CN102623801A - Surface-mounted multi-frequency antenna module - Google Patents

Abstract

A surface mount multi-band antenna module includes: a substrate and a carrier. The substrate is provided with a first grounding metal surface and a first microstrip line, one side edge of the first grounding metal surface is connected with a second microstrip line, a space is formed between the second microstrip line and the first microstrip line, and a second grounding metal surface is arranged on the other side of the substrate. The carrier is a ceramic material with high dielectric constant, and is provided with a first radiating metal part, a second radiating metal part and a third radiating metal part. When the carrier is electrically connected with the substrate, the joint of the first radiating metal part and the second radiating metal part is electrically connected with the first microstrip line, and the third radiating metal part is electrically connected with the second microstrip line so as to form a multi-frequency antenna module.

Description

Surface mount multi-frequency antenna module

technical field

The invention relates to an antenna, in particular to a multi-frequency antenna module with high gain and multiple frequency bands.

Background technique

With the development of wireless communication technology, electronic products such as notebook computers, mobile phones, personal digital assistants (PDAs) and other portable electronic devices are all designed and developed towards thinner and lighter. The size of the antenna used to send and receive radio signals is relatively reduced, or the structure of the antenna is changed before it can be built into the electronic product for use.

At present, the common multi-band multi-frequency antenna on the market is an inverted F-shaped antenna (Planar Inverted-FAntenna, PIFA). This antenna adopts a simple two-dimensional design, and the copper process is directly printed on the printed circuit board through the printed circuit board (PCB) manufacturing process to form a flat multi-band multi-frequency antenna, or the metal sheet is stamped by stamping technology A multi-frequency antenna with a three-dimensional design is formed.

Because the PIFA antenna structure can change the two-dimensional printed circuit board or the antenna geometry on the metal sheet, in order to achieve dual-band or even triple-band transceiver effects. However, in order to meet the quality of signal transmission and reception and avoid the influence of the surrounding environment from causing misalignment of its frequency coordination, the antenna stamped and formed by the printed circuit board or metal sheet must have a certain size. In order to install the PIFA antenna structure, the electronic device An appropriate space must also be reserved inside to place the PIFA antenna structure, which will inevitably violate the requirements of electronic devices for miniaturization design.

Contents of the invention

Therefore, the main purpose of the present invention is to solve the traditional deficiencies, so to provide a metal pattern of a multi-band multi-frequency antenna mounted on the ceramic carrier made of the high dielectric constant ceramic material to form a High efficiency multi-band multi-band antenna for direct surface mount engineering. At the same time, it also forms a thin, short and miniaturized built-in surface-mounted multi-frequency antenna.

In order to achieve the above purpose, the present invention provides a surface mount type multi-frequency antenna module, including:

A substrate has a first surface and a second surface, the first surface has a first ground metal plane and a first microstrip line, and one end of the first microstrip line has a perforation, and the part with the perforation The first microstrip line of the segment extends in the first grounded metal plane, and forms a gap with the first grounded metal plane, and a second microstrip line is connected to one side of the first grounded metal plane. The second microstrip line is parallel to the other end of the first microstrip line, and there is a distance between the first microstrip line and the second microstrip line; in addition, there is a set of phases on the first surface The two corresponding fixed contacts, and a second grounded metal plane on the second surface;

A carrier, a cuboid made of high dielectric constant ceramic material, has a first radiating metal part, a second radiating metal part and a third radiating metal part on it, the first radiating metal part, the second radiating metal part and The third radiating metal part is composed of different rectangular metal patterns and straight metal patterns, and is arranged on at least one or two surfaces of the carrier, and the first radiating metal part is electrically connected to the second radiating metal part , the first radiating metal part and the second radiating metal part are electrically connected to the third radiating metal part;

Wherein, when the carrier is electrically connected to the substrate, the first radiating metal portion and the second radiating metal portion are electrically connected to two fixed contacts on the first surface of the substrate, so that the carrier can be fixedly connected to the substrate on the first surface of the first radiating metal part and the second radiating metal part are electrically connected to the first microstrip line, and the third radiating metal part is electrically connected to the second microstrip line to Combined into a multi-frequency antenna module.

In the present invention, the metal pattern of the multi-band multi-frequency antenna is loaded on the ceramic carrier made of the high dielectric constant ceramic material to form a high-efficiency multi-band multi-frequency antenna that can be directly surface-mounted. At the same time, it also forms a thin, short and miniaturized built-in surface-mounted multi-frequency antenna.

The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

Description of drawings

Fig. 1 explodes the schematic diagram of multi-frequency antenna module of the present invention;

Fig. 2 is an exploded schematic diagram of another viewing angle of the multi-frequency antenna module of the present invention;

Fig. 3 is an exploded schematic diagram of another viewing angle of the multi-frequency antenna module of the present invention;

Figure 4 is a three-dimensional schematic diagram of the appearance of the multi-frequency antenna module of the present invention;

Fig. 5 is a circuit schematic diagram of the multi-frequency antenna module circuit of the present invention;

FIG. 6 is a schematic diagram of the use state of the multi-frequency antenna module of the present invention;

Fig. 7 is a schematic side sectional view of Fig. 6;

Fig. 8a schematic diagram (1) of the frequency response curve of the present invention;

Fig. 8b is a schematic diagram (2) of the frequency response curve of the present invention.

Among them, reference signs

Substrate 1

first surface 11

second surface 12

The first ground metal surface 13

The first microstrip line 14

front section 141

Rear section 142

piercing 143

Gap 15

The second microstrip line 16

Spacing 17

Fixed contact 18

The second ground metal surface 19

Carrier 2

The first radiating metal part 21

The second radiating metal part 22

The third radiating metal part 23

signal source 3

connector 4

Signal Feed Probe 41

Shell 42

Thread 43

Copper axis cable 5

Connector 51

Detailed ways

The technical content and detailed description of the present invention are now described as follows in conjunction with the accompanying drawings:

Please refer to FIG. 1 , FIG. 2 , FIG. 3 , and FIG. 4 , the decomposition of the multi-frequency antenna module of the present invention, the decomposition of another viewing angle, the decomposition of another viewing angle and the three-dimensional schematic diagram of its appearance. As shown in the figure: a surface mount multi-frequency antenna module of the present invention includes: a substrate 1 and a carrier 2 .

The substrate 1 has a first surface 11 and a second surface 12 . The first surface 11 has a first ground metal plane 13 and a first microstrip line 14. The first microstrip line 14 has a front section 141 and a rear section 142. The front section 141 has a through hole 143. The front section 141 of the first microstrip line 14 extends in the first ground metal plane 13 and forms a gap 15 with the first ground metal plane 13 . One side of the first ground metal surface 13 is connected with a second microstrip line 16, the second microstrip line 16 is parallel to the rear section 142 of the first microstrip line 14, and the first microstrip line There is a space 17 between the rear section 142 of the line 14 and the second microstrip line 16, and the width of the space 17 formed between the rear section 142 of the first microstrip line 14 and the second microstrip line 16 can be obtained from The value of the coupling capacitance is adjusted so that the first ground metal surface 13 can form a high-frequency resonance point, so as to increase the bandwidth. In addition, there is a set of two corresponding fixed contacts 18 on the first surface 11 , and the two fixed contacts 18 are used for fixing the carrier 2 . There is also a second grounding metal surface 19 on the second surface 12, and the second grounding metal surface 19 is for electrical connection with the grounding part (not shown) of the joint of the copper axis cable.

The carrier 2 is a cuboid made of ceramic material with a high dielectric constant, and has a first radiating metal portion 21 , a second radiating metal portion 22 and a third radiating metal portion 23 thereon. The first radiating metal part 21, the second radiating metal part 22 and the third radiating metal part 23 are arranged on at least one or two surfaces of the carrier 2 with different rectangular metal patterns and linear metal patterns, so that the antenna The volume is miniaturized. The first radiating metal part 21 is electrically connected to the second radiating metal part 22, and the first radiating metal part 21 and the second radiating metal part 22 are not electrically connected to the third radiating metal part 23 (that is, the The first radiating metal portion 21 and the second radiating metal portion 22 are insulated from the third radiating metal portion 23 ). When the carrier 2 is electrically connected to the substrate 1, the first radiating metal portion 21 and the second radiating metal portion 22 are electrically connected to the two fixed contacts 18 on the first surface 11 of the substrate 1, so that the carrier 2 can be fixed on the first surface 11 of the substrate 1 . Moreover, the junction of the first radiating metal portion 21 and the second radiating metal portion 22 is electrically connected to the first microstrip line 14 , and the third radiating metal portion 23 is electrically connected to the second microstrip line 16 , to be combined into a multi-frequency antenna module.

Please refer to FIG. 4 and FIG. 5 , the three-dimensional appearance of the multi-frequency antenna module of the present invention and the circuit schematic diagram of the circuit. As shown in the figure: after the first radiating metal part 21 and the second radiating metal part 22 are electrically connected to the first microstrip line 14, the first radiating metal part 21 forms a first antenna, and the second radiating metal part 21 forms a first antenna. The radiating metal part 22 forms the second antenna, and the third radiating metal part 23 and the second microstrip line 16 form a multi-band multi-frequency antenna module of the third antenna.

When the signal source 3 is input by the first microstrip line 14 , it flows through the first radiating metal part 21 and the second radiating metal part 22 to form a high-low frequency branch resonance structure. With the width of the spacing 17 formed between the first microstrip line 14 and the second microstrip line 16, the coupling capacitance value can be adjusted so that the first ground metal surface 13 can form a high-frequency resonance point, thereby increasing For bandwidth purposes.

Please refer to FIG. 6 and FIG. 7 , the usage state of the multi-frequency antenna module of the present invention and the side sectional schematic diagram of FIG. 6 . As shown in the figure: when the present invention is used, the signal feeding probe 41 of the connector 4 connected to the copper axis cable 5 passes through the through hole 143 of the first microstrip line 14, and the first microstrip line 14 electrical connection. The housing 42 of the connector 4 is electrically connected to the second ground metal surface 19 .

When the multi-frequency antenna module is used, the joint 51 of the copper axis cable 5 is locked on the thread 43 of the housing 42 of the connector 4, and passes through the first radiating metal part 21, the second radiating metal part 22 and the second radiating metal part 21. The three radiating metal parts 23 are used to receive signals of different frequency bands to achieve a multi-frequency antenna module that can be used in multiple frequency bands.

Please refer to FIGS. 8a to 8b , schematic diagrams of frequency response curves (1) and (2) of the present invention, and please refer to Table 1 for the frequency response tables of FIGS. 8a and 8b. As shown in Figure 8a, Figure 8b and Table 1: when the multi-frequency antenna module of the present invention is at 700MHZ, the return loss (Return Loss) of the antenna is -3.98, and the standing wave ratio (SWR) is 4.20.

When the multi-frequency antenna module of the present invention operates at 824MHZ, the reflection loss of the antenna is -11.66, and the standing wave ratio is 1.73.

When the multi-frequency antenna module of the present invention operates at 960MHZ, the reflection loss of the antenna is -5.57, and the standing wave ratio is 3.02.

When the multi-frequency antenna module of the present invention operates at 1710MHZ, the reflection loss of the antenna is -10.39, and the standing wave ratio is 1.76.

When the multi-frequency antenna module of the present invention operates at 2170MHZ, the reflection loss of the antenna is -6.38, and the standing wave ratio is 2.88.

Table I

700MHz 824MHz 960MHz 1710MHz 2170MHz Reflection loss (Reture Loss -3.98 -11.66 -5.57 -10.39 -6.38 Standing wave ratio (SWR) 4.20 1.73 3.02 1.76 2.88

Table II

Please refer to Table 2, the description of the peak gain parameter of the LTE antenna of the present invention (LTEANTENNA Peak Gain Parameter Summary). As shown in Table 2: Therefore, the multi-frequency antenna module of the present invention can provide the light, thin, short, small multi-band high-efficiency built-in sticker required by the current long-term evolution antenna (LONG TERM EVOLUTION ANTENNA, LTE ANTENNA) technology and the fourth-generation communication system. Chip (SMT) antenna module structure. And this multi-frequency band covers 700 ~ 960MHZ and 1710 ~ 2170MHZ, etc., for LTE, Global System for Mobile Communications (GSM), Digital Communications System (Digital Communications System, DCS), Personal Communication System (Personal Communication System, PCS), Wideband Code Division Multiple Access (WCDMA) and other system frequency bands.

Certainly, the present invention also can have other multiple embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these corresponding Changes and deformations should belong to the scope of protection of the appended claims of the present invention.

Claims (9)

1. A multi-frequency antenna module of surface mount type, is characterized in that, comprises: A substrate with a first surface and a second surface on it, a first grounded metal plane and a first microstrip line on the first surface, and a gap between the first microstrip line and the first grounded metal plane A gap is formed, a second microstrip line is connected to one side of the first ground metal surface, the second microstrip line is parallel to the first microstrip line, and the first microstrip line and the first microstrip line are arranged side by side. There is a distance between the two microstrip lines; A carrier with a first radiating metal part, a second radiating metal part and a third radiating metal part, the first radiating metal part is electrically connected to the second radiating metal part, the first radiating metal part and the second radiating metal part The second radiating metal part is insulated from the third radiating metal part; Wherein, when the carrier is electrically connected to the substrate, the joint where the first radiating metal part and the second radiating metal part are electrically connected is electrically connected to the first microstrip line, and the third radiating metal part is electrically connected to the first microstrip line. The second microstrip line is electrically connected to form a multi-band multi-frequency antenna module. 2. The surface mount type multi-frequency antenna module according to claim 1, wherein the first microstrip line has a front section and a rear section, the front section has a perforation, and the front section extends over the second section In a ground metal plane, and form a gap with the first ground metal plane. 3. The multi-frequency antenna module of surface mount type according to claim 2, characterized in that, the space width formed between the rear section of the first microstrip line and the second microstrip line is used to adjust the coupling The capacitance value enables the first grounding metal surface to form a high-frequency resonance point. 4. The surface mount type multi-frequency antenna module according to claim 3, characterized in that, the first surface has a set of corresponding two fixed contacts, and the two fixed contacts are fixedly connected to the first part of the carrier. The radiating metal part and the second radiating metal part. 5 . The surface mount type multi-frequency antenna module according to claim 4 , wherein the second surface has a second ground metal plane. 6 . 6 . The surface mount type multi-frequency antenna module according to claim 5 , wherein the carrier is made of a high dielectric constant ceramic material into a cuboid. 7 . 7. The surface mount type multi-frequency antenna module according to claim 6, characterized in that, the first radiating metal part, the second radiating metal part and the third radiating metal part respectively use a rectangular metal pattern and The linear metal pattern is formed and arranged on the carrier. 8 . The surface mount type multi-frequency antenna module according to claim 7 , wherein the rectangular metal pattern and the linear metal pattern are disposed on at least one or two surfaces of the carrier. 9. The surface mount type multi-frequency antenna module according to claim 8, characterized in that it also has a connector, the connector has a housing, a signal feed-in probe is provided in the housing, the signal feed-in probe The input probe passes through the through hole of the first microstrip line and is electrically connected with the first microstrip line.

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