, said damp-proof layer covers the OLED structure fully.
7. OLED device according to claim 6 is characterized in that, said glued membrane covers the zone that does not cover damp-proof layer on said damp-proof layer and the said oled substrate fully.
8. OLED device according to claim 6 is characterized in that, said damp-proof layer is the drier film.
9. OLED device according to claim 8 is characterized in that, said drier comprises: chemisorbed drier or physical absorption drier.
10. according to each described OLED device of claim 6～9, it is characterized in that the edge exclusion amount of said OLED device is below the 5mm.
11., it is characterized in that the overlay area of said glued membrane is more than the 10mm according to each described OLED device of claim 6～9.
12. a display unit is characterized in that, comprises each described OLED device of claim 6～11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2011103051872A CN102629668A (en) | 2011-10-10 | 2011-10-10 | OLED device packaging method, OLED device and display device |
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| CN2011103051872A CN102629668A (en) | 2011-10-10 | 2011-10-10 | OLED device packaging method, OLED device and display device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103682054A (en) * | 2013-12-23 | 2014-03-26 | 福州大学 | Graphene based flexible photoelectric device packaging method |
| CN104966726A (en) * | 2015-07-03 | 2015-10-07 | 深圳市华星光电技术有限公司 | OLED display panel and packaging method thereof |
| WO2016045163A1 (en) * | 2014-09-22 | 2016-03-31 | 深圳市华星光电技术有限公司 | Oled packaging method and oled packaging structure |
| CN112786802A (en) * | 2020-12-23 | 2021-05-11 | 乐金显示光电科技(中国)有限公司 | Display device packaging structure and manufacturing method of packaging plate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1612650A (en) * | 2003-10-29 | 2005-05-04 | 铼宝科技股份有限公司 | Organic light-emitting display panel |
| CN101681775A (en) * | 2007-04-20 | 2010-03-24 | 欧丽安等离子显示器株式会社 | Plasma display panel for multi-screen and fabricating method for the same |
| US20100308335A1 (en) * | 2009-06-04 | 2010-12-09 | Tae-Woong Kim | Organic light emitting diode display and method of manufacturing the same |
| CN201820801U (en) * | 2010-10-10 | 2011-05-04 | 四川虹视显示技术有限公司 | Encapsulating structure for OLED (Organic Light Emitting Diode) device |
| CN102145580A (en) * | 2009-12-14 | 2011-08-10 | 富士胶片株式会社 | Moisture protection of fluid ejector |
-
2011
- 2011-10-10 CN CN2011103051872A patent/CN102629668A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1612650A (en) * | 2003-10-29 | 2005-05-04 | 铼宝科技股份有限公司 | Organic light-emitting display panel |
| CN101681775A (en) * | 2007-04-20 | 2010-03-24 | 欧丽安等离子显示器株式会社 | Plasma display panel for multi-screen and fabricating method for the same |
| US20100308335A1 (en) * | 2009-06-04 | 2010-12-09 | Tae-Woong Kim | Organic light emitting diode display and method of manufacturing the same |
| CN102145580A (en) * | 2009-12-14 | 2011-08-10 | 富士胶片株式会社 | Moisture protection of fluid ejector |
| CN201820801U (en) * | 2010-10-10 | 2011-05-04 | 四川虹视显示技术有限公司 | Encapsulating structure for OLED (Organic Light Emitting Diode) device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103682054A (en) * | 2013-12-23 | 2014-03-26 | 福州大学 | Graphene based flexible photoelectric device packaging method |
| CN103682054B (en) * | 2013-12-23 | 2016-05-04 | 福州大学 | A kind of flexible photoelectric device method for packing based on Graphene |
| WO2016045163A1 (en) * | 2014-09-22 | 2016-03-31 | 深圳市华星光电技术有限公司 | Oled packaging method and oled packaging structure |
| CN104966726A (en) * | 2015-07-03 | 2015-10-07 | 深圳市华星光电技术有限公司 | OLED display panel and packaging method thereof |
| CN112786802A (en) * | 2020-12-23 | 2021-05-11 | 乐金显示光电科技(中国)有限公司 | Display device packaging structure and manufacturing method of packaging plate |
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Application publication date: 20120808 |